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Vacuum plasma processing machine vacuum plasma processing to solve bonding problems

Vacuum plasma processing machine vacuum plasma processing to solve bonding problems

        The vacuum plasma processor can help you solve the adhesion problem, improve the surface energy of the material, and ensure good adhesion. Then, how the vacuum plasma processor solves this problem will be discussed below. Vacuum plasma processor         Vacuum plasma treatment provides innovative surface modification technology and solves adhesion and wetting problems for many industries. The use of plasma processing is an important step in the printing, bonding, painting, painting and finishing processes. Vacuum plasma surface modification provides an economical solution for surface cleaning and activation of parts before further processing.         How does vacuum plasma treatment contribute to the solution of bonding?         To obtain good surface adhesion with low-polar materials such as PP, PE, HDPE, etc., the surface must be improved, that is, to increase its polarity. Placing components in the plasma chamber is a very effective way to increase the polarity of the material. During high-activity plasma discharge, free radicals and other particles are generated. These particles will adhere to the surface of the material, thereby generating additional polar groups on the surface of the material. These have a strong chemical attraction for inks, paints, coatings, adhesives, etc. Strength can enhance surface energy and thus adhesion.         Introduction to the internal structure of the vacuum plasma processor:         Separate rack-for large parts; multi-layer rack-for flat parts; laboratory-for testing equipment.         Tray structure: special tray; movable tray; large tray.         The company also develops and owns multiple laboratory-type vacuum plasma processors, which are light and compact, and can be placed on the workbench. They are an economical and effective solution to the problem of surface wetting. This device is very simple to install and can be processed in just a few minutes. The equipment only needs 220V power supply, and is equipped with an independent vacuum pump, and does not need to be connected to any separate vacuum power supply.         Vacuum plasma cleaning is a "dry cleaning" process that can replace chemicals that are harmful to the environment. Plasma is an ideal choice for cleaning and removing organic residues on ceramic surfaces.

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Research on Improving Hydrophilicity of Polyimide Plasma Treatment

Research on Improving Hydrophilicity of Polyimide Plasma Treatment

Research on improving hydrophilicity of polyimide plasma treatment:         Polyimide (P84) fiber has good mechanical properties, radiation resistance, thermal stability and non-combustibility, and can be widely used in some special environments, such as fire protection, electronic aerospace and industrial production. Because polyimide (P84) fiber is limited by its surface structure chemical inertness and surface energy, its poor adhesion affects its reinforcing effect in composite materials. Low-temperature plasma surface modification methods can be used to overcome this shortcoming of fibers.         Plasma is a gas composed of high-energy charged particles and neutral particles. Plasma surface modification only occurs on the surface of the material and does not affect the body of the fiber, so that the fiber can fully improve its surface performance while maintaining its own excellent overall performance.         Through low-temperature plasma surface treatment, the surface of the material undergoes multiple physical and chemical changes, or is etched and rough, or forms a dense cross-linked layer, or introduces oxygen-containing polar groups to make the hydrophilic adhesiveness dyeable Performance, biocompatibility and electrical properties have been improved.         Comparing the surface of the P84 fiber before and after the treatment, it is found that the surface of the untreated fiber is smooth, while pits appear on the surface of the P84 fiber after low-temperature plasma treatment. This is because particles such as ions and electrons excited molecules or atoms in the plasma sputter and etch the fiber surface. The chemically active substances in the plasma cause oxidative degradation and other reactions on the surface of the material to cause chemical micro-etching.         Under the simultaneous action of the two etchings, pits are formed on the surface of the P84 fiber, and convex deposits are generated at the same time, thus increasing the micro-roughness of the fiber surface. After low-temperature plasma modification, the relative content of N and O elements on the surface of P84 fibers increased significantly. The relative content of C element decreased, and the O/C ratio rose from 25.79% to 27.32%, which indicated that oxygen-containing groups were added on the fiber surface.         Plasma treatment produces unsaturated bonds and free radicals on the surface of polyimide (P84) fibers. These unsaturated bonds and free radicals interact with oxygen in the air to generate new oxygen-containing polar groups, thereby making P84 fibers The chemical composition of the surface changes.         After plasma treatment, the surface of polyimide (P84) fiber undergoes oxidation reaction, and hydrophilic polar groups are introduced into the fiber surface. Enhance the moisture absorption and moisture conduction performance. This is because when low-temperature plasma particles bombard the surface of the polyimide (P84) fiber, the surface will undergo processes such as etching, cross-linking and oxidation, thereby introducing a large number of hydrophilic groups. The presence of hydrophilic groups greatly enhances the moisture absorption capacity of the fiber surface; at the same time, the surface area of ​​the polyimide (P84) fiber after low-temperature plasma treatment increases the surface area, which further improves the moisture absorption and moisture conduction performance.

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Research on Improving Hydrophilicity of Polyimide Plasma Treatment

Research on Improving Hydrophilicity of Polyimide Plasma Treatment

Research on improving hydrophilicity of polyimide plasma treatment:         Polyimide (P84) fiber has good mechanical properties, radiation resistance, thermal stability and non-combustibility, and can be widely used in some special environments, such as fire protection, electronic aerospace and industrial production. Because polyimide (P84) fiber is limited by its surface structure chemical inertness and surface energy, its poor adhesion affects its reinforcing effect in composite materials. Low-temperature plasma surface modification methods can be used to overcome this shortcoming of fibers.         Plasma is a gas composed of high-energy charged particles and neutral particles. Plasma surface modification only occurs on the surface of the material and does not affect the body of the fiber, so that the fiber can fully improve its surface performance while maintaining its own excellent overall performance.         Through low-temperature plasma surface treatment, the surface of the material undergoes multiple physical and chemical changes, or is etched and rough, or forms a dense cross-linked layer, or introduces oxygen-containing polar groups to make the hydrophilic adhesiveness dyeable Performance, biocompatibility and electrical properties have been improved.         Comparing the surface of the P84 fiber before and after the treatment, it is found that the surface of the untreated fiber is smooth, while pits appear on the surface of the P84 fiber after the low-temperature plasma treatment. This is because particles such as ions and electrons excited molecules or atoms in the plasma sputter and etch the fiber surface. The chemically active substances in the plasma cause oxidative degradation and other reactions on the surface of the material to cause chemical micro-etching.         Under the simultaneous action of the two etchings, pits are formed on the surface of the P84 fiber, and convex deposits are generated at the same time, thus increasing the micro-roughness of the fiber surface. After low-temperature plasma modification, the relative content of N and O elements on the surface of P84 fibers increased significantly. The relative content of C element decreased, and the O/C ratio rose from 25.79% to 27.32%, which indicated that oxygen-containing groups were added on the fiber surface.         Plasma treatment produces unsaturated bonds and free radicals on the surface of polyimide (P84) fibers. These unsaturated bonds and free radicals interact with oxygen in the air to generate new oxygen-containing polar groups, thereby making P84 fibers The chemical composition of the surface changes.         After plasma treatment, the surface of polyimide (P84) fiber undergoes oxidation reaction, and hydrophilic polar groups are introduced into the fiber surface. Enhance the moisture absorption and moisture conduction performance. This is because when low-temperature plasma particles bombard the surface of the polyimide (P84) fiber, the surface will undergo processes such as etching, cross-linking and oxidation, thereby introducing a large number of hydrophilic groups. The presence of hydrophilic groups greatly enhances the moisture absorption capacity of the fiber surface; at the same time, the surface area of ​​the polyimide (P84) fiber after low-temperature plasma treatment increases the surface area, which further improves the moisture absorption and moisture conduction performance.

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Powder plasma surface treatment equipment Plasma powder treatment improves surface tension

Powder plasma surface treatment equipment Plasma powder treatment improves surface tension

        Powder materials, especially nano-materials (nano-materials refer to particles or structures, crystals or nano-composites with a nanometer length ranging from 1 to 100 nm). A very important feature is the surface effect. The surface effect of powder materials is the powder The ratio of the surface atom number of the bulk particles increases greatly with the smaller the size of the powder particles. After the powder plasma surface treatment equipment is processed, the surface energy of the particles can be increased, that is, the surface tension also increases, thereby causing changes in the properties of the powder materials. . Powder plasma surface treatment equipment         As the particle size decreases, the specific surface area of ​​the particles increases rapidly and is very unstable. Therefore, these atoms are easily combined with other atoms and stabilized. They have high chemical reaction activity. For example, metal nanoparticles will burn in the air. Some oxide powder particles are exposed to the atmosphere to adsorb gases and so on.         The main problem in the application of powder materials for powder plasma surface treatment equipment is to improve the surface effect of the powder. Improve the dispersibility and surface indirectness of the powder. For example, it can be seen that the smaller the nano-particle size, the more obvious the nano-specific function. The smaller the particle size of the powder, the more serious the agglomeration of particles. The agglomerates may reach sub-micron or even micron levels, which seriously affects the application of nano additives in fibers, especially the spinnability of the powder particle/fiber composite system. The use of powder plasma surface treatment equipment can realize the conventional performance of particles, which fully reflects the special functions of the powder particle/fiber composite system.

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Vacuum low temperature plasma processor technology provides activation effect in flexible materials

Vacuum low temperature plasma processor technology provides activation effect in flexible materials

        The vacuum low temperature plasma processor technology provides an excellent surface activation effect on flexible materials. It can be used for plasma cleaning before wire bonding to provide a cleaner bonding surface, provide surface activation function for flexible materials, and the removal process is uniform and stable. . Vacuum low temperature plasma processor technology         The plasma treatment of the vacuum low temperature plasma processor has always been regarded as an important process in the microelectronics and semiconductor packaging industry. Before introducing a suitable plasma process, plasma cleaning can make the bonding surface cleaner, thereby reducing product failures. The potential benefits are improved surface activity of flexible materials, improved equipment reliability, and elimination of deviations due to unsystematic effects, such as random surface contamination caused by uncontrollable factors.         The low-temperature plasma processor has an "alchemy" or "black box" halo. The plasma contributes to the performance of the lead connection process and the long-term reliability of the packaged device. Plasma has a double advantage: it improves the wire connection process itself and ensures the long-term reliability of the device. In order to greatly improve the quality and success rate of its manufacturing process and products through plasma cleaning before in-line bonding, the vacuum low temperature plasma processor plasma is a completely independent system. It not only saves energy, but also occupies a small space, so that the processing capacity is enlarged, and the production base area is reduced at the same time.         The double-layer rack cabinet of the vacuum low temperature plasma processor can install 20 30x35 inch panels in one cycle, and the multi-functional horizontal rack cabinet can handle a variety of different flexible PCB sizes and can be loaded easily. Efficient anti-fouling etching technology can remove epoxy resin, polyimide, compound and other resins, and has the ability to remove dust, which can effectively remove the resist residue on the inner layer and the panel and the residual solder paste exudation Objects, thereby improving adhesion and solderability.

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Vacuum low temperature plasma processor technology provides activation effect in flexible materials

Vacuum low temperature plasma processor technology provides activation effect in flexible materials

        The vacuum low temperature plasma processor technology provides an excellent surface activation effect on flexible materials. It can be used for plasma cleaning before wire bonding to provide a cleaner bonding surface, provide surface activation function for flexible materials, and the removal process is uniform and stable. . Vacuum low temperature plasma processor technology         The plasma treatment of the vacuum low temperature plasma processor has always been regarded as an important process in the microelectronics and semiconductor packaging industry. Before introducing a suitable plasma process, plasma cleaning can make the bonding surface cleaner, thereby reducing product failures. The potential benefits are improved surface activity of flexible materials, improved equipment reliability, and elimination of deviations due to unsystematic effects, such as random surface contamination caused by uncontrollable factors.         The low-temperature plasma processor has an "alchemy" or "black box" halo. The plasma contributes to the performance of the lead connection process and the long-term reliability of the packaged device. Plasma has a double advantage: it improves the wire connection process itself and ensures the long-term reliability of the device. In order to greatly improve the quality and success rate of its manufacturing process and products through plasma cleaning before in-line bonding, the vacuum low temperature plasma processor plasma is a completely independent system. It not only saves energy, but also occupies a small space, so that the processing capacity is enlarged, and the production base area is reduced at the same time.         The double-layer rack cabinet of the vacuum low temperature plasma processor can install 20 30x35 inch panels in one cycle, and the multi-functional horizontal rack cabinet can handle a variety of different flexible PCB sizes and can be loaded easily. Efficient anti-fouling etching technology can remove epoxy resin, polyimide, compound and other resins, and has the ability to remove dust, which can effectively remove the resist residue on the inner layer and the panel and the residual solder paste exudation Objects, thereby improving adhesion and solderability.

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