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Today, let’s talk about the plasma technology of different plasma processors

Today, let’s talk about the plasma technology of different plasma processors

Today, let’s talk about the plasma technology of different plasma processors: 1. Vacuum plasma processor technology: This type of plasma is generated in a closed vacuum (10-3 to 10-9 bar). Compared with normal pressure, there are fewer particles per unit volume, which increases the free path length of particles and relatively reduces the collision process. As a result, the tendency of plasma energy to decay is weakened, and it can spread more widely in space. In order to manufacture the vacuum chamber, a powerful air pump is required. Vacuum plasma technology has no linkage connection function. 2. High-voltage plasma processor technology: The high-voltage plasma is generated by a dedicated gas discharge tube. This type of plasma is not important in surface treatment. 3. Corona treatment technology: The corona treatment technology is a physical method that uses high pressure, and is mainly used for thin film processing. The disadvantage of corona pretreatment is that its surface activation ability is low, and the surface effect after treatment is sometimes not uniform. The reverse side of the film can also be treated, which can sometimes be avoided according to process requirements. In addition, the surface tension obtained after corona treatment cannot be kept stable for a long time, and the processed product can only be stored for a limited time. 4. Atmospheric plasma treatment technology: The atmospheric pressure plasma processor technology is a plasma generated under atmospheric pressure conditions. The atmospheric pressure plasma processing technology has low cost and excellent performance. It can be used as a process substitute and process improvement for vacuum plasma and corona plasma, and is widely used. One of the major advantages of atmospheric plasma technology is its online comprehensive performance. This technology can be smoothly integrated into the existing production system as a process criterion.

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Study on the modification of wood by plasma treatment of plasma plasma cleaner

Study on the modification of wood by plasma treatment of plasma plasma cleaner

Study on the modification of wood by plasma treatment of plasma plasma cleaner: As a material that has been used by humans for a long time, wood materials have many advantages such as easy to obtain materials, recyclable and environmentally friendly, high strength-to-weight ratio, convenient processing, and wide application. So far, they still play a great role. However, with the improvement of people's living standards and years of logging and utilization, logs with excellent wood properties are becoming scarce. In addition, the material properties of wood have given way to ecological properties. Traditional wood must be functional, intelligent, and fusion modified to meet the requirements of the new era. The use of artificial fast-growing forests to finely process wood has become a trend in the wood industry. In this context, research on wood modification has become an inevitable hot spot. However, chemical modification methods such as wood acetylation and wood-plastic composite materials have complex processes and a single applicable material category, and chemicals will generate environmental pressure, which limits the use of chemical modification methods. Physical modification methods such as mechanical sanding and thermal modification have a weaker degree of wood modification, and there is no qualitative change in wood properties. Therefore, plasma technology has entered people's field of vision. Plasma is generally a gas mixture composed of ground state and excited state electrons, ions and neutral particles. Wood is mainly modified by cold plasma. The modification of wood by plasma treatment is only limited to the surface of the material, without changing the nature of the wood itself, and to a large extent retains the advantages of the wood itself. This method has the advantages of short processing time, simple process, high efficiency, non-polluting, dry method, and wide application range. It is a research field that integrates physics, chemistry, materials science and many other disciplines with development potential. The effect of plasma modified wood is mainly reflected in three aspects: wetting characteristics, liquid transport characteristics and adhesion characteristics. The wettability of wood is directly related to its glue and characteristics, as well as its ability to prevent moisture and mildew. It is an intuitive feature of wood surface modification. Plasma treatment of wood can not only improve wettability, but also reduce wettability. The hydrophobic and hydrophilic surface produced depends on the gas used in the plasma treatment process. The use of methane, tetrafluoroethylene, etc. as the treatment gas increases the contact angle of the wood surface and forms a hydrophobic surface; while using oxygen and acrylic acid as the treatment gas, the wood is changed from a hydrophobic surface to a hydrophilic surface, but the nature of the wood itself is not Variety. After the plasma treatment, the depth of the wood adhesive to reach the surface of the wood body after penetration by transportation is increased. Plasma plasma cleaning machine plasma treatment of wood has other modification effects. Plasma is used to eliminate the weak boundary layer, homogenize the wood surface and increase wettability. Compared with laser ablation, the effect of plasma modification is better. Plasma polymerization coating technology plasmaizes polymerized organic gases through electrical effects, and these active particles undergo an addition reaction to form a polymerized film on the surface of the wood, thereby achieving functional characteristics such as moisture resistance, fire resistance, and mildew resistance. Plasma bombards the wood surface, causing etching, forming microscopic "gullies", increasing the roughness of the wood surface, creating a liquid transport channel, improving the wettability and permeability of the liquid, and forming a glue nail effect during gluing. Improve gluing performance. Plasma plasma cleaning machine plasma can promote graft copolymerization on the surface of wood, improve surface activity, and create conditions for subsequent chemical reactions. The performance is that ionic treatment can affect the acidity and alkalinity of the surface of the carrier, so that the surface layer can form a new metastable phase. .

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5 major surface treatment technologies, take stock of those surface treatment processes that you don’t know

5 major surface treatment technologies, take stock of those surface treatment processes that you don’t know

5 major surface treatment technologies, take stock of those surface treatment processes that you don’t know: Surface treatment refers to the artificial formation of a surface layer on the surface of the substrate that has different mechanical, physical and chemical properties from the substrate. The purpose of surface treatment technology is to meet the special performance requirements of products such as corrosion resistance, abrasion resistance, and decoration. So what are the material surface treatment processes? 1. Surface treatment technology before painting: In order to remove all kinds of foreign matter attached to the surface of the object (such as oil, rust, dust, old paint film, etc.), a good substrate is provided to meet the coating requirements and ensure that the coating has good anti-corrosion performance, decoration and certain For some special functions, the surface of the object must be pretreated before coating. The work of this kind of treatment is generally referred to as pre-painting (surface) treatment or pretreatment (surface). 2. Manual operation technology: For example, scrapers, wire brushes, grinding wheels, etc. Manual treatment can remove the rust and oxide layer on the surface of the workpiece, but the manual treatment has high labor intensity, low production efficiency, poor quality, and incomplete cleaning. 3. Chemical processing technology: Use acidic or alkaline solutions to chemically react with the oxide and oil on the surface of the workpiece to dissolve them in the acid or alkaline solution to achieve the purpose of removing rust, oxide scale and oil on the surface of the workpiece, and then use nylon wool Cleaning with brush roller or 304# stainless steel wire (steel brush roller made of acid and alkali solution) can achieve the purpose. The chemical method is suitable for cleaning thin plates, but its disadvantage is: if the time is not properly controlled, even if the preservative is added, the steel will be over-corroded. For more complex structural parts and parts with holes, use acidic solution to acid After washing, the remaining acid immersed in the crevices or cavities is difficult to completely remove. If it is not handled properly, it will become a hidden danger of future corrosion of the workpiece, and the chemicals are volatile and costly. It is difficult to discharge the chemicals after treatment. If they are not handled properly, It will cause serious pollution to the environment. 4. Mechanical processing technology, mainly including the wire grinder, the grinder and the shot blasting machine of the grinder: The sanding method is also called the polishing method, that is, the brush roller is driven by a motor and rotates at a high speed along the movement direction of the upper and lower surfaces of the strip to remove the oxide scale. Shot blasting is a method of using centrifugal force to accelerate the projectile and throw it to the workpiece to remove rust. However, shot blasting has poor flexibility and is limited by the site. There is a certain degree of blindness during cleaning. Dead corners are easily generated on the inner surface of the workpiece and the cleaning is not in place. When choosing conveying equipment and dust removal equipment, manufacturers who need spray treatment must fully consider the actual production situation and try to choose equipment with higher power, because the equipment for spraying operations generally wears quickly, and after long-term use, this or that The problem will have a great impact on production. Choosing equipment with higher power will greatly reduce the time and cost of later maintenance. 5. Plasma surface treatment technology: The plasma surface treatment machine is composed of plasma generator, gas pipeline, plasma nozzle and other components. The plasma nozzle generates high-voltage and high-frequency energy, generates low-temperature plasma through plasma jet and controlled discharge, and uses compressed air to spray plasma onto the surface of the workpiece. When the surface of the processing object is in contact, the object changes and chemical reactions occur. Its surface is cleaned to remove hydrocarbon dirt, such as grease, auxiliary additives, etc., or produce roughness due to etching, or form a dense cross-linked layer, or introduce oxygen-containing polar groups (hydroxyl, carboxyl, etc.) ), these groups can improve the adhesion properties of various coating materials and optimize the adhesion of coatings and the use of coatings.

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Plasma cleaning machine cleans polymer plays a role in surface reorganization, cleaning, modification, etc.

Plasma cleaning machine cleans polymer plays a role in surface reorganization, cleaning, modification, etc.

Plasma cleaning machine cleans polymer plays a role in surface reorganization, cleaning, modification, etc.: Plasma cleaning machine is a brand-new high-tech. Using plasma cleaning machine can achieve effects that cannot be achieved by conventional cleaning methods. Plasma is a state of matter, also called the fourth state. Add enough energy to the gas to make it ionize and become a plasma state. The active components of plasma include: ions, electrons, active radicals, excited states (metastable states) of nuclides, photons, and so on. Plasma cleaners play an extremely important role in cleaning polymers: 1. Reorganization of the polymer surface: The inert gas used in the cleaning process of the plasma cleaner will destroy the chemical bonds on the polymer surface, thereby generating free functional groups on the polymer surface. The free functional groups on the surface of the polymer recombine to form the original polymer structure, and can also be combined with the free functional groups of the adjacent same polymer chain, or with the free functional groups of adjacent different polymer chains. Polymer surface reorganization can increase surface hardness and improve surface resistance. 2. Cleaning the surface of polymer materials: The plasma action bombards the surface of the material with high-energy electrons and ions to mechanically remove the dirt layer. Plasma cleaner cleaning can remove the dirt layer, unwanted polymer surface coating and weak boundary layer that may exist in some processed polymers. 3. Surface modification of polymer: The plasma destroys the chemical bonds on the polymer surface, resulting in the formation of free functional groups on the polymer surface. According to the chemical properties of the plasma process gas, these surface free functional groups combine with atoms or chemical groups in the plasma to form a new polymer functional group, replacing the original surface polymer. Polymer surface modification can change the chemical properties of the material surface without changing the overall properties of the material; 4. Polymer surface coating: Plasma coating is to form a thin plasma film on the surface of the material substrate through the polymerization of the process gas. If the synthesis gas used is composed of composite molecules such as methane, tetrafluoride, carbon, etc., they will break in the plasma state to form free functional monomers, which are connected on the polymer surface and reconstituted into functional monomers, thereby Polymer surface coating. The polymer surface coating can significantly change the permeability and friction properties of the polymer surface.

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The surface of the glass plasma cleaner is cleaned and coated to improve the bonding strength

The surface of the glass plasma cleaner is cleaned and coated to improve the bonding strength

The surface of the glass plasma cleaner is cleaned and coated to improve the bonding strength: The mobile phone screen will be coated on the surface everywhere, and its effects are different, some are to improve the light transmittance; some are to improve the hydrophobicity and oleophobicity by brushing the AF film (anti-fingerprint film, in fact, its The actual effect is mostly anti-fingerprint). The surface of some raw materials is very smooth, and some have air pollutants, which can make the surface difficult to be plated, or the surface is easy to fall after plating, just like it is easy to fall when paint is painted with rusty iron. At this time, it is necessary to improve the roughness of the product surface and remove the impurities on the surface to carry out high-quality coating treatment, just like we need to use abrasive paper to remove rust and then paint. Now the problem is coming, we are unlikely to wipe the phone screen clean with sandpaper, so the phone screen will be scratched. So, is there a way to remove impurities on the surface of the mobile phone screen and increase the roughness of the screen surface without affecting the normal use of the screen surface? At this time, the glass plasma cleaning machine was developed. In 1879, Crokes made it clear that there is a fourth state in matter, which is what we call plasma. The plasma generated by the glass plasma cleaning machine through the reaction contains electrons, ions and highly active free radicals. These particles are very simple. The pollutants on the surface of the product will also react to form carbon dioxide and steam, so as to increase the surface roughness and surface cleaning. Effect. Plasma can form free radicals through reaction to remove organic pollutants on the surface of the product, thereby activating the surface of the product. The purpose is to improve the surface adhesion and the reliability and durability of surface adhesion. It can also clean the surface of the product, improve the surface affinity (reduce the water drop angle), and increase the adhesion of the coating in the body. On the other hand, if compressed air is used as the gas source of the glass plasma cleaning machine, the ejected plasma has a large amount of oxygen ions and free radicals, which can be deposited on the surface of the product. If the product after plasma treatment is quickly coated or sprayed After processing, the oxygen ions will chemically bond with the product and the spraying material. This bonding reflection can further improve the bonding strength between the molecular structures, making the film difficult to detach and fall. In addition, the glass plasma cleaning machine processing process is also a micro-processing method. Generally, the processing depth can reach nanometer to micron level. It is difficult to see the changes before and after the product is processed. Therefore, the plasma cleaning machine is widely used in mobile phone electroplating and new materials, etc. Manufacturing Industry.

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Plasma surface activation treatment method of plasma etching process to remove static electricity

Plasma surface activation treatment method of plasma etching process to remove static electricity

Plasma surface activation treatment method of plasma etching process to remove static electricity: 　　 With the development of semiconductor manufacturing technology, the process nodes continue to shrink, and the back-end copper interconnection technology has been widely used. As we all know, the structural basis of copper interconnection technology is the Damascus structure, and the etching of the Damascus structure occupies an important position in the subsequent process. There are many types of subsequent etching methods, such as etching the through hole first and then the channel, etching the channel first and then the through hole and simultaneously etching the through hole channel. Either way, there are often static residues in the wafer after etching, and the quality of static removal directly affects the quality of the channels and through holes. 　　 In the cleaning process after the plasma dielectric etching in the later stage, a method commonly used in the industry is to use a water-soluble multi-component organic mixture. After the pollution and cleaning technology of plasma etching, after the "partial dielectric layer removal" step, the water-soluble multi-component organic host mixture (solution A) in the cleaning process can be used to remove the remaining through holes and channels. By-products such as silicon, carbon and copper are removed. After plasma etching, there is a phenomenon of residual electric charge on the surface of the copper wire, which will cause serious copper loss in the subsequent solution cleaning process. 　　The change of the cleaning solution can appropriately adjust the electrostatic residue on the wafer. Another cleaning solution (solution B) (the main body of which is an organic electrolyte, and is not easy to undergo oxidation-reduction reactions with copper metal) is used to compare the cleaning effect with the above solution. After cleaning with solution B, the copper metal layer did not show a large area of ​​element sparseness, and the product yield reduction caused by copper loss did not occur. This indicates that the main cause of copper loss is the residual charge on the surface of the wafer, and solution B is not easy to undergo oxidation-reduction reactions with copper metal. However, solution B has a weak cleaning ability for silicon, carbon and copper residues, and has destructive process limitations on the dielectric layers on both sides of the metal layer, resulting in an increase in the dielectric constant (K) value, taking into account the cleaning residue and cleaning Effectively, changing the type of cleaning solution cannot fundamentally solve the problem of residual charge. 　　 Plasma surface activation treatment plasma-assisted static elimination optimization method found that the optimization of the plasma-assisted static elimination process is the control of variables such as the pressure of the reaction chamber, the power of the RF power supply, the temperature and the plasma flow rate. The plasma surface activation treatment plasma uniformity, the optimization of the RF power off method, and the optimization of the auxiliary program are three ways to reduce the residual charge on the chip. In the process of removing static electricity, the plasma assists the process steps of removing static electricity from the wafer, and under the premise of using the cleaning solution commonly used in the industry, the charge amount of the wafer is reduced, and finally the product yield is improved to a certain extent in the post-etching stage. 　　The de-static experiment process involves radio frequency power supply, coupling capacitor, adsorption device, pumping valve and plasma input device, etc. When the RF power supply is connected to the wafer in reactive ion etching, statistically, the probability of electrons hitting the wafer is greater than that of positive ions. Because of their high reaction characteristics, electrons are more likely to be absorbed by the wafer surface, resulting in charge accumulation. Too high concentration of plasma surface activation treatment plasma forms a local electrostatic field with the surface of the wafer, which inhibits the process of plasma-assisted destaticization, and the potential mutation occurs. The overall potential of the wafer varies greatly, which deviates from the target value and prevents the wafer from being separated from the adsorption device. When the radio frequency power is reduced to zero in proportion to time, the overall potential of the wafer changes less and the static removal process is more stable. 　　 The plasma-assisted de-static process has been optimized; and relying on the detection of the residual charge on the wafer and the analysis of the metal layer by the transmission electron microscope to optimize the feasibility and effectiveness of the process. The optimization process has a wide range of applications and can be used to improve process reliability and product yield. However, the opti

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