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Photovoltaic plasma equipment Application of photovoltaic cell to produce plasma

Photovoltaic plasma equipment Application of photovoltaic cell to produce plasma

Plasma equipment used in photovoltaic batteries can be ion cleaning, etching, plasma plating, plasma coating, plasma ash, surface activation, modification and other occasions, the material processing, can improve the wetting ability of the material, enhance the bonding force, bonding force, while removing organic matter, oil or grease. In order to ensure the product quality and meet the technical requirements in the production process of photovoltaic cell modules, plasma treatment is carried out on the backboard materials and junction boxes required by photovoltaic cell modules to ensure that the bonding force meets the specification requirements. At present, the manufacturing of photovoltaic module plasma processing is mainly manually operated, which is time-consuming and laborious. Moreover, the distance between the plasma gun head and the back panel cannot be accurately controlled, which is easy to cause damage to the back panel. Photovoltaic back-shelf plasma automation reconstruction refers to the current edge scanning device is installed above the workbench converted into superposed assembly line, the control mode from artificial start to automatic control, and docking with the assembly line implementation component in place after the plasma processor automatically start to plasma processing component adhesive junction box area, drive plasma processor spear in reciprocating feed component junction box area scanning process, after the completion of the automatic stack storage. The specific process is as follows: the flow direction of the line body is from left to right; The product flows from the connection with the upper station and is sent to the lower part of the robot along with the conveying drag chain line. After the product is blocked, the conveying drag chain line stops conveying; The positioning cylinder jacks and positions the product; The transmission line PLC outputs the completed positioning signal to the robot. After the robot receives the positioning signal, it runs to carry out the elliptical plane trajectory of the product and complete the processing of the product surface. After the robot outputs the signal of the completed track to the conveying line PLC, the conveying line runs again and sends the finished surface products to the next station. The bottom plate automatic plasma scanning is carried out by stepping motor of Siemens PLC200 controlling X axis and Y axis, which drives the bottom plate gun in the junction box area of the bottom plate of the plasma processor (the area is 150*150MM) to carry out reciprocating feed scanning. Feed 40MM each time, feed 3 times, reciprocating 4 times, scanning length 150MM. Return to the origin and prepare for the next scan. The main function of the junction box is to connect the electricity generated by the photovoltaic cell to the outside line. The leading wire inside the component is connected with the inner wire in the junction box, and the inner wire is connected with the external cable, so that the component is communicated with the external cable. The connecting box is bonded to the bottom plate of the assembly by silica gel. In order to increase the bonding force between the assembly and the bottom plate, plasma treatment is usually required at the bonding area. The high frequency plasma generator is connected with the plasma generator through a flexible conduit. The high frequency plasma generator is mounted on a smooth rail bar arranged above the worktable, and a longitudinal strip-shaped work piece rail is arranged in the central position of the upper part of the worktable. The PC controller is connected with the hand-controlled switch, the high-frequency plasma generator and the workbench. Based on the single chip microcomputer, the trajectory of X axis and Y axis is set, and the working parts track of the plasma generator and the workbench is synchronously controlled to realize the plasma automatic scanning of the wire box. The results of plasma scanning were effectively improved through automation: the improved plasma treatment was about 59 dynes, compared with about 38 dynes for manual scanning (the dyne value varies with different products). The surface tension of the junction box is increased, so as to improve the binding strength of the junction box and the back plate, so that the bearing tension of the junction box is increased from 110N to 158N. Dry and wet insulation test, protection grade test, freezing test and humidity and heat test were carried out on the modified components, all of which met the test standards. Increase the precision of plasma treatment by mechanical positioning, and reduce the backplate scald. Before the transformation, the number of backboard scald defective products was reduced from the original 5 to 0, which realized the zero manufacturing of backboard scald defective products. After the transformation of

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Plasma surface treatment of polymer Plasma polymer modification method

Plasma surface treatment of polymer Plasma polymer modification method

In the use of plastic film, rubber, fiber fabric and other solid polymer materials, the properties of the material is not only related to its volume performance, the surface performance of the material also accounts for a considerable proportion. For example, it involves adhesion, friction, surface hardness and so on. Therefore, in order to meet the requirements of modern society for multi-functional materials, the surface modification of materials is often carried out. A new dry modification method, plasma-polymer modification, is introduced. Plasma is excited by the high energy received by some gaseous material. It is composed of electrons, ions, atoms, molecules, free radicals and photons. It is generally electrically neutral. Plasma is the state in which all kinds of matter exist, at the same level as solids, liquids, and gases. Some people call plasma the fourth state of matter. So how does plasma-polymer modification interact with the surface of polymer materials? The experiment was carried out with surface hydrophobic polyester film and treated with argon plasma for 5 minutes. The contact Angle of water was 100° after removal and 70° after standing for one day. Why is the film becoming more hydrophilic? This is because the surface of general polymer materials after NH4, O2, H2, N2, Ar will be excited to produce a variety of free radicals. After treatment, free radicals will quickly react with oxygen in the air to generate polar groups such as carboxyl group, hydroxyl group and amino group. Thereby increasing the hydrophilicity of its surface. Among these gases, inert gases such as hydrogen, nitrogen, and argon are non-reactive plasmas, while ammonia and oxygen plasmas are reactive plasmas. The so-called non-reactive type refers to the free radicals and ions in the plasma do not react with the surface of the material, but only play the role of excitation free energy. The material needs to contact with the air, thus causing changes in the surface chemical structure. Reactivity refers to the free radicals or ions in the plasma directly interact with the surface of the material and connect into new functional groups. The adhesion of polymer materials can be improved by the hydrophilic modification of plasma. For example, the surface tension of polyurethane composite adhesive is high, and the surface polarity of PP, PE and other plastic films is low, so the surface polarity of polyurethane adhesive can be improved by surface treatment modification of plastic film, and it can be well spread on the surface of plastic film, thus greatly improving the adhesion. In addition, it is not difficult for us to think that if fluorine gas is used to stimulate plasma surface treatment of materials, will the surface polarity of materials be reduced? Yes, for example, some hydrophilic fiber fabrics, after gasification of carbon tetrafluorocarbon (CF4) and difluoromethane (CH2F2) treatment, hydrophobic obvious. But research has found that this is true, meaning that hydrophobicity disappears after a while. According to the analysis, this is the result of the deposition of fluorine-containing groups on the surface. Fluorine gas is excited into plasma, and then partially adsorbed on the fabric surface, resulting in hydrophobic effect. The longer the treatment time is, the more gas is introduced and the more hydrophobic the surface is. But after a period of use, the modification effect wears off because the fluorine-containing components are not chemically bonded to the surface of the fabric, which is usually the result of physical adsorption. In addition to the hydrophilic and hydrophobic surface modification of plasma surface treatment, there is another basic and obvious function of plasma -- etching. Photoresist is a common example and has been used in practical production. The typical application of etching in polymer materials is to increase the printability of the fabric. Some inert gases, such as argon, helium and high molecular weight gases, are excited into plasmas and bombarded the surface of the fibers, which greatly increases the surface roughness, destroys the crystalline phase, loosens the surface structure, and increases the micro-clearance, thus increasing the accessible area of the dyes. Of course, another convenience is to introduce polar groups on the fiber surface at the same time, which increases the adsorption force with the dye molecules. These plasma-polymer modifications are sufficient to greatly improve the dyeability of the fabric.

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Plasma processor manufacturers for you to introduce the factors affecting the bond strength of adhesives

Plasma processor manufacturers for you to introduce the factors affecting the bond strength of adhesives

As we all know, if you want a more simple and quick way to obtain bonding strength, you can use plasma processor to treat the surface of the material to increase the bonding ability. What are the influencing factors of adhesive bonding strength in the actual production process? CRF plasma processor manufacturers will give you a look together. After the adhesive and curing agent are determined to form BD series composite coating, the cold welding bonding strength is mainly related to the amount of powder, curing agent and toughening agent in the composition. In addition, the construction technology, matrix material, surface roughness and cleanliness also have a great influence on the cold welding bonding strength. 1. Influence of powder addition amount: The proper addition of powdery filler can reduce shrinkage and eliminate internal defects, thus improving the bonding strength of the coating. However, the increase of the amount of powder added will reduce the adhesion of the adhesive material, thus reducing the bonding strength. 2. is the influence of the amount of curing agent added: Insufficient amount of addition, incomplete curing; The coating brittleness increases with the addition of too large amount, and the residual curing agent reduces the coating performance. Therefore, in the development of cold welding composite materials, it is necessary to accurately calculate the number of adding curing agent, BD series composite coating sales, has been prepared according to the proportion of curing agent, the user can according to the product specification of the proportion of calculation and weighing to add, without doing tedious calculation. 3.affect other factors: The addition of coupling agent can improve the bond strength, but the addition of defoaming agent, anti-aging agent and accelerator can only reduce the bond strength, so it must be strictly controlled. In addition, a certain roughness of the workpiece surface and the necessary cleanliness can improve the bond strength, on the contrary, the surface with oil or rust will make the bond strength seriously decreased, and even lead to failure. In order to improve the bonding strength, the following points should be noted: (1) The actual bonding area of the coarse surface is large, which is conducive to improving the bonding strength and machining the large tooth surface; BBD series adhesive curing agent adding proportion must be accurate, that is, must be strictly weighed in accordance with the proportion specified in the product manual, adding too much or too little will affect the adhesive strength. (2) BD series adhesive A, B two components must be mixed very evenly, the color should be consistent. (3) The surface of the matrix metal should be as clean as possible, and there should be no oil stains or rust by all means. (4) The environmental temperature of the construction is above 10℃, and the environmental temperature below 5℃ is not suitable for construction. In the process of construction, the bottom layer must be repeatedly scraped and coated to make the adhesive fully infiltrate the bottom surface. BD series of industrial adhesives at room temperature curing reaction is slow, can improve the curing temperature, when the conditions can be used 60~80 curing, coating generally 4~6h can be completely cured. The bonding strength between coating and substrate increases gradually after curing and continues to increase after putting into use.

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Risk control methods required in the application of vacuum low-temperature plasma processor

Risk control methods required in the application of vacuum low-temperature plasma processor

Vacuum cryogenic plasma processor is a new high-tech technology. By injecting enough energy into the gas, the gas can be separated into plasma state. The "activation" of the active ions in the plasma is used to remove the stains on the surface of the object. The vacuum low-temperature plasma processor is connected to a vacuum pump. During the cleaning process, the plasma in the cleaning room is cleaned to clean the surface of the object. Short-time cleaning can completely clean organic matter, pollutants can be removed by vacuum pump, cleaning degree can reach the molecular level. It can effectively avoid the secondary pollution of the liquid cleaning medium to the object to be cleaned. In the process of application, there should be a certain sense of risk control. 1. The following are the risks of vacuum low-temperature plasma processor: (1) Leakage risk of cleaning medium: The cleaning medium is usually gas, and a gas cylinder is often used and delivered to equipment that passes through a pipe. Leakage of pipes and gas equipment may cause accidents if cylinders or gas charges leak. If hydrogen, methane and other flammable and explosive gases are used, fire and explosion accidents may occur in the room with open fire and static electricity. If argon gas is used, it may cause poor ventilation in the room and cause asphyxiation accidents. Accident: If oxygen is used, oxygen is an oxidizing gas that can increase combustible material. If there is too much oxygen in the room, a fire may occur. (2) Risk of electric shock: Electrical insulation failure due to failure, aging, corrosion, mechanical damage, etc. The leakage protection device is not installed or the leakage protection device fails. 2. Control methods of vacuum low-temperature plasma processor: (1) Fire, explosion and asphyxiation measures: standardize the use of gas cylinders, gas cylinder accessories should be complete, and there are measures to prevent dumping. Cylinders should be tested periodically to ensure that they are within their validity period. The air supply pipeline is firmly connected with the air supply equipment. If oxygen is used, cylinders, joints, pressure reducers, hoses and equipment must be isolated from oil, grease and other flammable and explosive substances. Do not touch oxygen cylinders or oxygen devices with oily hands or gloves. If hydrogen is used, it is recommended to install a hydrogen leak alarm device near the equipment being used. (2) maintain indoor air circulation. If ventilation is poor, install a mechanical exhaust device. (3) Anti-electric shock measures, equipment must be grounded, power cord must be free from damage, no aging phenomenon.

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Cause analysis of poor vacuum plasma cleaning equipment effect

Cause analysis of poor vacuum plasma cleaning equipment effect

The vacuum plasma cleaning equipment relies on the high-energy particle flow of specific substances in the plasma to wash the surface of the object, and produces physical washing (such as argon plasma) or chemical reaction (oxygen plasma) to achieve the function of removing dirt on the surface of the object. Currently, plasma cleaning systems are designed to produce plasma by lowering the pressure in the reaction chamber and then introducing a suitable gas and starting power at a certain rate. Therefore, what is the reason for the poor effect of vacuum plasma cleaning equipment? Let's analyze it together. 1. Influence of electrode on cleaning effect of vacuum plasma cleaning equipment: The design of the electrode directly affects the cleaning effect of the vacuum plasma cleaning equipment, mainly including the material, layout and size of the electrode. For the internal electrode plasma cleaning system, because the electrode is in contact with the plasma, the electrode of some materials will be corroded or sputtered by some plasma, causing unnecessary pollution, changing the electrode size, and affecting the stability of the plasma cleaning system. The arrangement of electrodes has an important effect on the cleaning speed and homogeneity of plasma. A smaller electrode spacing confines the plasma to a narrower area, resulting in a higher density and faster cleaning. With the increase of interval, the cleaning rate decreases gradually, but the uniformity increases gradually. The size of the electrode in the plasma system determines the total capacity of the system. In plasma cleaning systems, the electrodes are distributed in parallel and are usually used as pallets. Larger electrodes can clean more parts at one time, improving the efficiency of equipment operation.   2. Influence of working pressure on cleaning effect of vacuum plasma cleaning equipment: The working pressure is an important parameter of vacuum plasma cleaning equipment. Pressurization means that the density of the plasma increases and the average energy level of the particles decreases. The increase of density can significantly improve the cleaning speed of plasma system for chemical-based plasmas, while the effect is not obvious for physical-based plasmas. In addition, the change of pressure will also lead to the change of the plasma cleaning reaction mechanism. For example, CF4/O2 plasma is used in silicon wafer etching process, which plays a leading role under low pressure. With the increase of pressure, chemical etching gradually strengthens and gradually occupies the dominant position.   3. Influence of power supply power and frequency on cleaning effect of vacuum plasma cleaning equipment: The power supply will affect a variety of plasma parameters, such as electrode temperature, generated self-bias and cleaning efficiency. The plasma cleaning speed increases with the increase of the output power and reaches the peak gradually, while the self-bias voltage increases with the increase of the output power. In the process of plasma self-biasing, frequency is an important parameter, and the power range is basically unchanged. With the increase of frequency, the effect of self-biasing is gradually weakened. Moreover, with the increase of frequency, the electron density in the plasma increases gradually, and the mean energy level decreases gradually.   4. The influence of the choice of working gas on the cleaning effect of vacuum plasma cleaning equipment: In the process design of vacuum plasma cleaning equipment, the choice of process gas is the key. Although most gases or mixtures of gases can remove contaminants in many cases, the rate of purification can vary and can be tens of times higher. For example, different proportions of sulfur fluoride (SF6) are added to oxygen (O2) as a process gas to clean the plexiglass. Reasonable selection of process gas can greatly improve the cleaning speed.

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Low-temperature plasma technology manufacturers plasma chemical vapor deposition technology

Low-temperature plasma technology manufacturers plasma chemical vapor deposition technology

By low temperature plasma (non-equilibrium plasma) as an energy source, the workpiece on the cathode glow discharge under low pressure, using the glow discharge (or the other heating body) the workpiece heated to a predetermined temperature, then the right amount in the reaction gas is piped in, and then through a series of chemical reactions and plasma reaction, form a solid film on the surface. Includes chemical vapor deposition and glow discharge enhancement and other general technology. The collisions between the particles produce strong ionization of the gas, which activates the reaction gas. Cathode sputtering occurs at the same time, which provides a clean surface with good activity for deposition of thin films. Therefore, the whole deposition process is distinctly different from that of thermal activation alone. The interaction of the two creates favorable conditions for improving the bonding force, reducing the deposition temperature and accelerating the reaction rate of the coating. According to the type of plasma volume source, plasma chemical vapor deposition technology can be divided into DC glow discharge, RF discharge and microwave plasma discharge. When the frequency of CVD reaction increases, the enhancement effect of plasma on CVD reaction becomes more obvious, and the temperature of compound formation decreases. The PCVD process unit includes a deposition chamber, a reactant transport system, a discharge power supply, a vacuum system and a detection system. The gas source uses the gas purifier to remove water and other impurities, obtains the required flow rate through the adjustment device, and then sends the gas source into the deposition chamber at the same time, under the conditions of certain temperature and plasma activation, obtains the required products, and deposits them on the surface of the workpiece or substrate. Therefore, the production process of PCVD includes plasma physical process and plasma chemical reaction process.

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