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Research on enhancing the hydrophobicity of epoxy surface by plasma treatment with jet low temperature plasma power supply

Research on enhancing the hydrophobicity of epoxy surface by plasma treatment with jet low temperature plasma power supply

Research on enhancing the hydrophobicity of epoxy surface by plasma treatment with jet low temperature plasma power supply: The surface condition of insulating materials is one of the important factors that determine the size, performance and stability of power equipment. Insulating materials in a high-voltage electric field are prone to flashover discharge along the surface, and the flashover voltage is much lower than the breakdown voltage. How to increase the surface flashover voltage of insulating materials and effectively suppress the occurrence of flashover is a problem that has been working hard to solve. Improving the surface hydrophobicity of insulating materials is an effective way to increase wet flashover and pollution flashover voltage. At present, measures such as silicone oil, silicone grease (RTV), silicone rubber coating and nano-material filling are mainly used to improve the hydrophobicity of the insulating material surface, but these measures have poor coating adhesion, poor uniformity, poor timeliness, and high maintenance costs. shortcoming. Therefore, on the basis of not affecting the insulation performance of the substrate, forming a uniform, dense and long-lasting hydrophobic layer on the surface by new means can effectively overcome these shortcomings and better improve the surface performance of the insulating material. Plasma treatment with jet low-temperature plasma power supply is one of the new methods to change the surface properties of materials, and it has received extensive attention in recent years. The plasma surface modification of the low-temperature plasma power supply is a dry process, which is highly energy-efficient and pollution-free. The modification only involves the surface nanometer range, and the performance of the matrix is ​​not affected. Among the many discharge forms that generate atmospheric pressure low-temperature plasma, the plasma jet developed in recent years is an ideal plasma source for surface treatment of materials. This discharge form separates the discharge generation from the treatment area through the airflow, and has greater processing flexibility. And controllability, it is very suitable for processing large-size and complex-shaped insulating material surfaces. However, the current research on using jet low-temperature plasma power to improve the water repellency is mainly for typical polymer and metal surfaces, and less involved on the surface of insulating materials. The reason for the increase in water repellency caused by the jet low-temperature plasma power source is that with the increase of processing time, the surface energy dispersion component increases slightly, while the polar component decreases sharply with the increase of processing time. Caused by the reduction of the polarity component. The surface of the untreated epoxy has no obvious features, and the surface is relatively rough. The treated epoxy surface showed a specific morphology, and a uniformly distributed dense network structure was formed on the surface, indicating that the jet low-temperature plasma power plasma treatment formed a new material with a fixed morphology structure on the surface. The jet low-temperature plasma power plasma treatment can effectively improve the hydrophobicity of the epoxy surface. As the treatment time increases, the water contact angle of the epoxy surface increases and the surface energy decreases after treatment. The particles of Ar, OH, O and Si contained in the jet interact with the epoxy surface to form a dense network structure on the surface. At the same time, silicon-containing groups are introduced on the surface to effectively reduce the surface polarity and make the epoxy The hydrophobicity of the surface is improved.

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How does the alternating electric field of the plasma cleaner affect the discharge and surface treatment effects

How does the alternating electric field of the plasma cleaner affect the discharge and surface treatment effects

How does the alternating electric field of the plasma cleaner affect the discharge and surface treatment effects: In the process of changing the electric field generated by the plasma cleaning machine, the frequency of the electric field and the electrode spacing have an important influence on the plasma discharge phenomenon and affect the effect of plasma surface treatment. What is the relationship between the two, in order to avoid the electric field The effect of frequency on the discharge of the plasma cleaning machine, within a quarter of a cycle, the charged particles between the electrodes can reach the electrodes completely, thereby avoiding the generation of charges in the gap; therefore, when the gap is given, the The frequency of the alternating electric field at the fixed gap should be limited, otherwise the discharge process will be affected by the charge in the gap. First, consider the movement of positive ions between the plates, and then the corresponding distance and frequency between the electrodes can be calculated. Based on the influence of space charge, it can be divided into three situations: when there is no space charge accumulation, the breakdown conditions are similar to static charge; when part of the space charge exists, the breakdown voltage is slightly lower than the static charge; when the space charge increases, the ion space charge It will oscillate between the poles, and the breakdown voltage is lower than the static charge. For an atmospheric piezoelectric field with a distance between electrodes of 1 cm, the relationship between the alternating electric field breakdown voltage of the plasma cleaner and the electrostatic breakdown electric field frequency is very complicated. Under the condition of an alternating magnetic field, the relationship between the breakdown voltage and the air pressure of the plasma cleaner is also different from that of static electricity. Now, the method of generating plasma by alternating electric field has been widely used in industrial applications and research fields. For example, intermediate frequency power supply, low-pressure radio frequency power supply and microwave source for low-temperature plasma discharge. Chengfeng Zhizao has focused on the research and development of plasma cleaning machine technology for 20 years. If you want to know more product details or have questions about the use of the equipment, Chengfeng Zhizao is looking forward to your call!

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Why is plasma power also used for surface treatment of powder

Why is plasma power also used for surface treatment of powder

Why is plasma power also used for surface treatment of powder: The surface treatment of the powder material using plasma power can enable the surface of the powder to achieve the effects of etching, activation, impurity removal, grafting, crosslinking, and coating, thereby changing its structure and chemical composition. There are mainly two types of powder materials: organic powder and inorganic powder. Now Chengfeng Zhizao will introduce the role of plasma power in the surface treatment of organic powder. The surface treatment of organic powder materials is usually based on inhibition to make the organic powder more dispersed and more compatible in the polymer. Therefore, the composite material formed by it and polymer has good performance in terms of force, light, electricity and so on. When the plasma power source performs surface treatment on organic powders, polymer monomers and initiating gas mixed discharge are generally used. In this method, the discharge initiates the gas to generate active particles, and can initiate the grafting of polymerized monomers to the powder surface to form a modified coating layer. In addition to processing ordinary oxide organic powders, it can also process certain materials such as carbon fiber, activated carbon, and carbon nanotubes. Oxygen plasma is used to process the nano-carbon fiber material, and the mechanical properties of the treated carbon fiber and polypropylene are much better than that of the untreated one. In addition, under normal circumstances, after the carbon nanotubes are treated with a plasma power source, the dispersion and compatibility of the composite material can be significantly improved. Chengfeng Zhizao focuses on the research and development of plasma cleaners. If you want to know more product details or have questions about the use of the equipment, please click "Online Customer Service", and look forward to your call!

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The application of plasma plasma cleaning machine in the plastic and rubber products industry and the principle of degumming

The application of plasma plasma cleaning machine in the plastic and rubber products industry and the principle of degumming

The application of plasma cleaning machine in the plastic and rubber products industry and the principle of degumming: As consumers have higher and higher requirements for products, diversification and rapid change of plastic and rubber products are the future trend, and the requirements for craftsmanship are bound to become higher and higher. We have found in industrial applications that some rubber and plastic parts have difficulty in bonding when they are connected to the surface. This is because polypropylene, PTFE and other rubber and plastic materials are printed, bonded, and bonded without surface treatment. The effect of coating is very poor, or even impossible. At this time, the plasma technology of plasma plasma cleaner is used for surface treatment of these materials. Under the bombardment of high-speed and high-energy plasma, the surface of these materials is maximized, and an active layer is formed on the surface of the material, so that rubber and plastic can be Perform printing, bonding, coating and other operations. The application of plasma technology to the surface treatment of rubber and plastic has simple operation, no harmful substances before and after treatment, good treatment effect, high efficiency and low operating cost. Plasma plasma cleaners are widely used in the plastics and rubber industries, which are mainly reflected in the following aspects: 1. Increase ink adhesion and improve printing quality Plasma plasma cleaning machine Plasma technology is used in various common printing processes, such as pad printing, silk screen printing, and offset printing. For the surface of materials that are difficult to print, such as polypropylene, polyethylene, polyamide, polycarbonate, glass, and metal, only by using plasma pretreatment technology, solvent-free printing inks can be firmly attached for a long time. 2. Improve the bonding strength of the product In two-component injection molding and two-component extrusion molding operations, plasma treatment technology is used to achieve surface activation, which can bond two incompatible materials together. It is mainly to combine soft-touch materials, such as silicone rubber or thermoplastic polyurethane (TPU), and hard materials, such as high-strength and low-cost polypropylene materials. 3. Increase the bonding strength If there is no plasma surface treatment technology, many materials, such as polypropylene, polyetheretherketone or polyoxymethylene, cannot be bonded at all, or the bonding effect is poor. How to achieve high-strength, long-lasting and stable bonding effects of glass, metal, ceramics and plastics is a special challenge facing the manufacturing industry. The surface modification of the material by plasma surface treatment technology and the fine cleaning of the surface can make the materials to be combined have better bonding ability and obtain higher bonding strength. We talked about the three aspects of plasma plasma cleaning machine in the plastic and rubber products industry above. In fact, there are many other aspects. If you want to know more, you can consult our customer service hotline, and we will answer them one by one. So now let's talk about the principle of plasma degumming. The principle of plasma degumming of plasma plasma cleaning machine is called plasma degumming method, and the degumming gas is oxygen. Its working principle is to put the silicon wafer in a vacuum reaction system, pass in a small amount of oxygen, add 1500 V high voltage, and a high-frequency signal generator generates a high-frequency signal to form a strong electromagnetic field in the quartz tube to ionize the oxygen and form oxygen ions , Activated oxygen atoms, oxygen molecules and electrons and other mixture of plasma glow column. Activated oxygen (active atomic oxygen) can quickly oxidize the polyimide film into a volatile gas, which is pumped away by a mechanical pump, thus removing the polyimide film on the silicon wafer. The advantages of plasma degumming are simple degumming operation, high degumming efficiency, clean and smooth surface, no scratches, low cost, and environmental protection. The dielectric plasma etching equipment generally uses a capacitively coupled plasma parallel plate reactor. In the parallel electrode reactor, the reactive ion etching cavity adopts an asymmetric design with a small cathode area and a large anode area, and the etched object is placed on the electrode with a smaller area. Under the action of the thermal motion generated by the radio frequency power supply, the negatively charged free electrons reach the cathode quickly due to their small mass and fast moving speed; while the positive ions cannot reach the cathode in the same time due to their large mass and slow speed, thus making the cathode A negatively charged sheath is formed nearby. Under the acceleration of the sheath, the positive ions bombard the surface of the silicon wafer vertically, accelerating the chemical reaction on

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Research on cleaning and treating surface impurities of SERS active gold island membrane by low-temperature plasma equipment

Research on cleaning and treating surface impurities of SERS active gold island membrane by low-temperature plasma equipment

Research on cleaning and treating surface impurities of SERS active gold island membrane by low-temperature plasma equipment: The vacuum evaporation method forms a gold island film with surface-enhanced Raman activity on the surface of the silicon wafer. Raman spectroscopy found that the surface of the gold island film has amorphous carbon contaminants. By comparing the Raman spectra of different cleaning methods of low-temperature plasma equipment, it can be proved that cleaning the gold island film with oxygen plasma can effectively remove impurities on the gold surface, and the surface-enhanced Raman activity of the gold island film does not change significantly before and after cleaning.  Raman spectroscopy can provide various normal vibrational frequencies and related vibrational energy levels inside molecules, and is an effective method for studying the molecular structure of substances. Its great advantage is that there are no special requirements for sample preparation, and the sample can be measured in solution. Surface enhanced Raman spectroscopy (SERS) is an analysis technique that combines Raman spectroscopy and surface enhancement phenomena. The emergence of this low-temperature plasma equipment technology has greatly increased the detection sensitivity of Raman spectroscopy, even reaching the level of single-molecule detection. At present, SERS has been widely used in materials science, surface science, biomedicine and other fields, and it is one of the most sensitive spectroscopy techniques for studying surface/interface reactions. The preparation of a metal surface with nano-scale roughness is the primary condition for obtaining the SERS effect. At present, people mainly carry out SERS research on metal sol, metal island film and roughened metal electrode surface. The preparation method of the metal island film is mainly the vacuum evaporation method of low-temperature plasma equipment. The method has the advantages of accurate control of preparation conditions, relatively simple equipment, and easy operation. One of the main disadvantages is the pollution on the surface of the prepared metal island film. Due to the presence of a small amount of organic impurities in the vacuum chamber of the low-temperature plasma equipment during the preparation process, these impurities tend to be adsorbed on the surface of the substrate, resulting in strong and broad characteristic peaks in the obtained spectrum, which can sometimes seriously interfere with the true signal of the measured molecule. Many researchers have recognized this problem and have made various attempts to remove the surface impurities of the SERS substrate. Use CN~ with strong adsorption capacity to remove the contaminated silver surface layer; use alkanethiol to replace and adsorb the contaminants on the metal surface; select Cl i to remove impurities on the surface of the silver particles; chemical adsorption of iodide ions The impurity removal method of electrochemical oxidation: first use low-temperature plasma equipment plasma cleaning, and then use acetic acid soaking method to remove impurities on the surface of self-assembled gold particles, etc. It can be seen that for different SERS bases and experimental conditions, the methods for removing impurities are also different. The principle of plasma cleaning of oxygen low temperature plasma equipment is to generate carbon dioxide, carbon monoxide and water and other volatile substances through the reaction of oxygen free radicals with organic pollutants on the surface of the substrate, and then the vacuum pump sucks these volatile substances away. A layer of gold island film is vacuum-evaporated on the surface of the silicon wafer. The island membrane has a good surface enhancement effect, and the enhancement factor of the pyridine molecule is 10. The surface contamination of the gold island membrane was removed by oxygen ion cleaning, and the spectrum test showed that the surface enhancement characteristics of the gold island membrane did not change significantly before and after cleaning. Plasma cleaning with oxygen low-temperature plasma equipment can remove most of the amorphous carbon impurities on the surface of the gold island film formed by vacuum evaporation; the cleaned substrate can better retain the SERS activity for other molecules; the SERS signal attenuation is less after cleaning . Therefore, oxygen plasma cleaning is an effective way to remove impurities on the surface of the gold island film.

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Chengfeng Zhizhi plasma etching machine introduces the characteristics of dielectric barrier gas discharg

Chengfeng Zhizhi plasma etching machine introduces the characteristics of dielectric barrier gas discharg

Chengfeng Zhizhi plasma etching machine introduces the characteristics of dielectric barrier gas discharge: For the various working gases of the plasma etching machine, the inert gas is uniformly distributed in the discharge dielectric barrier at atmospheric pressure, and the metal circular electrode with the parallel plate structure can be used to study the discharge characteristics and properties of the inert gas in the dielectric barrier. The diameter of the electrode used in this study is 50mm, and the two electrodes are respectively coated with a layer of 1mm thick quartz glass, with a relative permittivity of 3.9 and an air gap interval of 5mm. The electrode and the barrier medium are placed in the discharge chamber, and the discharge chamber is first evacuated to below 5 Pa, and then filled with high-purity helium, argon and other gases. Use the ICCD high-speed camera to capture the side image of the DBD discharge, use the ITO transparent electrode as the bottom electrode and the 45° plane lens to assist, you can shoot to the bottom of the discharge area. The measured applied voltage Va, the total discharge current Vi and the calculated air gap voltage Vg waveform, wherein the measured quasi-sinusoidal dashed line is the applied voltage waveform, and the thin solid line is the current waveform. There is a current pulse on the applied voltage in every half cycle, which is a typical feature of uniform dielectric barrier discharge under the atmospheric pressure of a plasma etching machine. When studying the discharge mechanism, people are more concerned about the Vg value of the air gap voltage, but due to the existence of the barrier medium, the air gap voltage cannot be measured directly. Using the measured voltage Va and discharge current i, combined with the equivalent circuit of the plasma etching machine DBD, the voltage g can be calculated. Based on the measured voltage Va and the total discharge current i, the real voltage Vg on the air gap and the current id flowing in the flowing air gap are calculated. In this process, Vm(to) characterizes the cumulative effect of the discharge on the surface of the dielectric before to. When using the Vm(to) method to calculate, make the average value of Vm(t) 0 within an applied voltage cycle, that is, there is no self-polarization in the medium. The displacement current in helium discharge is much smaller than the transport current, so the transport current is basically the same as the actual measured total current, and it is no longer calculated separately. In the air gap, the voltage Vg increases with the increase of the applied voltage Va, and then decreases rapidly with the air gap discharge. This inflection point corresponds to the breakdown voltage of the air gap. When confirming the spatial uniformity of the discharge of the plasma etching machine, a 10ns discharge image can be taken near the peak of the discharge current, and it is found that the discharge has no light and dark discharge filaments, indicating that the discharge is uniform in space, so this is The discharge that is relatively easy to obtain in atmospheric pressure helium gas is uniform discharge; at the same time, it can be seen that there is a high-brightness light-emitting layer near the instantaneous cathode, which is a typical feature of glow discharge. Therefore, it can be concluded that the atmospheric pressure helium discharge belongs to the glow discharge. Light discharge. It can be seen from the voltage, current waveform and side light emission of the plasma etching machine that the power frequency is about 33kHz, the air gap thickness is about 6mm, the positive electrode is on the top, and the negative electrode is on the bottom. In addition, comparing the voltage and current waveform diagrams and the side emission diagrams, it can be seen that helium and helium DBD are very similar. The difference between the two is that their positive column area is not obvious, while the Faraday dark area is almost non-existent. The breakdown strength of the gas gap voltage waveform can be calculated. The breakdown strength of 6mm gas is 1kV/cm, which is much lower than that of atmospheric pressure gas of 30kV/cm. This low breakdown field strength is the guarantee for achieving uniform discharge of helium and gas at atmospheric pressure of the plasma etching machine. Chengfeng Zhizao has focused on plasma etching machine technology for 20 years. If you have any questions, please click on the Chengfeng Zhizao online customer service for consultation. Chengfeng Zhizao is waiting for your call!

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