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Plasma surface treatment machine applications

Plasma surface treatment machine applications

Plasma cleaning machine is mainly used for surface modification treatment of various materials: plasma surface cleaning, surface activation, surface etching, surface grafting, surface deposition, surface polymerization and plasma assisted chemical vapor deposition Surface modification: Paper bonding, plastic bonding, metal tin welding, surface treatment before electroplating Surface activation: The surface modification, printing, coating, or bonding of biomaterials before surface treatment, as of textiles Surface etching: Micromachining of silicon, surface etching treatment of solar energy fields such as glass, surface etching treatment of medical utensils Surface grafting: The production of specific groups on the surface of a material and the fixation of surface activation Surface deposition: Plasma polymerization deposition of hydrophobic or hydrophilic layers Plasma cleaning machine is widely used in metal, microelectronics, polymer, biological functional materials, low temperature sterilization and pollution control and other fields, is an ideal equipment for enterprises and research institutes to carry out plasma surface treatment.

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The function of plasma cleaning machine to clean micro holes

The function of plasma cleaning machine to clean micro holes

With the miniaturization of the aperture of THE HDI plate, the traditional chemical cleaning process can no longer meet the requirements of the cleaning of the blind hole structure, and the liquid surface tension makes it difficult for the liquid to penetrate into the hole, especially when treating the laser drilling microblind hole plate, the reliability is not good. At present, the hole cleaning technology applied to the microburied blind hole mainly includes supergenerated wave cleaning and plasma cleaning, while ultrasonic cleaning mainly achieves the purpose of cleaning based on cavitation effect. It belongs to wet treatment, and the cleaning time is long, and it depends on the deconvolution performance of the cleaning liquid, which increases the disposal problem of the waste liquid. At present, the commonly used process is mainly plasma cleaning process. The plasma treatment process is simple, environmentally friendly, and the cleaning effect is obvious, which is very effective for blind hole structure. Plasma cleaning means that highly activated plasma moves in direction under the action of electric field, and has gas-solid chemical reaction with drilling pollution of hole wall, and at the same time, the generated gas products and some non-reactive particles are discharged by air pump. In the first stage, high purity N2 is used to generate the plasma, and the printed board is preheated at the same time, so that the polymer material is in a certain activated state. In the second stage, O2 and CF4 are used as the original gases. After mixing, O and F plasma is generated, which reacts with acrylic acid, PI, FR4 and glass fiber, etc., to achieve the purpose of decontamination. In the third stage, O2 is used as the original gas, and the generated plasma and reaction residue make the hole wall clean. In the process of plasma cleaning, in addition to plasma chemical reaction, the plasma also has physical reaction with the material surface. Plasma particles knock off the atoms on the surface of the material or the atoms attached to the surface of the material, which is conducive to cleaning the etching reaction. With the development of materials and technology, the structure of buried blind hole will become smaller and more refined. In to fill the holes, blind holes on plating using the traditional chemical degumming slag method will be more and more difficult, and plasma processing cleaning method can effectively get rid of disadvantages of wet method in addition to the glue residue, can achieve the blind hole and small hole is better cleaning effect, which can guarantee the blind hole plating when fill hole to achieve good effect.

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Plasma cleaner machine in microelectronic package of application

Plasma cleaner machine in microelectronic package of application

In the production process of microelectronic packaging, a variety of fingerprints, flux, cross contamination, natural oxidation, devices and materials will form a variety of surface contamination, including organic matter, epoxy resin, photoresist and solder, metal salts, etc. These stains can have a significant impact on the packaging production process and quality. The use of plasma cleaning machine can be easily removed through the formation of contaminated molecular production process, to ensure the atoms and atoms between the close contact surface adhesion of the workpiece, so as to effectively improve the bonding strength, improve the quality of wafer bonding, reduce the leakage rate, improve packaging performance, output and component reliability. The choice of plasma cleaning process in microelectronic packaging depends on the requirements of subsequent processes on the material surface, the chemical composition of the original characteristics of the material surface and the properties of the pollutants. Plasma cleaning gases are commonly used for argon, oxygen, hydrogen, carbon tetrafluoride and their mixed gases. Small silver adhesive substrate: contaminants can cause colloidal silver to be spherical, which is not conducive to chip adhesion and easy to chip damage. The use of rf plasma cleaning can greatly improve surface roughness and hydrophilicity, which is conducive to silver colloidal and ceramic tile chip adhesion. At the same time, the usage can save silver adhesive and reduce cost. Lead bonding: Before the chip joins the substrate and after curing at high temperature, existing pollutants may contain microparticles and oxides. Physical and chemical reactions of these pollutants lead and welding between the chip and the substrate are incomplete with poor bond strength and poor adhesion. Rf plasma cleaning can significantly improve the surface activity, bonding strength and tensile strength of the bonding wire before wire bonding. The pressure on the joint can be low (when there are contaminants, the head penetrates the contaminants, the need for greater pressure), and in some cases the bonding temperature can also be lowered, thereby increasing production and reducing costs. Sealant: In the epoxy resin process, pollutants will lead to high foaming rate of foam, resulting in low product quality and service life, so in order to avoid the formation of sealing foam also pay attention to. After rf plasma cleaning, the bonding of the chip and substrate will be closer to the colloid, which will greatly reduce the foam formation, and also significantly improve the heat dissipation rate and light emissivity.

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The cleaning technology of plasma surface processor plays an important role

The cleaning technology of plasma surface processor plays an important role

With the development of The Times, science and technology are constantly improving, all walks of life have their own space for progress, different industries have different applications. Plasma surface treatment equipment I believe we all understand, for the plasma processing also understand, so for the plasma cleaning machine, its cleaning technology how prominent role, let's look at the following. Plasma cleaning machine is closely related to industrial cleaning and various industrial activities. Cleaning is not a final process, but a local process, process, or ancillary activity in many industrial processes. In some traditional industries, cleaning has been regarded as a simple process or common sense, which is often ignored by people. But the quality of cleaning affects the performance and quality of the final product. Especially in today's high-tech industry, the role of cleaning technology is particularly prominent. In recent years, some new cleaning technologies and equipment have been developed and applied gradually, such as vacuum cleaning, plasma cleaning, UV/odorous hydrogen cleaning, laser cleaning. Dry ice cleaning and other emerging, showing a good effect and application prospects. At the same time, with the improvement of the overall level of industry. Free cleaning technology is also beginning to be popularized, especially in the electronics industry and precision machining areas, where clean packaging technology can enable components. Cleaning equipment, cleaning agents and cleaning techniques required for precision industrial cleaning. Professional cleaning equipment manufacturers have won the bid in international public bidding for many times, and mass production of single automatic and complete sets of large cleaning equipment, after domestic and international experts acceptance, to meet the needs of the cleaning industry.

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The use of plasma cleaning machine should pay attention to what matters

The use of plasma cleaning machine should pay attention to what matters

Plasma treatment equipment is widely used in plasma cleaning, etching, plasma plating, plasma coating, plasma ashing and surface modification. Through its treatment, can improve the material surface wetting ability, so that a variety of materials can coating, plating and other operations, enhance the adhesion, bonding strength, while removing organic pollutants, oil or grease. So plasma cleaning machine in the operation should pay attention to what matters? 1. Set the operating parameters of the plasma equipment correctly and execute the operation instructions on time; 2. Protect the plasma ignition device to ensure that the plasma cleaning machine can start normally; 3. In the preparation of plasma equipment before starting, relevant personnel should be trained, and ensure that the personnel operating the plasma cleaning machine can strictly carry out all the operations as required; 4. When there is no ventilation in the primary air duct, the operating time of the plasma generator should not exceed the time required in the equipment manual, so as to avoid burning the burner and causing unnecessary losses; 5. If it is necessary to maintain the plasma equipment, please power off the plasma generator before the corresponding operation.

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What is the difference between atmospheric plasma cleaning machine and vacuum plasma cleaning machine

What is the difference between atmospheric plasma cleaning machine and vacuum plasma cleaning machine

Atmospheric plasma cleaning equipment, now most of the application is the mobile phone industry: mobile phone glass surface activation treatment, bottom glue before treatment, packaging front-end treatment, mobile phone shell surface activation treatment before painting. General mobile phone factory daily thousands to tens of thousands of capacity, it is necessary to have a fast and efficient activation process, atmospheric plasma cleaning machine is born for this. Whether fitted on a three-axis platform, transmission machine or installed on the whole line, the atmospheric plasma cleaning machine can quickly make one of the surface of the material to be processed to achieve a good activation effect. And vacuum plasma equipment it is its high performance, high quality, and high quality, and safety of product features, treatment effect comparison precision comprehensive, a lot of the material of the product itself, so cannot be used as the temperature of the atmospheric plasma equipment is relatively higher plasma device, this time can choose vacuum plasma equipment. The differences are as follows: 1, because the atmospheric plasma nozzle is directly ejected the ion, this situation by the nozzle structure indirectly changed the direction of ion movement (directly facing the material being processed). Thus atmospheric plasma can only process one surface on the pipeline, which is also one of the differences with vacuum plasma cleaning. Vacuum plasma cleaning machine in the work, the ions inside the cavity is not directional, as long as the material in the cavity exposed part, no matter which side and which corner can be cleaned. Second, in the use of gas, atmospheric plasma only need to access compressed air, of course, to better effect of direct access to nitrogen. The vacuum plasma cleaning machine will have more choices in gas, and can choose a variety of gases for matching material surface oxide, nanometer microorganism removal has a strong improvement. It should be emphasized here that the main purpose of the atmospheric type of gas is to activate and enhance the permeability. The purpose of vacuum gas is to enhance the etching effect, remove pollutants, remove organic matter, and enhance the erosion property. Obviously, the selection range of gas is wider and the vacuum plasma cleaning process will be more widely used. 3. Temperature. Although the temperature of the atmospheric plasma cleaning machine is about 60°-75° after several seconds of material processing, this data is measured according to the distance of the spray gun to the material is 15mm, the power is 500W, and the triaxial speed is 120mm/s. Of course, power, time of contact, and height of treatment all affect the temperature. Special attention is: atmospheric plasma cleaning machine spray gun work of the "flame" is divided into the internal flame and the external flame, when we clean are to take the external flame to wash, the internal flame in the nozzle inside, from outside is not visible. But it is easy to burn the surface if you do not move at a point for a long time in the presence of a "flame". Therefore, the temperature of atmospheric plasma can only be measured under the actual conditions. The vacuum plasma cleaning machine is not so complex, according to the power frequency division, 40KHz and 13.56MHz for example: usually the material into the body to work, the frequency of 40KHz general temperature is below 65°, and the machine is equipped with a strong air cooler, the treatment time is not long, the surface temperature of the material will be the same as room temperature. Frequencies at 13.56MHz are lower, usually below 30°. Therefore, it is suitable to deal with some materials that are easily deformed by heat. 4. Ion generation conditions. It can be seen intuitively that the atmospheric type depends on the access gas, and the gas pressure needs to reach about 0.2mpa to produce ions. The vacuum type relies on the vacuum pump. Before ion production, the vacuum degree inside the cavity must be pumped below 25pA to produce ions, even if no external gas is connected.

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