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Industrial plasma cleaning machine

Industrial plasma cleaning machine

The cleaning involved in industrial production is generally industrial cleaning. According to the requirements of cleaning accuracy, it can be divided into industrial cleaning, precision cleaning and ultra-high precision industrial cleaning. In the industry, plasma cleaning machine is widely used.   General industrial cleaning including car, ship, aircraft surface cleaning, generally only need to remove the surface rough and not smooth stains; High precision industrial cleaning includes the cleaning of the production and processing process of all kinds of products, the cleaning of the surface of all kinds of materials, which is characterized by the removal of tiny stains particles; Super precision cleaning includes precision industrial production of mechanical parts, electronic parts, optical parts and other super precision cleaning, easy to clean fine particles.   In addition to cleaning precision, cleaning can also be divided into physical and chemical treatment according to different cleaning methods. The use of mechanical, acoustic, electronic optics, thermology and other principles, with the help of external kinetic energy such as mechanical equipment friction, ultrasonic, air pressure, high pressure impact, ultraviolet radiation, negative pressure, known as physical cleaning; According to chemical change, the removal of surface dirt of chemical drugs, other solvent is called chemical cleaning, if use different inorganic or organic acid to remove surface besmear, use oxidant to remove surface tint, use fungicide to remove microbial species mildew spot and other substances. Both physical and chemical methods have their own advantages and disadvantages, and have good diversity. They are usually used in combination throughout the application process for a stronger cleaning effect.   Cleaning with different media, can be divided into wet cleaning and dry cleaning; Usually the cleaning in the liquid is called wet cleaning, the cleaning in the medium is called dry cleaning. Now mainly to dry cleaning, dry cleaning developed rapidly, laser cleaning, UV cleaning, dry ice cleaning, plasma cleaning machine and other new cleaning equipment in the ultra-high precision industrial production technology has been rapidly developed, new technology is constantly used in the cleaning process.

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Plasma surface processor plasma cleaning photoresist

Plasma surface processor plasma cleaning photoresist

Residue on the surface of the chip, metal ions, organic matter and residual air pollutant produces in the process of semiconductor components, in order to prevent the air pollutants do serious harm to the production and processing chip, in the process of chip manufacturing, chip production need more cleaning procedures, plasma surface treatment machine plasma cleaning equipment is chip photoresist removal efficiency of pollutants such as ideal cleaning equipment. Photoresist plays a very important role in the whole production and manufacturing process, its cost accounts for about 25% of the whole production and manufacturing process, and poor removal effect will affect productivity. Choose in addition to traditional photoresist is high cost and low efficiency of wet degumming, and at the same time with the processing technology of continuous iterative update, more and more manufacturers begin to choose plasma cleaning dry remove photoresist, and such as to clean dry degumming is different from traditional process, it does not need to immerse organic chemistry, organic solvents, also do not need to handle with dry, stripping process easier to control, to avoid too many defective products, improve the yield of the product. Dry degumming method, also known as plasma surface treatment plasma degumming method, its basic principle is similar to the plasma cleaning method, is to remove the colloid through the reaction of oxygen atomic nucleus, because the basic composition of photoresist is hydrocarbon, the reaction produces carbon monoxide, carbon dioxide, water and other substances, and then suction to complete the removal. Plasma surface treatment technology applications include treatment, ash, modification, etching and other processes. The choice of plasma cleaning equipment, not only can completely remove photoresist and other organic matter, but also can activate the wafer surface, improve the wettability of the wafer surface. Polymers, including small holes of different shapes and long and narrow holes, can be easily cleaned using plasma. It is known that if the holes become sharp, the metal liquid can be difficult to inject. This is because the sharp corners increase the surface tension, which affects the flow of the metal liquid. Plasma cleaning can remove residue such as deep holes or other deep photoresists.

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What is the material and structure of the electrode of the plasma cleaning machine

What is the material and structure of the electrode of the plasma cleaning machine

Electrode material and structure of plasma cleaning machine: In recent years, due to the practical application value of atmospheric pressure plasma technology in industrial production and its application prospect in various industries, the enthusiasm of scientists from all over the world has been aroused, and the theory and technology of atmospheric pressure plasma technology have been developed rapidly. The whole process of charging and discharging under atmospheric pressure of plasma cleaning machine has unique characteristics, so its application is different from that of vacuum. The material and structure of electrode of plasma technology under atmospheric pressure are discussed.   Definition of dielectric barrier charge and discharge:   Dielectric barrier charge and discharge (DBD) is a heterogeneous gas charge and discharge caused by the insertion of a dielectric material between metal electrodes.   Basic electrode structure of cleaning equipment or plasma plasma cleaning machine processing system:   In general, the electrodes are two parallel surface electrodes, at least one of which is covered by a dielectric material. In order to ensure the reliability of charge and discharge, the distance between the two electrodes is only millimeters, and sinusoidal alternating current or DC pulse high voltage power supply is needed to achieve atmospheric discharge. Depending on the discharge condition, the excitation operating voltage and frequency, the glow will form in the middle of the electrode. A single filamentous discharge is composed of surface microdischarge or discharge band. The formation of glow requires rare gases such as nitrogen and helium, which can produce metastable particles.   Another type of electrode structure is in which the discharge is generated between two dielectric material layers in direct contact with the metal electrode. The double layer discharge structure is used to avoid the direct contact between plasma and metal electrode, which makes the plasma more uniform and the discharge wire more fine. Suitable for corrosive gas separation and high purity plasma system.   The electrode structure of the third type of plasma cleaning machine is columnar. The key of making the low-temperature plasma torch and modifying the irregular surface layer is to make the columnar electrode and the columnar structure discharge system. Because the appearance of products and materials and the requirements of production and processing are different, so the design of plasma electrode is very important for the equipment.

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The action of each gas in plasma cleaning machine

The action of each gas in plasma cleaning machine

Plasma cleaning machine equipment commonly used gases are compressed air, oxygen, argon, hydrogen, argon hydrogen mixed gas CF4, etc. Before cleaning objects with plasma cleaning equipment, it is necessary to analyze the cleaning objects and contaminants, and then select the appropriate gas. According to the basic principle of the equipment, the selective gas can be divided into hydrogen, oxygen and other special gases. Hydrogen is mainly used for cleaning compounds on the metal surface. The oxygen in the plasma cleaning device is used to clean the organic matter on the surface of the object, resulting in oxidation removal. Non-reactive gas in plasma cleaning machine equipment, such as argon, helium, nitrogen and so on. The hardness and wear resistance can be improved after nitrogen treatment. Argon and helium have stable properties, and the working voltage of molecular charge and discharge is low, so it is easy to generate metastable molecules. On the one hand, the high-energy particle physics effect is used to clean up objects that are easy to oxidize or reduce.   The AR gas bombarded the pollutants with volatile chemicals, which were expelled through the vacuum pump, preventing the surface chemicals from reacting. Argon is very easy to form metastable molecules, and when it collides with oxygen atoms, it will produce positive charge transformation and recombination. The application of pure hydrogen in plasma plasma equipment is very effective, but considering the reliability and safety of charge and discharge, argon hydrogen compounds can also be used in plasma cleaning machines. In addition, reverse oxygen and argon oxygen cleaning sequence can also be used, this cleaning method has the characteristics of easy oxidation and easy reduction.   1. Argon: The principle of argon cleaning is physical bombardment of the surface. Argon is physically efficient because it has a large atomic size and can penetrate the surface layer of a product with a great deal of energy. The positive argon ions are attracted to the negative plate, the impact force makes all the surface stains disappear, and then the gas pollutants will be discharged with the pump.   2. Oxygen: organic chemical reaction occurs with chemicals on the surface of the product. For example, oxygen can reasonably remove organic chemical pollutants and react with the pollutants to produce carbon dioxide, carbon monoxide, and water. In general, chemical reactions facilitate removal of organic contaminants.   3. Hydrogen: Hydrogen can be used to remove oxides from metal surfaces. Often mixed with argon to improve the ability to remove dirt. People generally pay attention to the flammability of hydrogen and the use of hydrogen storage, we can use hydrogen generator to produce hydrogen from water, to eliminate the potential safety hazards.   4.CF4 / SF6: Fluorinated gas is generally used in semiconductor materials and PWB (printed circuit board) and other industrial production. Fluorinated gas used in PADS process can convert oxides into chlorides, so as to achieve flow free welding.

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Plasma cleaning machine controller

Plasma cleaning machine controller

Plasma cleaning machine equipment is a kind of new technology equipment used for surface treatment of electronic components and polymer materials. It is generally believed that plasma equipment has automatic control system, and the reliability and reliability of the automatic control system of the new technology machine equipment is more strict than the general equipment, the control system is as important to the equipment as the human brain. So what requirements does the device need to be met by the controller? In order to ensure that each sub-system can work normally, the plasma cleaning machine has an automatic control system (controller), which can issue work instructions to each sub-system. Systems are like our brains, and when instructed, they assign tasks to each structure to complete. There are many kinds of control panels sold on the market, the quality and price are very different, the reliability and service life of the control panel are also different. Many customers in the purchase of equipment, will stipulate the cleaning machine parts should be used which manufacturer's model specifications, some parts use domestic suppliers, some key parts are imported, manufacturers in the manufacturing process will be according to customer requirements for assembly configuration. In the production and processing of equipment, customers with higher requirements require plasma cleaning machine manufacturers equipped with imported controllers, imported controllers are expensive, but because of its reliability and service cycle and other reasons, often get the approval of manufacturers. Of course, some of the technical strength of the domestic controller manufacturers even reach the standards of imports. The control board is the key to monitor and manipulate the modulus of the control board of the vacuum plasma cleaning machine. The processing process is very complex, and the actual operation of logic and data information is carried out. Therefore, the vacuum machine can choose the high-precision control board. The key of the control board of atmospheric plasma cleaning equipment is used for precise positioning, simulation, logic operation and the setting and management of the main parameters. The PLC is used for accurate positioning and analog acquisition, and the main parameters of the system are monitored in real time according to the touch screen of the Ethernet port. Plasma cleaning machine is divided into vacuum and non-vacuum two types, non-vacuum is atmospheric pressure, or atmospheric pressure plasma cleaning machine, non-vacuum plasma cleaning machine, mainly used to clean flat objects, like mobile phone glass cover plate, or some small range of cleaning.

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Cleaning equipment of plasma surface treatment machine

Cleaning equipment of plasma surface treatment machine

With the development of electronic information technology industry, especially communication, electronic computers and electronic devices, semiconductor materials, LCD display and optoelectronic products and other industrial cleaning equipment accounted for a larger proportion, plasma surface treatment equipment has become the standard of many industrial cleaning equipment. Manufacturing technical requirements, continuously improve to make cleaning equipment technology at home will have a broader space for development, the rapid development of automobile industry, make many foreign manufacturers to target on the market in our country, many parts makers are also constantly introducing processor plasma surface cleaning technology, which puts forward a new cleaning technology for technology standard, can say plasma treatment machine cleaning technology is more suitable for the development of automobile industry. Medical machinery application pretreatment method, the treatment process is more complex, Freon cleaning is not only a waste of resources, but also expensive, the use of plasma surface treatment equipment can prevent chemical substances from causing harm to the human body, more suitable for the requirements of modern medical technology. Electro-optical components and some electronic optical products have high requirements for cleaning technology, so the technology of plasma surface treatment machine can be widely used in the electro-optical industry. In general industrial production, the surface treatment cleaning technology can not only play a cleaning role, but also can etch, play a role in ash, can stimulate the surface activity. Therefore, it has broad development prospects and will become more and more important production and processing technology for scientific research institutes, medical institutions, manufacturing enterprises and so on. Plasma surface processor cleaning equipment to the surface treatment of materials, the result is careful cleaning and efficient activation. The purpose of cleaning is to remove the surface electrostatic induction, dust and oil residue and other pollutants, through this fine treatment, can make the material surface layer is fully removed, can remove the tiny particles on the surface, even in the surface pore structure can also be.

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