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Plasma sheath for car Cleaning Machine

Plasma sheath for car Cleaning Machine

Plasma, when in contact with to the wall, the electrode in the interface can form a thin layer of electrically neutral be destroyed, the deviation of neutral thin layer known as the plasma sheath, also known as the plasma car washer plasma sheath layer, sheath layer formation is closely related to the plasma shielding effect, plasma is disturbed, the space charge generated by the debye shielding layer.   The plasma sheath can be formed on the surface of the electrode or the wall of the plasma. According to the relationship between the electrode or the wall potential and the plasma potential, the plasma sheath can be divided into ion sheath and electron sheath. The sheath near the electrode of the plasma car cleaning machine: plasma potential is set as Vp and electrode potential as Vs. When the difference between electrode potential Vs and plasma potential Vp is all reached, the external circuit will be connected, and the electrode will have current flowing, which is equivalent to introducing an external electric potential to act on the plasma. When VsNe). With the enhancement of the electric field, a space charge layer composed of ions will be formed within a certain distance from the electrode, namely, the ion sheath. When Vs>Vp, the electric field formed near the electrode will attract electrons and repel ions, and the result is that the electron density is higher than the ion density (Ne>Ni). With the increase of the electric field intensity, a space charge layer composed of electrons, namely the electron sheath, will be formed within a certain distance from the electrode.   The sheath at the floating substrate: when the plasma is inserted into the PLASMA of the PLASMA washer, the charged particles that reach the surface of the insulator either compound with each other at the surface or return to the plasma area because the current cannot pass through. In plasma, as the motion velocity of electrons is greater than that of heavy particles, there will be net negative charge accumulation on the surface of the insulator, that is, the surface is negative potential relative to the plasma area. The negative potential of the surface area repels subsequent electrons moving towards the surface and attracts the positive ions until the negative potential of the surface of the insulator reaches a certain value, equating the current of the ion with the current of the electron. At this time, the surface potential Vf of the insulator tends to be stable, and the difference between Vf and plasma potential (VP-VF) remains constant. There is a space charge layer near the surface of the insulator, and this space charge layer is the ion sheath. Since the insulator in plasma is often referred to as a floating substrate, the potential of the insulator is often called a floating potential. It is obvious that the floating potential is a negative value, and the junction between the floating substrate and the plasma forms a space charge layer composed of positive ions. So any insulator, including the reactor wall, placed in a plasma will form an ionic sheath.   Plasma sheath is one of the important characteristics of plasma body weight. The specific performance of plasma sheath in plasma car cleaning machine is closely related to system temperature T and particle density N. Some important properties of plasma can be understood by studying sheath.

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Application of plasma cleaning before adhesion in TP adhesion

Application of plasma cleaning before adhesion in TP adhesion

In the production process of camera modules, plasma plasma cleaning process can significantly improve the quality of camera modules. In the production process of the new generation of camera modules, plasma cleaning is an essential link. Plasma cleaning is widely used in the pre and post links of camera modules DB, WB and HM, and before TP bonding, greatly improving the binding, bonding strength and uniformity.   With the emergence of more and more terminal products, based on the public aesthetic and market demand, the screen takes up an increasing proportion of the width, various "narrow frame", "ultra-narrow frame", "no frame" and other concepts have also swept the whole industry, the pursuit of consumers is no less than metal and glass fuselage. However, due to the current limitations of liquid crystal and structure technology, it is difficult to realize the real bezel-less mobile phone in industrial design, and it is far from being popularized. By contrast, the "narrow border" and "ultra-narrow border" technologies are comparable in terms of structural stability and user experience. Moreover, this technology benefits from the extensive application in terminal products in the past two years, which is relatively mature compared with curved screen technology.   However, there are still some details in the production of ultra-narrow border. Because this technology minimizes the frame as much as possible, the binding surface of TP module and mobile phone shell will be smaller (width less than 1mm), which also leads to problems such as poor adhesion, glue overflow and uneven expansion of hot melt adhesive in the production process. It is worth noting that plasma processing technology has found a way to solve these problems that beset both component and terminal plants. The application of plasma surface processor in the process of fitting the TP module mentioned above with the mobile phone shell has been greatly improved after plasma surface treatment.   The plasma and the surface of the material have microphysical and chemical reactions (the depth of action is only tens to hundreds of nanometers, which will not affect the properties of the material itself), so that the surface of the material can be greatly improved, thus increasing the adhesion between the product and the glue. After plasma processing, the TP module shows the following advantages: 1. Enhanced surface activity, stronger adhesion to the shell, avoiding degumming; 2. The hot melt adhesive is evenly spread to form a continuous adhesive surface, and there is no gap between TP and the shell; 3, due to the increase in the surface energy of the hot melt adhesive, it can be spread thin without weakening the adhesive force, at this time can reduce the amount of glue applied, reduce the cost (about 1/3 of the glue used); In addition, compared with similar cleaning machine equipment, plasma surface processor has obvious advantages in processing technology.   First, the plasma flame width is small, can be designed to 2mm processing range, does not affect other areas do not need to be treated, to reduce accidents;   Second, the temperature is low, in normal use conditions, the plasma flame temperature at room temperature or so, will not reflect the film, LCD and TP surface caused high temperature damage;   Third, the equipment adopts low potential discharge structure, the flame is electrically neutral, does not damage the TP and LCD functions, the product after continuous processing, will not affect the TP capacity and display performance.   With the development of smart phones today, every time the terminal manufacturers launch a product, they must pursue high-quality experience on the basis of the past. For module enterprises, although different processes used in the traditional production process can complete the same production task, but through the continuous improvement of the entire production process, to achieve the overall increase in product yield, is the goal that should be achieved.

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Plasma cleaning instrument Atmospheric pressure DIELECTRIC barrier discharge plasma

Plasma cleaning instrument Atmospheric pressure DIELECTRIC barrier discharge plasma

Dielectric barrier discharge (DBD), referred to as DBD discharge, is a kind of gas discharge with insulating medium inserted between discharge electrodes. The medium may be overlaid on the electrode or suspended in the discharge space. In this way, when a high enough ac voltage is applied to both ends of the electrode, the gas between the electrodes can be broken down under high pressure, forming a so-called DBD discharge. The plasma washer discharge is similar to glow discharge, which is uniform, diffuse and stable. It is actually composed of many small fast pulse discharge channels. Generally, the pressure of discharge gas can reach 1 ATM (1 ATM = 1.013X 10^5 Pa), so DBD discharge belongs to non-thermal equilibrium discharge under high pressure, which is also known as silent discharge.   The common DBD discharge device of plasma cleaning instrument is usually composed of two parallel electrodes, and at least one electrode is covered by dielectric material. In order to ensure the stability of discharge, the two electrodes are spaced at several millimeters apart, and sinusoidal or pulsed high-voltage power supply is needed to realize atmospheric discharge. DBD discharge reactor consists of three parts: high voltage electrode, electric dielectric and ground electrode. The structure of single-gap single-dielectric barrier discharge reactor is characterized by that the dielectric is connected with the high-voltage electrode and the discharge area is between the grounding electrode and the dielectric. The structure is simple and is often used to produce ozone. Double gap single dielectric barrier discharge reactor is characterized by two different reaction zones formed between the upper and lower electrodes of the plasma cleaning apparatus and the medium, which are generally used to produce plasma with two different components. The structure of single-gap dual-dielectric barrier discharge reactor is characterized by the fact that the reaction takes place between two layers of dielectric, so as to avoid the influence of electrodes on the reaction, especially for corrosive gases and the reaction that needs to produce high-purity plasma in a closed environment. This structure has outstanding advantages. In addition to parallel plate structure, DBD discharge device also has line simple structure and surface structure.   Atmospheric DBD discharge plasma usually presents filament discharge or glow discharge characteristics. When high pressure is applied at both ends of the electrode, the gas near the cathode ionizes under the action of electric field to produce electrons. These electrons accelerate in the electric field before the gas is completely broken down. When the energy reaches or exceeds the ionization energy of the gas, the electrons multiply in each ionization collision and form an electron avalanche. Electrons are more mobile than ions, allowing them to pass through gas gaps in the measurable nanosecond range. When the electron avalanche is formed in the gas gap and generates directional movement, ions will be trapped behind due to slow movement speed and will form accumulation in the discharge space. The generation of space charge distorts the electric field in the discharge space, so that the electric field intensity of the air gap between electrodes equals or exceeds the breakdown field intensity of the surrounding gas. Therefore, the gas ionization increases sharply in a short time, leading to the occurrence of a single filament discharge.   A single filamentation discharge occurs at one location in the discharge gas gap and at other locations at the same time. It is the insulating nature of the medium that enables this filament discharge to occur independently in many discharge Spaces. When the voltage at both ends of the filamentous discharge is lower than the breakdown voltage, the current is cut off. Only when the breakdown voltage is reached again at the same position can the plasma cleaner re-breakdown and a second filameter discharge occur at the original place. Each filamentous discharge is only a few dozen to a few hundred nanometers in diameter, and the roots of these filaments are attached to the dielectric layer and create bumps and bumps on the surface. The existence of concave-convex points on the surface of the dielectric layer increases the local electric field intensity and makes the discharge more likely to occur, which is commonly referred to as the cusp discharge. A micro-discharge process is actually a process in which streamer discharge occurs and disappears. The so-called streamer discharge is a discharge phenomenon in which a local area of the discharge space is highly ionized and rapidly transmitted. In DBD discharge, it is usually divided into three stages: discharge breakdown, streamer development and discharge disappearance.   As a simple and easy to operate atmospheric pressure

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Medical applications of plasma-activated treatment equipment

Medical applications of plasma-activated treatment equipment

In some cases, surface modification and activation of cultured cells are necessary to improve cell adhesion and cell growth rate. Under special conditions, cell adhesion was a necessary condition to ensure cell proliferation, and the cell proliferation rate of the culture dish treated by plasma activation equipment was significantly higher than that of the untreated culture dish. The results show that the modification and activation of polyester, polyethylene and K resin by plasma can significantly improve their adhesion properties.   Compared with other materials, the surface friction coefficient of polymers such as silicone and polyurethane is higher. After plasma surface activation treatment, the instrument made of this material is coated with a layer of polymer with low friction coefficient to make its surface more lubricated. For example, after plasma surface activation, the adhesion of hydrogel coating on the surface of medical catheter can be improved, thus reducing the friction between the medical catheter and the blood vessel wall. Catheters for the urethral, respiratory, tracheal, and cardiovascular systems, or instruments for endoscopic/laparoscopic surgery, and ophthalmic materials, when in contact with body fluids, have a good hydrophilic properties, so that when body fluids come into contact with the surfaces of these smooth medical devices, they do not stick to their surfaces. Plasma ionized gases can reduce this friction coefficient on the surface. Small friction coefficient of medical devices, when inserted or removed from the patient's body, can reduce the mechanical damage to the patient's mucosa, reduce the patient's discomfort. Plasma technology in combination with other technologies, especially xylene polymer coating, has been successfully used in the manufacture of a variety of medical devices, such as ophthalmology and imaging surgery.   Film deposition method is used to deposit a barrier layer on the surface of plastic products to reduce the permeability of liquid such as alcohol to the surface of plastic products. For example, treating high-density polyethylene (HDPE) with plasma-activated equipment reduces the material's permeability to alcohol by a factor of 10. Due to the interaction between blood and certain chemical components in biological materials, blood clotting can be caused and human health is jeopardized. Therefore, implants made of biological materials such as silicone rubber, polyester, polytetrafluoroethylene, polyurethane and PVC can only stay in the blood for a short time. For example, dioctyl phthalates (DOP) and certain stabilizers in PVC blood bags are slowly released from the PVC base and react with the blood, causing blood to clot. After plasma treatment of PVC material, a cross-linked film is formed on the surface. The film is biocompatible, which can adjust the dispersion degree of the film within a small range and play a role in controlling the transmission of substances such as stabilizer.   Plasma-modified and activated membrane materials can improve the selectivity of diffused materials. Generally, it is necessary for membrane materials to have high permeability and high selectivity to permeable materials. By controlling the pore size and combining with chemical action or physical restriction, the membrane surface selectivity can be improved, which is beneficial to the application of biological separation process in hemodialysis and protein purification.   In general, diagnostic biosensors often require biological components such as enzymes or antibodies to be fixed to the surface of the sensor. Plasma grafting and surface functional activation treatment provide a convenient and effective method for establishing covalent bonding between biological components and substrates.

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PCB plasma etcher Introduction

PCB plasma etcher Introduction

Traditionally, PCB manufacturers have used corrosive solvents, such as strong acids, to etch and clean holes in printed circuit boards. Many different chemicals are used to clean the holes, but all of these chemicals can cause harm to the environment and can easily harm workers.   Etching with chemical reagents:   The traditional PCB board manufacturing method is chemical etching. Some parts of the copper foil are protected by an etching inhibitor consisting of tin, tin, and lead, while the rest of the copper is etched away. The process USES an ammonia-etched solution to remove the copper, which does not corrode tin or lead, so the copper remains a "conductor" beneath the tin, or a path for electrons to travel along the entire circuit board. The quality of the chemical etching can be defined by the integrity of the copper removal that is not protected by the anticorrosion agent. The quality also refers to the straightness of the trace edge and the degree of etched bottom cutting.   Etching bottom is caused by non-directional etching of chemicals. Once downward etching occurs, lateral etching is allowed. The smaller the bottom cutting is, the better the quality will be. These base cuts are measured and called "etching factors". All the steps of the etching process are linked together, and the quality of the etching can be the result of the etching solution or the anticorrosive agent used. Chemical etching USES many harmful chemicals and is not an environmentally friendly etching process.   Use plasma for etching:   Plasma etching is an environmentally friendly etching method popular in the 1980s to remove gum residue from PCB holes. A plasma formed in a vacuum by ionizing gas particles using a radio frequency of 13.56MHz is the fourth state of matter. Plasma PCB technology can improve the quality of etching and the removal effect of through hole pollutants. As its name suggests, PCB plasma etcher is an etching technique that produces plasma under strict conditions and is used to clean the residue from drilling holes in the PCB.   To fully understand PCB etching technology, it is necessary to master the working principle of plasma etching machine. The plasma etcher is composed of two electrodes to generate RF and a ground electrode. Generally there are four gas inlets, oxygen, CF4 or some other etched gas coming into the system through these gas inlets. Depending on the etching material, the mixture of gases is required to treat the different materials. Radio frequency ionized gas particles are applied during gas entry into the system. 13.56MHz is considered as the standard frequency of plasma formation. Rf excitations excite gaseous electrons and change their state, and the machine generates high-speed plasma pulses to etch the material. In the process of chemical reaction, PCB plasma etching system will produce volatile compounds as by-products, and it usually takes little time for the plasma to clean the hole residue on the circuit board.   Plasma is also commonly used in the lead frame of the cleaning chip package. The lead frame transmits electrical signals to the outside of the package. All organic matter must be removed before it can be added to the package.   According to the type of material to be etched, the nature of the gas used and the required type of etch, there are many types of plasma etch on PCB. The working temperature and pressure also play an important role in plasma etching. Small changes in working temperature and pressure can significantly change the electron collision frequency. RIE(reactive ion etching) USES physical and chemical mechanisms to achieve unidirectional high level surface etching. Because the RIE process combines physical and chemical processes, it is faster than plasma etching alone. High-energy ion collisions strip electrons from the plasma and allow the use of positively charged plasma for surface treatment.

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Application of plasma cleaning machine in packaging plasma coating process

Application of plasma cleaning machine in packaging plasma coating process

Silica can be obtained by oxidizing silica vapor in an oxygen plasma. The anodic arc process USES consumable silicon metal placed in a furnace as the anode for the vacuum arc. If a DC voltage of 20~30V is applied between the metal cathode and the furnace, continuous arc discharge will occur between the cathode and anode as long as there is a vapor mass in front of the cathode. This discharge can produce a highly active plasma in a vacuum furnace, at which point the silicon atoms in the highly excited state are vaporized and move towards the packaging substrate, which rotates continuously on the upper part of the vapor cloud. At this point, if oxygen is added to the steam, a layer of silica will be deposited on the surface of the encapsulated substrate.   The polymerization process is the process of forming organic or inorganic polymer coating on the substrate. The process belongs to the category of plasma enhanced chemical vapor deposition. In the PECVD process, the vapor containing the required components is introduced into the plasma. The electrons in the plasma ionize the molecules or decompose them into free radicals. The generated active molecules can undergo chemical reactions on the surface or in the gas phase environment and form thin films through deposition. The nucleation process depends on the appearance of the material surface and whether there are foreign atoms on the surface. The dense film produced by the above process is hydrophobic and has no pores. However, in order to produce high quality films in a short time, process parameters must be optimized, especially in the application of barrier layers. Organosilicon films can be obtained by cracking organosilicon resins in a plasma environment. If the silicon atoms react with oxygen, nitrogen or their mixture of gases, silica, silicon oxide or silicon nitride films can be deposited. Organic gases such as acetylene are used as the precursor reactants of diamond-like carbon films.   Compared with the traditional chemical vapor deposition (CVD) process, the plasma pulsed CVD process is an improved one. Pulsed plasma can be generated by applying a pulsed signal to a power source (usually a radio frequency or microwave power source). Pulsed plasma allows ions to have lower energy in the packaging coating process. The coating is gradually thickened through a series of small-scale treatments to form a highly dense and uniform coating. In addition, the chemical composition of the reaction mixture can be changed between the two pulses. Therefore, multiple layers of different properties can be coated in the same process operation, resulting in customized multi-layer coating systems. Using plasma chemical vapor deposition of silicon dioxide and titanium dioxide prepared by coating technology has been widely used in all kinds of plastic surface modification, terephthalic acid glycol polyester (PET) and poly (methyl methacrylate (PMMA), polycarbonate (PC), copolymerization cyclic olefin (COC), polypropylene (PP) and high-density polyethylene (HDPE)) of the surface modification.

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