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Plasma treatment can significantly improve the coating of polymer ceramic materials, metallic glasses or diamond-like material

Plasma treatment can significantly improve the coating of polymer ceramic materials, metallic glasses or diamond-like material

Plasma treatment can significantly improve the coating of polymer ceramic materials, metallic glasses or diamond-like materials: Plasma processing offers the possibility to obtain innovative finishing functions on one or both sides of fabrics. A suitable plasma device configuration can be used to treat a single piece of clothing or shoe, creating a huge opportunity for branding and marketing. The big advantage of plasma treatment is that it provides an option for dry processing of textile materials. Solvent-based processing equipment uses organic solvents. The cost is much higher than water, and the equipment must be equipped with an efficient solvent recovery system to meet the necessary economic and environmental demands of the process. The processing technology using water as the medium will generate a large burden of wastewater pollution, resulting in an increase in the cost of wastewater treatment and disposal. Furthermore, removing moisture from textile materials is an energy-intensive process. Usually, the moisture in textile materials is removed as much as possible by mechanical dehydration, such as centrifugal dehydration, open-width calendering, and vacuum suction. The larger the capillary area in the textile structure and the heavier the grammage of the textile, the more difficult it is to mechanically remove moisture. The higher the proportion of hydrophilic fibers in the textile, the greater the residual moisture after dehydration, because such fibers have a higher fiber-saturation value. Plasma treatment is an air-dried textile material, which is an energy-efficient and economical choice compared to traditional water-based processing. At present, the main processing technology of textiles usually refers to wet processing technology. During the plasma treatment, the textiles are kept dry, and the costly heating and drying process can be omitted. In addition, no water is needed in the plasma treatment process, so there is no need to soften the water, and no waste water is generated. Plasma treatment therefore offers both economical and ecological advantages and offers dyeing, printing and finishing workers the opportunity to develop innovative processes to achieve novel finishing effects. The plasma process is considered to be a more environmentally friendly processing method than traditional wet processing of textiles. Plasma treatment is only carried out on the surface of the substrate, so physical or chemical modification is limited to the outermost layer of the fabric. Under normal processing conditions, most of the properties of the fabric were not affected. After the fiber surface is treated with plasma, the dirt on the fiber surface, such as natural impurities (wax), or added impurities (slurry) can be removed. The ablation/cleaning process can also modify the physical structure of the fiber surface through the erosion of the polymer material. In addition, the functionalization of the fiber surface layer with chemical groups also helps to improve the adhesion during coating/lamination treatment. The chemical groups on the fiber surface can act as reaction points for subsequent dyeing, printing or finishing. Plasma treatment can significantly improve the wear resistance of polymer, ceramic, metal, glass or diamond-like coatings in end-use applications. Plasma treatment can be used to achieve functional polymer coating on fibers, and the interior of the coating has a gradient along the thickness of the coating, so that different properties can be obtained. In composite materials, the interface of the matrix material is the key to determine the mechanical/chemical properties of the material. Plasma treatment improves composite properties such as interlaminar shear strength, fatigue resistance, delamination, and corrosion. Improvements in the interfacial reactivity of composites, including plasma-induced enhancement of surface adhesion, are achieved through microetching and mechanical interlocking, as well as changing surface chemistry. This performance enhancement is important for textile coating and lamination processing, as the adhesion of coating and laminating films to fabrics is critical for the product to achieve the highest end-use properties.

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The application of six types of surface treatment plasma cleaners removes residues on the surface of products

The application of six types of surface treatment plasma cleaners removes residues on the surface of products

The application of six types of surface treatment plasma cleaners removes residues on the surface of products: In view of the wide application of plasma cleaners in all walks of life, CRF Chengfeng Zhizao Xiaobian summarized 6 solutions for the application of plasma cleaners. The solution to surface activation, after treatment with plasma surface treatment machine, can improve surface energy, hydrophilicity, increase adhesion, adhesion strength, etc. In the cleaning process, the plasma surface treatment machine is used in conjunction with different gases, and the dirt effect of the cleaning residues is also very different. Among these gases, the inert gas argon (Ar) is commonly used, which is often used in conjunction with argon in the cleaning process of vacuum equipment, which can effectively remove nano-scale pollutants on the surface. The solution to the etching of the material surface is to selectively use the reactive gas plasma to corrode the material surface, so that the impurities on the corroded material are converted into gas, and then discharged through a vacuum pump. Hydrophilic. In order to enhance the etching effect, oxygen (O2) can be introduced, which can effectively remove organic pollutants such as photoresist. Nano coating solution, through the treatment of plasma cleaning machine, plasma guide polymerization to form nano coating. Various materials can obtain hydrophobicity (hydrophobicity), hydrophilicity (hydrophilic), lipophobicity (anti-fat), and oleophobicity (anti-oil) through surface coating. There is also some hydrogen (H2) that can be used in combination with other oxides that are difficult to remove, usually using a hydrogen-nitrogen gas mixture (95% nitrogen mixed with 5% hydrogen). TSP/OLED product solutions, in terms of TSP: cleaning the main process of the touch screen, improving the adhesion/coating force on OCA/OCR, lamination, ACF, AR/AF and other processes, through various atmospheric pressure plasma It can eliminate air bubbles/foreign objects, and evenly discharge various glasses and films, so that the surface is not damaged. Nitrogen (N2) is a widely used gas and its production cost is low. The gas of the present invention is mainly combined with the online plasma cleaning machine technology to perform surface activation modification on the material. Can also be used in vacuum environments. Nitrogen (N2) is a gas that improves the wettability of material surfaces. The solution for vacuum plasma cleaning machine equipment, due to the high energy density in the vacuum plasma, virtually all powders with a stable molten phase can be transformed into dense, firmly attached spray coatings, and the quality of the coating depends on The instantaneous melting degree when the sprayed powder particles hit the surface of the workpiece. Vacuum plasma spray technology provides a new way for the production of modern coating machines. The surface cleaning solution uses radio frequency power to generate high-energy, disordered plasma in the vacuum plasma cavity, and the surface of the cleaned product is bombarded by the plasma, so that the surface contaminants are detached from the product, so as to achieve the purpose of cleaning. In addition, there are some special gases, such as carbon tetrafluoride (CF4), sulfur hexafluoride (SF6), etc., the use of these gases in the plasma cleaner is more important for the etching and removal of organic substances.

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The application of plasma cleaner technology in semiconductor wafer cleaning has become a mature process

The application of plasma cleaner technology in semiconductor wafer cleaning has become a mature process

The application of plasma cleaner technology in semiconductor wafer cleaning has become a mature process: In the semiconductor production process, almost every process needs to be cleaned, and the quality of wafer cleaning has a serious impact on device performance. It is precisely because wafer cleaning is an important and frequent process in the semiconductor manufacturing process, and its process quality will directly affect the yield, performance and reliability of the device, so major domestic and foreign companies, research institutions and other research on the cleaning process. It's been going on and on. As an advanced dry cleaning technology, plasma cleaning machine has the characteristics of green and environmental protection. With the rapid development of the microelectronics industry, plasma cleaning machine technology is also used more and more in the semiconductor industry. With the continuous development of semiconductor technology, the requirements for process technology are getting higher and higher, especially for the surface quality of semiconductor wafers. The main reason is that the contamination of particles and metal impurities on the surface of wafers will seriously affect In terms of device quality and yield, in the current integrated circuit production, more than 50% of the material is still lost due to the contamination problem on the wafer surface. Application of plasma cleaner in semiconductor wafer cleaning process. Plasma cleaning has the problems of simple process, convenient operation, no waste disposal and environmental pollution. But it cannot remove carbon and other non-volatile metal or metal oxide impurities. Plasma cleaning machines are often used in the removal process of photoresist. A small amount of oxygen is introduced into the plasma reaction system, and under the action of a strong electric field, the oxygen generates plasma, and the photoresist is rapidly oxidized into a volatile gaseous substance. was taken away. In the degumming process, the plasma cleaning machine has the advantages of convenient operation, high efficiency, clean surface, no scratches, and it is beneficial to ensure the quality of the product. Moreover, it does not use acids, alkalis and organic solvents as cleaning raw materials, and does not pollute the environment. Plasma treatment technology is an irreplaceable mature process, no matter in the implantation of chip source ions, or the coating of wafers, or what our low-temperature plasma surface treatment equipment can achieve: removal of oxidation on the surface of wafers Ultra-purification treatment and surface activation of film, organic matter, demasking, etc., improve the wettability of wafer surface. The application scope of plasma cleaning machine technology mainly includes medical equipment, sterilization, disinfection, glue box, optical cable factory, cable factory, university laboratory cleaning experimental tools, shoe soles and shoe uppers are bonded, automotive glass coating film before. Cleaning, plasma treatment to make the bond stronger, bonding work on car lights, bonding of glass and iron, textiles, plastics, paper, printing and optoelectronic materials or metals, etc., can all be treated by plasma.

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Plasma etching machine technology PTFE plasma hole film interface adhesion performance Surface treatmen

Plasma etching machine technology PTFE plasma hole film interface adhesion performance Surface treatmen

Plasma etching machine technology PTFE plasma hole film interface adhesion performance Surface treatment:         PTFE microporous membrane has stable chemical properties, high temperature resistance, corrosion resistance, excellent water resistance and oleophobicity, and has good filtration performance for high temperature, high humidity, high corrosion and machine fluids in special gases, and can be widely used. It is used in dust removal and filtration in metallurgy, chemical industry, coal, cement and other industries. It is a film material of high temperature resistant composite filter material. However, its extremely low surface activity and outstanding non-stick properties make it difficult to compound with substrates, thus limiting its application. Plasma etching machine is also known as plasma etching machine, plasma plane etching machine, plasma surface treatment instrument, plasma cleaning system, etc. Plasma etching machine technology is a common form of dry etching. The principle is that the gas exposed to the electron region forms plasma, generates plasma and releases gas composed of high-energy electrons to form plasma or ions. When bulk atoms are accelerated by an electric field, the force released is sufficient to cling to the material or etch the surface, combining it with the surface driving force. To a certain extent, plasma cleaning is actually a minor phenomenon in the plasma etching process. Dry etching processing equipment includes reaction chamber, power supply, vacuum and other parts. The workpiece is sent to the reaction chamber, and the gases are introduced into the plasma and exchanged. The plasma etching process is essentially an active plasma process. Recently, a shelf form has appeared in the reaction chamber, which the user can move flexibly to configure the appropriate plasma etching method: reactive plasma (RIE), downstream plasma (downstream) and direct plasma (directionplasma) . The power of plasma surface treatment of plasma etching machine technology is not as large as possible. At lower power, the shear strength of the treated film increases with the increase of power, and the strength gradually decreases after reaching the peak value. Inductively Coupled Plasma Etching (ICPE) is a combination of chemical and physical processes. Its basic principle is: under low pressure, the ICP radio frequency power supply is output to the annular coupling coil, and through the coupling glow discharge, the mixed etching gas generates high-density plasma through the coupling glow discharge. The surface of the substrate is bombarded, the chemical bonds of the semiconductor material in the pattern area of ​​the substrate are broken, and volatile substances are generated with the etching gas, which separates the gas from the substrate and is evacuated from the vacuum tube. Under the same conditions, oxygen plasma treatment is more effective than nitrogen plasma treatment. If etching is required, as well as removal of dirt, scum, surface treatment, plasma polymerization, plasma ashing or any other etching application after etching, we can produce safe and reliable plasma etcher technology according to customer requirements. Our company has both traditional plasma etching system and reactive ion etching system, can produce series products, and can also customize special systems for customers. We can provide fast/high quality etch that provides the required uniformity. With the prolongation of the treatment time, the contact angle of the film surface decreased, but within a certain period of time, the contact angle hardly changed. Plasma treatment can be used for a variety of substrates, and complex geometries can also be plasma activated, plasma cleaned, plasma coated, etc. Plasma processing has a low thermal and mechanical load, so low-pressure plasma can also process sensitive materials. The above results show that the use of plasma surface treatment of PTFE has better viscosity, and it is necessary to continuously adjust various treatment parameters to obtain a good treatment process. CRF Chengfengzhi plasma cleaning machine is simple to operate, can set multiple experimental parameters, and can also Store a variety of process parameters, which is very helpful for exploring process parameters. Typical applications of plasma etcher technology are: semiconductor/integrated circuits; gallium nitride; aluminum nitride/gallium nitride; gallium arsenide/aluminum gallium arsenide; gallium arsenide; /InAlAs); silicon; silicon germanium; silicon silicide ceramics (Si3N4); silicon hydrogen bromide; zinc selenide (ZnSe); aluminum; chromium; platinum; molybdenum; niobium; indium; tungsten; indium tin oxide; indium titanium lead acid; plastic/polymer material; polytetrafluoroethylene (PTFE); polyoxymethylene (POM); polybenzimidazole (PBI); polyetheretherketone (PEEK); polyamide (PFA); polyamide (PFA) ; Polyamide etc.

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Comparison of plasma-modified MH-Ni polypropylene battery separator hollow cathode before and after remote treatment:

Comparison of plasma-modified MH-Ni polypropylene battery separator hollow cathode before and after remote treatment:

Comparison of plasma-modified MH-Ni polypropylene battery separator hollow cathode before and after remote treatment: Polypropylene has high chemical stability and good mechanical properties, small specific gravity and specific resistance, excellent air permeability, low price, low energy consumption, no pollution, and is an ideal battery separator substrate. However, because there are no hydrophilic groups in the macromolecular structure of polypropylene, the crystallinity is high, the fiber cross section is round, the structure is dense, and the lack of micropores and gaps, its hydrophilicity is extremely poor. In order to improve the wettability of polypropylene fiber separator to electrolyte, it can be treated by wetting method and surface modification method. In the wetting method, the hydrophilic group cannot be fixed on the surface of the separator material in a chemically bonded state, so the life span is short. Plasma surface modification is mainly to improve its hydrophilicity by introducing functional hydrophilic groups or depositing a hydrophilic polymer film on the surface of the polypropylene battery separator, so as to improve the alkali absorption performance of the separator. At present, most of them are directly processed by low temperature plasma discharge. However, the traditional low-temperature plasma discharge direct treatment method has disadvantages such as low ion concentration, low treatment efficiency, surface contamination and thermal stress, and its application scope is limited. The plasma concentration of radio frequency discharge can be increased by an order of magnitude, resulting in a higher polymerization rate. At the same time, the plasma is to place the experimental sample away from the plasma treatment area. The energy of the active particles in the far area is moderate. The plasma polymerization reaction has mild reaction, few side reactions, strong controllability, and polymerization grafting. The membrane structure is easy to control and so on. Plasma equipment modified the separator for alkaline secondary battery-MH-Ni battery, and the plasma treatment conditions affected the performance of polypropylene separator. The high alkali absorption of the diaphragm can effectively reduce the electrochemical polarization and concentration polarization of the electrode reaction, fully reduce the internal resistance of the battery during the charging and discharging process, make the discharge reaction more sufficient and complete, and improve the utilization rate of active materials. With the increase of air flow, the activated plasma state increases, and more acrylic acid is grafted faster. Therefore, the alkali absorption rate and alkali absorption rate of the polypropylene diaphragm are gradually increased. However, after reaching a certain flow rate, under the condition that the discharge power remains unchanged, the increase of the gas flow rate leads to an excessively high gas density, which makes the energy of a single charged particle smaller, and at the same time causes more energy loss in the collision between particles. , affecting the effect of acrylic polymer deposition. After plasma cleaning, the alkali absorption rate of the diaphragm decreases correspondingly, but the alkali absorption rate does not decrease much. This may be part of the buildup on the treated battery separator, the polyacrylic film is not firmly bonded to the polypropylene. After cleaning, this part of the polyacrylic acid film fell off, resulting in a great reduction in the rate of alkali absorption. The alkali absorption rate experiment was carried out after the treated diaphragm was fully infiltrated. Even if the alkali absorption rate of the diaphragm decreased, the total alkali absorption rate did not change much. The comparison between untreated polypropylene battery separator and plasma treatment shows that hydrophilic carboxyl groups are introduced on the surface of polypropylene fiber after plasma treatment. The untreated battery separator is relatively smooth, while the treated separator fibers are distributed with a sheet-like polyacrylic acid film, and the surface becomes rough. In addition, the characteristic peaks of polypropylene are still well preserved, indicating that although the separator has been treated, its own characteristics have not been affected.

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Changes of surface activity of nylon dental materials treated with plasma surface processor

Changes of surface activity of nylon dental materials treated with plasma surface processor

Changes of surface activity of nylon dental materials treated with plasma surface processor: With the continuous improvement of nylon processing technology and modification technology, the application scope of plasma surface treatment has expanded rapidly, and the application requirements of nylon surface cleaning, material protection, enhancing adhesion or dyeing are increasing. However, the structure of various nylon materials is different, and the corresponding surface properties are also very different. In order to adapt to various applications, plasma surface treatment technology came into being. Titanium is an inert metal material with low biological activity and is easily wrapped in a fibrous membrane after implantation in the jawbone. The lack of initiative results in long osseointegration times, poor initial stability, and low long-term success rates. However, pure titanium has low hardness, poor fatigue strength and wear resistance. During the use of titanium implants, failures such as loosening of abutment screws, pitting corrosion, wear and corrosion of connecting threads occur, which seriously affect the reliability and service life of the implant system. . Plasma surface treatment provides adhesion to nylon surfaces and improves surface hydrophilicity and wettability by introducing polar organic functional groups to the surface. Clean surface and surface wettability play an important role in the color combination of the two surfaces. Surface wetness depends on the surface condition of the nylon itself and all nylon dyed materials. The surface tension of these dyed materials can be reached to the required value by efficient treatment with low temperature plasma. After the plasma equipment was treated and modified, the water droplets of the contact angle tester slipped down from the top of the implant, and the angle value could not be determined and was close to 0. Existing experiments have proved that under the corresponding process gas and other conditions, the super-hydrophilic change on the surface of dental implant titanium implants by plasma treatment has important medical significance. Before processing: the contact angle of the nylon tube is 78.16°; After the plasma cleaning machine, the contact angle of the nylon tube is close to 0°; Result: Plasma treatment by plasma surface processor can significantly change the surface activity of nylon material, and can significantly improve its surface energy and hydrophilicity, and enhance the dyeing ability. Due to the unique physical and chemical properties of the surface material and its successful application in finishing, lubrication, bonding, foaming, waterproofing and biomedical materials, its wetting performance is one of the important properties of the surface material, which mainly depends on Microgeometry and chemical composition of surface materials. The adsorption and proliferation experiments of osteoblasts were carried out using a plasma surface processor, and the results showed that their surface oxidation activity was better than that of heat treatment. The superhydrophobic surface was prepared by the method of molecular self-assembly, and the contact angle can reach more than 130 degrees. The conversion and control of sample superhydrophilicity and superhydrophobicity can be realized by plasma treatment with a plasma surface processor.

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