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Plasma cleaning instrument PDMS

Plasma cleaning instrument PDMS

Polydimethylsiloxane, or PDMS for short, is an organosilicon polymer, plasma cleaning device cleaning PDMS is widely used at home and abroad. All organosilicon have a common siloxane unit, which is composed of one siloxane group. Many side groups can bind to silicon atoms, and PDMS of these side groups are CH3 methyl groups. Si-sh3 is the most common polymer, and its content is also high. A short molecule consisting of only two terminal groups (without dimethylsiloxane monomer units) is hexamethyldisiloxane, which is very important as a process gas for hydrophobic plasma coating plasma cleaning apparatus. PDMS is a linear polymer with a very large molecular weight and is liquid. But it binds to each other and thus has elastic properties. PDMS is a nearly inert polymer with high oxidation resistance that can also be used as an electrical insulating material (microelectronics or polymer electrons) in organic electronics, as well as in biological microanalysis. One of the most common applications for PDMS is in the field of microfluidic systems, where specified polydimethylsiloxane (e.g. Sylgard184) is structured upon request, plasmacytreated, and PDMS chips are permanently coated on glass panels, silicon surfaces, or other substrates. Advantages of pretreatment of plasma cleaning instrument for microflow system: Shorten processing time; PDMS is permanently attached to the substrate surface to form a non-permeable channel of the microfluidic element. The substrate surface of PDMS and hydrophilicity, and thereby completely wetting the channel; Form hydrophilic and hydrophobic waters.

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Lithium battery plasma cleaning machine processing process

Lithium battery plasma cleaning machine processing process

At present, lithium batteries are mainly used in electronic and digital products, including tablet computers, laptops, mobile phones, digital cameras and other products. Plasma cleaning machine plays a vital role in the manufacture of lithium batteries. With the rapid development of electric vehicles and the gradual rise of energy storage industry, these two fields will also be the focus of lithium battery development in the future. As for the electronic industry, after years of rapid growth, electronic and digital products are expected to show a steady growth trend in the future. With the development of electronic and digital products towards portability, higher requirements have been put forward for battery products, and the battery industry will correspondingly develop towards high energy density, large capacity and light weight. The reliability of the power battery pack is very high, not only to stable discharge, but also to ensure that all the welding line does not fall down, so the welding line welding position is particularly important. Each welding line should be inspected according to national standards, more importantly, in the welding stage to improve the adhesion, so that the welding wire is firm. Cell processing is an important part in the production and assembly process of vehicle power lithium ion batteries. Cell processing includes edge sealing and pole ear leveling. After leveling the polar ear, use a plasma cleaning machine to clean it, which can remove organic matter and small particles and improve the reliability of subsequent laser welding. The vehicle used in the power of lithium batteries is divided into positive and negative, positive and negative from the metal strip leading out of the cell, colloquially said, the battery positive and negative is the contact point when charging and discharging. Whether the contact surface is clean will affect the reliability and durability of the electrical connection. In the production process, the pole ear of lithium battery cell is often uneven, bent or even twisted, which leads to false welding, false welding, short welding and other phenomena during welding. After leveling the electrode ear, impurities such as organics and particles are removed from the electrode ear surface by plasma cleaning machine, so as to make the weld surface roughened, which can ensure good weld effect of the electrode ear. Introduction to the technological process and advantages of the plasma cleaning machine: I. Lithium battery cell core plasma cleaning machine Processing flow: Core feeding → pole ear leveling → plasma cleaning → front side of the core → reverse side of the core → plasma cleaning → core discharging Two, plasma cleaning machine advantages; Plasma cleaning is to excite compressed air or process gas into plasma through high frequency and high pressure, and then conduct physical or chemical reactions with organic matter and small particles to form a clean and slightly roughened surface with no residue after thorough cleaning. The use of plasma cleaning cost is low, almost no waste gas, green environmental protection; Plasma cleaning machine can be installed on the assembly line, and other automatic equipment seamless docking, easy to operate and monitor. Plasma cleaning is a dry cleaning, relying on the active ion in the plasma "activation" to achieve the purpose of removing stains. This method can effectively remove the dirt, dust and other substances on the end face of the battery pole column, prepare for the battery welding, and reduce the bad welding.

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Surface treatment of carbon fiber plasma improves hydrophilicity

Surface treatment of carbon fiber plasma improves hydrophilicity

As an important fiber material, carbon fiber has high specific strength, high specific modulus, high temperature resistance, corrosion resistance and other excellent properties. It has been widely used in national defense and military industry, aerospace, weapons and equipment, transportation, biomedicine and other high-tech industries. But, as a result of carbon fiber is made of flake graphite crystallite organic fiber, such as along the fiber axial inclination of microcrystalline ink material, its surface is highly crystallization and non-polarity flake graphite layer structure, chemical inertness, lead to their table interface performance is poorer, the serious influence subsequent comprehensive performance of composite materials, is limited under the specific conditions of application, plasma surface treatment technology can improve the problem. At present, surface modification of carbon fiber has become an indispensable part in the process of carbon fiber production. Manufacturers such as Toray of Japan, Mitsubishi Rayon of Japan and Siguri of Germany have used surface modification as an important indicator of carbon fibre quality. Therefore, surface modification of carbon fiber to improve its surface hydrophilic properties is the key to the production and application of carbon fiber. In the past few years, a great deal of research has been done on the surface modification of carbon fiber. Among these factors, improving the surface roughness and increasing the surface chemical functional groups are the keys to improve the surface interface properties of carbon fiber. The common methods of surface modification of carbon fiber include surface oxidation, surface coating, high-energy ray irradiation, supercritical fluid surface grafting and plasma surface modification. The electrochemical oxidation process has the characteristics of strong continuity of production and easy control of process conditions, which has been applied in industry. But it still USES a lot of chemicals, consumes a lot of energy, produces a lot of waste water and liquid, and is difficult to oxidize for high-modulus carbon fiber, requiring extended treatment time. Compared with the traditional plasma surface modification technology, it is the most widely used method with the advantages of clean environment protection, time saving and high efficiency. The working principle of plasma surface treatment mainly includes two aspects: on the one hand, free radicals and polar groups are formed on the fiber surface through active particles, so as to improve the free energy and wettability of the fiber surface; On the other hand, the surface area and surface roughness of the fiber are increased by etching to remove pollutants from the fiber surface. The surface modification of carbon fiber in aqueous solution was carried out by surface treatment of atmospheric plasma cleaning machine, and the hydrophilic modification of carbon fiber surface slurry was carried out at the same time by using the interaction between active particles and water molecules in plasma.

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Manufacturing application of semiconductor plasma cleaning machine

Manufacturing application of semiconductor plasma cleaning machine

Plasma assisted cleaning technology is a kind of precision cleaning technology in advanced manufacturing industry, which can be widely used in many industries. The following is to introduce the application of plasma cleaning technology in semiconductor manufacturing industry. Chemical vapor deposition (CVD) and etching are widely used in semiconductor processing. CVD can be used in the deposition of polysilicon thin films, silicon nitride thin films, silicon dioxide thin films, tungsten and other metal thin films. In addition, CVD technology is also used to connect the micro - three - stage pipe and the thin conductor in the circuit. After the CVD reaction, some residues will deposit in the inner wall of the CVD reaction chamber. The danger here is that these residues will escape from the inner wall and contaminate the subsequent circulation process. Therefore, before the new deposition process begins, the CVD chamber needs to be cleaned with a plasma cleaning machine to maintain the qualified product output. Commonly used cleaning gas is F containing gas such as PFCs and SF6, which can be used as plasma generated gas to clean Sio2 or Si3N4 on the wall of CVD chamber. During the recirculation process, the F atomic energy decomposed by FFC under the action of plasma etched the electrode, the residue on the chamber wall, and the residue on the hardware devices in the chamber. In the plasma cleaning machine cleaning process, a considerable part of the FFC in the chamber did not dissociate into active F atoms. Unless emission reduction technology is adopted, this unreacted gas containing F will eventually escape into the atmosphere. Since these gases are present in the atmosphere for a long time, contributing significantly to global warming and producing four orders of magnitude more heat than carbon dioxide, the International Environment Organization has been developing technologies to reduce their emissions since 1994. Nitrogen has little influence on greenhouse effect and can replace the gas containing F above. Another step in the semiconductor industry is to use a plasma cleaner to clean photoresist made of photosensitive organic material on the surface of the element on the silicone sheet. Before the start of the precipitation process, the remnants of photoresist must be clean, using hot sulfuric acid and hydrogen peroxide solution or other toxic organic solvent to degumming of colloid, it leads to environmental problem, but using plasma cleaning machine to clean, can use the gases such as sulfur trioxide degumming, thus reducing the dependence on chemical solvents and organic solvent. For general manufacturers, the use of plasma to remove adhesive technology, chemical solution can be reduced by more than a thousand times, not only environmental protection, and save a lot of money for enterprises.

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Plasma automatic cleaning machine ion and ionization degree

Plasma automatic cleaning machine ion and ionization degree

In general, the basic particles of plasma consist of electrons, ions and neutral particles. Let the electron density be Ne, the ionic density be Nj, and the density of neutral particles be Ng. Obviously, for a plasma with a single atmosphere and only first-order ionization, Ne=Ni exists, and n can be used to represent the density of any charged ion in the two, abbreviated as plasma density. Of course, mixed gas plasma or plasma with multiorder ionization may contain different valence ions or different kinds of neutral particles, so the electron density and ion density in the equiionization body are not the same.   When α<0.01, it is called weak ionization plasma. When 1> α> is 0.01, it is called strongly ionized plasma. When α=1, it is called a fully ionized plasma. In thermodynamic equilibrium systems, where there is an equilibrium between ionization and ion recombination, ionization degree α depends only on the type, density, and temperature of the particles. The following table shows the variation of ionization degree α of nitrogen plasma with temperature under the condition of thermal equilibrium at atmospheric pressure. As can be seen from the table, with the increase of temperature, the ionization degree increases rapidly, but if you want to get the plasma automatic cleaning machine plasma ionization, it must reach tens of thousands of degrees of high temperature. Variation of nitrogen plasma ionization α with temperature at atmospheric thermal equilibrium. T/K α 300 10^-122 5000 3.2×10^-7 10000 0.0065 15000 0.22 20000 0.82   There is a equilibrium between ionization and recombination in plasma. If the equilibrium is reached at temperature T, the relationship between ionization degree α and ionization conditions can be described by the Equation of Saha (Mcghnad Saha, 1893~1956, Indian astrophysicist).   P stands for pressure (Torr, 1 Torr=1.333 22×10^2Pa); T is for temperature (K); W stands for ionization potential (eV) of gas molecules (atoms); K represents Boltzmann constant (1.380 6505×10^ -23j/k); Alpha stands for ionization. Lowering the gas pressure, using a gas with a low ionization potential, or using a high electron temperature all contribute to increased ionization.

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Plasma processor applications in the medical industry

Plasma processor applications in the medical industry

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