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Plasma equipment cleaning machine plasma treatment PMMA/MMT composite micron fiber for immobilization of laccase

Plasma equipment cleaning machine plasma treatment PMMA/MMT composite micron fiber for immobilization of laccase

Plasma equipment cleaning machine plasma treatment PMMA/MMT composite micron fiber for immobilization of laccase: Laccase is a kind of copper oxide, which promotes the oxidation of various aromatic materials while reducing oxygen in the solution. The specificity of laccase and its ability to degrade many pollutants indicate that it has great potential in the field of sewage treatment and bioremediation. Fixing laccase on a water-insoluble substrate can improve its stability and can be reused. Electrospinning is a novel and universally applicable method for preparing nano or micro fibers. The ultra-high specific surface area and porosity of nanofibers make microfibers an ideal material for enzyme immobilization substrates. The surface of electrospun PMMA micron fibers has a microporous structure, which further increases the specific surface area of ​​the micron fibers. Montmorillonite (MMT) is one of the silicate minerals. It has a unique layered one-dimensional nanostructure. Each unit cell consists of two silicon-oxygen tetrahedral layers and aluminum ( Magnesium) oxygen (hydrogen and oxygen) octahedron structure. The thickness of each layer is about 1nm, has a large specific surface area and a diameter-to-thickness ratio of up to 20, and has high rigidity, and it is not easy to slide between layers. The upper and lower surfaces of montmorillonite are all oxygen atoms, and the layers are only combined by van der Waals forces, so the connection force is very weak. Therefore, water or other polar molecules can easily enter the interlayers, causing the layer bonds to break, and the layer spacing Increase, resulting in directional expansion of the crystal lattice. Therefore, montmorillonite is an expansive clay mineral, and its swelling degree is related to the types of exchangeable cations. DMMA/MMT composite micron fiber is prepared by high-voltage electrostatic spinning method, and its surface is treated with plasma equipment cleaning machine plasma technology to improve the immobilization rate of laccase. Micropores are evenly distributed on the surface of the original fiber. This micropore has a certain effect on the adsorption of laccase. The micropores on the surface become blurred after the original laccase is adsorbed. This may be because the immobilized laccase will affect the surface The micropores are covered. After plasma treatment with a plasma equipment cleaner, the micropores on the fiber surface become larger and free oxygen groups are now available, which makes the fiber surface easy to combine with water molecules and improves the hydrophilicity of the fiber surface. The fiber after plasma treatment by the plasma equipment cleaner has greatly increased the adsorption of laccase. This is because the hydrophilicity of the fiber surface is increased, which is beneficial to the combination of laccase and the fiber. The electrospun PMMA/MMT composite micron fiber was successfully used for the adsorption of laccase after plasma treatment. The plasma treatment of the plasma equipment cleaning machine greatly improves the hydrophilicity of the fiber, thereby promoting the adsorption of laccase. Infrared analysis showed that laccase formed a chemical bond with MMT in the fiber.

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The application of vacuum plasma machine in semiconductors solves three major technological problems

The application of vacuum plasma machine in semiconductors solves three major technological problems

The application of vacuum plasma machine in semiconductors solves three major technological problems: People in the field of vacuum plasma machines know that vacuum plasma machines are widely used in industries such as semiconductors, biology, medical treatment, optics, flat panel displays, etc. It uses some active components to process samples. The surface layer achieves the functions of cleaning, cleaning, modification and so on. The application of vacuum plasma equipment in the semiconductor industry has a certain foundation, because a series of problems such as oxidation and humidity occurred during the filling process during the manufacturing process, so people in the LED industry thought of using vacuum plasma machine cleaning to achieve Good sealing, reducing current leakage, and providing good bonding performance. In addition, the electronic products processed by the vacuum plasma machine can also improve the surface energy, trace its hydrophilicity, and improve the adhesion. The application of vacuum plasma machine technology in the semiconductor industry has been well known by many industrial product manufacturers, and it is believed that it will also be popular and admired in the electronics industry. This is the application of vacuum plasma machines. At present, many semiconductor manufacturers in China are already using this technology. To deal with the material, then I will explain which three major process problems are solved by its application in semiconductors. Process problem 1. Die bonding pre-treatment The bonding between the chip or silicon wafer and the package substrate is often two materials with different properties. The surface of the material is usually hydrophobic and inert, and its surface bonding performance is poor. The interface is prone to voids during the bonding process. Sealed and packaged chips or silicon wafers bring great hidden dangers. Silicon wafer cleaning machines industrial plasma cleaning machines can perform plasma treatment on the surfaces of chips and packaging substrates, which can effectively increase their surface activity. Vacuum plasma machines greatly improve adhesion. The fluidity of the epoxy resin on its surface improves the bonding wettability of the chip and the package substrate, reduces the delamination between the chip and the substrate, improves the thermal conductivity, improves the reliability and stability of the IC package, and increases the life of the product. Process problem 2. Surface treatment of lead frame In the field of microelectronics packaging, lead frame plastic packaging is still used, which still accounts for 80%. Copper alloy materials with good thermal conductivity, electrical conductivity, and processing performance are mainly used as lead frame copper oxides and other organic pollutants will cause sealing molds. The delamination of the plastic and copper lead frame will cause poor sealing performance and chronic gas leakage after packaging, and will also affect the bonding and wire bonding quality of the chip. To ensure the cleanliness of the lead frame is to ensure the reliability and yield of the package. The key is that the cleaning and activation of the lead frame surface after cleaning by the industrial vacuum plasma machine will greatly improve the yield of the finished product compared with the traditional wet cleaning, and it will avoid waste water discharge and reduce the cost of chemical medicine procurement. Process problem 3. Optimize wire bonding (wire bonding) The quality of integrated circuit wire bond pads has a decisive influence on the reliability of microelectronic devices, and the bonding area must be free of contaminants and have good bonding characteristics. The presence of contaminants, such as chlorides and organic residues, will severely weaken the pull value of the wire bond pad. The wet cleaning of the traditional industrial cleaning machine does not completely remove or can not remove the contaminants in the bonding area. However, the vacuum plasma machine equipment cleaning of the plasma manufacturer can effectively remove the surface contamination of the bonding area and activate the surface, which can obviously Increasing the bonding tension of the lead wire greatly improves the reliability of the packaged device. The mechanism of the vacuum plasma machine mainly relies on the "activation" of the active particles in the plasma to achieve the purpose of removing stains on the surface of the object. In terms of reaction mechanism, plasma cleaning usually includes the following processes: inorganic gas is excited into a plasma state; gas phase substances are adsorbed on the solid surface; adsorbed groups react with solid surface molecules to form product molecules; product molecules resolve to form a gas phase; reaction The residue is detached from the surface. The great feature of vacuum plasma machine technology is that regardless of the type of substrate to be processed, it can process metals

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What are the benefits of plasma equipment pretreatment of engine guard plate before epoxy foaming

What are the benefits of plasma equipment pretreatment of engine guard plate before epoxy foaming

What are the benefits of plasma equipment pretreatment of engine guard plate before epoxy foaming: The material of the engine guard plate includes hard plastic, steel, aluminum alloy, plastic steel, etc. The foam plastic is usually used for surface pretreatment with plasma equipment before foaming to increase adhesion and reliability. Plasma surface treatment can completely remove dirt, activate the surface, and improve bonding quality. The main function of the engine guard plate is to protect the engine and prolong the service life of the engine. Its materials include hard plastic resin, iron or manganese alloy guard plate, aluminum alloy, plastic steel "alloy" guard plate, etc. Epoxy foaming of engine guard plate is to form good sealing effect, high weather resistance and high reliability requirements. Plasma surface treatment by plasma equipment can completely remove contaminants on the surface of the material, activate the surface, and improve the quality of bonding. Plastics are increasingly used as engine guards, and the main chemical composition of plastics is modified polymers, also known as modified copolymer PP. It has excellent performance, convenient processing, and wide range of uses. Because of its excellent physical properties such as rigidity, elasticity, corrosion resistance, and aging resistance, it is an ideal substitute for non-ferrous metals such as copper, zinc, and aluminum. Function hinders. However, the surface energy of polypropylene material is low, and the reliability of combining it with glue without special primer will be reduced. These glues are expensive to use, and VOC gas will be generated at high temperatures, causing harm to the human body; plasma surface treatment technology is environmentally friendly , Low cost of use and other advantages, more and more attention by engine guard plate manufacturers! Before the plasma treatment of the plasma equipment, the surface energy of PP is low, it is not easy to stick to water, and it is in the shape of water droplets. The surface of PP treated by plasma equipment is enhanced, and the water droplets are easy to spread and spread out completely. The change of water droplets on the surface of the engine guard plate, users report that the adhesive foaming effect has been significantly improved, this process is very worth recommending! The above description of the benefits of plasma surface treatment of the plasma equipment before epoxy foaming of the engine guard plate. Do you have any different opinions or suggestions on this? Welcome to leave a message to communicate and share with us! If you are interested in plasma cleaners or want to know more details, please click Chengfeng Zhizao online customer service consultation, Chengfeng Zhizao is waiting for your call!

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Who is to blame for the vacuum-type plasma cleaner that cannot be pumped down

Who is to blame for the vacuum-type plasma cleaner that cannot be pumped down

Who is to blame for the vacuum-type plasma cleaner that cannot be pumped down: During the use of the vacuum plasma cleaner, there may be such a phenomenon: the equipment is operating normally, and after replacing the new product, the vacuum increases and cannot be pumped down. Why? Have you discovered the mystery? I will share with you now for reference only. To determine whether the vacuum plasma cleaner vacuum chamber can be pumped backward, such as 30Pa, within 50S when the vacuum chamber is empty, and when processing other products, the equipment does not give an alarm, indicating that there is no problem with the pumping capacity of the vacuum pump. And there is no air leakage in the entire vacuum generating system. Judging from the operating conditions of the vacuum plasma cleaner equipment, the operation of the equipment is stable. If the background vacuum cannot be pumped to the alarm within a set time, such as 200S, it is mainly related to the material of the product being processed. We usually call it "material leakage". If the substance contains volatile substances, such as moisture, solvents, plasticizers, etc., and the vacuum escapes, the vacuum will decrease, which is called outgassing. Material leakage is the leakage rate of the material. Each material is different, and it is mainly determined by the density of the substance. The higher the density, the higher the leakage rate of the substance, and the lower the leakage rate of the substance; the higher the density of the substance molecule. The smaller the gap between, the smaller the density, the larger the gap between the material molecules, and the gaps between the molecules contain gas. In a vacuum state, the smaller the molecular gap inside the substance, the gas slowly flows from the inside of the substance to the outside. Exhaust until the pressure balances, this process is relatively slow, so after the vacuum plasma cleaner is evacuated to a certain degree, the vacuum degree is reduced. The speed of the vacuum degree reduction is related to the quantity of discharge, and the discharge speed also has Relationship, the more the number of times of feeding, the slower the speed of feeding will decrease. If there are volatile substances in the cavity, it can also cause the vacuum to be slow. Such as permeable material-sponge permeable material-copper wire skeleton. Moreover, the vacuum plasma cleaning machine is limited by the overall structure, and generally cannot be modified. The ideological analysis can be solved by increasing the pumping capacity. However, if the product is reduced after the pumping is increased, the vacuum will be reduced, and the power supply will be reduced. The load will increase, and it will be unstable, it is easy to burn out the power supply and matching device, causing unnecessary losses. Generally, the method of extending the vacuum time (changing the system parameters) and reducing the number of venting is used to ensure the normal operation of the equipment; other similar products can also be used, such as cleaning with the equipment. Therefore, before purchasing a vacuum plasma cleaner, you should conduct tests based on samples, and fully consider the impact of material infiltration on the vacuum of the equipment, otherwise it will be difficult to meet the processing requirements of the required products. If the ordered equipment cannot be upgraded or modified, it can only be solved by reducing the amplifier and increasing the pumping time. The explanation of the above-mentioned material leakage affecting the vacuuming of the vacuum plasma cleaner is helpful to you, what other experiences and experiences do you have, please leave a message to communicate and share with us! If you are interested in plasma cleaners or want to know more details, please click Chengfeng Zhizao online customer service consultation, Chengfeng Zhizao is waiting for your call!

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Can plasma treatment equipment enhance ionization? What are some good methods

Can plasma treatment equipment enhance ionization? What are some good methods

Can plasma treatment equipment enhance ionization? What are some good methods: The ionization phenomenon in plasma processing equipment is closely related to the movement of electrons, and enhanced ionization also has a great impact on the effect of plasma processing. Then, how can the ionization effect of plasma processing equipment be enhanced? There are two existing proof methods, one is obtained through the reasonable coordination of the time between the electron and the field position in the elastic collision, and the other is obtained through the "surfing" effect.  For the mechanism of electron acceleration, the ideal condition is that when electrons collide with argon atoms elastically and turn in the electric field, the speed and energy of the electrons will increase; if the above conditions are met, the electrons can obtain ionization energy, even if the electric field strength is very weak. , It can also get ionization energy. In this mechanism, the ideal range of electric field frequency is usually around several thousand MHz. Some scholars have extended this mechanism. They believe that the secondary electrons emitted from the wall and the cathode enter the photodischarge area after being accelerated, and become an additional source of electrons, which is a phenomenon of secondary electron multiplication. When the secondary electrons are released, if the electric field is reversed to achieve the same phase, the ionization can be effectively enhanced. The impulse effect is another evidence mechanism of ionization enhancement. It is generally believed that under the action of a high-frequency alternating electric field, the "impulse" phenomenon of electrons at the interface of the electrode sheath of the plasma treatment equipment can effectively enhance ionization, which is generally expressed as plasma The sheath voltage and sheath of the body treatment equipment fluctuate continuously. Existing calculations and demonstrations show that electrons obtain energy through sheath oscillation, and "surfing" electrons will have a positive effect on the ionization process. Chengfeng Zhizao has been focusing on plasma processing equipment for 20 years. If you have any questions, please click "Online Customer Service" for consultation. Chengfeng Zhizao is looking forward to your call!

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What is the difference between the treatment of the PTFE microporous membrane by the plasma cleaning machine and the untreated

What is the difference between the treatment of the PTFE microporous membrane by the plasma cleaning machine and the untreated

What is the difference between the treatment of the PTFE microporous membrane by the plasma cleaning machine and the untreated: In the production of PTFE microporous membranes, plasma cleaning equipment is often used to modify the surface of various materials, such as: sterilization membranes, electrolytic membranes, gas dialysis membranes, ultra-clean membranes, mountaineering clothes, breathable tents, raincoats, etc. . So, what is the relationship between cleaning equipment and PTFE microporous membrane? What is the change of PTFE microporous membrane after treatment by plasma cleaning machine equipment? Due to the low surface energy of the PTFE microporous film itself, it often faces problems of hydrophobicity and adhesion during the application process. If the above problems cannot be completely solved, plasma cleaning equipment can be used for treatment. In the plasma surface modification, plasma grafting modification technology is used more to reduce the contact angle between the surface of the PTFE microporous membrane and water, so that It becomes a hydrophilic material and can also make the surface of the PTFE microporous membrane oleophobic. The surface modification of the PTFE microporous membrane is carried out by plasma cleaning equipment. In a vacuum environment, the plasma generator is used to generate glow discharge from the gas to generate high-energy particles, and carry out a series of physical or chemical reactions with the PTFE microporous membrane. Not only retains the excellent properties of PTFE materials, but also makes PTFE microporous membranes have new hydrophilic, oleophobic and other characteristics, adapting to a wider range of application scenarios and uses. Chengfeng Zhizao has focused on the research and development of plasma technology for 20 years. If you want to know more product details or have questions about the use of the equipment, please click "Online Customer Service", and Chengfeng Zhizao is waiting for your call!

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