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Plasma cleaning machine to enhance the material surface adhesion and wetting

Plasma cleaning machine to enhance the material surface adhesion and wetting

How to solve the problem of poor adhesion and wettability of material surface, low cost, no waste, no pollution and good treatment effect of surface modification with plasma surface processor? Plasma surface cleaning equipment principle of work is by means of physical and chemical surface modification into plasma, plasma as the fourth state of matter, there are a lot of, a wide variety of active particles, than the usual types of active particles produced by chemical reaction is more and more active, more easy to react and the contact surface of the material, so the plasma is often used to the material surface modification. Compared with traditional methods, plasma surface modification has low cost, no waste, no pollution, excellent treatment effect, and has broad application prospects in metal, microelectronics, polymer, biological functional materials and other fields. Plasma surface modification of plasma surface cleaning machine exposes the material to non-polymeric gas plasma. The plasma bombards the material surface, causing many changes in the surface structure of the material, and the activation modification function of the material is realized. Plasma surface treatment of plasma surface modification of the functional layer is very thin (several to several hundred nanometers), will not affect the overall macroscopic properties of the material, is a lossless process. Plasma surface modification can also make use of the function of plasma polymerization or grafting polymerization to generate ultra-thin, uniform, continuous and high function without holes on the surface of the material to achieve the functions of hydrophobic, wear resistance, decoration and so on. It is an important way to develop new materials economically and effectively that the plasma of plasma surface cleaning machine can modify the surface of polymer materials to achieve high performance or high function. In the use of plasma polymer materials in the daily necessities, automobiles and electronics industries, low surface energy may lead to insufficient performance of finished products. Shenzhen Sing Fung Intelligent Manufacturing plasma treatment can improve the surface performance of polymer materials, including dyeing, wetting, printing, adhesion, anti-static, surface curing, not only improve the quality of products, but also broaden the application field of materials.

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Low temperature plasma equipment is widely use

Low temperature plasma equipment is widely use

The plasma technology is simple, the adsorption method should consider the regular replacement of adsorbent, desorption may cause secondary pollution; Combustion requires very high operating temperatures; In the combined catalysis method, the catalyst is selective, some conditions (such as too high temperature) will cause the catalyst deactivation, photocatalysis can only use ultraviolet light, etc. The biological method must strictly control the pH value, temperature and humidity and other conditions, in order to suit the growth of microorganisms. However, the low-temperature plasma technology can better overcome the shortcomings of the above technologies. The reaction conditions are normal temperature and pressure, the reactor structure is simple, and the mixed pollutants can be eliminated at the same time (some cases have synergistic effects), and secondary pollution will not be generated, etc. In terms of economic feasibility, low temperature plasma reaction device itself to a single compact system structure, in terms of operating cost, microscopic, due to the discharge process improve the electron temperature and ion temperature only basic remains the same, this reaction system is to keep the low temperature, so not only high energy utilization, and make the equipment maintenance cost is low. Low temperature plasma technology has a wide range of applications, and gas velocity and concentration are two very important factors for the application of gas pollutant treatment technology. Biofiltration and combustion can be applied in high concentrations but are limited by the flow rate of the gas. Electron beam irradiation technology has only a very narrow range of gas velocity. Low temperature plasma technology has a wide range of applications for gas velocity and concentration, and its wide application is self-evident. Low temperature plasma technology has significant advantages in the treatment of gaseous pollutants. The basic principle is to produce high-energy electrons under the acceleration of electric field. When the average energy of electrons exceeds the chemical bond energy of the target molecule, the molecular bond will break, so as to eliminate gaseous pollutants. In the 1980s, the high-voltage pulsed corona discharge method proposed by Professor S. Masuda of The University of Tokyo in Japan is a simple and effective method to obtain low-temperature plasma at room temperature and pressure. It has become the current research frontier and is being used more and more in the treatment of gaseous pollutants. Mechanism of pollutant removal by low-temperature plasma: In the process of plasma chemical reaction, the energy transfer in the reaction process of plasma chemical energy is roughly as follows: (1) Electric field + electron → high energy electron (2) High-energy electron + molecule (or atom)→(excited atom, excited group, free group) active group (3) Active group + molecule (atom)→ products + heat (4) Active group + active group → products + heat As can be seen from the above process, electrons first obtain energy from electric field, and transfer energy to molecules or atoms by excitation or ionization. Molecules or atoms that obtain energy are excited, while some molecules are ionized, thus becoming active groups. After that, the stable products and heat are generated after the collision between these active groups and molecules or atoms or between the active groups and the active groups. In addition, high-energy electrons can be captured by substances with strong electron affinity such as halogens and oxygen and become negative ions. This kind of anion has good chemical activity and plays an important role in chemical reaction. Principle of removal of pollutants by low-temperature plasma equipment: Low temperature plasma technology to deal with the principle of pollutant is: under the action of applied electric field, the discharge of a large number of medium and electron bombardment of pollutants, and the ionization and dissociation and excitation, and then raises a series of complicated physical and chemical reaction, make complicated molecules pollutants into simple small molecule safe material, or make the poisonous and harmful substances into harmless non-toxic or low toxic less harmful material, hence leading to the degradation of pollutants removal. Since the average energy of electrons generated after ionization is at 10eV, the reaction conditions can be properly controlled to realize the chemical reactions that are difficult to realize or slow in general conditions and become very fast. As a new and high technology with potential advantages in the field of environmental pollution treatment, plasma has been highly concerned by the related disciplines at home and abroad. Low-temperature plasma equipment can be used in the electronic industry, such as mobile phone case printing, coating, dispensing and other pre-treatment, mob

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CRF plasma cleaning machine use skills

CRF plasma cleaning machine use skills

CRF plasma cleaning machine is an advanced high-tech equipment, is the use of plasma cleaning device, in use, must be in accordance with the requirements of the instructions to operate, which for some of the use of technical knowledge also need to understand, today I will give you a detailed introduction. 1. During the vacuum pumping operation, the three-way valve must be pointed to the closed state, that is, let the arrow down, and then turn on the power and turn on the vacuum pump to see whether the rotation direction of the vacuum pump is clockwise or counterclockwise. If it is clockwise, it is normal. 2. Before starting the vacuum pump, make sure that the plasma cleaning machine is connected with the vacuum pump. First, make the vacuum pump rotate for five minutes, at this time, the plasma cleaning agent is in the closed state, after five minutes, the plasma cabin will produce glow. 3. when pumping, to open the three-way valve, let it and indoor air, and then open the needle valve, pay attention to be opened gently, let the air slowly into the chamber of the plasma cleaning machine, in order to form plasma, and then turn on the power of the control panel in front of it. 4. During plasma processing, samples should be processed in accordance with the required time. After the processing is completed, RF should be turned off, and finally the plasma cleaning mechanism should be properly turned off. In the use of plasma cleaning machine, you can refer to the above content, only the correct operation, will not fail, in addition, after turn off the power supply, also check the plasma cleaning machine behind the insurance pipe in the fuse box on the side of the power supply is normal, for any signs of burned off, if damaged, be sure to replace the new matching insurance tube.

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The difference between plasma and corona treatment

The difference between plasma and corona treatment

Plasma is not treated in the same way as corona, which can only deal with very thin things, such as plastic film, which requires that the object should not be large in volume and should be used for wide area processing. The principle is to use high frequency and high voltage in the treated plastic surface corona discharge (high frequency AC voltage up to 5000-15000V/m2), thus producing a low-temperature plasma, the plastic surface to produce free radical reaction and polymer crosslinking. Surface roughness and increased wettability to polar solvents - these molecules are shocked and infiltrated into the surface of the substrate to destroy its molecular structure, thereby oxidizing and polarizing the surface molecules to be treated, and ionic shocks erode the surface, thereby increasing the adhesion of the substrate surface. I. Similarities between plasma surface treatment and electric airsickness surface treatment: 1. Plasma surface treatment and electric airsickness surface treatment are glow discharges with high frequency and high voltage. Plasma is used to treat the surface of materials. 2. Effects of plasma surface treatment and electric airsickness surface treatment: both can improve the adhesion of material surface and facilitate bonding, spraying and printing processes. 3. are all online processing, production line. Ii. Differences between plasma surface treatment and electric airsickness surface treatment: 1. In addition to glow discharge, plasma surface treatment also includes electrovolt discharge, which generates more energy and can reach adhesion of 52 Dyne above, while electric airsickness generally can only reach adhesion of 32-36 Dyne. 2. corona function processing large width, suitable for adhesion is not very high material, such as cloth, film, plastic film and other things. Plasma treatment is suitable for high adhesion, good durability and low temperature. A linear plasma cleaner (as shown below) can be used for processing up to 120mm-2000mm in width, and larger processing systems can be customized. Therefore, plasma cleaning can also meet the processing of large materials, but the budget is higher than electric airsickness, can be selected according to the needs.

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Plasma cleaning machine gas pressure regulation and use skills

Plasma cleaning machine gas pressure regulation and use skills

Compressed gas is an essential part of modern industry. The common compressed gas in industry mainly includes compressed air (CDA) and bottled compressed gas. Compressed air is called the second power source, second only to electricity, and is a multi-purpose process gas source. Bottled compressed gas for industrial use is usually contained in a controlled cylinder with a pressure of 13-15 mpa. Its advantages are space-saving, safe and easy to transport. Compressed gas in the use of the actual use of demand for decompression and voltage regulation, so the plasma cleaning machine gas pressure regulation of what, and what are the use of skills? Gas pressure control is one of the important parameters to ensure the normal operation of plasma cleaning machine, common gas pressure reducer, pneumatic pressure regulating valve and pipeline throttle valve. 1. Cylinder pressure reducer: Cylinder unloader is a device for reducing the pressure of gas in a cylinder to the pressure of gas. The process gas used in the plasma cleaning machine is mostly bottled high-pressure gas. In order to ensure the process stability and the working stability of each gas circuit element, the high-pressure gas is usually reduced to 0.2-0.4mpa through the cylinder pressure reducer. It is necessary to ensure the sealing of the gas cylinder connecting the pressure-relief device and the pressure-relief device connecting the air pipe. When installing the pressure-relief device to the gas cylinder, the raw material belt shall be used as the sealing medium and wound on the threaded mouth of the gas cylinder. The output interface of the pressure-relief device is recommended to use the 3/8 standard interface, which is convenient to replace the original tower joint with quick twist joint or double sleeve joint, so as to ensure the sealing between the process gas output pipe and the gas interface of the plasma cleaning machine. If the industrial gas is argon, an oxygen pressure reducer is recommended. The main reason is that the output pressure of the special argon pressure-relief device is usually 0.15mpa. For example, one bottle of gas is supplied to two or more plasma cleaning machines, and the output pressure cannot meet the requirements of use, which is likely to cause undervoltage alarm of the device.   2. Pneumatic pressure regulating valve: Pneumatic pressure regulating valve is an important part of pneumatic control, its role is to control the external compressed gas at the required working pressure, and ensure its pressure and flow stability. Whether it is vacuum plasma cleaning machine or atmospheric plasma cleaning machine, pneumatic pressure regulating valve will be installed when the gas input, in order to ensure the cleanliness of the gas can be installed in the use of gas filter module. The following picture shows the application of pressure regulating valve and filter assembly in atmospheric plasma cleaning machine. To facilitate the inspection of gas pressure, pressure gauge can be installed on the pressure regulating valve or choose a pressure regulating valve with pressure gauge. If you need to provide undervoltage alarm, you can also choose the pressure gauge with alarm output function or add pressure switch. 3. Pipe throttle Valve: Pipeline throttle valve is usually used in atmospheric plasma cleaning machine, through its regulating needle valve to adjust the size of the vent to achieve pressure and flow control. Most of the common pipe throttle valves are quick plug joints, and the volume is relatively small. The process gas used by the atmospheric plasma cleaning machine is purified clean compressed air, and the pressure stability requirements are much lower than the vacuum plasma cleaning machine, so part of the atmospheric plasma cleaning machine directly installed in the air pipeline throttle valve to achieve pressure and flow control. Similarly, if the need for real-time pressure monitoring, can be installed on the gas line pressure gauge, with alarm output pressure gauge and pressure switch and other devices.

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What is the discharge principle and characteristics of inductively coupled plasma cleaning machine

What is the discharge principle and characteristics of inductively coupled plasma cleaning machine

Inductively coupled vacuum (low pressure) plasma cleaning machine is developed with the process requirements of the semiconductor industry, the main use is in wafer manufacturing photoresist removal and etching. Strictly speaking, plasma etching has been another category of process equipment, today we will discuss the induction coupling plasma cleaning machine discharge principle, model and characteristics. When a spiral coil is fed with a high-frequency current, two kinds of electric fields exist simultaneously in its space. The first is the axial electric field E1 established by the high-frequency potential difference between the two ends of the coil, which is the electric field of e-type discharge. The second is the vortex electric field E0 generated by the magnetic field changing in the discharge space, that is, the H-type electric field. The ratio of these two fields varies according to the way the coil is wound. We will see an interesting phenomenon, when the plasma density is low, discharge is capacitive mode; At high density, the discharge shifts to perceptual mode. An induced electric field is used to accelerate electrons to maintain the plasma. The plasma produced in this way is called the induction-coupled plasma ICP, whose neutral gas pressure is generally lower than one atmosphere, 102~104Pa, and sometimes even reaches atmospheric pressure. Inductive discharge plasmas are generated by applying rf power to a non-resonant coil. There are two common structures which are more suitable for low aspect ratio discharge systems. The first common structure of inductively coupled plasma sources is a cylindric helical coil type (helical type for short). The second common type of inductively coupled plasma source structure is the planar coil type (disc-type for short). Drive the output of the rf source inductance coil impedance of 50 Ω, its frequency is 13.56 MHz or lower. There is a capacitive matching network between the RF source and the inductor coil. The obtained plasma density is 1017~1018m-3, the electron temperature is 2~4eV, and the diameter is up to 30cm. ICP has been widely used in semiconductor plasma processing in recent years because it is easy to obtain large-diameter and high-density plasma over a wide pressure range (1~40Pa). By c=,13.56MHz electromagnetic wave wavelength is 22m, greater than the length of the antenna, so you can ignore the displacement current, the use of quasi-static method to deal with the core do field. The electrons in the plasma are accelerated by this electric field, thus creating eddy currents in the plasma in the direction that neutralizes the antenna's current magnetic field. Although electrons are sometimes accelerated and sometimes slowed by an induced electric field, if this effect is averaged over time, the net energy expenditure in the non-collision condition is zero, and power cannot enter the plasma. Nu e for electrons and neutral particles, ion collision frequency, can calculate the conductor "plasma" DC conductivity. In general, when an alternating magnetic field is applied to a conductive plate of conductivity, a vortex current flows through the conductor causing joule heating. In this case, the magnetic field decays exponentially from the surface to the inside of the conductor, so the depth into the conductor is limited (skin effect). In the low pressure (argument e/omega < < 1), high plasma density (omega p > > omega), skin depth is expressed as the delta = c/p omega. In the physical sense omega p is a measure of how fast electrons respond to collective motion. Less than omega p, the electrons' motion prevents the wave's electric field from entering the plasma, which is called plasma shielding. The wave will travel along the surface of the plasma, and the surface wave can also be used to generate a high-density plasma. Once entered into a state of depression, the resistance of the plasma will be small variations, skin depth will drop, so the joule heating effect cannot make plasma power input, therefore under pressure to maintain high density such as Yu daughter must be another mechanism, the mechanism of thermal motion of electrons is this: local electric field caused by an abnormal skin effect. Consider the collision free process: the electrons, moving at the thermal speed, return to the plasma no matter how far they go into the edgedepth delta region of the induced electric field. When the electron through this electric field area of time/nu is roughly equal to or slightly less than the high frequency voltage cycle 2 / nu, electron acceleration, deceleration is random, after the statistical average electron can obtain energy efficiently, this is the abnormal skin effect. Through the above principle analysis, we can understand some basic principles and characteristics of inductively coupled plasma, but in the design of plasma cleaning machin

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