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What kinds of plasma cleaning

What kinds of plasma cleaning

There are two main cleaning methods that have been widely used: wet method and dry method. Considering environmental impact, raw material consumption and future development, wet cleaning has great limitations, and dry cleaning is obviously superior to wet cleaning. Among them, plasma cleaning develops rapidly and has obvious advantages. A plasma is an ionized gas. It is a collection of electrons, ions, atoms, molecules, or free radicals. In the process of cleaning, high-energy electrons will collide with gas molecules to dissociate or ionize them. A variety of particles generated will be used to bombate the cleaned surface or chemically react with the cleaned surface to effectively remove various pollutants. At the same time, it can also improve the surface performance of the material itself, such as improving the wettability of the surface, improving the adhesion of the film, etc., which is of great significance in many applications.   After plasma cleaning, the surface of the device is dried and no further treatment is required, which can improve the processing efficiency of the whole process line. It can prevent the operator from being hurt by harmful solvent. The plasma can be cleaned deep into the small holes and depressions inside the object, so the shape of the object to be cleaned does not need to be considered too much. It can also handle all kinds of materials, especially for high temperature and solvent resistant materials. All these advantages make plasma cleaning widely concerned.   There are several kinds of plasma cleaning, mainly divided into chemical, physical and physical chemistry. For different cleaning objects, process gases such as O2, H2 and Ar can be selected for surface treatment.   1. Chemical reaction cleaning: Chemical reactions are carried out with highly active free radicals in plasma and organic substances on the surface of the material, also known as PE. Clean with oxygen to convert non-volatile organic compounds into volatile substances to produce carbon dioxide, carbon monoxide and water. It has the advantages of fast cleaning speed and better cleaning effect on organic pollutants. Its main disadvantage is that oxides can be reformed on the material surface. Oxide production is undesirable when lead bonding is used, but these disadvantages can be avoided by selecting proper process parameters.   2. Physical reaction cleaning: The atoms attached to the surface of the material are broken down by pure physical collisions with ions in the plasma, also known as sputtering corrosion (SPE). When cleaned with argon, the argon ions have enough energy to bombard the surface with enough force to remove any dirt. The macromolecules in the polymer were separated into small molecules by chemical bonds and evaporated by vacuum pump. During argon plasma cleaning, the microstructure of the material surface can be changed to make the material more "rough" at the molecular level, thus greatly improving its surface activity and binding performance. The advantage of argon plasma is that no oxide is left on the surface of the material. The disadvantages are excessive corrosion or reconcentration of pollutant particles in other undesirable areas, but these disadvantages can be controlled by adjusting process parameters.   3. Simultaneous cleaning of physical and chemical reactions: Both physical and chemical reactions play an important role in the reaction. For example, using Ar and O2 mixed gas online plasma cleaning process, the reaction rate is faster than using Ar and O2 alone. After argon ion acceleration, the kinetic energy generated can enhance the reaction capacity of oxygen ion, so physical and chemical methods can be used to clean the surface of heavily polluted material.

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PCB plasma surface cleaning machine Printed circuit board processing technology

PCB plasma surface cleaning machine Printed circuit board processing technology

Plasma processing technology is a new semiconductor manufacturing technology. This technology has been applied in semiconductor manufacturing field earlier and is an essential semiconductor manufacturing process. Therefore, IC processing is a long - term and mature technology. Plasma is a kind of high-energy and highly active material, which has a good etching effect on any organic material, etc. The production of plasma is processed by dry method and will not cause pollution, so it has been widely used in the production of PCB printed circuit board in recent years.   With the application of plasma processing technology becoming more and more popular today, PCB manufacturing process mainly has the following functions:   (1) Activation treatment of ptFE materials: Anyone who has ever been engaged in the hole metallization of PTFE material has the experience that using the hole metallization method on the common FR-4 multi-layer printed wire circuit board is not successful in the hole metallization of PTFE. Among them, PTFE activation pretreatment before chemical copper sink is the biggest difficulty and also the key step.   In the activation treatment of PTFE material before chemical deposition of copper, there are many methods that can be adopted, but in general, the product quality can be guaranteed and there are two purposes suitable for mass production as follows:   A) Chemical processing method: Metal sodium and naphthalene, in the solution of non-aqueous solvents such as tetrahydrofuran or glycol dimethyl ether reaction, the formation of naphthalene - sodium complex, the sodium naphthalene treatment solution, can make the surface of the polytetrafluoroethylene atoms etch, thereby achieving the purpose of wetting the hole wall. This is a typical method with good effect and stable quality, which is most widely used at present.   B) Plasma treatment: This process is easy to operate, stable and reliable, suitable for batch production, using dry process production. The sodium - naphthalene treatment solution prepared by chemical treatment is difficult to synthesize, toxic, short shelf life, and needs to be prepared according to the production situation, with high safety requirements.Therefore, at present, the activation treatment of PTFE surface mostly adopts plasma treatment method, which is easy to operate and greatly reduces the treatment of wastewater.   (2) Erosion of hole wall/removal of resin drilling dirt on hole wall: For fr-4 multilayer printed circuit board processing, the removal of material such as resin drilling dirt, etc. after nc drilling is usually performed by concentrated sulfuric acid treatment, chromic acid treatment, alkaline potassium permanganate treatment and plasma treatment.   But, at the beginning of flexible printed circuit boards and flexible printed circuit board to remove the dirt on the processing of drilling, due to the difference of material properties, if the chemical treatment method is used, the effect is not ideal, and using plasma to remove dirt and pitting drilling, you can get a better hole wall roughness, is advantageous to the hole metallization plating, and also has a "three-dimensional" pitting connection properties.   (3) Removal of carbide: Plasma treatment not only has obvious effect on drilling pollution of various plates, but also shows its superiority in drilling pollution treatment of composite resin materials and microholes. In addition, due to the increasing demand for the production of multilayer printed circuit boards with high interconnect density, many drilling blind holes are manufactured using laser technology. This is a by-product of laser drilling blind hole applications -- carbon, which needs to be removed before the hole metallization production process. At this point, plasma processing technology does not hesitate to take on the task of removing carbon.   (4) Internal pretreatment: Due to the increasing production demand of printed circuit boards, the corresponding processing technology requirements are also higher and higher. The inner layer pretreatment of flexible PCB and rigid flexible PCB can increase the surface roughness and activation degree, increase the bonding strength between the inner layers, and also have important significance to improve the yield of production.   Plasma treatment process is a dry process, compared with the wet process has many advantages, these advantages are determined by the characteristics of plasma itself. The whole reactive neutral plasma from high voltage ionization has a high degree of activity, and can continuously react with the atoms on the surface of the material, so that the surface material is constantly excited into gas, volatilization, in order to achieve the purpose of cleaning. It has good practicability in the process of PCB printed circuit board production, and is a clean, environme

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Plasma surface treatment debye shielding and Debye length introduction

Plasma surface treatment debye shielding and Debye length introduction

If the plasma thermal motion disturbance of internal particles in plasma surface treatment, plasma body somewhere around power for q negative charge accumulation, due to the electrostatic field of the group charge effect, it will attract positive ions around the electronics, the results of positively charged "positive" clouds "negative". Seen from a distance, clouds of "positive charge" weaken the effect of "negative charge," the coulomb force of "negative charge" on distant charged particles, a phenomenon known in plasma surface treatment physics as "debay shielding." The length from the center of the "negative charge" to the edge of the "positive charge" cloud is called Debai length

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Vacuum plasma cleaning machine price manufacturer price influencing factors

Vacuum plasma cleaning machine price manufacturer price influencing factors

In front of the atmospheric pressure plasma cleaning machine affects the price of several main factors, then introduced the price of vacuum plasma cleaning machine manufacturers factors.   First talk about the advantages of vacuum plasma cleaning machine, vacuum plasma cleaning machine through gas reaction, so that its process diversification, users can be away from harmful solvents to the human body damage; Easy to use digital control technology, high degree of automation; The whole process is extremely efficient; With high precision control device, high time control precision; Vacuum plasma cleaning will not produce damage layer on the surface, and the surface quality is guaranteed. Because it is carried out in a vacuum, it does not pollute the environment, which ensures that the cleaning surface is free from secondary pollution.   Because the vacuum plasma cleaning machine has many advantages, the price is quite expensive compared with the atmospheric pressure. Its advantages are many, the price is also very high, the price of a product is also very high, mainly depends on configuration. Let's take a look at the main components of the vacuum plasma cleaner to get a general idea of the main factors influencing its price. It is mainly composed of vacuum chamber, plasma generator (power supply), vacuum pump and other three main parts.   Main factors influencing the price of vacuum plasma cleaning machine manufacturer:   1. Cavity size and material: The cavity size is the main factor affecting the product price. The small experimental equipment is small, the cavity size is small, and the price is relatively low. This kind of machine is more suitable for the experimental research work in universities. In other words, the larger the cavity, the more difficult the technique and the higher the price. Material, to small equipment for example, there are mainly stainless steel cavity and quartz cavity. In fact, the price difference between the two is not big, which can only be considered as an influential factor, not a big influential factor.   2. Power supply (plasma generator) : Domestic power supply, and import power supply price difference, which is also the main factor affecting the price.   3. Vacuum pump: The price of domestic and imported vacuum pumps also varies greatly, as well as the structure and precision, durability and other functions. Therefore, if you want to buy a cheaper vacuum plasma cleaning machine, you can consider the choice of domestic accessories, which will greatly reduce the price of the whole machine. Choose what kind of equipment to see their specific needs.

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Plasma silicon wafer cleaning machine ion energy density

Plasma silicon wafer cleaning machine ion energy density

Energy density refers to the amount of energy stored in a certain space or mass. Therefore, energy density is divided into mass energy density and volumetric energy maximum density. If the density is uniformly distributed in mass or space then the mass energy density is the total energy divided by the total mass of the matter that has that energy; The volumetric energy density of a plasma silicon wafer cleaner is the total energy divided by the volume of the space in which the energy exists. If the density is not uniformly distributed in mass or in space then we have to solve it according to the actual density distribution.   In the plasma silicon wafer cleaning machine, the main factors affecting the plasma energy density are the raw material gas flow rate F and the plasma injection power P. Feed gas flow rate is affected in the reaction system of active particle density and one of the main factors of the collision probability, plasma silicon wafer cleaning machine plasma injection power is generated in the plasma of various active particles (high energy electron, methyl radical, etc.) of reactive oxygen species, energy source, both the dynamic synergy effects available energy density Ed (kJ/mol) description.   Ed=P/F (1-20)   Where, Ed is the energy density (kJ/mol); P is plasma power (kJ/s); F is the molar flow rate of raw gas (mol/s).

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The surface dyne value of corona treated material is improved

The surface dyne value of corona treated material is improved

Corona treatment is a method of electric shock, it can make the substrate surface has higher adhesion. Principle is the use of high frequency high voltage corona discharge in the processing of plastic surface (high frequency ac voltage up to 5000-15000 - v/m2), low temperature plasma, free radical reaction in the plastic surface, make the polymer become rough, crosslinking and surface will increase the plasma wettability of polar solvent, the plasma by electric shocks and infiltration was printed body surface, the damage was printed the molecular structure of the body, so that the surface of the pending polarized molecules oxidation, ion electric erosion surface, thereby enhancing the adhesion on the surface of the substrates.   The physical and chemical effects of corona treatment on the plastic surface are quite complex, and its effects are mainly in three aspects: 1. Specific electrode system; 2. Material medium on the guide roller; 3. Specific electrode power;   Because different chemical structures have different atomic bonds, the treatment of plastic corona can vary depending on the chemical structure of the plastic, and different types of plastic require different levels of corona treatment.   The practice shows that BOPP film will still change in structure after production, and the polymer will change from amorphous state to crystalline state within a few days, thus affecting the corona treatment effect. After corona treatment, the crosslinking degree of the plastic surface layer is obviously lower than that of the internal layer, so that the functional groups of the plastic surface layer have higher mobility. Therefore, during the storage process, many plastics will appear corona treatment effect decay phenomenon, so that the surface energy is reduced, thus affecting the bonding factor.   In fact, relative humidity will also affect the effect of corona treatment. Generally speaking, humidity has little influence on pole remover and is often ignored within the range of test error. If the connection of the electrical halo treatment, then do not need to consider.   Corona treatment is achieved by changing the surface energy of many substrate, making it easy to combine with printing inks, coating materials and adhesives. In the production process of all the substrate after some treatment, it will have a better adhesion. In the process of substrate production, corona treatment is one of the methods to change the surface energy of substrate. Other treatment methods include flame treatment and coating treatment, which treatment is mainly dependent on the substrate structure.   Corona treatment roughens the surface of the substrate and makes the printing ink and binder easy to bond, but this view was rejected when viewed with a scanning electron microscope. It is now generally believed that corona treatment rearranges the molecular structure of substrate surface to produce more polar parts, which is conducive to external attachment. The unit of measurement of surface energy is dyne. All liquids and most of the substrate can be measured except for multipass. In order for the printing ink to adhere well to the substrate surface, the substrate should have a dyne value 10 times higher than the total ink.   The surface energy of water - based ink is higher than solvent - based ink, so its substrate also has a higher surface dyne value. Everything in nature has the characteristic of returning to its original state. The higher the dyne a paper processor hopes to achieve, the faster the processing energy decays. Therefore, the use of water-based ink printing film, foil and some paper, should be carried out before the second processing. A corona treatment device is used on a printing machine to extend or lengthen the processing level of the film to the original level (or slightly higher).   Processing energy level with time gradually weakened, the use of secondary treatment can remove ink film surface stains, not only can improve the ink adhesion, but also improve the visual effect. With this in mind, it is recommended to use solvent based inks, water-based inks or UV ink substrate film, foil or some paper printing pieces, the substrate surface can be secondary corona treatment.

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