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Introduction to the characteristics of the plasma surface treatment equipment that increases the bonding of the atmospheric plasma cleaning machine:

Introduction to the characteristics of the plasma surface treatment equipment that increases the bonding of the atmospheric plasma cleaning machine:

Introduction to the characteristics of the plasma surface treatment equipment that increases the bonding of the atmospheric plasma cleaning machine: Atmospheric plasma cleaning machine surface treatment equipment, that is, single-electrode plasma processor, generates low-temperature plasma in low-temperature plasma, and its ion and electron energy can be as high as 7-10eV, which can process various polymer materials and glass ceramics, such as poly Propylene (PP), Polyethylene (PE), Polyvinyl Chloride (PUL), Propylene Oxide (PTFE/Teflon), Polystyrene (PS), ABS, P Ester (PET), Polyurethane (PUL), POM, Polyethylene Tetrafluoroethylene (PTFE/Teflon), vinyl, nylon, rubber, glass, plexiglass, ABS, etc. Even for extremely difficult polymer materials such as fluorine-containing plastics and silicone rubber, the surface tension can still reach 65~70 y/cm or higher after treatment, thereby improving its adhesion. The ionized gas produced by low pressure discharge (glow, corona, high frequency and microwave, etc.), under the action of the electric field, the free electrons in the gas are converted into high-energy electrons by the electric field, so how does this substance enable the plasma surface treatment equipment to be able to Improve its surface adhesion? The following will answer this question for you. Such high-energy electrons collide with molecules and atoms in the gas. If the energy of the electrons is greater than the excitation energy of the molecules or atoms, free radicals, ions and radiations with different energies that excite the molecules or atoms will be generated. Ion bombardment or implantation into the polymer surface results in bond breakage or introduction of functional groups to activate the surface to achieve modification. In the radio frequency low temperature plasma of the plasma surface treatment equipment, due to the high ion energy and electron energy of the single electrode, it can be designed into various shapes, especially

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Plasma cleaner surface cleaning Plasma surface processor activation uniformity improvemen

Plasma cleaner surface cleaning Plasma surface processor activation uniformity improvemen

Plasma cleaner surface cleaning Plasma surface processor activation uniformity improvement: The plasma cleaning machine has a wide range of RF low-temperature plasma treatment, and can be designed into various shapes, especially suitable for material surface modification. Through low-temperature plasma surface treatment, many physical and chemical changes will occur on the surface of the material, or etching phenomena (difficult to see with the naked eye), or the introduction of oxygen-containing polar groups, make the material hydrophilic, adhesive, Affinity and sex were improved respectively. After the surface of the plastic has been plasma treated, it can be effectively pretreated to activate its surface and then glued, printed or painted. Similarly, materials such as ceramics and glass can also be plasma treated. Factory oxygen is often used as a plasma treatment process gas, hence the name: oxygen plasma. The atmosphere is called atmospheric plasma. Depending on the type of material that needs to be plasma treated with a plasma cleaner, this effect may only last for minutes or even months. Because the plasma surface treatment technology has the advantages of simple process, convenient operation, fast processing speed, good treatment effect, less environmental pollution and energy saving, it has been widely used in surface modification. Plasma treatment is a surface modification technique that alters the surface properties of materials through electrical discharge. Substances/objects must be combined with printing inks, coatings and binders after surface treatment. Designed to optimize the bonding properties of polymer substrates. The low surface energy of polymer substrates typically results in poor adhesion of inks, glues and coatings, which have higher surface energy. Plasma surface treatment is widely used in plastic film, extrusion, automotive, pharmaceutical and other industries. In order to obtain adhesion, the surface energy of the matrix must be greater than or equal to the material surface energy of the polymer used. In the process of surface treatment of materials, plasma cleaner plasma has the following basic functions: significantly improve wettability, and form active surface; clean dust and oil, finely clean and eliminate static electricity; provide functional surface, through surface coating treatment, improve The surface adhesion ability improves the reliability and durability of surface adhesion; the wettability of the surface helps us distinguish whether it is good or bad; when the surface tension of the liquid phase increases, the surface energy of the solid substrate increases, and its wettability is better. , the smaller the contact angle. Surface energy of solids and the need for polymer surface treatments. Plastic products usually need to be bonded to metal or other plastic products, or just printed on the surface of plastic products. In order to do this work smoothly, the surface of the material must be wetted with mucilage or ink. Corona treatment and plasma treatment techniques are required. Lubrication properties depend on a special property of the surface: surface energy, commonly referred to as surface tension. Surface energy is the same unit of measure as surface tension, expressed in mN/m. The surface energy of solid substrates directly affects the wettability of liquid surfaces. The rationality of its wettability can be verified by measuring the contact angle. The contact angle is the angle between the tangent of the point of contact and the horizontal plane of the solid surface. After treatment with plasma cleaning machine, good surface energy of various polymer plastics, ceramics, glass, PVC, paper or metal can be obtained. This treatment process can improve the surface tension performance of the product, and the plasma surface treatment is more in line with the industrial requirements for coating, bonding and other treatments. In order for the liquid to form a proper bond with the surface of the substrate, the surface energy of the substrate should be kept within the range of the liquid tension of 2-10mN/m. When the droplet is mounted on a smooth solid surface, the droplet spreads to the substrate, and if it is completely wet, the contact angle is almost zero. Conversely, if the wetting is localized, the contact angle is balanced between 0 and 180 degrees

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Introduction to the functional cleaning principle of plasma vacuum plasma cleaning machine plasma surface treatment equipment

Introduction to the functional cleaning principle of plasma vacuum plasma cleaning machine plasma surface treatment equipment

Introduction to the functional cleaning principle of plasma vacuum plasma cleaning machine plasma surface treatment equipment: Plasma vacuum plasma cleaners can increase surface energy by changing the surface of materials, bonding, printing and wetting. At the same time, plasma waterproof coating products can also be provided. In fact, almost any material can be plasma treated. The pollutants treated by plasma surface treatment equipment are generally invisible and belong to the nanometer scale. These contaminants affect the ability of objects to interact with other substances such as glue or ink. The surface of an object is treated with plasma to remove organic matter. Plasma surface treatment equipment can improve adhesive or solder adhesion and print reliability. This process is suitable for bright plastic and rubber, and can be directly printed and bonded after impurities are removed. Plasma vacuum plasma cleaning machine can be widely used in the surface activation modification of materials to improve its bonding properties. The following introduces the cleaning principle of plasma vacuum plasma cleaning machine: 1. The cleaned workpiece is sent into the cavity of the vacuum plasma cleaning machine and fixed, the operating device is started, and the exhaust is started, so that the vacuum degree of the vacuum chamber reaches the standard 10 Pa, and the general discharge time is about tens of seconds. Any method of surface modification without chemical treatment of plasma is called dry etching. During the plasma etching process, all plasma cleaned products are dry etched. Plasma etching is similar to plasma cleaning. Plasma etching is used to remove impurities from the treated surface layer. 2. Introduce the gas passed through the plasma vacuum plasma cleaner into the vacuum chamber, and keep the inner cavity pressure stable. Depending on the cleaning material, oxygen, argon, hydrogen, nitrogen, carbon tetrafluoride and other gases can be used respectively. Oxygen-plasma treatment is one of the commonly used dry etching methods. Oxygen (sometimes mixed with argon) is used to treat aluminum, stainless steel, glass, plastic and ceramic surfaces. 3. The high-frequency voltage is applied between the electrodes in the vacuum chamber and the grounding equipment of the plasma vacuum plasma cleaning machine, so that the gas is broken down, and a glow discharge occurs to generate plasma, and the treated workpiece completely covers the plasma generated in the vacuum chamber. Start the cleaning operation. Generally, the duration of the cleaning process varies from tens of seconds to several minutes. Etchers allow plasma to etch printed circuit boards, giving them better bonding properties such as adhesion and decoration. 4. After the cleaning is completed, cut off the power supply, and discharge the gas and vaporize the dirt through the vacuum pump. Several functions commonly used in plasma surface treatment equipment: 1. Activating metal: Although the metal is activated, the activation process of plasma surface treatment equipment is very unstable, so the effective time is very short. For example, after the metal is activated, subsequent treatments (bonding, painting, etc.) must be completed within minutes or hours, otherwise the surface will quickly combine with dirt from the surrounding air. 2. Activated modified plastics: Plastics such as polypropylene and PE are all non-polar structures. That said, these plastics must be pretreated before painting and bonding. Dry oil-free compressed air is often used as process gas. Through the effect test, the workpiece treated and untreated by the plasma surface treatment equipment can be immersed in water (polar solution), and the activation effect is impressive. For the untreated portion, water droplets of normal shape are formed. The machined part of the machined part will be fully saturated with water. 3. Glass and ceramics can also work: Glass and ceramic bottles have similar properties to metals, have a short effective time, and usually use compressed air as the process gas. Enhance its ability to print or bond. The purpose of plasma surface treatment equipment cleaning is to remove surface organic contaminants. Plasma treatment of product surfaces, using adhesives or printing inks. Often used to surface modify Teflon or plastic plasma, it can actually change the surface of the material so that it retains free radicals and binds with glue or ink.

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The application of atmospheric plasma surface processor plasma cleaning machine on FPC board

The application of atmospheric plasma surface processor plasma cleaning machine on FPC board

The application of atmospheric plasma surface processor plasma cleaning machine on FPC board: As soon as the atmospheric plasma surface processor came out, it was welcomed and favored by the majority of industrial enterprises, because it can modify the surface physicochemically, which can improve the adhesion performance of the surface to a certain extent. Its role can be said to be quite large. The following will introduce which of these industries need to use atmospheric plasma surface processors. In the electronics industry, the plasma activation cleaning process is a key technology in the process of reducing costs and improving reliability. Before coating the circuit board on the chip printed circuit board, the plasma activation cleaning process is performed first. Electrostatic treatment can ensure the firm adhesion of the coating, while in the field of chip packaging, plasma cleaning machine cleaning technology is used, and atmospheric pressure or vacuum equipment can be used for treatment. Plasma treatment of plastic windows, due to the use of plasma treatment process, improves the surface properties of the material and makes the coatings more evenly distributed together, which not only makes the product look impeccable, but also greatly reduces the production process. Rejection rate. As we all know, the printing and packaging industry provides a wide variety of packaging boxes to customers. If it is not handled properly, it is easy to open the glue, which has a great impact on the profit of the company. If a plasma processor is used, the problem of glue opening can be effectively avoided, and the surface of various materials can be treated, which can greatly reduce grinding pollution, save glue consumption to a certain extent, and save costs at the same time. In the digital industry, it is also necessary to use an atmospheric plasma surface processor. If it is used to spray the casing of digital products, it can make the bonding of the display screen more firm, and there will be no problem of glue opening, which can greatly improve the adhesion of the treated surface and effectively Prevent degumming of digital product casings. As the substrate of electronic components, the printed circuit board is electrically conductive, which presents a challenge to the processing of the printed circuit board by the atmospheric pressure process. Any surface pretreatment method, even if only a small potential is generated, will cause short circuits and thus damage. wiring and electronics. For this electronic application, the special performance of the atmospheric plasma surface treatment technology provides new possibilities for industrial applications in this field. In the manufacturing industry, it is also necessary to use a pneumatic plasma surface treatment machine. Knowing that the car must have good air tightness, the pneumatic atmospheric plasma surface treatment machine can be used to pretreat and spray some parts of the car, such as doors and windows, air conditioners, etc. Adhesive to increase the air tightness of the car, and has a good effect on waterproof and sound insulation. There are many metal products in the hardware industry. If the surface is modified with a processor, it can not only prolong its service life, but also greatly improve its wear resistance. With the development of high-sensitivity electronic components such as silicon, silicon, and high-performance semiconductors, atmospheric plasma surface processors have also been developed as a manufacturing process. The development of plasma technology in atmospheric environment provides a new application prospect for plasma cleaning, especially its fully automatic production. It can be seen that the application of air pressure plasma surface processor is very extensive, and in the near future, it may be used by more industries and the coverage will be wider. If you need to use it, you can buy it from regular manufacturers.

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COG process of plasma surface cleaning technology glass substrate flexible circuit bare chip IC

COG process of plasma surface cleaning technology glass substrate flexible circuit bare chip IC

COG process of plasma surface cleaning technology glass substrate flexible circuit bare chip IC: In the LCD panel industry, in the production process of touch screen, notebook computer display screen and other products, the connection between the display screen and the flexible film circuit used to use the hot pressing method, that is, the flexible film circuit is directly attached to the LCD by heating and pressing. On glass with connection points, this process requires the glass plane to be clean, but the glass surface is easily contaminated during actual production, storage, and transportation. If it is not cleaned, fingerprints or dust will inevitably appear. In the COG process of mounting bare chip IC on a glass substrate (LCD), when the chip is hardened at high temperature after bonding, there is a base plating layer on the surface of the bonding filler to form an analysis. There are also overflowing components of the connecting agent such as Ag paste, which contaminate the bonding filler. If these contaminants can be removed by plasma cleaning before the thermocompression bonding process, the quality of thermocompression bonding can be greatly improved. Furthermore, since the wettability of the substrate and the surface of the bare chip IC is improved, the adhesion and adhesion of the LCD-COG module can also be improved, and the problem of line corrosion can also be reduced. When the surface of the material has high requirements for smoothness, it is necessary to conduct coating, deposition, bonding, etc. through surface activation without destroying the surface finish of the material, and use plasma for activation. The wetting effect of water droplets on the surface of the material after plasma activation is significantly stronger than that of other treatment methods. We used a plasma cleaning machine to do the cleaning test of the mobile phone screen, and found that the surface of the mobile phone screen after plasma treatment was completely infiltrated by water. The current trend of assembly technology is mainly SIP, BGA, and CSP packaging, which make semiconductor devices develop in the direction of modularization, high integration and miniaturization. In such packaging and assembly processes, the major problems are organic contamination at the bonding filler and oxide films formed during electrical heating. Due to the presence of contaminants on the bonding surface, the bonding strength of these components is reduced and the potting strength of the resin after encapsulation is reduced, which directly affects the assembly level and continued development of these components. In order to improve and improve the assembly ability of these components, everyone is trying every means to deal with them. Improved practice has proved that proper introduction of plasma cleaning technology in the packaging process for surface treatment can greatly improve packaging reliability and improve yield. The advantage of plasma equipment lies in the characteristics of surface cleaning, surface modification, and product performance improvement for products.

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The RF plasma generator has the effect of concentrating the plasma on the double-substrate stage structure

The RF plasma generator has the effect of concentrating the plasma on the double-substrate stage structure

The RF plasma generator has the effect of concentrating the plasma on the double-substrate stage structure: Diamond has physical and chemical properties such as high hardness, thermal conductivity, chemical stability, and optical transmittance. These excellent properties make diamond an ideal material in many fields. For example, it can be used as an electron beam extraction window, a high-frequency high-power electronic device, a highly sensitive surface acoustic wave filter, a cutting tool, and the like. At the beginning of the preparation of diamond by the plasma chemical vapor deposition (MPCVD) method of the radio frequency plasma generator, the advantages of the MPCVD method for preparing the diamond became very obvious. The high-end diamonds in the world are basically prepared by the MPCVD method. In contrast, the MPCVD method has become an ideal method for growing diamond due to its advantages of non-polar discharge, fast growth rate, and less diamond impurities. In recent years, MPCVD technology has made great progress, and the research on the influence of diamond deposition process parameters has become mature, but the research on the resonant cavity of MPCVD device needs to be further studied. The microwave resonator is the core component of the MPCVD device. Different structures of the microwave resonator of the RF plasma generator will affect the intensity and distribution of the electric field, thereby affecting the plasma state, and correspondingly affecting the quality and rate of diamond deposition. The structural study of the microwave resonator of MPCVD device is valuable for diamond growth. Commonly used MPCVD method for diamond growth resonators are stainless steel resonator type and quartz bell type, quartz bell type is conducive to the growth of large-area diamond film, but the rate is slow and easy to contaminate the quartz tube, while the stainless steel resonator type equipment has the ability to grow. Features of fast speed. The use of cylindrical resonant cavity MPCVD equipment can increase the plasma density by increasing the deposition pressure, and realize the rapid growth of diamond films on the substrate table. The purpose of enhancing the power density is achieved by changing the position of the quartz tube, the structure of the cavity, and the flexibility of the tuning board. The quartz tube is arranged under the deposition table, and the moving range of the tuning plate and the tuning piston in the resonant cavity is increased to achieve the purpose of reducing plasma pollution and increasing the deposition rate. The relative spectral line intensity of the groups in the plasma of the RF plasma generator can reflect the degree of dissociation of the gas, and is also an important factor for the deposition rate and quality of diamond. The upper substrate stage is used as the tip in the microwave electromagnetic field. The ions move violently and continuously collide with other particles, increasing the density of the plasma. The high H spectral line intensity indicates that the plasma can generate a higher concentration of H radicals under the dual-substrate structure, and the H radicals can etch non-diamond phases such as sp'C and graphite, and improve the quality of the deposited diamond. Compared with the dual-substrate structure, the group strengths at each position under the single-substrate stage are very close, indicating that the dual-substrate stage structure has the effect of agglomerating plasma, which can make each group move closer to the range of the substrate stage. The uniformity is good in the range of the wafer stage, while the uniformity outside the range of the substrate stage is poor, and the agglomeration effect of a single substrate stage on the plasma is weaker, and the plasma is more divergent. In addition, under the double-substrate structure, with the increase of methane concentration, the intensity of C2 groups increases more significantly, which can effectively improve the deposition rate of diamond; under the double-substrate structure, the plasma electron temperature of the RF plasma generator is lower, and the internal particles The collisions are more violent, and the electron temperature decreases as the pressure rises.

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