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Application of PMMA Surface Plasma Treatment for Ophthalmic Medical Materials

Application of PMMA Surface Plasma Treatment for Ophthalmic Medical Materials

Polymethyl methacrylate began to be used as contact lens materials in the 2040s. Because PMMA has high refractive index, suitable hardness and good biological affinity, it is still widely used. However, PMMA has poor hydrophilicity, which can cause long-term eyelid closure and discomfort to the wearer. At the same time, its oxygen permeability is poor, serious can lead to complications. If the above disadvantages of PMMA can be overcome, the efficiency of its use can be greatly improved. The surface of PMMA lens was coated with acetylene, nitrogen and water plasma polymer to improve the material's hydrophilicity and reduce the adhesion of corneal epithelial cells. The addition of organosiloxane into the interlayer of the polymer can improve the air permeability of the material, but because of the hydrophobic nature of the siloxane itself, its moisture retention is reduced. The surface hydrophobic problem of silicon-containing polymers was treated by means of glow discharge generated by vacuum ionization cleaning machine. The PMMA surface was treated by vacuum plasma MMA and polysiloxane, the carbon content of PMMA surface was decreased, the oxygen content was increased, and the moisture retention was improved. Contact lenses made of silicone rubber are called "soft" lenses. Silicone rubber has good air permeability, soft texture, good mechanical elasticity and durability. Its disadvantage is that the viscosity is too large, hydrophobic, easy to penetrate. Plasma deposition of methane film on silicone rubber surface can improve the moisture of silicone rubber, reduce viscosity, reduce liquid permeability, and maintain its air permeability.   PMMA is widely used in surgery as intraocular lens graft material, but its contact with corneal epithelial cells can lead to damage of corneal epithelial cells. Hydrophilic monomers, such as hydroxyethyl isobutenate or N-vinylpyrrolidone, can be deposited on the surface of PMMA by vacuum plasma cleaning machine graft deposition or irradiation treatment. In the experiment, the static "contact" test between rabbit cornea and lens surface showed that the PMMA surface without plasma treatment could cause 10-30% cell damage, while the treated PMMA/HEMA composite surface could cause about 10% cell damage, and the PMMA/NVP composite surface could cause less than 10% cell damage. Plasma deposition on C3F8, HEMA and NVP films can significantly reduce the damage of corneal cells. In addition, the adhesion ability of NVP membrane on PMMA surface was significantly lower than that of PMMA.

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Plasma cleaning machine for material surface pretreatment industry application

Plasma cleaning machine for material surface pretreatment industry application

Every process must be precisely coordinated, which is the premise to ensure high quality products. Plasma cleaning machine can meet the requirements of automotive manufacturing pretreatment process, such as the removal of manufacturing residues or silica residues through the plasma cleaning machine process. Plasma is an indispensable processing technology in automobile industry. Plasma activation can also be used in the pretreatment of material adhesives or in the pretreatment of spraying, such as plasma etching for high performance plastics and plasma coatings as bonding accelerators (primers), where consumer demand for products is increasing. Plasma cleaning machine is used to pretreat the surface of materials, which can ensure that all kinds of materials can achieve high surface activation. Durable adhesives, manufacturing surfaces that do not produce harmful substances or resist pollution, and fire-resistant coatings are just a few examples. Plasma can guarantee reliable bonding without the use of solvents, such as furniture, white goods, toys, sports equipment, etc. The manufacturing process and the quality of the materials used are important to the life and effectiveness of the module. Photovoltaic modules are often damaged due to climate change, and water infiltration will lead to a sharp decline in the performance of solar cells. Plasma pretreatment of materials by plasma cleaning machine can significantly improve the quality of solar cell modules, improve the tightness, so as to ensure the long-term stability and weatherability of modules.

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After the plasma surface treatment effect test how to identify

After the plasma surface treatment effect test how to identify

Although we know that the surface properties of materials will change after plasma surface treatment, but the naked eye can not tell whether the material has been treated or not. So, is there a simple way to quickly tell whether the material has been treated or not? The following are some commonly used rapid identification methods. The user of the plasma surface treatment device can tell at a glance whether the plasma treatment has been performed by displaying the label and observing the plasma indicator compound. It takes almost no time to complete the tests. Can be used in a variety of plasma equipment for a variety of processing purposes, including cleaning, activation, etching or coating. Over the course of weeks or months, these indicators will determine whether your product or semi-finished product has been identified before plasma treatment. 1. Identification label The pasted label film is a film treated with special coating. It can be placed directly in the box as a reference or pasted on the components. When the dark indicator point disappears, the plasma treatment is completed successfully. Device testing may also use an indication label, in which case the label may be placed in a vacuum chamber. 2, ADP- plasma indicator The plasma indicator is a label made of a special fabric. After successful plasma treatment, the fabric will dissolve. Attach this sticker to the component or model as needed. It can be used as a reference exposure for plasma jets, and the indicator has no effect on the actual plasma processing process or the device itself. Fabric can be damaged during processing. 3. Plasma indicator -- metal compound A plasma indicator is a liquid metallic compound that decomposes in a plasma to give a shiny surface to objects treated by the plasma. Droplets applied to the component or reference sample, when treated by isoionization, turn to a shiny metallic coating, in sharp contrast to the original colorless droplets. The metal film produced in the plasma is visually outstanding because of its reflectivity compared with the various colors of the object. 4. Dain pen test Dain pen can directly draw a line on the product, can show the difference between the treatment and the treatment, different Dain pen to measure the results are different, need to be used according to the actual situation.

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The application of graphene in integrated circuit is introduced in Plasma cleaning machine

The application of graphene in integrated circuit is introduced in Plasma cleaning machine

It is no exaggeration to say that graphene is the star material of the 21st century. In 2004, the discovery of graphene overthrew the two-dimensional structure "thermodynamic fluctuation at a finite temperature are not allowed to two-dimensional crystal under free existence" of cognition, shocked the whole physics, its discoverer, department of physics and astronomy at the university of Manchester, England Geim and Novoselov have therefore won the nomination of the Nobel Prize for physics in 2008, and won the 2010 Nobel Prize for physics. Compared with silicon, graphene has unique advantages in integrated circuits. Silicon-based microcomputer processors can only perform a certain number of operations per second at room temperature, but electrons pass through graphene with almost no resistance and generate very little heat. In addition, graphene itself is a good heat conductor and can dissipate heat very quickly. Because of its excellent properties, graphene can be used to make electronic products at much faster speeds. Speed is just one advantage of graphene. Silicon cannot be cut into pieces smaller than 10nm, or it will lose its attractive electronic properties. Compared to silicon, graphene's basic physical properties do not change when it is partitioned, and its electronic properties may even behave differently. As a result, graphene, which is smaller than silicon, can continue to maintain Moore's law when silicon is no longer separable, and thus has the potential to be a silicon replacement to drive microelectronics forward. Therefore, the unique physical and chemical properties of graphene also arouse the great interest of scientists in the fields of physics, chemistry and materials. The above is the introduction of graphene in the integrated circuit of CRF plasma cleaning machine manufacturers.

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Comparison of contact Angle before and after plasma cleaning before plastic IC sealant

Comparison of contact Angle before and after plasma cleaning before plastic IC sealant

Plasma cleaning is a pollution-free stripping cleaning. When plasma cleaning is used, different chip cleaning techniques vary greatly. For example, the surface of metal fragments cannot be cleaned with oxygen to prevent oxidation. The application of plasma cleaning technology in LED packaging can be roughly divided into the following categories. (1) dispensing and packaging before: if there are pollutants in the substrate dispensing silver glue, silver glue is easy to form a ball, reduce chip adhesion. Plasma cleaning can increase the surface roughness of the workpiece, which is conducive to the success of dispensing silver. At the same time, it can save the amount of silver glue and reduce the cost. (2) Before lead bonding, the chip is pasted on the lead frame substrate, and should be cured at high temperature. If there are contaminants on the surface of the chip, it will affect the bonding effect between the lead and the chip and the substrate, resulting in incomplete bonding or poor adhesion and low strength. Plasma cleaning before bonding can significantly improve the surface activity, bonding strength and tensile uniformity of the wires. (3) before curing: the existence of pollutants will also lead to the formation of bubbles in the process of epoxy resin injection, so that the chip is easy to damage in the temperature change, reduce the service life of the chip. Plasma cleaning enables the chip and substrate to bond more tightly to the gel, reducing the formation of bubbles, and significantly improves the characteristics of the components. The contact Angle test of the chip shows that the contact Angle of the sample without plasma cleaning is about 39°~65°. After chemical plasma cleaning, the chip contact Angle is about 150°~20°. After the chip is cleaned by the physical reaction plasma, the contact Angle is 20°~27°. This shows that the plasma surface treatment of the encapsulated chip is effective. The contact angles of copper lead frames before and after plasma cleaning were compared by means of contact Angle tester. The contact Angle before cleaning is 46°~50°, and the contact Angle after cleaning is 14°~24°, which meets the requirements of chip surface treatment. Today, with the rapid development of integrated circuit technology in accordance with Moore's law, microelectronics manufacturing technology has become the frontier technology representing advanced manufacturing technology, and is also an important standard to measure the manufacturing level of a country. With the improvement of IC chip integration, the number of pins increases and the pin spacing decreases. Particulate pollutants, oxides and epoxy resins on chips and substrates will restrict the rapid development of integrated circuit packaging industry to a large extent. The on-line plasma cleaning technology, which is beneficial to environmental protection, good cleaning uniformity, good repeatability, strong controllability, strong 3D processing ability and directional selective processing, is applied to the integrated circuit packaging technology, and will promote the faster development of the integrated circuit packaging industry.

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Application of Plasma Surface Treatment in Microassembly Technology Application of Plasma Surface Treatment in Microassembly Technology

Application of Plasma Surface Treatment in Microassembly Technology Application of Plasma Surface Treatment in Microassembly Technology

Overview of microgroup assembly technology: From the beginning of micro assembly concept put forward, especially surface-mount technology development to a high level of specific stages, namely the guide feet must be less than 3 mm between components in surface-mount technology, with the further development of technology, now also refers to various forms of element SMT technology, such as circuit lead spacing is small, such as modules, components, systems or SMT technology. There is another saying that micro-assembly technology is short for micro-circuit assembly technology, that is, the assembler uses assembly equipment, tools, and micro-welding, interconnection and packaging technology to assemble a variety of micro components, integrated circuit chips, micro structural parts, etc., on the multi-layer interconnect substrate. Processes, methods and techniques for making it a highly reliable, high-density, two-dimensional microelectronic product (module/component/component/subsystem/system). The main application objects of micro - assembly technology are: micro - components, micro - spacing, micro - structure and micro - connection. The application of micro-assembly technology mainly includes: device level packaging, circuit module level assembly, micro-assembly or micro-system level assembly. The main contents of micro-assembly technology are as follows: 1) chip welding (conductive adhesive connection, eutectic welding, reverse assembly welding, etc.); 2) Interconnection of chemical plates (lead connection, automatic connection of carrier belt, micro-convex connection, etc.); 3) Device 3D assembly (wafer level 2D assembly, chip level 2D assembly, package level H-dimensional assembly); 4) Stereo assembly (chip level stereo assembly, board level stereo assembly). The main characteristics of microassembly technology are: 1) on a single printed plate (or substrate) to assemble a plurality of components (including outer package and no outer package) and other small components to form circuit modules (or components, Microsystems, subsystems); 2) the circuit module or component has a specific function and performance; 3) Independent circuit modules or components are generally not externally packaged, but can also be externally packaged (when the substrate is equipped with unpackaged components or specially required components); 4) Through motherboard and vertical interconnection technology, multiple independent circuit modules or components can be assembled into three-dimensional components -- dimensional three-dimensional assembly; 5) Multiple independent circuit modules or components can form a higher level system through motherboard, connection and plug interconnection or cable interconnection technology -- complete machine interconnection technology; 6) Multi-disciplinary optimization and micro-assembly design should be carried out according to the requirements of micro-assembly design with the pin spacing less than 3mm of the components. Plasma surface treatment process: In the process of microassembly, plasma surface treatment technology is a very important link, which directly affects the quality of the functional modules of microassembly. In the process of microassembly, plasma cleaning process is mainly used in the following two aspects. (1) point conductive adhesive before: the contaminants on the substrate will make the substrate wettability worse, point conductive adhesive is adverse to the tile glue, glue is round. Plasma surface treatment technology can greatly improve the wetting property of the substrate surface, which is beneficial to the adhesion between the conductive adhesive layer and the chip, and improve the bonding strength of the chip. (2) before the lead connection: chip affixed on the substrate, after high temperature curing, the substrate contaminants may contain particles and oxides, so that the lead and chip or substrate connection is not strong, resulting in insufficient connection strength. Isoionization treatment can obviously improve the surface activity before lead connection and thus enhance the strength of lead connection. The objects of plasma surface treatment in microassembly mainly include chip bonding zone, substrate, guide frame, ceramic substrate, etc. In this experiment, the substrate was cleaned, and silver and oxidation were generated on the surface of the substrate. Plasma cleaning machine was used to clean the substrate, and hydrogen and nitrogen mixture was selected as the cleaning process gas. During the cleaning process of plasma surface treatment, hydrogen plasma was effective enough to remove oxides on the substrate. The experimental results show that the process parameters such as pressure, power, time and gas flow can be effectively controlled in the cleaning process, and a better cleaning effect can be achieved.

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