图片名称

NEWS

Popular Articles

Contact Us

图片名称
图片名称

Service Hotline

13632675935

CRF

TEL：13632675935

E-mail：shaobo@sfi-crf.com

Address: 1303, Building 3, Manjinghua Science and Innovation Workshop, No.6 Songjiang Road, Songgang Street, Bao'an District, Shenzhen, China.

Material polycrystalline silicon wafer plasma etching cleaning equipment to remove surface impurities

Material polycrystalline silicon wafer plasma etching cleaning equipment to remove surface impurities

With the development of semiconductor technology, wet etching has gradually limited its development due to its inherent limitations, because it has been unable to meet the processing requirements of micron or even nanometer fine wires in VLSI. Dry etching method of polycrystalline silicon wafer plasma etching cleaning equipment is gradually widely used in semiconductor processing technology because of its high ion density, etching uniformity, etching side wall verticality, high surface finish, can remove surface impurities. With the development of modern semiconductor technology, the requirement of etching is higher and higher. The plasma etching cleaning equipment of polycrystalline silicon wafer meets this requirement. The stability of equipment is one of the key factors to ensure the stability and repeatability of the production process. CRF plasma cleaning machine is a multi-functional plasma surface treatment equipment, through the configuration of different components, can have a surface coating (coating), etching, plasma chemical reaction, powder plasma processing and other capabilities. Polysilicon wafers are etched very well by plasma cleaning/etching machines. Through the configuration of etching components, the CRF plasma cleaning machine can achieve etching function, cost-effective, simple operation, so as to achieve multi-function. Plasma cleaning machine is the use of the characteristics of low temperature plasma to be processed materials of plasma surface treatment equipment, generally after plasma treatment, the surface tension of the material will be changed, wettability and hydrophilic, dyne value changes, suitable for dyne pen test of the material has a lot of, such as stainless steel, glass, plastic, ceramic lamp, etc. The dyne value is mainly represented by the dyne pen, also known as the surface tension detector pen, the corona treatment pen, and the plastic film surface tension detector pen. Surface tension test pen has 32, 34, 36, 38, 40, 42, 44, 46, 48, 50, 52, 54, 56, 58, 60 or more dozens of different tension test pen, can test whether the sample surface tension reaches the value of the test pen. After plasma surface cleaning and activation treatment, the surface energy of traditional materials can be improved, which is reflected in the experiment of material dyne value improvement. Plasma cleaning machine was used to treat the polymer plastic samples, and dyne values were compared before and after treatment. Before treatment, the Dane was crossed on the surface of the sample. After 40# crossing, the Dane slowly contracted and beads appeared, indicating that the Dane value was between 30 and 40. After plasma cleaning, 30#, 40# and 50# dyne stroke lines can be uniformly distributed without beads, indicating that the surface dyne value of the sample is greater than 50. After plasma cleaning machine treatment, the surface tension and surface energy of the material are improved, which provides the possibility for the subsequent process and material application.

MORE +
The change of surface activity of materials treated by nylon plasma surface processor

The change of surface activity of materials treated by nylon plasma surface processor

With the continuous improvement of nylon processing and modification technology, the application field of plasma surface processor is expanding rapidly, and the requirements for nylon surface cleaning, material protection, improving adhesion or dyeing performance in different application fields are also getting higher and higher. But the structure of various nylon materials is different, the corresponding surface properties are also obviously different. Plasma surface treatment technology has been developed to adapt to different applications. Plasma treatment can provide adhesion to the nylon surface and improve surface hydrophilicity and wettability by removing organic contaminants and introducing polar organic functional groups on the surface. Clean surfaces and surface wettability play a key role in the staining binding of the two surfaces. The degree of surface wettability depends on the surface condition of the nylon itself and on all the dyeing materials of the nylon. The high efficiency of low temperature plasma can increase the surface tension of the material to be dyed to the desired value for printing and dyeing. Before treatment: contact Angle of nylon tube is 78.16°; After treatment: after plasma cleaning machine treatment, nylon tube contact Angle is close to 0°; Conclusion: Plasma treatment can greatly change the surface activity of nylon material, greatly improve the surface energy and hydrophilicity of the sample to increase the printing and dyeing ability.

MORE +
Plasma Surface Modification Graft Polymerization of Metal Polymer Materials

Plasma Surface Modification Graft Polymerization of Metal Polymer Materials

Graft polymerization is one of the commonly used methods in plasma surface modification. The grafting of appropriate monomers or polymers can improve the hydrophilicity, adhesion, corrosion resistance, electrical conductivity and biocompatibility of metal polymer materials. Agnesr, Denes et al. grafted polyethylene glycol (PEG) onto the surface of stainless steel by plasma surface modification. XPS results showed that the introduction of a large number of -CH2-CH2-O groups on the surface of stainless steel could significantly improve the surface hydrophilicity of the material. It can reduce the roughness and greatly reduce the adsorption of bacteria on the surface of the material. In the treatment of coronary vascular disease, the common clinical method is to do coronary angioplasty (PTCA). That is, in the blood vessel with metal dilator will be open, but the polymer metallized Steetan fixed film used in them still has a high coagulation, so the blood vessel will be restenosis. Lahann et al. polymerized p-xylene chloride on the surface of polymer metal by CVD method, and then treated with SO2 microwave plasma. The results show that the contact Angle is reduced to 15 degrees after treated with SO2 plasma, and the hydrophilicity of the material surface is improved. The adhesion between polymer and metal is involved in the grafting of polymeric organic matter on the surface of metal plasma or the metallization of polymer surface. E.C.Zhang et al. studied the adhesion of polytetrafluoroethylene (PTFE) to metal aluminum. They first pretreated PTFE with an argon plasma at a frequency of 40kHz, a power of 35W, and an argon pressure of 80Pa. And its exposure to the atmosphere about 10 min to produce oxide and peroxide, and then conducted on the acrylic ester of glycerol alcohol namely GMA graft copolymerization, and then to thermal evaporation aluminum, make with GMA graft copolymer of PTFE and PTFE is the adhesion force between A and 22 times between Al, that only by Ar plasma pretreatment of 3 times between PTFE and Al. E.D ayss respectively with three methods (mechanical casting rough method, oxygen, nitrogen, argon, low pressure plasma and produce interlayers method) to deal with polypropylene, research metal polymer on the adhesive properties, the results show that mechanical casting rough method in the improvement of adhesion of polypropylene and q of copper is valid, but the plasma treatment can lead to better results, especially the Ar plasma, plasma polymerization of acrylic acid middle tier contains C - 0 keys showed very strong adhesive.

MORE +
Biological research plasma surface treatment equipment to improve the corrosion resistance of metal

Biological research plasma surface treatment equipment to improve the corrosion resistance of metal

Once the metal material in the biological body corrodes, the corrosion products generated by the dissolved metal ions will have a bad effect on the human body, so the corrosion must be controlled. Research shows that the metal material itself will not produce allergic reaction to the human body, but because of corrosion and dissolved metal ions or dissolved ions in the form of metal salt and the combination of biological molecules or the form of abrasive powder will cause harm to the human body. In addition, the fracture of metal materials in the human body is usually caused by fatigue and friction fatigue, but these two factors are not simple, in fact, it is caused by corrosion fatigue, and corrosion is closely related. To prevent the toxicity of metal materials in the human body. To improve its safe use and prolong its service life, in the biological environment, biological research plasma surface treatment equipment on the corrosion performance of metal materials is very important. At present, most of the commonly used clinical medical stainless steel contains nickel (such as medical 316I stainless steel containing nickel for 10 ~ 14). Nickel element is a potential sensitization factor. The precipitation and enrichment of nickel ions in human body due to corrosion or wear can induce toxic effects, cell destruction and inflammatory reactions. Similarly, the Co and Ni elements in medical Cobalt-based alloys also have serious sensitization problems. The V and Al in medical titanium alloy are also harmful to organisms. These problems restrict the application of metal biomaterials. Metallic biomaterials direct contact with the body's tissues, in order to make implant materials, give full play to its function in the body by plasma surface modification on it, for example, in the stainless steel surface by a layer of polymer film, low temperature plasma grafting or spraying a layer of diamond thin films, in cobalt base alloy and titanium alloy surface with biological research of plasma surface treatment equipment of the preparation of plasma grafting TiO2 thin film can effectively prevent the precipitation of nickel ions, improve its corrosion resistance, reduce the abrasion of the product ion precipitation around the implants adverse reactions, greatly improve the safety of biological implant materials use for a long time.

MORE +
How to do the right maintenance strategy for plasma surface treatment machine

How to do the right maintenance strategy for plasma surface treatment machine

Plasma surface treatment machine is a multifunctional machine, can increase the surface tension, nanoscale fine cleaning, remove static electricity, activate the surface. Nowadays, more and more attention is paid to saving cost, protecting environment and safety. It has become indispensable and loved by all walks of life, whether for manufacturing or experimental research and development. With the increasing market demand, plasma surface processors are widely used in all walks of life. Because of its relatively cheap price, its maintenance is also valued by everyone. After a period of use, if you do not pay attention to routine maintenance, the function of the plasma surface processor is easy to damage, directly affect the surface treatment effect, processing speed and the life of the plasma equipment. Therefore, it is necessary to maintain regularly, so how to do the maintenance strategy of plasma surface processor correctly? Warm Tips: The maintenance of the plasma surface processor must be performed by a professional. Non-professional personnel are prohibited from disassembly and maintenance to avoid unnecessary loss or personal injury.   Daily maintenance strategy: 1. Check whether the voltage of the display screen is normal, within the voltage range of 220V ±10%; 2. Check whether the plasma pressure is within the normal range. The air pressure of rotary plasma machine is 0.2-0.3 Mpa, and the air pressure of direct injection plasma machine is 0.1-0.2 Mpa (slightly different according to the actual processing situation); 3. Check whether the power plug of the plasma surface processor is effectively grounded; 4. Confirm that the switch is normal and effective, press the switch to check whether it is energized; Whether the plasma flame works normally, turn the plasma machine to observe whether the gun head rotates normally. 5. Check whether the distance between the nozzle of the plasma surface processor and the material is within the normal range (direct injection distance is 10-20 mm, rotation distance is 6-10 mm); 6. Clean up the dust, dirt and foreign matter inside the equipment, and remove the dust, dirt and foreign matter with vacuum cleaner, alcohol and dust-free cloth after power failure;   Weekly maintenance strategy: 1. Keep the machine clean, clean the surface and interior of the machine; 2. Check water pollution and oil pollution in the air filter once a week; 3. Check that the high-voltage cable between the sprinkler head and the main machine should be wired naturally, and large Angle bending is forbidden;   Monthly maintenance strategy: 1. Clean the dust on the surface of the fan and high voltage transformer in the main engine with the brush every month, and clean the dust on the surface once half a month in bad environment; 2. It is recommended to oil bearings once a quarter; 3. Check whether the plasma flame intensity meets the product treatment standards. If the flame is shortened, the distance between the nozzle and the material needs to be shortened; Plasma copper core to be replaced once a year or so.   Notes for use: 1. There is high frequency and high pressure inside the plasma system. It is strictly prohibited to open the back cover of the chassis for debugging and maintenance, and reliable grounding. To avoid electric shock, do not operate with wet hands. 2. The temperature of plasma flame is very high, do not use it in places with inflammable and explosive articles. 3. Please do not touch the plasma flame with your hands to avoid electric shock and scald. 4. When the plasma machine is moving, it is strictly prohibited to put the body and other articles into the protective cover to avoid unnecessary losses; 5. Without the permission of the equipment technician, it is not allowed to change the specific system parameters at will; 6. In case of emergency due to improper operation of the machine, press the button to turn off the power immediately.

MORE +
Packaging plasma cleaning machine pretreatment technology semiconductor field application

Packaging plasma cleaning machine pretreatment technology semiconductor field application

Optimized lead connection (wiring) : The bonding quality of the chip leads is a key factor affecting the reliability of the device. The lead bonding area must be guaranteed to be free of contaminants and have good bonding performance. The presence of oxides, organic residues and other contaminants will seriously weaken the tensile value of the lead connection. The conventional wet cleaning method can not completely or completely remove the contaminants in the bonding zone, but the plasma cleaning method can effectively remove the dirt on the surface of the bonding zone and activate the surface of the bonding zone, which can significantly improve the bonding tension of the lead wire and greatly improve the reliability of the package device. Wafer and packaging substrate bonding, often are two different nature of the material, the material surface is characterized by a hydrophobic and inertia, adhesive performance is poor, the adhesive interface, easy to produce gap brings chip great hidden trouble, the wafer plasma processing and packaging substrate surface, can effectively improve the activity of the surface of the wafer, and greatly improve chip encapsulation adhesive liquid epoxy resin on the surface of the substrate, improve chip encapsulation of substrate binding and invasive, reduce the chip and the substrate layer, improve the heat conduction ability, improve the reliability of chip packaging, stability, prolong the service life of the product. The advantages of plasma pretreatment flip chip packaging, improve the reliability of the welding: flip chip packages, using plasma processing technology to chip and loading board processing, not only can make weld surface ultra purification, and can significantly improve the activity of weld, can effectively prevent welding, reduce hole, improve the reliability of welding, at the same time can improve the edge of the weld height and inclusive, improve packaging mechanical strength, decrease due to the thermal expansion coefficient of different materials in the interface between the formation of the gel, improve product reliability and life expectancy. Packaging plasma cleaning machine pretreatment lead frame surface treatment: In the field of microelectronics packaging, lead frame encapsulation forms still accounted for more than 80%, it mainly adopts thermal conductivity copper alloy materials, conductive, processing the good performance of the lead frame, as a result of the copper oxide and other organic pollutants can cause seal forming copper lead frame in the process of layering, encapsulate the sealing performance variation and chronic permeability gas phenomenon, but also affects the bonding and wire bonding of the chip quality, to ensure that the lead frame for ultra clean packaging reliability and the yield is the key, by plasma treatment can achieve lead frame surface super purification and activation, finished product yield than the traditional wet cleaning has greatly improved, And does not produce waste water discharge, reduces the procurement cost of chemical solution. Packaging plasma cleaning machine pretreatment technology for semiconductor packaging: improve the coating quality of ceramic packaging: in the packaging of ceramic products, usually use the metal paste printed circuit board as the bonding area, sealing sealing area. Using plasma to clean the surface of these materials before electroplating can remove the drill dirt in organic matter and improve the coating quality significantly.

MORE +
< 1...181920...43 > proceed page
图片名称

CRF

National Service Hotline

136 3267 5935

Contact Email

shaobo@sfi-crf.com

Address:1303, Building 3, Manjinghua Science and Innovation Workshop, No.6 Songjiang Road, Songgang Street, Bao'an District, Shenzhen, China.

图片名称

Add WeChat
Get related information

Links

Apply to exchange friend links

Copyright © Shenzhen Chengfeng Smart Co.

京ICP备10002622号-38

粤公网安备 44030602005200号

图片名称

Cheng Feng Zhi Zuang a focus on plasma research and development for 20 years

We

The services of

Inquire for free sample testing

1-to-1 program customization

24-hour online after-sales service

Source manufacturer

Get the program
%{tishi_zhanwei}%
图片名称

Scan the code for information

诚峰智造