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Chengfeng Zhizhi plasma equipment manufacturer will introduce you the influencing factors of PEF plasma treatment

Chengfeng Zhizhi plasma equipment manufacturer will introduce you the influencing factors of PEF plasma treatment

Chengfeng Zhizhi plasma equipment manufacturer will introduce you the influencing factors of PEF plasma treatment: In previous articles, the basic principles and typical models of PEF plasma treatment have been introduced, and the following content mainly introduces the related content of the factors that affect PEF plasma treatment. In fact, the main parameters that affect the effect of PEF plasma treatment can be divided into three categories: material characteristic parameters, processed medium characteristic parameters and processing process parameters. The plasma equipment manufacturer of Chengfeng Zhizhi will introduce you the detailed information below. Plasma equipment PEF plasma treatment influencing factors The cell characteristic parameters of the material: The cells treated by the plasma method are mainly manifested in the type of microorganisms, the area, shape and growth cycle of the cells. Characteristic parameters of the treated medium that affect the PEF plasma treatment of the plasma equipment: The characteristic parameters of the processing medium, or the characteristic parameters of the food in the food field, mainly include the electrical conductivity, acidity and alkalinity, water quality of the food, and the composition of the processing medium. pH is an important external parameter in the process of cell growth, and the activity of water affects the osmotic pressure inside and outside the microbial cell membrane. Treatment process parameters of the influencing factors of PEF plasma treatment of plasma equipment: The process parameters during processing mainly include: electric field strength, pulse waveform, pulse width, processing time, frequency, energy, processing temperature, etc. The intensity of the pulse field and the processing time are important factors that affect the effect of PEF processing. Compared with the exponential wave, the square wave has a higher energy utilization efficiency than the exponential wave, and the electrochemical corrosion in the bipolar processing chamber is lower. The pulse width and frequency determine the processing time, and the pulse energy contains the electric field strength and processing time, so their influence on the processing time is a comprehensive performance of many basic electrical parameters. In addition, the rise time of the pulse waveform also has an important impact on the PEF processing effect. There is a certain correlation between the above influencing factors. For example, the conductivity of the processing medium determines the equivalent impedance of the processing chamber, and the equivalent impedance affects the pulse waveform parameters output by the pulse power supply; for square waves In other words, the difference in load impedance leads to the difference in pulse rise time. Therefore, when analyzing differences in processing effects, the processing parameters, processing medium characteristics, and processing unit characteristics should be specifically considered. Chengfeng Zhizhuang plasma equipment manufacturers have focused on the development of plasma cleaning machines for 20 years. If you want to know more product details or have questions about the use of the equipment, please click Chengfeng Zhizhao's online customer service, waiting for your call!

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Research on plasma surface treatment of ultra-smooth substrate by plasma etching machine

Research on plasma surface treatment of ultra-smooth substrate by plasma etching machine

Research on plasma surface treatment of ultra-smooth substrate by plasma etching machine: Plasma treatment can remove the processed deterioration layer by sputtering, reduce the surface roughness, improve the surface cleanliness and surface energy of the substrate. The optimized parameters prove that the substrate treated by plasma etching is better than the substrate without plasma treatment. The loss after coating was reduced by an average of 34.2ppm and showed good consistency. In recent years, with the rapid development of semiconductor technology and optical technology, the application of ultra-smooth surfaces has become more and more extensive, and the requirements for the quality of ultra-smooth surfaces have become higher and higher. In the manufacture of laser gyro, the processing quality of the mirror substrate directly affects the optical performance of the coated mirror and the quality of the photoresist between the optical elements, which in turn affects the accuracy, stability and reliability of the gyro. At present, the super-smooth surface is mainly obtained by polishing. Due to the processing characteristics and environmental factors, the polished super-smooth surface adsorbs a large number of particulate organic matter and other pollutants, and the optical surface obtained by the asphalt polishing process is a "pseudo surface", namely There is a processing deterioration layer, which is composed of a rheological layer damage layer and a hydrolyzate layer. The "pseudo surface" has a large number of internal defects and is highly active. It is easy to become a nucleation center during the coating process, which seriously affects the physical structure of the film and thus has a great impact on the optical performance of the mirror. In order to describe the real surface, the surface is divided into: outer surface layer (pollutant, adsorption layer) and inner surface layer (processed deterioration layer). Traditional surface treatment mainly uses brushing and ultrasonic cleaning. Due to the technology itself, it can only remove the dirt adsorbed on the surface, that is, the outer surface layer, and has no effect on the inner surface layer (polished and deteriorated layer). Plasma etching Plasma surface treatment is a technology developed in the past ten years, and it is widely used due to its full dry method and good pollution-free treatment effect. The ion energy in the plasma reaches hundreds of electron volts, which can not only remove the fine impurities adsorbed on the surface, but also sputter and polish the surface of the substrate. Plasma treatment can reduce the surface roughness of the substrate and remove the processed deterioration layer. The radio frequency power of plasma etching directly affects the density of gas ionization and the energy of ions, which in turn affects the effect of plasma on the surface of the substrate. Plasma surface treatment uses high-energy ions to act on the surface of the substrate to sputter off the loose atomic layer (that is, the polished metamorphic layer) by collision. The treatment is carried out in a vacuum environment, and the surface of the substrate is not easily contaminated, thereby obtaining freshness. The dense real surface improves the quality of the ultra-smooth optical surface, which is conducive to the growth of epitaxial films. Before plasma etching plasma treatment, the droplets are not spread out on the surface of the substrate, and the shape is irregular; after plasma treatment, the droplets spread out on the surface, the average spread area is 4.6 times that before the treatment, and the shape is regular Round. This shows that the surface energy of the substrate is improved and becomes uniform after plasma treatment. The surface of the asphalt-polished substrate must have a processing deterioration layer. Plasma etching plasma treatment can remove the processing deterioration layer by sputtering, reduce surface defects, greatly improve the cleanliness and surface energy of the substrate surface, and obtain a fresh, dense, uniform, and flat Super smooth surface.

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Application of plasma etching technology in chip integrated circuit manufacturin

Application of plasma etching technology in chip integrated circuit manufacturin

Application of plasma etching technology in chip integrated circuit manufacturing: Plasma etching is one of the key processes in the manufacture of chip integrated circuits. Its purpose is to completely copy the mask pattern to the surface of the silicon wafer. Its scope covers the control of the size of the front-end CMOS gate, as well as the etching and etching of the back-end metal aluminum. Etching of Via and Trench. Today, no integrated circuit chip can be completed without plasma etching technology. The investment in etching equipment accounts for about 10% to 12% of the equipment investment in the entire chip factory, and its technological level will directly affect the quality of the product and the advancement of production technology. It was reported very early that the literature on plasma etching technology was published in Japan in 1973, and soon attracted the attention of the industry. The parallel electrode etching reaction chamber (Reactive Ion Etch-RIE), which is still widely used in chip integrated circuit manufacturing, was proposed in 1974. This kind of reaction chamber consists of the following items: a vacuum chamber and a vacuum system, a gas system for providing different gas types and flow rates, a radio frequency power supply and its regulating and matching circuit system. The principle of plasma etching can be summarized as the following steps: 1. Under low pressure, the reaction gas is excited by radio frequency power to produce ionization and form plasma. The plasma is composed of charged electrons and ions. The gas in the reaction chamber is converted into ions under the impact of electrons. , Can also absorb energy and form a large number of active groups; 2. The active reactive group and the surface of the etched substance form a chemical reaction and form a volatile reaction product; 3. The reaction product separates from the surface of the etched material and is drawn out of the cavity by the vacuum system. In a plasma reaction chamber with parallel electrodes, the etched object is placed on an electrode with a smaller area. In this case, a DC bias voltage will be formed between the plasma and the electrode and cause a positively charged reaction. The gas ions accelerate to hit the surface of the etched material. This ion bombardment can greatly accelerate the chemical reaction on the surface and the desorption of reaction products, resulting in a high etching rate. It is precisely because of the existence of ion bombardment that all directions The opposite sex is etched. There are many types of plasma etching technology, such as pure physical etching, pure chemical reactive etching, and so on. Etching can be divided into wet etching and dry etching. The etching method used in the early chip semiconductor manufacturing process is wet etching, that is, using a specific chemical solution to decompose the part of the film to be etched that is not covered by photoresist, and convert it into a compound that is soluble in the solution, and then eliminate it to achieve etching. the goal of. Plasma is a state of existence of matter. Generally, matter exists in three states: solid, liquid, and gas, but in some special cases, there is a fourth state, such as the ionosphere in the earth’s atmosphere. The following substances exist in the plasma state: electrons in a state of high-speed motion; neutral atoms, molecules, and groups of atoms (radicals) in an activated state; ionized atoms and molecules; unreacted molecules, atoms, etc., but the substance is in the whole The electrical neutral state is still maintained. In the vacuum chamber, a high-energy disordered plasma is generated by the radio frequency power supply under a certain pressure, and the surface of the product is cleaned by plasma bombardment. In order to achieve the purpose of cleaning.

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In 2021, the low-temperature plasma cleaning machine manufactured by Chengfeng Intelligent will enter the biomedical field again

In 2021, the low-temperature plasma cleaning machine manufactured by Chengfeng Intelligent will enter the biomedical field again

In 2021, the low-temperature plasma cleaning machine manufactured by Chengfeng Intelligent will enter the biomedical field again: The cost advantage is the huge advantage of domestic medical biomaterials and related devices. With the continuous improvement and implementation of the hierarchical diagnosis and treatment policy, primary medical and health institutions have an increasing demand for yi treatment machines. At the same time, the hospital’s more refined budget management has also encouraged relevant institutions to prefer to purchase domestically-made equipment that is more cost-effective. Under this background, the domestic medical materials and equipment market has a good development prospect. , Looking forward to the low temperature plasma cleaning equipment made by Chengfeng Zhizhi once again set sail in the field of medical biology, and take advantage of the trend. As a high-duan precision manufacturing industry, the core competitiveness of the medical device industry is still technology. Due to the particularity of yi therapy equipment, the safety and effectiveness control requirements are usually very strict. Its technology involves many industries such as medicine, machinery, electronics, plastics, etc. The plasma treatment process of the low temperature plasma cleaning machine also has its unique treatment Requirements, especially medical polymer materials, in addition to certain functional properties and mechanical properties, must also meet the basic requirements of biocompatibility. The company has many years of experience in low-temperature plasma cleaning machine processing services, providing customers with plasma surface treatment services, and using low-temperature plasma cleaning machine processing technology, with the surface modification of medical polymer materials and surface film synthesis research, to solve the problem of anticoagulation, Key technologies such as biocompatibility, hydrophilic polymer surface, anti-calcification, cell growth and cell compatibility. The equipment has been widely used in materials such as cardiovascular stents, intraocular lenses, three-dimensional cell culture stents, urinary catheters, syringes, cardiac leak traps, puncture heads, diagnostic test strips, microfluidic biochips, petri dishes, 96-well microtiter plates, etc. Surface treatment. By 2021, Chengfeng Zhizhi plasma cleaning machine is expected to be more closely integrated with medical materials and equipment related fields, and take advantage of the trend. Chengfeng Zhizao has focused on plasma cleaning machines for 20 years. If you have any questions, please click on the Chengfeng Zhizao online customer service for consultation. Chengfeng Zhizao is waiting for your call!

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Chengfeng Zhizhi plasma etching machine introduces the characteristics of dielectric barrier gas discharg

Chengfeng Zhizhi plasma etching machine introduces the characteristics of dielectric barrier gas discharg

Chengfeng Zhizhi plasma etching machine introduces the characteristics of dielectric barrier gas discharge: For the various working gases of the plasma etching machine, the inert gas is uniformly distributed in the discharge dielectric barrier at atmospheric pressure, and the metal circular electrode with the parallel plate structure can be used to study the discharge characteristics and properties of the inert gas in the dielectric barrier. The diameter of the electrode used in this study is 50mm, and the two electrodes are respectively coated with a layer of 1mm thick quartz glass, with a relative permittivity of 3.9 and an air gap interval of 5mm. The electrode and the barrier medium are placed in the discharge chamber, and the discharge chamber is first evacuated to below 5 Pa, and then filled with high-purity helium, argon and other gases. Use the ICCD high-speed camera to capture the side image of the DBD discharge, use the ITO transparent electrode as the bottom electrode and the 45° plane lens to assist, you can shoot to the bottom of the discharge area. The measured applied voltage Va, the total discharge current Vi and the calculated air gap voltage Vg waveform, wherein the measured quasi-sinusoidal dashed line is the applied voltage waveform, and the thin solid line is the current waveform. There is a current pulse on the applied voltage in every half cycle, which is a typical feature of uniform dielectric barrier discharge under the atmospheric pressure of a plasma etching machine. When studying the discharge mechanism, people are more concerned about the Vg value of the air gap voltage, but due to the existence of the barrier medium, the air gap voltage cannot be measured directly. Using the measured voltage Va and discharge current i, combined with the equivalent circuit of the plasma etching machine DBD, the voltage g can be calculated. Based on the measured voltage Va and the total discharge current i, the real voltage Vg on the air gap and the current id flowing in the flowing air gap are calculated. In this process, Vm(to) characterizes the cumulative effect of the discharge on the surface of the dielectric before to. When using the Vm(to) method to calculate, make the average value of Vm(t) 0 within an applied voltage cycle, that is, there is no self-polarization in the medium. The displacement current in helium discharge is much smaller than the transport current, so the transport current is basically the same as the actual measured total current, and it is no longer calculated separately. In the air gap, the voltage Vg increases with the increase of the applied voltage Va, and then decreases rapidly with the air gap discharge. This inflection point corresponds to the breakdown voltage of the air gap. When confirming the spatial uniformity of the discharge of the plasma etching machine, a 10ns discharge image can be taken near the peak of the discharge current, and it is found that the discharge has no light and dark discharge filaments, indicating that the discharge is uniform in space, so this is The discharge that is relatively easy to obtain in atmospheric pressure helium gas is uniform discharge; at the same time, it can be seen that there is a high-brightness light-emitting layer near the instantaneous cathode, which is a typical feature of glow discharge. Therefore, it can be concluded that the atmospheric pressure helium discharge belongs to the glow discharge. Light discharge. It can be seen from the voltage, current waveform and side light emission of the plasma etching machine that the power frequency is about 33kHz, the air gap thickness is about 6mm, the positive electrode is on the top, and the negative electrode is on the bottom. In addition, comparing the voltage and current waveform diagrams and the side emission diagrams, it can be seen that helium and helium DBD are very similar. The difference between the two is that their positive column area is not obvious, while the Faraday dark area is almost non-existent. The breakdown strength of the gas gap voltage waveform can be calculated. The breakdown strength of 6mm gas is 1kV/cm, which is much lower than that of atmospheric pressure gas of 30kV/cm. This low breakdown field strength is the guarantee for achieving uniform discharge of helium and gas at atmospheric pressure of the plasma etching machine. Chengfeng Zhizao has focused on plasma etching machine technology for 20 years. If you have any questions, please click on the Chengfeng Zhizao online customer service for consultation. Chengfeng Zhizao is waiting for your call!

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The technology of vacuum plasma machine is eye-opening, and contact lenses can also be processed with it

The technology of vacuum plasma machine is eye-opening, and contact lenses can also be processed with it

The technology of vacuum plasma machine is eye-opening, and contact lenses can also be processed with it: With the rapid development of low-temperature plasma surface treatment technology, vacuum plasma machines have been widely used in many industries such as automobile manufacturing, textiles, medical equipment, health and beauty, cosmetics, etc., and gradually penetrated into people’s lives, quietly changing people’s lives . Maybe you still have some doubts, contact lenses can also be processed in a vacuum plasma machine. Contact lenses, also called contact lenses, are lenses worn on the cornea of ​​the eyeball to correct vision or protect the eyes. Contact lenses can be divided into hard, semi-hard, and soft according to their softness and hardness. Because of its small size, light weight, easy-to-wear, beautiful appearance, it has been favored by consumers in recent years. Now if I ask you, what are the characteristics of contact lenses? How to choose? Is it impossible to answer for a while? In fact, wearing contact lenses is comfortable and not dry, and the surface is aseptic and hygienic. These characteristics actually contain many characteristics that contact lenses need to have, such as smooth surface, good water wettability, and good durability. , Wearing comfort, reducing bacterial adhesion, etc. These characteristics sometimes require the low-temperature plasma processing technology of the vacuum plasma machine to complete. At present, the main method of caring for hard lenses is washing and dipping with care solution, which is of great help to the safe use of lenses. However, the above methods still cannot fundamentally solve the problems of the deterioration of the physical properties of the lens and the decrease in comfort with the increase of use time, and some impurities on the surface of the lens cannot be completely removed by the care solution. In order to ensure the user's better wearing safety and comfort, it is very important to perform surface treatment on the contact lens through a vacuum plasma machine. After the surface of the contact lens is treated by the vacuum plasma machine, the surface can be further cleaned to make the surface of the lens smooth, water-wet, durable, comfortable to wear, and reduce bacterial adhesion. Chengfeng Zhizhuang has focused on the research and development of vacuum plasma machines for 20 years. If you want to know more product details or have questions about the use of the equipment, please click Chengfeng Zhizhao's online customer service, waiting for your call!

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