图片名称

NEWS

Popular Articles

Contact Us

图片名称
图片名称

Service Hotline

13632675935

CRF

TEL：13632675935

E-mail：shaobo@sfi-crf.com

Address: 1303, Building 3, Manjinghua Science and Innovation Workshop, No.6 Songjiang Road, Songgang Street, Bao'an District, Shenzhen, China.

Plasma cleaning of composite materials to improve the surface bonding performance

Plasma cleaning of composite materials to improve the surface bonding performance

Since the emergence of plasma cleaning technology, its application has been increasingly extensive with the rapid development of electronics and other industries. At present, plasma cleaning has been widely used in semiconductor and optoelectronic industry, and has been widely promoted in many technical fields such as automobile, aerospace, medical treatment, decoration and so on. In recent years, plasma cleaning technology has been widely used in polymer surface activation, electronic device manufacturing, plastic bonding treatment, improvement of biocompatibility, prevention of biological contamination, microwave control, precision machinery parts cleaning and other fields. To improve the bonding performance of the composite material surface: Continuous fibers such as carbon fiber and aramid fiber are characterized by light weight, high strength, excellent thermal stability and fatigue resistance. The products used to enhance thermosetting and thermoplastic resin matrix composites have been widely used in aircraft, automobiles, sports, electrical appliances and other fields. But commercial fibrous materials usually have an organic coating on their surface, which is used to make composites. The weak interfacial layer is formed during the processing process, which seriously affects the interfacial bond between resin and fiber. Therefore, before preparing the composite material, it is necessary to remove it by certain treatment means. Plasma cleaning technology can effectively avoid the damage of chemical solvents to the properties of the material itself, introduce a variety of active functional groups to the surface of the material, increase the surface roughness, improve the surface free energy of the fiber, effectively strengthen the interface between the resin and fiber, and improve the comprehensive properties of the composite material. The interlaminar shear strength of aramid fiber was compared by solvent and plasma washing methods. The results show that the plasma washing method can improve the interfacial properties of the composites more obviously under better conditions.

MORE +
Application of Medical Plasma Cleaning Machine on PEEK Biomaterials

Application of Medical Plasma Cleaning Machine on PEEK Biomaterials

PEEK, as the main component of polyether ether ketone, has been widely used in medical nonmetallic implant materials due to its good biocompatibility, dimensional stability and elastic modulus between cortical bone and cancellous bone. Such as human skeleton, spinal implant, wound repair, temporary stents in oral medicine, healing caps, occlusal rods in orthodontic applications, etc. Without the surface treatment process of medical plasma cleaning machine, PEEK material is difficult to be widely used in the biomedical field. Next, we will discuss the application of medical plasma cleaning machine in bipeek material processing. 1. Necessity of ionization of biomedical PEEK materials. Due to the low surface energy and hydrophobic property of PEEK material, the interface bonding force is low when it is combined with the composite resin, which affects the bonding property of the material. Therefore, it is usually necessary to adopt certain treatment technology to improve the surface property of PEEK material. The treatment of concentrated sulfuric acid and silicon coating can effectively improve the binding strength of PEEK material and resin, but this treatment method is not suitable for clinical application. Plasma cleaning machine is used to treat PEEK material, which can not only effectively improve the binding strength, but also meet the requirements of clinical application. 2. Corrosion and coarsening effect of medical plasma cleaning machine on PEEK material treatment. When PEEK material is processed by plasma cleaning machine, particles in the plasma will collide with PEEK material, resulting in sputtering corrosion, and chemical active substances in the plasma will also produce chemical etching on its surface. Due to different corrosion rates, the PEEK material surface will produce small concave and convex, and the corroded material in the plasma will be excited and decomposed into gas components, and reverse diffusion to the material surface. At the same time of erosion and repolymerization, PEEK material surface will produce a large number of protrusions, which make the surface rough, increase the contact area of the bond, improve the bond performance, improve product quality, and ensure the safety and reliability of clinical use of medical devices. 3. Medical plasma cleaning machine improves the hydrophilicity and biocompatibility of PEEK material. Plasma cleaning machine is used to treat PEEK material with inactive chemical properties and poor surface hydrophilicity. Many physical and chemical changes can take place on the surface of PEEK material. In addition to erosion, dense correlation layer can be formed on the surface of PEEK material, and polar groups can be introduced on the surface of the material to improve the hydrophilicity and biocompatibility of PEEK material. In a word, treating PEEK and its composites with medical plasma cleaning machine is an effective way to improve the adhesion performance of PEEK. In addition, due to the different hardness of different materials, the surface treatment of PEEK material can obtain different etching effect and roughness. Therefore, in order to obtain the ideal bonding strength and hydrophilic effect, the processing parameters of the plasma cleaning machine need to be adjusted according to the actual situation.

MORE +
Plasma dry etching machine manufacturers gallium arsenic etching

Plasma dry etching machine manufacturers gallium arsenic etching

In addition to indium gallium arsenic, gallium arsenic is also widely expected as a semiconductor material, and the two are often used together to build high performance devices. Therefore, it is necessary for us to explore and prospect the etching technology of this kind of semiconductor. The deep hole etching of GaAs semiconductor material was carried out by using Cl2 and BCl3 mixed gases. The etching rate was 6~8um/min, the photoresistor was used as the mask material, and the selection ratio was 8∶1. Although the author claims that there is no problem with the smooth morphology of the hole as an interconnection, it is obvious that the Angle of 70℃ ~ 80℃ is difficult to win. For any process below 14nm, more new technologies and detailed studies are needed to better complete the graphic definition. In addition to being used as semiconductor material itself, gallium arsenic can be used with indium phosphide and indium gallium arsenic, gallium arsenic semiconductor can also be used with aluminum-gallium arsenic, aluminum-gallium arsenic phosphorus. This type of etching also generally has a large aspect ratio. This kind of etching generally adopts high temperature laser etching, so the graphic definition is accurate, but the roughness is large, especially sensitive to the etching gas composition and temperature. Taking into account the actual situation, the post processing process of etching is added to improve the surface roughness. The roughness of the etched line edge needs to be improved, but the straight Angle of nearly 90° has great advantages, especially when the aspect ratio reaches more than 20, it can still transmit the image accurately.The above is the introduction of the plasma dry etching machine manufacturers to the etching of gallium and arsenic, I hope to help you.

MORE +
Rotate bottle plasma glasses cleaning machine how to prevent goggles fog

Rotate bottle plasma glasses cleaning machine how to prevent goggles fog

Swimming is a healthy aerobic exercise, to relax the body and mind, burning fat, enhance physical fitness and so have great benefits. Swimming without the preparing work before swimming, choose the goggles is certainly one of the indispensable items, swimming goggles can make the person get superior underwater vision, can prevent the pool water starting again at the same time, have the effect of maintenance eyes, often some goggles will appear the phenomenon of mirror fog, turn plasma glasses bottle cleaning function to deal with the problem very well, then turn to a bottle of plasma glasses cleaning machine is how to deal with? In life, we may touch a lot of small tricks to prevent fog, almost all are coated with a layer of other substances in the mirror, such as foam, anti-fog spray, in order to achieve the effect of anti-fog. Want to remind is, do not mix as far as possible, if the material enters the eye to clean in time, the situation is serious trouble, here do not recommend us to try here. How to intuitively distinguish the treatment effect of rotating plasma glasses cleaning machine on the surface of goggles? Below we through the lens plasma cleaning machine treatment before and after the change of the appearance of the dyne value to understand. The dyne value of the lens not treated by the plasma cleaning machine was measured, and it was found that its dyne value was less than 36 dynes and the energy of the mirror surface was low. If the lens was directly modified at this time, the effect would be poor. The dyne value is measured after being processed by the rotating plasma glasses cleaning machine. The dyne value is greater than 60 dyne, which can improve the mirror surface. At this time, it is easier to form a uniform and durable anti-fogging film and improve the yield of good products by applying coating. Through the comparison of several experimental data, we can draw the following conclusion: after the surface of the goggles is treated by the rotating plasma glasses cleaning machine, the surface activity is greatly improved, the adhesive performance is also greatly improved, and the anti-fogging film can be formed evenly and not easy to fall off, thus solving the problem of fogging in the use of the goggles.

MORE +
Application of Plasma Cleaning BGA Packaging Process

Application of Plasma Cleaning BGA Packaging Process

The substrate or intermediate layer is an important part of the BGA package and can be used for impedance control and inductor/resistor/capacitor integration in addition to interconnection wiring. Therefore, the substrate is required to have high glass conversion temperature rS(about 175~230℃), high dimensional stability and low moisture absorption performance, and has good electrical properties and high reliability. In addition, there is a high adhesion between the metal film, the insulating layer and the substrate medium. 1. Lead bonding PBGA packaging process: 1) Preparation of PBGA substrate The two sides of the BT resin/glass core plate were pressed into extremely thin copper foil (12~18 microns thick), and the metal was drilled and metallized through holes. Using traditional PCB process, guide tape, electrode and welding zone array mounted with solder ball are made on both sides of the substrate. Then a solder mask is added to make a pattern of exposed electrodes and welds. In order to improve production efficiency, a substrate usually contains more than one PBG substrate. 2) Packaging process WAFer thinning → wafer cutting → chip bonding → plasma cleaning → lead bonding → plasma cleaning → molded packaging → solder ball assembly → reflow soldering → surface marking → separation → inspection → test packaging Silver-filled epoxy binder is used to bond the IC chip to the substrate, and then the connection between the chip and the substrate is realized by gold wire connection, and then the chip, welding line and pad are protected by molding encapsulation or liquid glue pasting. A specially designed solder ball 62/36/2Sn/Pb/Ag or 63/37/Sn/Pb with a diameter of 30mil(0.75mm) with a melting point of 183℃ is used for reflow soldering in a common reflow furnace. The high temperature processing temperature cannot exceed 230℃. Substrates are then centrifugally cleaned with a CFC inorganic cleaner to remove residual solder and fiber particles, followed by marking, separation, inspection, testing, and packaging. The above is the lead bond PBGA packaging process. 2. FC-CBGA packaging process: 1) Ceramic substrate Because the FC-CBGA substrate is multilayer ceramic substrate, its production is difficult. Due to the high wiring density of the substrate, narrow spacing, and many through holes, as well as the substrate coplanar requirements for higher reasons. The main process is: first, the multi-layer ceramic sheet substrate is co-fired into multi-layer ceramic metallized substrate at high temperature, and then the multi-layer metal wire is made on the substrate, and then electroplating. In the process of CBGA assembly, the CTE mismatch between the substrate, chip and PCB is the main cause of product failure. In order to improve this situation, in addition to the use of CCGA structure, another ceramic substrate can also be used - HITCE ceramic substrate. 2) Packaging process The preparation of the flanges: groan cut → groan chip flip and reflow soldering → bottom filling groan heat transfer grease, sealing distribution of solder + cap bucket assembly solder ball → reflow bucket marking + separation groan → inspection → test packaging 3. Packaging process of lead connection TBGA: 1) TBGA loading TBGA is usually made of polyimide material. Manufacturing, the first two sides of the copper copper coating, and then nickel plating, gold plating, and then punching, through the hole metallization, made into graphics. Because in this lead connection TBGA, the packaging heat sink is the addition solid of the packaging and the core cavity base of the shell, the carrier tape should be bonded to the heat sink with pressure-sensitive adhesive before packaging. 2) Packaging process WAFer thinning → wafer cutting → chip bonding → cleaning → lead bonding → plasma cleaning → liquid sealant filling → solder ball assembly → reflow soldering → surface marking → separation → inspection → test → packaging

MORE +
Plasma cleaning machine enterprise technical equipment characteristics

Plasma cleaning machine enterprise technical equipment characteristics

Plasma cleaning machine technology is often used in the field of material surface treatment products, through ion exchange to change the surface characteristics of the material. With the continuous improvement and upgrading of plasma cleaning technology, there are more and more cleaning equipment coming to the market, so today, we will take you to understand the specific characteristics of the equipment produced by advanced plasma cleaning machine enterprises. Advanced cleaning equipment can effectively improve cleaning efficiency. In the process of plasma cleaning, it often takes a certain amount of time, and the treatment effect is also different. The more advanced the equipment we use, the more mature the technology, the more satisfactory the effect can be achieved, thus effectively saving the production and operation costs for the major enterprises. Secondly, plasma cleaning equipment in the technology of continuous development and upgrading. At present, most of the common equipment in the market is the advanced research results in the field of technology at home and abroad, and has been widely praised by many enterprises in the overall application market. The normal operation and use of our daily equipment can achieve the purpose of cleaning by changing the state of the substance and modifying the surface. The energy saving and environmental protection of plasma cleaning machine equipment is also our concern. Cleaning usually adopts plasma technology, which will not cause additional environmental pollution and has good environmental applicability. And the more advanced equipment we choose, the better the overall performance will be. At present, the advanced plasma cleaning machine equipment on the market is advanced in many aspects, and the product design and functional design of plasma enterprises are becoming more and more perfect. Some customers may not understand this aspect. If you need to understand this industry information, please through our website to understand more in-depth, or consult our customer service staff for further answers.

MORE +
< 1...222324...46 > proceed page
图片名称

CRF

National Service Hotline

136 3267 5935

Contact Email

shaobo@sfi-crf.com

Address:1303, Building 3, Manjinghua Science and Innovation Workshop, No.6 Songjiang Road, Songgang Street, Bao'an District, Shenzhen, China.

图片名称

Add WeChat
Get related information

Links

Apply to exchange friend links

Copyright © Shenzhen Chengfeng Smart Co.

京ICP备10002622号-38

粤公网安备 44030602005200号

图片名称

Cheng Feng Zhi Zuang a focus on plasma research and development for 20 years

We

The services of

Inquire for free sample testing

1-to-1 program customization

24-hour online after-sales service

Source manufacturer

Get the program
%{tishi_zhanwei}%
图片名称

Scan the code for information

诚峰智造