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Typical applications of material processing technology for thin film plasma surface treatment machines

Typical applications of material processing technology for thin film plasma surface treatment machines: The plastic film is treated with plasma surface treatment machine treatment technology, and part or all of the material surface treatment can be selected. The mechanical properties of the material did not change before and after treatment. The equipment uses gases and nothing else to effectively clean, activate or coat these thin-film materials by selectively controlling process parameters such as temperature, nozzle position, width and speed. The advantages and characteristics of the plasma surface treatment machine technology for pretreatment of thin films: it has complete "on-line" integration capability (without affecting the original process operation), saves energy, reduces costs, protects the environment, does not change the mechanical properties of the thin film, and can achieve Selective, local cleaning, standard nozzle width, processable width: 2.20 meters or more, double-sided processing of films, effective surface activation, and long-lasting surface treatment effects; additives for surface precipitation The cleaning effect, eliminate the static effect. Good surface pretreatment of plasma surface treatment machine is a prerequisite to ensure the quality of subsequent coatings. For many companies, the environmentally friendly water-based coating process is the core link of their production. The application of plasma pretreatment technology makes water coating technology possible. The plasma surface treatment machine can remove oil and dust from the material, and give the material higher surface energy. The cleaning effect of plasma pretreatment technology can remove oil stains on the surface, the antistatic effect of plasma can remove dust particles attached to the surface, and the chemical reaction effect can increase the surface energy. The comprehensive effect of these aspects makes the plasma pretreatment technology. Becoming an efficient tool, in general, plasma pretreatment does not require additional cleaning steps and primer treatments. Typical applications of plasma treatment, reliable coating adhesion, and plasma surface treatment machine pretreatment technology include automotive and aviation industries, electronic appliances and household appliances manufacturing, daily necessities manufacturing and packaging industries. Pre-treatment ensures strong adhesion of surface coatings on metallic materials such as aluminum, plastic materials such as PP or EPDM, or other materials.

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Surface modification of bamboo powder/PETG composites by low temperature plasma treatment technology

Surface modification of bamboo powder/PETG composites by low temperature plasma treatment technology: Wood-plastic composite material is a composite material made of thermoplastics and bamboo fibers with a small amount of chemical additives and fillers and other auxiliary agents, through a special composite method, and has the dual characteristics of plastic and bamboo, that is, it has the following Advantages: good acid and alkali resistance, chemical resistance, salt water resistance, can be used at low temperature, UV resistance, no rot, no cracking or warping and other mechanical properties, low price, long service life, easy to shape, easy to process , recyclable, no formaldehyde and other harmful gas release, etc., has been widely used in automobile manufacturing, construction, transportation, packaging and other fields. However, due to the poor wettability and poor adhesion of the surface of the bamboo-plastic composite material, the bonding process on the surface is greatly affected. In order to improve the wettability of the material surface, the ideal modification method is low temperature plasma treatment technology. Plasma is an ionized gas-like substance", containing electrons, positive ions and neutral particles, a high-energy aggregate of various particles. Plasma is divided into high-temperature plasma and low-temperature plasma according to temperature. Usually, low temperature plasma Plasma treatment techniques are used for the modification of material surfaces. The energy of the active particles in the plasma of low temperature plasma treatment technology is generally close to or exceeds the bond energy of C-C or other carbon bonds, which will modify the surface of the composite material and cause complex physical and chemical changes on the surface of the material, such as Etching, cross-linking, etc. to improve the contact angle and surface energy of the polymer surface. The increase of plasma discharge power of low temperature plasma treatment technology increases the number of active particles in the plasma atmosphere, the energy increases, the etching effect of active particles on the surface of the sample is strengthened, the contact angle of the surface of the sample decreases, and the surface of the sample decreases. Wetting is improved. With the increase of the discharge power, the contact angle of the sample surface increases with the increase of the discharge power. As the treatment time increases, the thickness of the oxide layer increases and the polarity of the oxygen-containing functional groups increases. After low-temperature plasma treatment of the sample, the water absorption rate of the sample increases with the increase of the low-temperature plasma discharge power; after the low-temperature plasma treatment of the sample, the water absorption rate of the sample decreases with the increase of the low-temperature plasma discharge power . This is because after the low-temperature plasma treatment technology plasma treats the sample, increasing the low-temperature plasma discharge power will promote the conversion of inactive particles inside the low-temperature plasma into active particles with higher energy that are easy to participate in the reaction, which is beneficial to the low-temperature plasma. The reaction between the body and the surface of the sample increases the oxygen content on the surface of the sample, the number of polar oxygen-containing functional groups increases, and the water absorption rate increases. With the further increase of the power, the energy obtained by the active particles from the electric field increases, and the probability of the particles colliding with each other increases, resulting in the loss of particle energy and the weakening of the molecular interaction between the active particles and the sample surface, resulting in wetting. The relative decline of the property, the water absorption rate decreased. This is because with the increase of treatment time, the number of polar oxygen-containing functional groups introduced on the surface of the sample increases, and the surface polarity increases. Low-temperature plasma treatment technology After plasma treatment, the amount of -COC on the surface of the sample increases, but with the increase of low-temperature plasma treatment time, the amount of -COC on the surface gradually decreases. The oxide layer thickens, and the attractive -COC on the surface of the sample is further oxidized to -C=O.

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The effect of atmospheric plasma discharge voltage on the conversion reaction of plasma CH4 to H2

The effect of atmospheric plasma discharge voltage on the conversion reaction of plasma CH4 to H2: With the increase of the discharge voltage, the conversion rate of methane and the yield of C2 hydrocarbons showed an upward trend, and the selectivity of C2 hydrocarbons increased first and then decreased. When the atmospheric plasma discharge voltage was 16 kV, the selectivity of C2 hydrocarbons was large. According to literature reports, the emission intensity changes of CH active species under low temperature atmospheric plasma conditions are directly affected by the working pressure and discharge parameters. The degree of methane cracking in the plasma can be detected by the strength of the CH active species. Because the intensity of the same spectral line is proportional to the particle density of the component, the relative intensity of the spectral line can be inferred from the change of each process parameter. The number of particles varies with the corresponding process parameters. With increasing discharge voltage, the emission intensity of atmospheric plasmaCH active species increases with the increase of discharge voltage. The reason is that under the condition of constant gas flow rate, the energy obtained by the electrons accelerated by the electric field is low when the input voltage is low, and the total collision cross-sectional area in the low-energy state is also low, and the collision probability between CH4 and high-energy electrons is small, so This results in fewer active species being generated. With the increase of the discharge voltage, the ionization rate and electron density increase, and the cross-section of the collision between high-energy electrons and CH4 also increases, which means that the collision probability increases and the generated CH active species increase. It was also noticed that the coke deposits on the reactor walls increased with increasing voltage during the experiment.

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The effect of the oxidizing gas N2 on the conversion reaction under the action of plasma

The effect of the oxidizing gas N2 on the conversion reaction under the action of plasma: Influence of energy density Ed (kJ/mol) on CH4 conversion reaction: CH4 conversion and C2 hydrocarbon yield gradually increased with the increase of energy density, which means increasing plasma injection power and decreasing feedstock in flow reactor The air flow is beneficial to improve the conversion rate of CH4 and the yield of C2. When the energy density is 2000 kJ/mol, the CH4 conversion and C2 hydrocarbon yield can reach 52.7% and 40.9%, respectively. The relationship between energy density and CH4 conversion and C2 hydrocarbon yield is approximately logarithmic. When the energy density is lower than 1000kJ/mol, the CH4 conversion rate and C2 hydrocarbon yield increase rapidly with the increase of energy density; when the energy density exceeds 1000kJ/mol, the CH4 conversion rate and C2 hydrocarbon yield increase rapidly with the increase of energy density slow. It shows that in this reaction, the increase of energy density does not mean that the energy efficiency increases, on the contrary, there is a downward trend. Therefore, from the perspective of energy efficiency, an appropriate energy density should be selected. The effect of N2 addition on the CH conversion reaction in plasma: As the N2 concentration in the feed gas increases, the CH4 conversion rate increases, indicating that the inert gas N2 is present. Conducive to CH4 conversion. The yield of C2 hydrocarbons increased slightly with the increase of N2 addition amount, and the carbon deposition on the reactor wall decreased slightly with the increase of N2 addition amount. However, compared with the effect of H2 on the methane dehydrogenation coupling reaction, under the same experimental conditions, the yield of C2 hydrocarbons is lower and the amount of carbon deposition is higher. From the emission spectrum of CH-N2 plasma, it can be found that the characteristic peak of N2 and the spectral peak of CH at 431 nm are in the wavelength range of 400-440 nm. Since the cleavage energy of the N-N bond of nitrogen molecules is as high as 9.76 eV, the possibility of forming N atoms in pulsed corona plasma is relatively small, so the active particles in the CH4-N2 plasma system are excited to free molecules and methyl groups. Based on the main. The effect of O2 addition on methane plasma conversion reaction under the plasma energy density of 629 kJ/mol: Methane conversion increases with the increase of O2 addition, but the yield of C2 hydrocarbons (mainly C2H2) increases with the increase of O2 addition. gradually decreased. The research on adding gas to the methane plasma system shows that the addition of H2 or N2 not only promotes the conversion of methane, but also helps to improve the yield of C2 hydrocarbon products. The addition of O2 can effectively promote methane conversion, but the yield of C2 hydrocarbon products decreases.

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Chengfeng Zhizao Plasma introduces the importance of ethylene as a chemical raw material for industrial development

Chengfeng Zhizao Plasma introduces the importance of ethylene as a chemical raw material for industrial development: The mixed gas of methane and ethane widely exists in natural gas, oilfield gas, refinery gas and catalytic cracking gas, and the relative content of ethane is small. Separating and purifying methane and ethane and then utilizing them separately is costly. Without separation, directly using methane containing part of ethane as raw material to carry out the conversion reaction is a practical need from many occasions. The proven oil reserves in my country are 2.27×1017t and the natural gas reserves are 1.97×1021 m3. With the continuous development and utilization of the above resources, the amount of ethane in natural gas, oilfield gas, refinery gas and catalytic cracking gas will increase sharply. . Therefore, it is necessary to carry out the research on the ethane conversion reaction, which is of great significance for the rational utilization of ethane. As an important organic chemical raw material, ethylene is one of the symbols to measure the development level of a country's chemical industry. As we all know, the production of ethylene from ethane has always been one of the main processes of petrochemical industry. The traditional method is high-temperature cracking and dehydrogenation, which is a strong endothermic process. It not only requires high temperature (generally higher than 850 °C), but also needs to be carried out under negative pressure (adding a large amount of superheated steam for dilution), which consumes a lot of energy. , the operation is complicated, and the product separation is very difficult. If catalytic dehydrogenation is used, the reaction temperature can be lower than that of pyrolysis dehydrogenation, but it still has its limitations and is not sufficiently competitive. Moreover, with the continuous depletion of petroleum resources, the potential for preparing raw material ethylene from petroleum is nearly exhausted, and it is difficult to compete with petrochemicals economically from coal, and the oxidative dehydrogenation of gaseous alkanes is a realistic and effective way to fill this gap. way. Under the situation of increasingly tight energy supply, further efficient utilization of gaseous carbon resources has important strategic significance.

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Pure ethane can undergo dehydrogenation reaction under the action of plasma plasma at low temperature and atmospheric pressure

Pure ethane can undergo dehydrogenation reaction under the action of plasma plasma at low temperature and atmospheric pressure: Under atmospheric pressure pulsed corona plasma conditions, the conversion rate of C2H6 and the yield of C2H2 increased with the increase of energy density, the yield of C2H4 increased slightly, but the yield of CH4 did not change much with the increase of plasma energy density. When the plasma energy density was 860 kJ/mol, the conversion of C2H6 was 23.2%, and the sum of the yields of C2H4 and C2H2 was 11.6%. It is generally believed that in a flow plasma reactor, when the flow rate of the reactant gas is constant, the high-energy electron density and its average energy in the system are mainly determined by the plasma energy density. The plasma power increases, the high-energy electron density and its average energy in the system increase, the elastic and inelastic collision probability between high-energy electrons and C2H6 molecules and the transmitted energy increase, and the CH bond and CC bond of C2H6 are more likely to break, and their breakage increases. The concentration of the free radicals formed also increases, and the probability of the free radicals to form products by recombination also increases. Therefore, the conversion rate of C2H6 and the yield of C2H2 tend to increase with the increase of plasma power. The insignificant upward trend of C2H4 yield and CH4 yield with the increase of plasma injection power may be related to the fact that C2H4 and CH4 are the primary reaction products of the reaction, and C2H2 is more stable. Chemical bond Dissociation energy/(kJ/mol) Dissociation energy/(eV/mol) CH3—CH3 367.8 3.8 C2H5—H 409.6 4.2 CH2=CH2 681.3 7.1 C2H3—H 434.7 4.5 CH≡CH 964.9 10.0 C2H—H 501.7 5.2 The main gas phase products of the conversion reaction of pure C2H6 under plasma conditions are: C2H4, C2H2, H2 and CH4, and the solid product is carbon deposition. In order to explore the possible mechanism of the conversion of pure ethane under the action of plasma, the conversion of pure ethylene was investigated under the same plasma conditions. The main products of the reaction were: C2H2, CH4 and a small amount of carbon deposits. According to the above experimental facts, combined with the mechanism of methane conversion reaction and plasma characteristics under the action of plasma, it is speculated that the process of C2H6 conversion reaction under plasma conditions is as follows. (1) The plasma field produces high-energy electrons. The free electrons are accelerated under the action of the electric field E to generate high-energy electrons e*: e + E → e* (3-26) (2) Initiates a free radical reaction. High-energy electrons collide elastically and inelastically with ethane molecules. Depending on the energy of the high (3-26) energy electrons, the collision leads to an increase in the kinetic energy or internal energy of the ethane molecule, which breaks the C-H and C-O bonds of ethane to generate various free radicals: C2H6 + e* → C2H5 + H + e (3-27) C2H6 + e* → 2CH3 + e (3-28) According to the chemical bond dissociation energy data in Table 3-1, the reaction formula (3-28) (C-C bond breaking) is more than the reaction Equation (3-27) (C-H bond cleavage) is easier to carry out. (3) Chain transfer reaction: H + C2H6 → C2H5 + H2 (3-29) CH3 + C2H6 → C2H5 + CH4 (3-30) CH3 + e* → CH2 + H (3-31) CH2 + e* → CH + H (3-32) CH + e* → C + H (3-33) (4) Chain termination reaction: CH3 + H → CH4 (3-34) CH2 + CH2 → C2H4 (3-35) CH3 + CH → C2H4 (3-36) CH + CH → C2H2 (3-37) Under the low temperature and normal pressure, pure ethane can undergo dehydrogenation reaction under the action of plasma to generate acetylene, ethylene, a small amount of methane and carbon deposits, but there are problems such as low conversion rate and the formation of carbon deposits on the reactor wall. According to the ethane dehydrogenation reaction mechanism under chemical catalytic conditions, for the ethane dehydrogenation reaction under plasma conditions, the CH bond of ethane is preferentially broken to form C2H5 radicals, and the C2H5 radicals are further dehydrogenated to ethylene. Key pathways for hydrogen reactions in practical applications. Therefore, the effect of the added gas and plasma on the ethane dehydrogenation reaction is particularly important.

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