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The cleaning characteristics of plasma cleaning machine under different action

The cleaning characteristics of plasma cleaning machine under different action

Plasma cleaning machine in different role, its cleaning characteristics are also different, the following introduced a few for everyone to discuss oh. 1. Cleaning function: it can remove the weak bonds on the surface of the matrix and typical CH-based organic pollutants and oxides. Main features: for the material surface function and no erosion of the interior, can get a super clean surface, ready for the next process. 2. Etching: The typical gas combination is used to form etchable gas equivalence ionites and organic materials on the surface of the object to produce other gases such as CO, CO2, H2O, etc., so as to achieve the purpose of plasma etching. Main features: uniform etching of material workpiece; No harm to the workpiece substrate; It can effectively remove the foreign matter on the surface and achieve the ideal etching degree. Activation: Three groups -- C=O Carbonyl, -COOH Carboxyl, and OH Hydroxyl -- are formed on the substrate surface. These groups have stable hydrophilic properties and have positive effects on adhesion. Main features: active atoms, free radicals and unsaturated bonds can appear on the surface of the polymer. These active groups react with the active particles in the plasma to generate new active groups, increase the surface energy, change the surface chemical characteristics, and effectively enhance the surface adhesion and adhesion. 4. Coating (grafting and deposition) : In plasma coating and plating, two kinds of gases enter the reaction chamber at the same time, and the gases polymerize under the action of plasma. This application requires more rigor than activation and cleaning. Typical applications are the formation of protective coatings, applied to fuel containers, scratch-proof surfaces, similar to PTFE coating, waterproof coating, etc. Main features: it can make the molecular chain on the surface of the material break to generate new radical, double bond and other active groups, and thus generate crosslinking, grafting and other reactions in the process; The active gases can aggregate on the surface of the material to produce a sedimentary layer. The presence of the sedimentary layer will effectively improve the adhesion, coating and printing of the material surface. Shenzhen Sing Fung Intelligent  Manufacturing Co., Ltd. LTD. Is a high-tech enterprise engaged in plasma equipment research and development, manufacturing, production and sales. As a professional plasma equipment manufacturer, has many years of experience in plasma technology services.

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Cable plasma processor improves cable code adhesion

Cable plasma processor improves cable code adhesion

In recent years, with the increase of the market demand for special cables and the wide application of new insulating materials such as crosslinked polyethylene, fluoroplastics and nylon, the surface of the cables made of these materials is very smooth, which leads to the phenomenon of code spraying on the wires and cables and the characters falling off and wiping off. In order to solve this problem, some cable users have tried to improve the ink adhesion method to solve this problem, but the high adhesion of the ink not only cannot achieve good anti-wiping effect, and will cause the printer fault rate is high, expensive imported ink and other problems. Cable pre - printing treatment, wire - coated reinforcement treatment can be used plasma surface treatment. Under appropriate technological conditions such as PE, PP, PVF2, LDPE materials of low temperature plasma treatment, can significantly change the surface of the material form, usually is invisible to the naked eye change belongs to the nanometer level, introduced a variety of oxygen-containing groups, which changes the surface from the infinite, difficult to stick to a certain polarity, viscosity and hydrophilic, is advantageous to the materials of adhesive, coating and printing. This method has the advantages of simple process, convenient operation, fast processing speed, good treatment effect, little environmental pollution and energy saving. Plasma technology can improve the wetting rate and performance of plastic components. Plasma surface treatment technology with the method of integration of online, the plasma surface treatment machine spray on the surface of the cable, the cable surface pretreatment, make the surface tension of the cable surface get enough after pretreatment, under the condition of without changing insulation performance, the perfect adhesion force, so again during printing, inkjet, ink can be close to the insulation material surface, to achieve the ideal effect of printing, inkjet.

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What causes the smell of plasma cleaning machines

What causes the smell of plasma cleaning machines

The answer is that ozone is at work. The basic principle of ozone generation during plasma discharge is that oxygen molecules are decomposed into oxygen atoms in the low-temperature plasma gas formed in the discharge reactor, and then ozone molecules are formed through the three-body collision reaction, which also takes place in the ozone decomposition reaction. Ozone, chemical molecular formula for O3, also known as triatomic oxygen and superoxygen, because of its fishy taste and named, room temperature can be reduced to oxygen. Compared with oxygen, it is soluble in water and easily decomposed. Ozone consists of an oxygen atom carried by an oxygen molecule, which determines that it is only temporarily stored. The oxygen atoms that carry them are used up by oxidation, and the rest combine to form oxygen into a stable state, so there is no secondary pollution of ozone. If the gas we introduce contains oxygen, a small amount of ozone will be produced during the reaction. It is because of the production of ozone, we can sometimes smell a bad smell when using the plasma cleaning machine, which is also the reason that the plasma cleaning will produce a bad smell. Plasma cleaning machine, also known as plasma surface treatment instrument, is a new high-tech technology, the use of plasma to achieve conventional cleaning methods can not achieve the effect. Plasma is a state of matter, also known as the fourth state of matter, does not belong to the common solid liquid gas three states. By applying enough energy to a gas, it can be ionized into a plasma state. The "active" components of plasma include ions, electrons, atoms, active groups, excited nuclides and photons, etc. The plasma cleaning machine USES the properties of these active components to treat the sample surface, so as to achieve the purpose of cleaning. Conditions for plasma production: sufficient reaction gas and pressure, reaction products must be able to hit the surface of the cleaning object at high speed, and sufficient energy supply. The resulting substances must be volatile micromixtures so that they can be pumped away by vacuum pumps. The capacity and speed of the pump must be large enough to rapidly remove the by-products of the reaction and to replenish the gas required for the reaction.

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Application of semiconductor plasma cleaning machine in wafer cleaning

Application of semiconductor plasma cleaning machine in wafer cleaning

With the continuous development of semiconductor technology, the requirement of process technology is higher and higher, especially the surface quality of semiconductor chip. The main reason is that the particles and metal impurities on the surface of the chip will seriously affect the quality and yield of the device. In the current IC production, there is still more than 50% material loss due to the pollution of the wafer surface. In semiconductor manufacturing, almost every process needs cleaning, and the quality of wafer cleaning has a serious impact on device performance. It is precisely because wafer cleaning is the most important and frequent step in semiconductor manufacturing process, and its process quality will directly affect the yield, performance and reliability of the device, so companies and research institutions at home and abroad have been constantly studying the cleaning process. Plasma cleaning, as an advanced dry cleaning technology, has the characteristics of environmental protection. With the rapid development of microelectronics industry, plasma cleaning machine has been used more and more in semiconductor industry. Plasma cleaning has the advantages of simple process, easy operation, no waste treatment and environmental pollution. Plasma cleaning is commonly used in photoresist removal. A small amount of oxygen is introduced into the plasma reaction system. Under the action of a strong electric field, oxygen produces plasma, which rapidly oxidizes the photoresist into volatile gas and is pumped away. This cleaning technology has the advantages of easy operation, high efficiency, clean surface, no scratch and so on, which is helpful to guarantee the product quality. And do not use acid, alkali, organic solvents, more and more attention by people. The following is a brief introduction to the impurities and classification of semiconductors: Semiconductor manufacturing requires the participation of some organic and inorganic materials. In addition, because the process is always carried out by people in the purification room, the semiconductor chip will inevitably be contaminated with various impurities. According to the sources and properties of pollutants, they can be roughly classified into four categories: particles, organic matter, metal ions and oxides. 1.1 particles: Particles are mainly polymers, photoresist and etching impurities. This contaminant is usually adsorbed on the wafer surface and affects the geometric pattern formation and electrical parameters of the photolithography process. The removal method of this kind of pollutant is mainly to clean the particles through physical or chemical methods, gradually reduce the contact area between particles and the surface of the wafer, and finally remove. 1.2 Organic matters: Organic impurities come from a wide range of sources, such as human skin oils, bacteria, oil, vacuum oils, photoresist, cleaning solvents, etc. These contaminants usually form an organic film on the surface of the wafer to prevent the cleaning solution from reaching the wafer surface, resulting in incomplete surface cleaning and leaving contaminants such as metal impurities on the surface intact. Removal of such contaminants is usually done in the first step of the cleaning process, using mainly sulfuric acid and hydrogen peroxide. 1.3 metals: Common metal impurities in semiconductor technology include iron, copper, aluminum, chromium, tungsten, titanium, sodium, potassium, lithium and so on. The sources of these impurities include various containers, pipes, chemical reagents, and metal contamination in semiconductor wafer processing. Chemical methods are often used to remove such impurities. Cleaning fluids prepared with various reagents and chemicals react with metal ions to form metal ion complexes, which are separated from the wafer surface. 1.4 Oxide: A natural oxide layer forms on the surface of a semiconductor chip exposed to oxygen and water. Not only does this oxide film block many of the steps in semiconductor manufacturing, but it also contains metal impurities that, under certain conditions, can transfer to the chip and form electrical defects. The removal of this oxide film is usually accomplished by immersion in dilute hydrofluoric acid.

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Application of on-line plasma cleaning machine in cleaning process

Application of on-line plasma cleaning machine in cleaning process

What are the advantages of plasma equipment compared with traditional processing technology? The efficiency link of plasma is gas-solid coherent chemical reaction, which does not consume water and chemical agents, and is environmentally friendly to the natural environment. In the whole process, the gas drying treatment method does not need the anticoagulant and water, which will hardly cause environmental problems, save energy and environmental protection, and save more costs. On-line plasma cleaning machine adopts automatic cleaning method, which is suitable for large production line, saves labor, reduces labor cost, and improves cleaning efficiency greatly, especially its advantages are obvious. With the development of the industry and consumer electronics market, electronic devices are getting thinner and thinner, and the volume is getting smaller. This market demand promotes the miniaturization of microelectronic packaging, and at the same time, it puts forward higher requirements for the reliability of packaging. High-quality packaging technology can extend the service life of products. The bonding gap, the low bonding strength of the lead wire, and the lamination or shedding of the welding ball in the process of wafer packaging have become important factors restricting the reliability of packaging. Therefore, it is necessary to effectively remove all kinds of dirt without damaging the surface properties and electrical properties of the material. There are two main cleaning methods that have been widely used: wet method and dry method. Considering environmental impact, raw material consumption and future development, wet cleaning has great limitations, and dry cleaning is obviously superior to wet cleaning. Among them, plasma cleaning develops rapidly and has obvious advantages. A plasma is an ionized gas. It is a collection of electrons, ions, atoms, molecules, or free radicals. In the process of cleaning, high-energy electrons will collide with gas molecules to make them dissociative or ionizing. Various particles generated will be used to bombate the cleaned surface or have chemical reactions with the cleaned surface to effectively remove various pollutants. At the same time, it can also improve the surface performance of the material itself, such as improving the wettability of the surface, improving the adhesion of the film, etc., which is of great significance in many applications. After plasma cleaning, the surface of the device is dried and no further treatment is required, which can improve the processing efficiency of the whole process line. It can prevent the operator from being hurt by harmful solvent. The plasma can be cleaned deep into the small holes and depressions inside the object, so the shape of the object to be cleaned does not need to be considered too much. It can also handle all kinds of materials, especially for high temperature and solvent resistant materials. All these advantages make plasma cleaning widely concerned.

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Nitrogen plasma cleaning machine Manufacturer

Nitrogen plasma cleaning machine Manufacturer

According to the nature of gases, plasmas can be divided into the following two types: Gas and the gas plasma: gaseous plasma according to their chemical properties of the gas used when different can be divided into two categories, lively and inert gas gas, inert plasma such as argon (Ar), nitrogen (N2), nitrogen fluoride (NF3) is used, carbon tetrafluoride (CF4), air, gas plasma such as oxygen (O2), hydrogen (H2), etc., the reaction mechanism of different kinds of gas in the process of cleaning, lively plasma have bigger influence on the chemical reaction. Because of the different nature of gases, the pollutants used for cleaning them must also have different choices. If one gas permeates into another or more gases, the mixture of these elements will produce the etching and cleaning effects we want. By using the ions or highly active atoms in plasma, the surface pollutants are smashed apart or formed into volatile gases, which are sent out through the vacuum system to achieve the purpose of surface cleaning. At low pressure in a high-frequency electric field, gas molecules, such as oxygen, nitrogen, methane, water vapor, in a glow discharge, will break down the accelerating atoms and molecules. When the generated electrons are accelerated in the electric field, they can obtain high energy and collide with the surrounding molecules or atoms, so that the molecules and atoms are reexcited by the electrons, but they are in the excited state or ionic state. At this time, the existence state of the matter is the plasma state. In addition to gas molecules, ions and electrons, there are electrically neutral atoms or groups of atoms in a plasma, which are excited by the state of energy (also known as free radicals) and the light emitted by the plasma. Among them, the length and energy of the wave play an important role in the interaction between the plasma and the material surface. In the plasma cleaning process, nitrogen as an inactive gas, mainly as a non-reactive gas, nitrogen plasma treatment can improve the hardness and wear resistance of materials. Sometimes, nitrogen also ACTS as an active gas, forming ammonia compounds. In many cases, plasma cleaner manufacturers use nitrogen or use it as an inactive gas.

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