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Low-temperature plasma surface treatment equipment which industry will be used

Low-temperature plasma surface treatment equipment which industry will be used

The low temperature plasma surface treatment equipment is composed of a plasma generator, a gas pipeline and a low temperature plasma nozzle. When an arc is discharged, the plasma generator generates high pressure and high frequency kinetic energy to produce plasma. This plasma technology is excited and controlled in the nozzle tube, and the gas such as air is passed into the material surface to spray plasma. When plasma technology touches the surface of a material, physical changes and chemical reactions occur. The treated surface layer has formed a high density chemical crosslinking layer, or due to the introduction of methyl and carboxyl groups, has the effect of promoting the adhesion of a variety of architectural coatings, and has been improved in the application of adhesion and paint. Plasma treatment of the surface layer can also obtain very thin ductile coating, so that the surface layer has good adhesion, coating and printing properties. Without the need for other industrial auxiliary equipment, more functional components can be obtained to improve adhesion. Plasma treatment can be used for daily necessities and electronic products, high-grade furniture surface treatment, immediate spraying, do not drop paint, surface treatment before bonding, surface treatment before bonding and smooth coating, surface treatment before printing, the coating is hard, do not drop paint after printing. Surface modification materials of low temperature plasma surface treatment equipment can improve the corrosion resistance of metal surface layer, improve the bonding property of metal surface, improve the strength and wear resistance of metal materials; Vulcanized rubber and plastic industry surface treatment; Laminated glass is pretreated to make the bonding more waterproof, and can be printed, glued, sizing and other sound insulation and noise reduction; Adjusted FRP products are pretreated with plasma treatment; The cell culture dishes in the laboratory were treated with hydrophilic and adhesive properties, and the cells were uniform after generation. Display pressing pre-processing, LCD soft film on the circuit board surface treatment, bonding the hard part of the pre-processing, to ensure the mobile phone shell and notebook case solid bonding. Paint is not easy to peel off the frame of mobile phone and laptop computer. The case sticks together, the case is not easy to peel off the paint, and the text is not easy to fade. The mobile phone and laptop keyboard stick together, and the text is not easy to peel off the paint. Low-temperature plasma pretreatment is carried out in the plastic surface treatment tube to improve the adhesion of printing, the surface printing of beverage bottle caps, nursing products packaging bottles, the surface treatment of small adhesive toys, the adhesion of shoes and other pre-treatment, to ensure that the strong glue does not open, the application of low-temperature plasma surface treatment equipment in the printing and dyeing industry. The low temperature plasma surface treatment equipment is used as a biotech medical catheter in medical instruments, and the combination after surface treatment is more compact. The compatibility and hydrophilicity of medical consumables can be considered in the surface treatment of human prosthetic materials. Medical machinery disinfection and sterilization. Low-temperature plasma surface treatment of ceramic surface coatings has previously been performed. No surface paint is required. Solid ceramic glazing oil pretreatment, enhance the cohesive force, used for printing special cable, fiber optic cable printing, laser engraving, printing chemical fiber cross, transparent printing, durable cars and shipbuilding very fastness bonding surface treatment, car seal more inseparable from caking, acoustic noise reduction, antifouling headlights bonding processing technology, strong adhesion, prevent dirt and stains, automobile brake pads waterproof, skeleton seal, bumper coating pretreatment, seamless splicing car surface, with dip coating printing solution, do not fade, the shipbuilding industry to pre bonded raw materials, printing and packaging industry mineral water bottles, and jam jars bonding, To achieve the purpose of firmness and reliability. Shenzhen Chengfeng Zhi Manufacturing Co., Ltd. is an enterprise mainly engaged in the development, design, manufacture and marketing of low-temperature plasma surface treatment equipment. If you need more details, please contact everyone.

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Plasma Cleaning Technology of Composite Materials and Its Application in Material Field

Plasma Cleaning Technology of Composite Materials and Its Application in Material Field

Since the advent of plasma cleaning technology, with the rapid development of electronics and other industries, its application has gradually increased, used for plasma cleaning activation modification etching to improve adhesion and so on. At present, plasma cleaning technology has been widely used in semiconductor and optoelectronic industry, including integrated circuit, semiconductor, medical treatment and so on. Next, I will introduce the application of plasma cleaning technology in the field of composite materials. 1. Improve the interfacial bonding properties of composites: Plasma cleaning technology can effectively avoid the damage of chemical solvents to the properties of the material, and introduce a variety of active functional groups to the surface of the material to increase the surface roughness, improve the surface free energy of the fiber, and effectively strengthen the bond between the resin and the fiber. The composite properties can be improved by the bonding between the fiber interfaces. The results show that under appropriate conditions, the interlaminar shear strength and interfacial properties of polyaramid ether sulfone ketone resin can be greatly improved by plasma cleaning. 2. Improving the manufacturing process properties of composite materials: Due to the poor impregnation effect of resin on fiber in LCM process, and the phenomenon of cavity and dry spot on the surface of the product, plasma cleaning technology can be considered to improve the physical and chemical properties of the fiber surface and the surface quality of the fiber preform. Under the same process conditions (pressure field, temperature field, etc.), the resin can more fully impregnate the fiber surface, improve the impregnating uniformity, and improve the process performance of the composite liquid forming. 3. Improving the coating performance of the composite surface: Conventional cleaning methods should not only use organic solvents, but also produce a lot of dust pollution in the grinding process, which has a serious impact on the environment and endangers the personal safety of the operator. But after the green plasma technology cleaning, the composite coating surface reached a better coating state, coating reliability improved, can effectively avoid coating off, defects and other problems, the surface after coating smooth, continuous, no pores. Compared with the conventional cleaning, the adhesion of the coating is significantly improved, reaching the GB/T9286 test result grade 1, and meeting the requirements of engineering application. 4. To improve the bonding performance between multiple parts of composite materials: Using the method of physical grinding, the surface roughness of the composite parts is increased, so as to improve the bonding performance between the composite parts. However, this method causes dust pollution to the environment, and at the same time, it is difficult to achieve the purpose of uniformly increasing the surface roughness of the parts, which is easy to cause the deformation and damage of the surface of the composite parts, thus affecting the performance of the adhesive interface of the parts. Therefore, a simple and easily controlled plasma cleaning technology can be used to effectively and accurately clean the contaminants on the surface of composite parts. The physical and chemical properties of the surface are improved and the good bonding properties are obtained. Due to the increasing maturity of plasma technology and the development of cleaning equipment, especially the on-line continuous plasma equipment under atmospheric pressure, the cleaning cost is continuously reduced and the cleaning efficiency is further improved. Plasma cleaning technology itself has the advantages of ease of use, reasonable use of all kinds of materials, green and environmental protection. With the gradual improvement of people's understanding of fine production, the application of advanced cleaning technology in the field of composite materials will be widely promoted.

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Effect of PTFE Plasma Surface Treatment on Interfacial Adhesion Properties of Microporous Film

Effect of PTFE Plasma Surface Treatment on Interfacial Adhesion Properties of Microporous Film

Ptfe microporous membrane has stable chemical properties, high temperature resistance, corrosion resistance, excellent resistance to water, thin oil, such as performance, the high temperature, high humidity, corrosion and special gases such as organic fluid with good filtering performance, can be widely used in metallurgical, chemical, coal, cement and other industries of dust removal filter, is a production of high-temperature resistance composite filter material of thin film materials. However, its very low surface activity and outstanding non-viscosity make it difficult to composite with matrix materials, thus limiting its application. In recent years, more and more studies have been conducted on polytetrafluoroethylene (PTFE) surface treatment using etcet ions. The results show that plasma surface treatment can improve the viscosity of PTFE film well, but the main influencing factors are as follows: 1, processing power: The greater the power of plasma surface treatment is not the better. When the power is low, the shear strength of the treated film increases with the increase of power and decreases gradually after reaching the peak value. 2. Gas treatment: Under the same conditions, the treatment effect of O2 plasma is obviously higher than that of nitrogen plasma surface treatment. 3. Processing time: The contact Angle of the film surface decreases with the increase of treatment time, but the contact Angle has little change after a certain time. The above shows that the use of plasma surface treatment of polytetrafluoroethylene viscosity is good, need to constantly adjust the processing parameters, in order to obtain a good processing process, CRF Chengfeng plasma cleaning machine is simple to operate, can set a number of experimental parameters, and can store a variety of process parameters, which is of great help to explore the process parameters.

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Characteristics of plasma dry etching technology and typical material applications

Characteristics of plasma dry etching technology and typical material applications

Plasma etching machine is also known as plasma etching machine, plasma plane etching machine, plasma surface treatment instrument, plasma cleaning system, etc. Plasma etching, is a common form of dry etching, its principle is exposed to the electronic area gas plasma, the plasma and the release of high-energy electron gas, forming a plasma or ion, when the plasma atomic accelerated by electric field can release enough force to close to the material or surface of etching, which combined with surface driving force. Plasma cleaning is actually a slight phenomenon in the process of plasma etching to some extent. Dry etching equipment includes reaction chamber, power supply, vacuum, etc. The working parts are sent to the reaction chamber, where the gases are introduced into the plasma and exchanged. Plasma etching process is essentially an active plasma process. More recently, in the reaction room there is a downstream format that will play a flexible role and users will move around to configure appropriate plasma etching methods: RIE, downstream plasma, direction plasma. Inductively coupled plasma etching (ICPE) is the result of chemical and physical processes. Whose basic principle is: under the pressure, the RF power supply to the loop coupling coil output by ICP, coupled by glow discharge, mixed etching gas glow discharge by coupling, to produce high density plasma, the electrode under the action of RF, bombarding the substrate surface, substrate semiconductor materials of chemical bonds in graphic area is interrupted, and etching gas to produce volatile substances, gas out of the substrate, the vacuum tube to pull away. For etching, and after etching for decontamination, scum removal, surface treatment, plasma polymerization, plasma ash or any other etching applications, we can produce safe and reliable plasma treatment systems according to customer requirements. The company has both traditional plasma etching system and reactive ion etching system, can produce a series of products, also can customize the special system for customers. Our company can provide fast/high quality etching, reduce plasma damage, provide the required uniformity. Plasma treatment can be applied to a variety of substrates, even complex geometry can be activated by plasma, plasma cleaning, plasma coating without problem. Plasma treatment has low thermal and mechanical loads, so low-pressure plasmas can also handle sensitive materials. Typical applications of plasma etching machines are: semiconductors/integrated circuits; Gallium nitride; Gallium aluminum nitride/gallium nitride; Gallium arsenide/aluminum gallium arsenide; Gallium arsenide. Indium phosphide, indium aluminum-arsenic/indium gallium arsenide (Inp InGaAs/InAlAs); Silicon; Silicon germanium. Silicon nitride ceramics (Si3N4); Hydrogen bromide of silicon; Zinc selenide (ZnSe); Metal; Aluminum; Chromium; Platinum; Molybdenum; Niobium; Tantalum; Titanium; Tungsten; The dielectric; Indium tin oxide; Lead zirconate titanate (PZT); Silicon carbide. Plastics/polymers; Polytetrafluoroethylene (PTFE); Polyformaldehyde (POM); Polybenzimidazole (PBI); Polyether ether ketone (PEEK); Polyimide (polyimide); Polyamide (nylon); Perfluoroalkoxy alkane (PFA); Polyfluorinated ethylene propylene (FEP); Polyolefin; Polyester, etc.

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Plasma etching cleaning machine indium phosphide etching

Plasma etching cleaning machine indium phosphide etching

Indium phosphide can not only be used as the substrate material of the epitaxial layer, but also can be used as the channel material or electrode material itself, so relative to other 35 groups of materials, the plasma etching of indium phosphide material cleaning machine plasma etching research is also more. Using CH4 and H2 to etch phosphated steel is a kind of method that appeared earlier. This method can be applied to large area and large size indium phosphide etching. Etching rate is significant, but in the graphics complex and concentration areas domain due to produce by-products is difficult to volatilize, and plasma etching of cleaning machine plasma etching gas polymer is very heavy, it is easy to etch termination occurs at the bottom of the etched pattern, or graphic morphology change poor phenomenon, therefore, CH4 and H2 gas combinations need to be further improved to become the industrial applications of indium phosphide etching method. Literature shows that the low temperature etching of indium phosphide with chlorine as the main etching gas has the problems of low etching rate and difficult removal of by-products at low temperature. Chlorine is very sensitive to temperature, and the higher the temperature, the faster the etching rate. However, when the temperature is low, due to the large number of by-products and difficulty in volatilization, the enrichment effect of by-products will cause the etching termination when the total amount of etching is too large (InClx is difficult to volatilize). However, the low temperature etching mainly with CH4 and H2 is faced with the phenomenon of low etching rate causing the etching stop. Therefore, how to realize the etching of InP materials at low temperature has become a common research hotspot. The more common method is to mix other gases with conventional indium phosphide etching gas, and the earlier research in this area was reported by Carlotta in New Zealand. Using Cl2/Ar/H2 mixed gas, good indium phosphide graphics can be obtained at 150℃, and smooth and continuous graphic morphology can be obtained at high temperature, but 150℃ is not low temperature after all. In 2007, Tsinghua University reported a method to further optimize the gas ratio and improve other conditions to overcome these problems. This etching method can overcome the problem of difficult-to-volatilize by-products at room temperature. Because the appropriate ratio of CH4 and chlorine gas will form In(CH)x by-products, which are easier to volatilize and remove than InClx. The surface roughness of indium phosphide is low and there is no residue of by-products. The etching conditions are as follows :Cl2:CH4:Ar=12∶12:3; 4 mt; TCP is 1000 w; Bias voltage 300 v. The calculated etching rate is 8600 A /min, and the selective ratio of SiN is 10∶1, which can meet the requirements of the current process. However, the disadvantages of this method are also obvious: the by-product is completely volatile, the side wall of the graph is not protected enough, resulting in the overall shape will be concave. However, such morphology can hardly meet the requirements of device performance no matter as gate, epitaxial layer or mask. Therefore, another gas mixture Cl2/N2/Ar has been developed by the authors, which uses different etching mechanism and adds N2 to better remove indium phosphide by physical bombardment. This kind of method can realize the vertical graph of phosphated steel. The study on etching rate and selection ratio of different flow ratio is summarized in Table 8.2. It can be seen that in the absence of N2, the selection ratio is high, but the surface roughness is poor. With the increase of N2, the roughness is continuously improved, but a lot of selection ratio will be sacrificed. Based on the existing etching machine, we should be able to make better use of different etching steps, using different etching gas ratios and other conditions, and synchronously improve these contradictions to obtain the desired graphics. The above methods are implemented in the ICP machine, and earlier in the RIE machine has also been studied to explore the impact of pressure on the etching of indium phosphate. With the increase of pressure, the by-products continue to accumulate so that the selection ratio continues to decrease, and the etching is terminated. Under the condition of 5 pa, is there a silicon nitride environment of hard mask etching pattern is almost the same, but under the 10 pa, the absence of silicon nitride hard mask, in the graphics area density is bigger, the by-product or polymers is more, etching rate fell sharply, and got there is a big difference between different graphics environment etching depth; When the pressure is 20Pa, the etching will stop regardless of the density surrounding the pattern. This is because the amount of polymer is so large that it covers all the pattern and the etching cannot be carried out. A

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Material polycrystalline silicon wafer plasma etching cleaning equipment to remove surface impurities

Material polycrystalline silicon wafer plasma etching cleaning equipment to remove surface impurities

With the development of semiconductor technology, wet etching has gradually limited its development due to its inherent limitations, because it has been unable to meet the processing requirements of micron or even nanometer fine wires in VLSI. Dry etching method of polycrystalline silicon wafer plasma etching cleaning equipment is gradually widely used in semiconductor processing technology because of its high ion density, etching uniformity, etching side wall verticality, high surface finish, can remove surface impurities. With the development of modern semiconductor technology, the requirement of etching is higher and higher. The plasma etching cleaning equipment of polycrystalline silicon wafer meets this requirement. The stability of equipment is one of the key factors to ensure the stability and repeatability of the production process. CRF plasma cleaning machine is a multi-functional plasma surface treatment equipment, through the configuration of different components, can have a surface coating (coating), etching, plasma chemical reaction, powder plasma processing and other capabilities. Polysilicon wafers are etched very well by plasma cleaning/etching machines. Through the configuration of etching components, the CRF plasma cleaning machine can achieve etching function, cost-effective, simple operation, so as to achieve multi-function. Plasma cleaning machine is the use of the characteristics of low temperature plasma to be processed materials of plasma surface treatment equipment, generally after plasma treatment, the surface tension of the material will be changed, wettability and hydrophilic, dyne value changes, suitable for dyne pen test of the material has a lot of, such as stainless steel, glass, plastic, ceramic lamp, etc. The dyne value is mainly represented by the dyne pen, also known as the surface tension detector pen, the corona treatment pen, and the plastic film surface tension detector pen. Surface tension test pen has 32, 34, 36, 38, 40, 42, 44, 46, 48, 50, 52, 54, 56, 58, 60 or more dozens of different tension test pen, can test whether the sample surface tension reaches the value of the test pen. After plasma surface cleaning and activation treatment, the surface energy of traditional materials can be improved, which is reflected in the experiment of material dyne value improvement. Plasma cleaning machine was used to treat the polymer plastic samples, and dyne values were compared before and after treatment. Before treatment, the Dane was crossed on the surface of the sample. After 40# crossing, the Dane slowly contracted and beads appeared, indicating that the Dane value was between 30 and 40. After plasma cleaning, 30#, 40# and 50# dyne stroke lines can be uniformly distributed without beads, indicating that the surface dyne value of the sample is greater than 50. After plasma cleaning machine treatment, the surface tension and surface energy of the material are improved, which provides the possibility for the subsequent process and material application.

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