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The use of plasma cleaning machine benefits

The use of plasma cleaning machine benefits

Plasma cleaning machine by vacuum cavity and high frequency plasma power supply, vacuum pumping system, gas system, automatic control system and so on. It is widely used in all kinds of fresh treatment industry. Here are a few of us to give you a plasma cleaning machine is widely used reasons: 1. Environmental protection The plasma ACTS as a coherent gas-solid process, consuming no water, adding no chemicals, and polluting the surrounding environment. 2. Universality Using plasma cleaning machine in general is the basic material type, regardless of processing objects can be handled, for metal, semiconductor and oxides and most of the polymer materials, such as polypropylene, polyester, polyimide, and even ptfe etc can get very good treatment, and can realize the overall and partial and is responsible for the structure of the cleaning process. 3. Strong functionality Plasma cleaning machine not only involves the road polymer material shallow surface, can maintain the material's own characteristics at the same time, has given a kind of or many new functions. 4. Low temperature Plasma cleaning machine close to room temperature, especially suitable for polymer materials, compared with the use of corona and flame method has a long preservation time and surface treatment tension. 5. Low cost The plasma treatment device is simple, easy to operate and maintain, can run continuously, often a few bottles of plasma gas can replace thousands of kilograms of cleaning fluid, so the cost of cleaning will be greatly reduced with wet cleaning. 6. The whole process is controllable Almost all parameters of the plasma cleaner can be set and recorded by computer for quality control. 7. Unlimited geometry of the processed objects Use such as ion cleaning machine processing objects, its or large or small, simple or complex shape, components or textiles can be processed.

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The key cause of plasma surface area increas

The key cause of plasma surface area increas

(1) Sputtering erosion effect of charged particles on the cleaned material; (2) Chemical erosion effect of chemical active groups. However, what we call surface modification can be interpreted as: the surface roughness of the treated material increases the contact area, while the hydrophilic groups on the surface increase the hydrophilicity. Today, this feature is perfectly used in printing, digital, glass, biology, pharmaceuticals, mobile phones, electronics, cables, optical fibers, machinery, and more. It not only solves the problems in the production process of many industrial products, but also enhances the durability and quality of products.

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How does a plasma become a high-energy electron under the action of an electric field

How does a plasma become a high-energy electron under the action of an electric field

Plasma surface treatment is a low temperature plasma is a low pressure discharge (glow, corona, high frequency and microwave, etc.) produced by ionized gas, under the action of an electric field, free electrons in the gas from the electric field energy to become high energy electrons. These high-energy electrons collide with gas molecules, atoms, if the electronic energy is greater than the atoms or molecules of the excitation energy can produce molecules or atoms excited free radicals, ion and radiation, with different energy by ion bombardment or injection of polymer surface, produce off key or the introduction of functional groups, make surface activity to achieve the purpose of modification. Plasma surface activation: Under the action of plasma, some active atoms, free radicals and unsaturated bonds appear on the surface of refractory plastics, and these active groups will react with the active particles in the plasma to form new active groups. However, materials with active groups will be affected by the action of oxygen or the movement of molecular segments, making the surface active groups disappear. In the surface modification of materials by plasma, due to the effect of active particles on surface molecules in plasma, the surface molecular chains are broken to generate new active groups such as free radicals and double bonds, and then surface crosslinking and grafting reactions occur. Reactive plasma means that the active particles in the plasma can chemically react with the surface of the refractory material, so that a large number of polar groups are introduced to make the surface of the material turn from non-polar to polar, the surface tension is increased, and the adhesiveness is enhanced. In addition, under the high speed impact of plasma, molecular chains on the surface of refractory materials break and cross link, which increases the relative molecular mass of surface molecules, improves the weak boundary layer condition, and also plays a positive role in improving the surface adhesion performance. Reactive plasma active gases mainly include 02, H2, NH3, C02, H20, S02, H√H20, air, glycerol vapor and ethanol vapor.

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Plasma cleaning machine advantages

Plasma cleaning machine advantages

1. The cleaning object is dried after the plasma cleaning machine, and can be sent to the next process without further drying treatment. Can process the efficiency of the whole process line; 2. The plasma cleaning machine can keep users away from harmful solvents to human body, and avoid the problem that the objects are easily damaged in wet cleaning; 3. avoid the use of trichloroethane and other harmful ODS solvents, so that the cleaning will not produce harmful pollutants, so this cleaning method belongs to the environmental protection of the green cleaning method. This becomes more and more important in the context of global concern for environmental protection; 4. Plasma generated by using high frequency radio wave range is different from direct light such as laser. The plasma is not very directional, which allows it to go deep into the tiny holes and pits of the object to complete the cleaning task, so there is no need to worry too much about the shape of the object to be cleaned. And the cleaning effect on these hard-to-clean areas was even better than that of freon cleaning; 5, the use of plasma cleaning, cleaning efficiency can be significantly improved. The whole cleaning process can be completed in a few minutes, so it has the characteristics of high yield; 6. The vacuum degree that plasma cleaning needs to be controlled is about 100Pa, which is easy to achieve. Therefore, the equipment cost of this device is not high. In addition, the cleaning process does not require the use of expensive organic solvents, which makes the overall cost lower than the traditional wet cleaning process. 7. the use of plasma cleaning machine, to avoid the cleaning solution of transportation, storage, emissions and other treatment measures, so it is easy to keep the production site clean and sanitary; 8. plasma cleaning can not be separated from the treatment of objects, it can handle a variety of materials, whether it is metal, semiconductor, oxide, or polymer materials (such as polypropylene, polyvinyl chloride, polytetrafluoroethylene, polyimide, polyester, epoxy resin and other high polymer) can be used to treat the plasma. Therefore, it is especially suitable for materials that are not resistant to heat and solvent. And can also selectively clean the whole, part or complex structure of the material; 9. At the same time of cleaning and decontamination, it can also improve the surface performance of the material itself. For example, improving the surface wettability and film adhesion is very important in many applications.

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Why plasma has an invisible function

Why plasma has an invisible function

This is mainly because of the refraction and absorption of radio waves by plasma. This can quote it related materials are given: plasma is a special kind of filter, when radar frequencies below the plasma frequency radar is total reflection, the plasma energy in the form of electromagnetic wave reflection body electronic jamming to radar, namely, by bending radar wave transmitted back and forth is attacking weapon virtual image that appeared on the radar screen, rather than the real weapons. When the radar frequency is higher than the plasma frequency, the radar wave can enter the plasma and be absorbed, so that the signal of attack weapon received by the radar will be greatly weakened. These functions make plasma become a new electronic interference and stealth material, among which stealth technology is a promising technology. Absorption effect on plasma for radio waves can be experienced from the satellite/ship recycling process of "black area" have a intuitive understanding: when the satellite/spacecraft returned to the atmosphere with fast speed, the surface temperature will because of severe air friction shot up to several thousand, tens of thousands of degrees Celsius, the satellite and the surface of the spacecraft will because of the temperature and air into a plasma and the satellite/ship tightly wrapped. Since plasma has a strong absorption effect on radio, ground tracking radar will lose target because of no echo signal, and wireless communication cannot be carried out due to the wrapping of plasma air mass. At this point, all contact between the satellite/spacecraft and the ground will be broken, forming the so-called "black barrier area". Only when the speed of the satellite/spacecraft drops and the surface air temperature drops can the radar be tracked again after the plasma disappears and the communication can be restored to normal.

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What is a plasma cleaner machine

What is a plasma cleaner machine

Plasma cleaning machine, also known as plasma surface treatment machine, is a high-tech technology, the use of plasma to achieve conventional cleaning methods cannot achieve the results. Plasma cleaning is a dry cleaning method, which use gas phase chemical method to remove surface pollutants. The gas phase chemical method mainly includes thermal oxidation method and plasma cleaning method, etc. The cleaning process is to introduce the thermochemical gas or plasma reaction gas into the reaction chamber, and the reaction gas reacts with the wafer surface to generate volatile reaction products that are vacuum-pumped out.

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