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The processing application of high molecular material and metal material of medical plasma surface treatment machine

The processing application of high molecular material and metal material of medical plasma surface treatment machine

The processing application of high molecular material and metal material of medical plasma surface treatment machine: The medical plasma surface treatment machine is a commonly used medical polymer material and metal material surface cleaning and modification treatment equipment, and the special medical plasma surface treatment machine can often achieve better treatment results. The medical plasma surface treatment machine What are the advantages? Let's take a look at them together. In the medical equipment industry, the production and manufacturing process of many products cannot be separated from the plasma surface treatment process. At present, the medical plasma surface treatment machine is mainly used for the treatment of medical polymer materials and metal materials to remove the surface of medical polymer materials and metal materials. In addition, the medical plasma surface treatment machine can also modify the surface of the treated material to change its hydrophilicity or hydrophobicity. At the same time, the surface grafting treatment method of the medical plasma cleaning machine can be used in Groups such as hydroxyl, carboxyl, and amino are formed on the surface of the processed material. At present, there are relatively few special plasma surface treatment machines for medical use in my country, and a large part of them are made from ordinary treatment machines. What is the reason? In fact, there are two factors. One is that the original medical device industry does not have high requirements for plasma surface treatment, and the other is that plasma cleaning machine suppliers do not understand the actual application scenarios and production processes of medical products, and it is difficult to make targeted Stronger dedicated processing equipment. With the improvement of industry standards and requirements, many medical products have higher and higher requirements for plasma surface treatment. Various industries have begun to look for more targeted medical plasma surface treatment machines. If you are also looking for medical-specific plasma surface treatment equipment , Welcome to inquire at any time. Chengfeng Zhizhi has been committed to the development of various plasma surface treatment equipment and the application of plasma surface treatment technology for 20 years. It has accumulated rich experience in surface modification of medical polymer materials and surface film synthesis. The relevant samples of the instrument were processed.

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How to choose the equipment suitable for the products of the enterprise for the quality of the top ten brands of plasma cleaning machine

How to choose the equipment suitable for the products of the enterprise for the quality of the top ten brands of plasma cleaning machine

How to choose the equipment suitable for the products of the enterprise for the quality of the top ten brands of plasma cleaning machine: Plasma cleaning machine is a kind of process equipment. Choosing the right brand is very important to the overall quality of the equipment. There are differences in mechanical design, electrical configuration, programming ability, etc., so there are more than ten brands of plasma cleaning machines. There are many kinds, which brand should the enterprise choose for product processing? Is it reliable? For plasma cleaning machine brands, Chengfeng Zhizhi knows a lot, but it is really difficult to list the top ten brands and list the order, because most of the non-standard equipment in the equipment is based on actual conditions. Use needs to be customized. Any information of various industries, processing materials, processing purposes, product shapes, etc. may affect the special requirements of plasma cleaners. For this reason, choosing a reliable equipment brand and manufacturer is actually a test of its production R&D capabilities and industry process experience. At present, there is no uniform industry standard for the product quality of plasma cleaners. Directly listing the top ten brands of plasma cleaners is not credible and authoritative. Cheng Fengzhi has created some brands that are currently more concerned and influenced in the market. When choosing these brands, you can choose Plasmatreat, TePla, Diener, March, APP, Vision, and of course, including Chengfeng Zhizhi. Chengfeng Zhizao has focused on the research and development of plasma for 20 years. If you want to know more product details or have questions about the use of the equipment, please click on the Chengfeng Zhizao online customer service consultation. Chengfeng Zhizao is waiting for your call!

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Plasma cleaner precision electronic package packaging and coating substrate surface cleanliness activation

Plasma cleaner precision electronic package packaging and coating substrate surface cleanliness activation

Plasma cleaner precision electronic package packaging and coating substrate surface cleanliness activation: As a traditional mainstream high-efficiency cleaning process, solvent cleaning is widely used in various industries, but it is more complicated in the management of the cleaning process of precision electronic devices; and with the precision microelectronics process technology and coating film on the surface cleanliness of the substrate The strict requirements of activation energy and their application limitations are self-evident. Plasma cleaner technology, as a new type of surface treatment and dry cleaning process, has been well-known to everyone in recent years with the continuous intensification of its application research in various industries, especially the precision electronics industry. Plasma's solvent-free dry fine cleaning can play an important role in the elimination of ODS and organic volatile VOC cleaning agents. Compared with solvent cleaning, it has the characteristics of simple process, low cost, environmental protection and energy saving. It can also be used as a solvent type. An important supplement to deep cleaning. Plasma cleaner cleaning can be applied to various substrates and optical glass, such as surface activation, modification, and cleaning treatment before touch screen, printing, laminating, spraying, inkjet and other processes, thereby improving the surface of the material Joint durability and strength. The physical and chemical cleaning methods that have been widely used at present can be roughly divided into two categories: wet cleaning and dry cleaning. Wet cleaning is mainly based on solvent-based cleaning as the mainstream, and dry cleaning is characterized by plasma cleaning and is popular. Pay attention to. With the high requirements for surface cleanliness and activation energy of precision electronic assembly (encapsulation) and coated substrates, precision cleaning has become indispensable in related manufacturing processes. For example, before high-density interconnect HDI, PCB PTH plating, semiconductor chips, solar panels, touch screen glass, plastic, ceramic, metal and polymer panels are coated or bonded, BGAFip Chip, LCD, LED, IC chips And bracket packaging or assembly, the potting process after PCBA soldering, the dispensing encapsulation of IC pins or soldering ends, the underfill of the chip, the "three-proof" coating on the surface of the circuit board, etc. Pretreatment for cleaning or cleaning. In the packaging process, effective cleaning of the chip (DIE), wire support, PCB soldering pad, PCBA "three-proof" coating, underfilling of the bottom solder end device BTC, and potting of the whole machine and devices, we only have to ensure Workpieces such as PCBA&PCB bonding interface pads are clean in order to obtain sufficient surface to achieve the effectiveness and durability of bonding. For this reason, it is very important to use proper cleaning processes for bonding chips, substrates or substrates. Adding a dry plasma cleaner process cleaning after the traditional solvent cleaning can more effectively eliminate organic residues and oxides. Dry plasma technology is very effective for removing organic photoresist (ashing) and other contaminants. In the integrated pretreatment step, the natural oxide layer can be removed, and the decontamination can be achieved through the chemical reaction of gas and plasma energy. Purpose. Plasma, as a refined new cleaning process, has its shortcomings: it has no obvious cleaning effect on hardened solder and other inorganic substances and deep grease dirt, but it has a more obvious cleaning effect on all slight organic substances, so it is more effective. It is used for fine cleaning or replenishment after solvent cleaning. Plasma cleaners do not need to use solvents and water for cleaning, and there is no pollution problem; the process is relatively simple, and there is no need for operation steps such as drying after cleaning, and it is especially suitable for fine and high-quality cleaning of the surface of precision workpieces. Plasma cleaners can be used to clean all kinds of PCB through holes, solder pads, substrates and optical glass touch screens, and surface activation, cleaning, coating, and coating before printing, laminating, spraying, inkjet, and electroplating , Modification, connection technique, roughening, etc. Activation: greatly improve the wetting performance of the surface to form an active surface; cleaning: remove dust and oil, fine cleaning and electrostatic discharge (ESD); coating: provide a functional surface through surface coating treatment and improve surface adhesion Capability and reliability and durability of surface bonding. Plasma can not only effectively remove organic dirt on the surface of high molecular polymers, but also can be used to finely clean the surface of PCBA and PCB, ceramic panels, glass panels, metal panels and other materials. Plasma cleaners can treat the surfac

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What are the characteristics of automated or semi-automated plasma surface treatment equipment

What are the characteristics of automated or semi-automated plasma surface treatment equipment

What are the characteristics of automated or semi-automated plasma surface treatment equipment: At present, automation technology has been widely used in various fields such as industry, agriculture, and military, achieving the goal of reducing manpower and improving efficiency. With the development and progress of PLC, the vacuum low-pressure plasma surface treatment machine continues to develop in the direction of automation and intelligence. The intelligent control and operation also allow more people to choose automatic plasma surface treatment equipment. Vacuum plasma machines can be divided into two types: semi-automatic and online. On-line low-pressure vacuum plasma machines have greatly improved automation and are one of the automated plasma surface treatment equipment. In fact, semi-automatic and online plasma equipment are controlled by PLC. The PLC and the touch screen communicate data through communication. The common features of the two plasma equipment are: high data collection accuracy, visual alarms, and maintenance. Convenient, low failure rate, high safety, convenient control logic modification, less connection lines, small size, and high reliability. Compared with semi-automatic plasma equipment, the line-type automatic plasma surface treatment equipment adds servo drives and motors, and adds photoelectric switches, proximity switches, axis limit switches and other components. At the same time, the control logic is also more complex than manual and semi-automatic devices, so , In the choice of PLC, the performance of the selected PLC is better than the semi-automatic plasma device, and the experience of using the equipment is also better. The semi-automatic and online automatic plasma surface treatment equipment controlled by PLC is used, and the operation is performed on the touch screen interface. The touch screen can be used to set and monitor the input and output values ​​of analog quantities such as discharge power, and can flexibly modify and set process parameters according to the processing object. There are two control modes, manual and automatic, on the touch screen. (1) Manual control interface: The manual interface can independently operate and control the vacuum pump, break valve, flapper valve, one-way air valve, two-way air valve, RF power supply, etc. (2) Automatic control interface: Under automatic control, we can set relevant process parameters in advance and save them as engineering recipes. After the installation is complete, just put it into the product, select the engineering formula, and press the start button. The above is mainly part of the semi-automatic and on-line automatic plasma surface treatment equipment and the characteristics of the two operating modes. If you want to know the details of the product or have questions when using the equipment, please click on the online customer service of Chengfeng Zhizhi, Chengfengzhi We are waiting for your call!

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Precautions when selecting oxygen, hydrogen, and nitrogen for vacuum plasma processor

Precautions when selecting oxygen, hydrogen, and nitrogen for vacuum plasma processor

Precautions when selecting oxygen, hydrogen, and nitrogen for vacuum plasma processor: There are many materials processed by the surface treatment technology of the vacuum plasma processor. They have different processing requirements and uses. At this time, the process gas we choose will be different. The process gas used in the surface treatment of the plasma processor is oxygen, Argon, nitrogen, compressed air hydrogen, carbon tetrafluoride, etc., are commonly used in oxygen, hydrogen, and nitrogen. The gases selected by the plasma processor technology are these three process gases. What should be paid attention to? How to choose? 1. The gas selected is oxygen: Oxygen is mainly used for surface activation of polymer materials and removal of organic pollutants, but it cannot be used for easy oxidation of metal surfaces. In the vacuum plasma state of the vacuum plasma processor, the oxygen plasma is light blue, and part of the discharge is white; the light in the environment is bright, and the discharge in the vacuum chamber may not be seen when observed with the naked eye. 2. The selected gas is hydrogen: As a process gas, hydrogen is widely used in industries such as microelectronics, semiconductors, and circuit board manufacturing. When using hydrogen, pay attention: because hydrogen is a dangerous gas, it will self-detonate when combined with oxygen without ionization. Therefore, it is generally not allowed to mix the two gases in the vacuum plasma processor equipment. In the vacuum plasma state, hydrogen plasma is red, similar to argon plasma, and slightly deeper than argon plasma under the same discharge environment. 3. The gas is selected as nitrogen: Nitrogen particles are heavier. It is a gas between activated gas and inert gas. It can achieve bombardment and etching, and it can also prevent oxidation of part of the metal surface. Plasma, which is a mixture of nitrogen and other gases, is usually used to process some special materials. In the vacuum plasma state, nitrogen plasma appears red, and under the same discharge environment, nitrogen plasma is brighter than argon plasma and hydrogen plasma. The above are the precautions when choosing oxygen, hydrogen, and nitrogen for the vacuum plasma processor. If you want to know more product details or have questions about the use of the equipment, please click on the online customer service consultation of Chengfeng Zhizao, and Chengfeng Zhizao is waiting for you Call!

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The edge effect of low-temperature plasma surface treatment DC glow plasma

The edge effect of low-temperature plasma surface treatment DC glow plasma

The edge effect of low-temperature plasma surface treatment DC glow plasma: Low-temperature low-temperature plasma surface treatment Plasma is widely used in material treatment. The existing treatment technologies include plasma cleaning, glow nitriding, magnetron sputtering, multi-arc ion plating, plasma etching, ion implantation, etc., related Discharge forms are divided into direct current glow discharge, radio frequency plasma discharge, high voltage pulse direct current discharge and so on. However, due to the different shapes of the processed workpiece materials, many of them have obvious edges and corners, so "edge effects" appear, which have varying degrees of impact on material properties, especially in terms of uniformity, thickness, and mechanical properties. Glow nitriding is also called ion nitriding. It uses glow discharge to generate plasma. Under the action of low-temperature plasma surface treatment plasma and strong electric field, high-speed nitrogen and hydrogen positive ions bombard the surface of the workpiece, and nitrogen will penetrate the surface of the workpiece. . Nitrogen infiltrated into the material can form helium compounds, which have high hardness, thermal stability, and dispersion, so the mechanical properties of the material will be greatly improved. It is a high-performance nitriding method with short nitriding cycle, low brittleness of the nitriding layer, controllable thickness and organization of the nitriding layer, and has the effect of purifying the surface. The central problem of the low-temperature plasma process is that there is a sheath layer between the plasma and the substrate, and the ions are accelerated through the sheath layer, thereby causing bombardment, sputtering, and injection to the material to achieve modification. Nitriding is a direct current glow discharge, which is set in a vacuum chamber with a certain size to perform a low-pressure, non-magnetic direct current glow discharge and generate plasma. Since the entire plasma is in an electrically neutral state, the potential at the plasma boundary is the same, and the workpiece to be processed is regarded as an equipotential body, and the potential difference between the two is the sheath potential difference. If the corners of the workpiece have no functional or shape requirements, the corners can be cambered. Since there is no abnormal electric field distribution, the sheath voltage and thickness are constant, and the ion density is the same, so the hardness of the nitrided layer is uniform. In the range from the edge of the DC glow of the low-temperature plasma surface treatment, the closer to the corners, the greater the electric field intensity and ion density, and the smaller the sheath thickness. After the corner arc surface treatment, because there is no corner, there is no edge effect; the main plasma density can be reduced, the edge effect is suppressed, and the nitriding effect is better.

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