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Plasma cleaning machine manufacturers provide customized and standard plasma processing systems

Plasma cleaning machine manufacturers provide customized and standard plasma processing systems

Plasma cleaning machine manufacturers provide customized and standard plasma processing systems:         Chengfeng Zhizhi plasma cleaning machine manufacturers can provide fully customized and standard plasma processing systems, which can be integrated into existing production lines, automated robots or work independently as an independent unit. The surface processing system can significantly improve printing, dyeing, and welding. Adhesion to extrusion and other processes. Plasma cleaning machine manufacturer         Plasma cleaning machine is a multifunctional surface treatment system, which includes conveyors and shells customized for different applications. Now, Chengfeng Zhizhi plasma cleaning machine has been fully upgraded. All electronic components, control systems and additional functions are durable and run "smart".         Spray, blow molding and extruded parts plasma cleaning machine manufacturer's surface treatment system can significantly improve material adhesion. This is designed to handle smaller areas before screen printing, and can be incorporated into an existing production line or used as an independent workstation. This series of plasma cleaners are manufactured with advanced components and can be fully customized according to your application.         The small independent vacuum processing device with built-in conveyor can be installed online or used as an independent device. Efficiently process most 3D plastic parts without changing settings. Through plasma treatment, in the closed treatment station, all exposed top surfaces are improved and the surface energy is improved. It is suitable for the operation of laboratory instruments, petri dishes, lenses, etc.         The surface layer of the plasma treatment system is compact and independent, and its design purpose is to improve the combination of tube ends with other tubes, surgical instruments and housings for circuit board processing and manufacturing. And carry out strong, repeatable, uniform surface activation treatment. Clean and activate the non-reactive surface in a small amount to make the adhesion lasting. Plasma discharge is used to improve the adhesion of various surfaces, including complex surfaces. Improve the adhesion of glues, coatings, laminates, paints and inks. From a macro point of view, impurities, residues and organic matter can also be removed from the surface. Thick, large, hard and uneven objects can be surface treated by atmospheric plasma treatment to greatly improve the surface adhesion.         If you encounter problems that you do not understand during use and operation, please contact our engineers to help you find a solution to the problem.  与此原文有关的更多信息要查看其他翻译信息，您必须输入相应原文

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Spectroscopic study of silicon dioxide film deposited by plasma treatment TEOS process

Spectroscopic study of silicon dioxide film deposited by plasma treatment TEOS process

Spectroscopic study of silicon dioxide film deposited by plasma plasma treatment TEOS process:         Silicon dioxide film is a kind of dielectric material with excellent performance. It has the advantages of stable dielectric performance, low dielectric loss, good moisture resistance, and good temperature coefficient. It has extremely stable chemical properties and electrical insulation. Therefore, silicon dioxide is widely used in integrated circuit technology. plasma plasma treatment         It is precisely because of the wide application of silicon dioxide films in integrated circuit technology that it is necessary to prepare silicon dioxide films with different characteristics, which means that various new film deposition technologies must be continuously developed. In recent years, the application of atmospheric plasma plasma processing technology in thin film deposition has attracted more and more attention. Compared with traditional deposition methods, it has no vacuum chamber constraints, convenient and flexible operation, and low operating costs. At the same time, it has a very low reaction temperature and will not cause thermal damage to the substrate.         Different processing purposes have different requirements for plasma plasma processing characteristics. In plasma chemical vapor deposition film processing, a high concentration of highly reactive free radical particles is required. This requires the plasma to have a sufficiently high electron and ion concentration, and a suitable electron temperature. At the same time, in order to obtain a uniformly deposited film with a larger area, the plasma is required to have sufficient spatial uniformity.         Spectroscopy is more and more widely used as a diagnostic method of plasma. Its advantages are not only that it will not affect the state of the plasma itself, but it also has selectivity to the composition, and it can also obtain time and space-resolved information. Spectral analysis is the spectrum obtained by using the light radiation of a substance. This analysis method can be used for substances that can emit light under the excitation of external energy. The number, intensity, shape, and width of the spectral lines emitted by the elements are closely related to the physical state and physical parameters of the substance, such as temperature, pressure, and particle density. Therefore, this test technique provides us with an effective method to analyze the plasma composition, content, temperature and microscopic motion mechanism.         Under normal circumstances, the PECVD technology that uses TEOS as the deposition source to deposit silicon dioxide films, it is generally believed that TBOS will undergo the following decomposition reaction: Si(OC2H)4(@)-SiO2(目 + 4C2H(2) + 2H2Og. TEOS in It is decomposed in the plasma to produce solid silicon dioxide and deposited on the substrate, while other decomposition products are gaseous and exhausted with the reaction exhaust gas.         The characteristic peaks of Si and C-H detected in the spectrum indicate that TEOS has indeed undergone a decomposition reaction in the plasma, producing silicon compounds and some hydrocarbons. This also reflects from the perspective of spectroscopy that silicon dioxide is the product of TEOS decomposed by plasma.         We found that the growth rate of silicon dioxide does increase with the increase of input power. They have excellent similarity, so in actual production, we can judge the change of the film growth rate by the intensity change of the characteristic peaks of Si and CH in the spectrum, and thus change the process parameters when depositing the film, so as to get us The required film deposition rate improves the quality of film formation.

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Vacuum plasma cleaning machine system plasma processing PCB board processing application

Vacuum plasma cleaning machine system plasma processing PCB board processing application

        The plasma chamber of the vacuum plasma cleaner system is made of high-quality aluminum with excellent durability and is designed to process PCB boards in a separate plasma chamber to provide high etching rates and good processing uniformity. Vacuum plasma cleaner system         Key applications on flexible and rigid circuit boards (such as degumming and cleaning surfaces) provide good PCB handling. Many factors make the cost of ownership of the plasma treatment system 20% lower in the cost of similar systems. The design of this system is compact and easy to use. The printed circuit boards are vertically loaded with easy-to-load trolleys to optimize idle time and increase productivity. The rapid vacuum pump down, low air consumption and processing cycle time further improve the production efficiency of the system. Equipped with a touch screen operation interface, providing a variety of control functions and data collection functions.         In the circuit board manufacturing process, the vacuum plasma cleaner system can accommodate larger panel sizes, and can perform decontamination, etch back and landing pad cleaning operations when the size is smaller. The plasma processing system is mainly used for cleaning and etching of HDI, flexible and rigid circuit boards. Based on years of development experience, it combines market plasma technology and applications.         With the increase in production requirements and operations, 4 to 8 upgradeable plasma chambers are ideal for small and medium-sized enterprises or R&D institutions to handle low-volume, high-mix products. These products are designed to meet the ever-changing production environment. , From the gas distribution, pump package to user interface and control parameters, all have been upgraded. By sharing similar components and interfaces, the ability of plasma to process PCB panels becomes easier. Similar to other series of plasma systems, it is independent and takes up little space. The chassis is equipped with a plasma chamber, control electronics, 13.56MHz radio frequency generator, combined pump/fan and automatic matching network. Both front and rear panels can be repaired and overhauled. The vacuum plasma cleaner system uses a one-step process to provide uniformity of plasma treatment on both sides of the elastic material. Independent vacuum plasma processing system, space-saving compact chassis, and two easy-to-access front-mounted doors. It adopts advanced horizontal electrode design and integrated frame structure to provide good material alignment for plasma processing uniformity. And there is no need to use expensive fluoride. Instead, environmentally friendly and cost-effective gas plasma solutions, such as argon (Ar) and oxygen (O2), should be used.         Vacuum Plasma Cleaning Machine System This system is a completely independent roll-to-roll vacuum processing system, which integrates the processing of roll-to-roll materials and is used in the production of PCB manufacturing environment. The uniformity of plasma treatment is a key operating characteristic of flexible circuit board manufacturing technology in terms of surface activation, removal and etch back. The integrated roll-to-roll material handling system ensures the control of roll speed, tension and edge guidance for substrates as thin as 25 microns. During the rewinding process, optical-based edge-guided detection can achieve reliable control. The base is easy to load, and the loading area can be easily accessed through four doors. According to the production, it can be divided into three configuration types to meet actual needs.

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Wafer plasma cleaner can clean multi-chip contaminants

Wafer plasma cleaner can clean multi-chip contaminants

        The advanced applications of wafer-level packaging plasma processing in wafer-level packaging are increasing. As semiconductor device manufacturers further reduce the size and improve the reliability of packaged devices, plasma processing technology is obtained in higher-level wafer-level packaging. More and more applications. Chengfeng Zhizuo wafer plasma cleaning machine can handle a variety of sizes of wafers, large-capacity, automated processing. Wafer Plasma Cleaner         Sheet cleaning Plasma cleaning is a good method to eliminate contaminants generated during wafer-level equipment manufacturing or upstream assembly. In either case, cleaning products to remove fluorine, oxide or metal pollution will greatly improve the output, reliability and performance of integrated circuits.         Deslagging means that the amount of photoresist residue is still developing and processing. In plasma treatment, a small amount of resist is uniformly removed on the entire surface of the wafer before further processing. Wafer plasma cleaner plasma treatment can be used for batch stripping, materials include photoresist, oxide, nitride etching, and dielectric. The uniformity of the etching rate is greater than 97%, and 1 micron per minute can be achieved. Stripping and etching processes can be used for wafer-level packaging, MEMS manufacturing and disk drive processing. Plasma treatment of silicon wafer pretreatment removes pollutants and oxidation, improves bonding rate and reliability. In addition, the plasma also improves the adhesion between the passivation layers of the wafer for micro-roughness.         In UBM, the adhesion plasma treatment of BCB and UBM changes the morphology and wetting effect of the passivation layer of the wafer. Polymer materials, such as benzocyclobutene (BCB) and UBM, are redistributed in the dielectric layer of the wafer. Plasma treatment changes the shape of the initial passivation layer of the silicon wafer and enhances the wettability. The typical method of forming the redistribution layer by patterning the medium includes patterning the redistribution material of the medium using a typical photolithography method. Wafer plasma cleaning machine plasma cleaning is a viable alternative to dielectric patterning, and can avoid traditional wet processing.         Using the cleaning of the WLP holes, the wafers are assembled on the stacked chips, and residual products are often produced through the forming process. By optimizing the structure of the plasma, the through holes can be processed without damaging the surface of the wafer. Indentation plasma cleaning can improve indentation adhesion and increase indentation shear strength. By improving the uneven adhesion of the wafer surface, the plasma cleaner can significantly improve the uneven shear strength. The punch material includes different components of solder and gold nails.

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Application of low temperature plasma generator in industry

Application of low temperature plasma generator in industry

        The principle of surface treatment of atmospheric jet low-temperature plasma generator: The air flow of the cold arc plasma jet gun can produce oxygen-based active substances containing a large number of oxygen atoms. These oxygen atoms can be sprayed on the surface of the material to separate the adhered to the surface of the material. The organic pollutant element C can be converted into carbon dioxide and then removed; at the same time, it can improve the contact performance, thereby increasing the strength and reliability of the connection.Industrial low temperature plasma generator         Industrial applications of low-temperature plasma generator surface treatment technology:         (a) Pre-welding treatment Stainless steel sheet butt welding is widely used in industry. For example, the inner barrel of a solar water heater is made of 0.4mm stainless steel sheet rolled into a cylindrical shape and welded. In order to meet the welding requirements, the welding part must be cleaned. The current cleaning method is a wet method, which uses a chemical cleaning agent to scrub manually. The cleaning cost is high, the pollution is large, and it is difficult to realize automation. Low-temperature plasma generator cleaning technology is a dry cleaning technology, applied to the pre-treatment of thin plate butt welding, which can replace traditional manual chemical cleaning agents, reduce cleaning costs, improve welding quality, reduce environmental pollution, and realize welding areas Automation of cleaning. (b) Surface treatment of plastic sheets, such as wood plastic, is a new type of material that can replace wood, but the surface coating is very difficult, which greatly limits its scope of application. If chemical treatment is used, the cost is high and the pollution is large. Therefore, using low-temperature plasma air jet treatment, the surface of the material will change significantly: the color is slightly lighter, the reflectance is reduced, and the surface is in a matte state; the surface is slightly rough when touched by hand; the adhesion performance of the spray paint is greatly improved improve. The bonding force before and after plasma treatment can be tested. Test method: Use a scraper to make a scratch on the surface of the part to be tested, and use a soft brush to scrape off the debris on the surface. Use scotch tape to stick the markings, there should be no air bubbles between the tape and the sample, keep it for 1 to 2 minutes, and tear the tape at a constant speed of 60 degrees. Judge the bond strength by observing the integrity of the scribe line and the square.         In our daily life, such as door seals on cars, we often use rubber processed products. The surface should be painted or woven. If there is no plasma treatment with a low-temperature plasma generator, adhesion is not easy. If chemical cleaning is used, it will be offline and pollute the environment. The ideal solution is to use online plasma treatment.         (d) Plasma jet for glass and metal plates can treat glass and metal surfaces, not only can effectively remove organic pollutants from floating dust in the atmosphere, but also can change the surface properties to make it last long enough. Thereby improving the joint strength of the product. In addition, atmospheric pressure plasma cleaning can be applied to the surface of organic and metallic materials.         Plasma refers to a gas that is partially or completely ionized, and the sum of the positive and negative charges of free electrons and ions is completely offset, and it appears as neutral electricity on a macroscopic scale. Plasma, also called plasma, is an ionized gaseous substance. It is composed of atoms deprived of some electrons and positive and negative electrons generated after atoms are ionized. It exists widely in the universe. It is usually considered to remove solids and liquids. In addition to qi, the fourth state of matter existence.         Low-temperature plasma generators are mainly used for surface modification treatment of various materials: surface cleaning, surface activation, surface corrosion, surface grafting, surface deposition, surface polymerization and plasma-assisted chemical vapor deposition.         After being processed by a special metal low-temperature plasma generator, the surface morphology of the material undergoes microscopic changes. After the metal material is processed by Dyne’s low-temperature plasma surface processor, the bonding force of the material surface reaches 80 dynes or more, which can meet various bonding, Spraying, printing and other processes can achieve the effect of removing static electricity at the same time.

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Plasma technology to modify the hydrophilicity of wool in low-temperature plasma treatment process

Plasma technology to modify the hydrophilicity of wool in low-temperature plasma treatment process

        The surface structure and surface physical and chemical properties of wool fibers are closely related to the printing performance of wool fabrics. The outer skin layer of the wool surface scales is rich in C21-based covalently bonded lipids, which makes the wool fibers have a hydrophobic surface, making it difficult for the printing paste to evenly wet, spread and penetrate. The secondary outer skin layer of the scales is rich in cystine, and the disulfide bonds of cystine are covalently cross-linked between the wool macromolecules to form a diffusion barrier for dye additives. Low temperature plasma treatment process Therefore, in order to obtain a printing effect with uniform block surface, clear pattern outline and high color yield, especially for digital inkjet printing of wool, the surface of wool fabric must be modified. ​The low-temperature plasma processing technology is a dry processing technology, which saves energy and has no environmental pollution. Compared with the wet treatment method, the low-temperature plasma technology can not only realize the effective modification of the surface of wool, but also has almost no influence on the body performance of the wool. ​​​​​​​ Most of the past methods used low-pressure plasma technology, which is an intermittent processing method, which consumes a lot of energy and requires a vacuum system, and the production cost for industrial applications is high. Dielectric Barrier Discharges (DBD) atmospheric pressure plasma does not require a vacuum system, and can realize continuous production with low cost and high efficiency. Industrialized application prospects are broad. ​​​​​​​ Plasma treatment modifies the surface of wool fabrics and improves the performance of digital printing on wool fabrics. The non-plasma-treated wool fiber has complete scales, smooth surface and sharp edges and corners. Cracks and dot-like deposits appeared on the surface of wool fibers treated by the low-temperature plasma treatment process, and the edges of the scales became blurred. With the prolongation of the treatment time, the fibrous scaly layer peeled off, and even apparently fell off. ​​​​​​​ The reason may be that during the plasma treatment process, the bombardment of the active particles on the surface of the fiber produces an etching effect, which leads to the degradation of some macromolecular substances (lipids and proteins) on the surface of the wool fiber. Low-molecular gas or fragments; after degradation, the part with larger molecular mass may contain active free radicals, which may react with the macromolecules on the surface of the fiber, and eventually be dispersed and deposited on the surface of the wool fiber. ​​​​​​​ The surface of wool fiber contains components such as CC, NC, OC, O=C and O=C-OH. After atmospheric pressure plasma treatment, the content of CC and NC decreases significantly, while O=C- The OH content increased more. This is because there are lipids with higher carbon content and a small amount of protein on the surface of wool fibers. The etching effect of high-energy particles in the plasma on the surface of wool causes some of the CC and amide bonds in the wool to be broken and converted into other small molecules. The substance may then be oxidized to carbon-containing polar groups, such as carboxyl groups, etc., thereby improving the hydrophilicity of the fabric. ​​​​​​​ The wettability of untreated wool fabrics is poor, mainly due to the lipids contained in the flakes on the surface of the wool, which give the wool fibers a certain degree of hydrophobicity. After the low-temperature plasma treatment process, the high-energy particles have an etching effect on the surface of the wool, so that the flake layer of the wool is destroyed, and the lipid substance on the surface is modified or removed. ​​​​​​​ After atmospheric pressure plasma treatment, the surface of the wool fabric introduces oxygen-containing polar groups, such as carboxyl groups, etc., so the water contact angle of the fabric is reduced, the wetting time is shortened, and the wool fabric is wetted Performance has been significantly improved. After the low-temperature plasma treatment process, the whiteness of the wool fabric remains basically unchanged, the breaking strength is obviously improved, and the breaking elongation is reduced. This is because the cortical layer in the wool fiber determines the strength of the fiber, and the plasma only produces etching and oxidative degradation on the surface layer of the scales, and does not damage the wool fiber body; on the other hand, the etching effect of the plasma will cause Micro cracks appear on the fiber surface, making the surface uneven, thereby increasing the surface roughness of the fiber, increasing the cohesive force between the yarns, resulting in an increase in the strength of the fabric and a decrease in the elongation at break. ​​​​​​​ The smaller the value of stiffness, smoothness and softness, th

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