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Plasma Cleaning Process Application of Plasma Cleaning to Bonding Line

Plasma Cleaning Process Application of Plasma Cleaning to Bonding Line

Plasma Cleaning Process Application of Plasma Cleaning to Bonding Line At present, the development trend of integrated circuit is miniaturization, high power and multi-function, and the users' requirements for the reliability of products are becoming higher and higher, which puts forward many new problems for the microelectronics manufacturing technology and process. The failure of the bonding line is one of the main reasons for the circuit failure in the manufacturing process of Thick and Thin Film Hybrid IC. According to statistics, more than 70% of the product failures of hybrid integrated circuits are caused by the failure of bond lines. The reason is that the bonding zone will inevitably be polluted in the production process. If the bonding zone is directly bonded without treatment, it will cause defects such as false welding, unwelding, low bonding strength and so on, so that the long-term reliability of the product is not guaranteed. Plasma cleaning process can effectively remove photoresist, solvent residue, epoxy spillage and other organic pollutants in the bonding zone. Therefore, plasma cleaning treatment before bonding can greatly reduce the failure rate of bonding and improve the reliability of products. Plasma cleaning has the characteristics of cleaning clean, not damaging the chip, not reducing the adhesion of the film layer, and it has incomparable advantages over conventional liquid phase cleaning: From the working principle, it uses electric energy to produce a low-temperature working environment, without affecting the bonding (welding) of the components and the performance of the components themselves. At the same time, the plasma cleaning also eliminates the danger and trouble caused by chemical reaction. Isogenous cleaning produces gaseous material, rather than liquid waste, which can be discharged directly into the air. This eliminates the need for expensive waste disposal systems. Plasma cleaning is through the selection and adjustment of process parameters such as power, pressure, time, gas type and other process control, easy to operate, simple. In the plasma cleaning process, high-energy electrons collide with gas molecules to dissociate or ionize them. A variety of particles generated can be used to bombardment the surface to be cleaned or react with the surface to be cleaned, so as to effectively remove organic pollutants on the surface to be cleaned or improve the surface state. In the process of plasma cleaning with Ar gas, the huge energy generated by the impact of Ar ions on the surface can remove organic pollutants, and the mechanical energy generated by the bombardment can separate the chemical bonds of large molecules in the polymer into small molecules and vaporize them. In the process of plasma cleaning with O2, oxygen ions react with organic molecules to form H2O or CO2 gasification. When cleaning with a mixture of Ar and O2, the reaction rate is much faster than using any single gas. The argon ion is accelerated by negative bias pressure, and the kinetic energy formed can improve the reaction ability of oxygen. In this way, the surface of the device which is seriously polluted can be cleaned. Plasma cleaning process before bonding Plasma cleaning function: (1) The bonding strength generally increases after cleaning; (2) The range decreases after cleaning; (3) The discreteness of bonding strength decreases after cleaning; (4) Cleaning improves the failure mode. Plasma cleaning process before the bonding line can effectively remove the organic pollutants brought by various processes in the film bonding zone. So as to achieve the purpose of improving the bonding strength and reducing the desoldering. Plasma cleaning can reduce the product failure caused by bonding failure, and provide a powerful process guarantee to increase the long-term reliability of bonding and improve the quality of products.

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Cu surface modification in atmospheric plasma surface treatment system inhibits micro-discharge

Cu surface modification in atmospheric plasma surface treatment system inhibits micro-discharge

Cu surface modification to suppress microdischarge in atmospheric plasma surface treatment system: In power transmission lines, conductors may be damaged during line construction (such as on-site production of cable joints, erection of high-voltage overhead lines, etc.), which is easy to cause serious distortion of local electric field. Under the action of strong field, the air around the conductor will be ionized, and even the electrons in the metal body will be pulled out, thus leading to local micro-discharge. Atmospheric plasma surface treatment system Long-term partial microdischarge is one of the important factors causing insulation failure of transmission lines, which seriously affects the safe and stable operation of transmission lines. Therefore, finding an effective method to suppress the microdischarge caused by microdefects on the surface of conductors has become a research hotspot. The plasma of atmospheric plasma surface treatment system has the advantages of high concentration of highly active particles and low excitation temperature, which has been widely used in many fields. With the rise and development of the subject of material surface modification, the method of using plasma surface modification has been widely concerned. Plasma surface modification uses the energetic active particles in the plasma to bombard the surface of the material and endue the surface with new properties. Since it only acts on the surface, the original bulk properties of the material remain unchanged. It should be pointed out that plasma has no requirement on the substrate material, so it can be used for surface modification of metal materials as well as insulating materials. Atmospheric plasma surface treatment system technology is used to modify insulating materials, fluorine treatment and SiO film deposition, which can effectively regulate the modified groups and improve the insulating properties of materials. After the surface modification of epoxy resin by atmospheric plasma, the surface roughness of the material increases, and the introduction of fluorine-containing groups increases the voltage of the epoxy in vacuum. Plasma jet driven by RF power supply deposited silicon oxide thin films on silicon wafer, using HMDSO and O2 as reaction precursors, the thin films were obtained under favorable treatment conditions by optimizing O2 flow rate and RF power supply. The surface of copper and copper was treated by air dispersion discharge. It was found that the surface hydrophilicity and surface energy of copper and copper were effectively improved by plasma treatment in the atmospheric plasma surface treatment system. Li Wenyao et al. used the method of atmospheric pressure plasma enhanced chemical vapor deposition to deposit SiO2-like insulating film on copper and copper, and made use of the good dielectric properties and high resistivity of the silicon oxide film itself to suppress the occurrence of corona. The work function of metals is the main factor affecting the field emission threshold electric field. With a slight change in the work function, titanium tetrachloride (TiC4) is a common precursor for the preparation of TiO2. TiO2 can be generated through hydrolysis, and the reaction is easy to proceed at room temperature without producing organic waste. Using titanium tetrachlide (TiCl4) as a titanium source, low temperature plasma jet was used to deposit TiO2 films on the surface of copper and copper to change the surface characteristics of the conductor and block the microdefects, so as to inhibit the occurrence of microdischarge. After plasma treatment, the surface work function of Cu wafers is increased from 4.65eV to 4.87eV, the electric field distortion is improved, and the field intensity is reduced from 1.4x106 V/m to 9.89x105V/m. The plasma treatment method can improve the electric field distortion to a certain extent and inhibit the occurrence of local microdischarge.

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FPC plasma cleaning machine surface cleaning activation

FPC plasma cleaning machine surface cleaning activation

FPC Plasma Cleaning Machine Surface Cleaning Activation: Plasma cleaning machine surface activation, has been successfully applied in the electronic industry FPC and other different industries N times, combined with the surface adhesion is not strong, can not bond the situation, in the use of adhesive before using ion cleaning machine surface pretreatment of non-polar materials to achieve. After plasma treatment, the material can be bonded in minutes using a quick curing binder. FPC Plasma Cleaner for Electronics Industry At present, the plasma cleaning machine has been successful in a number of industries. Such as mobile phone electronics industry, chemical raw materials industry, FPC industry, LED industry, semiconductor, lithium battery and so on! All kinds of industrial plasma cleaning machine processing requirements, are from hydrophobic to hydrophilic, improve the adhesion of surface materials, improve the bonding effect. There is an increasing demand for materials with different surface properties: from various plastics to composites containing CFRP. Plasma technology can accurately obtain the surface tension or surface characteristics required for further processing, even for complex materials. Suitable for preprocessing from large to sophisticated, from simple to complex geometry, from simple to plastic packaging to FPC electronics industry component processing (such as sensors) -- all can be achieved with plasma processing technology. Using the FPC Electronic Industry Plasma Cleaner for fine cleaning is a very simple and environmentally friendly way to quickly and safely clean and modify surfaces by pulsed plasma triggering and special treatment gases. Even microorganisms, tiny bacteria and fungi can cause serious problems when packaging foods like dairy products. Before packaging, plastic containers must be treated to enhance the coating ability between them for sealing treatment, to ensure their storage cycle. The FPC Fine Powder Coating process pre-cleanses and activates the components through separate environmental protection operations, and then selectively deposits the metal coating in seconds. Especially in the electronics industry, FPC plasma cleaning machine can be used to use functional conductivity for plastic parts, the production of circuit boards can improve the ability to paste, welding, reduce other process steps.

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Application of Low Temperature Plasma Technology in Plasma Processor

Application of Low Temperature Plasma Technology in Plasma Processor

        Using low-temperature plasma surface treatment technology, using plasma surface activation treatment technology, after laboratory analysis, the plasma processor can obtain a uniform film layer with high performance, high coating rate, and strong permeability on the surface of the material, and can be used in Change its surface adhesion performance in a short time. Low temperature plasma technology         Application of plasma processor in various application fields:         1. Automobile manufacturing industry: EPDM sealing, flocking and coating pretreatment;         2. Plasma activation cleaning of PPPE and other materials: Before spraying, it is necessary to perform low-temperature plasma technology plasma cleaning with cell phone cover, cell phone glass, tempered film, etc., to increase the cleanliness of the product surface, significantly improve the surface activity, and enhance the adhesion effect;         3. Electronics industry: In the production line, plasma processor plasma system processes labels that replace hot melt and diffusion; single-sided pretreated PP film is stable and long-lasting, and can be used for water-based dispersing adhesives; mobile phone plastic shells and moped shells, Pre-treatment of paint;         4. Optoelectronics manufacturing industry: flexible and non-flexible printed circuit board contacts are cleaned, liquid crystal fluorescent tubes "contacts" are cleaned;         5. Metal and coating industry: pretreatment of aluminum profile, plasma processor replaces roughening and primer to obtain a stable oxide layer; aluminum foil deoiling-non-humidity chemical treatment; stainless steel laser welding pretreatment;         6. Chemical fiber and textile industry: Low-temperature plasma technology is used for fiber pretreatment speed up to 60 meters per minute; the glass surface and the surface before mirror bonding are cleaned;         7. Printing and coding industry: Plasma treatment of automatic box gluer can improve the adhesion of UV and film-coated folding cartons, reduce the amount of glue used, and effectively reduce production costs; PP and PE material screen printing, before pad printing Treatment to increase the adhesion of the ink layer; PE, PTFE, silicon rubber wire and cable pre-treatment for coding.

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Plasma treatment equipment in medical antibacterial and furniture bonding treatment

Plasma treatment equipment in medical antibacterial and furniture bonding treatment

Plasma treatment equipment in medical antibacterial and furniture bonding treatment:        With the improvement of social hygiene standards, the role of antibacterial surfaces is becoming more and more important. Especially life science and medical technology have higher requirements for health. Therefore, the application of the antibacterial surface is uniform, gentle and sustainable. With the help of plasma treatment equipment plasma surface activation technology, we can now deposit fine particles on the surface of the silver base. The experimental results show that the plating layer is uniform, the silver layer has good antibacterial properties, and the permeability changes in a short period of time. Plasma processing equipment        The seamless connection between the board and the edge (zero bonding line) is one of the important features of modern furniture. Therefore, it is very important to open the invisible boundary. The usual method is to glue the edge of the furniture to the veneer with an adhesive. However, this method will significantly darken the bonding line. The plasma treatment equipment can easily improve the adhesion to prevent the glue from flowing out.        The application of adhesives is replaced by functional layers of polymers. Some manufacturers provide plasma treatment for plasma treatment equipment, using plasma to activate the functional layer, so that the edge banding machine can directly bond the slats to the furniture board, so that the slats can achieve a good sealing effect, and the quality standards are continuously improved. And to meet the requirements for service life and durability.

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Introduction to Plasma of Vacuum Plasma Surface Treatment System (Encyclopedia)

Introduction to Plasma of Vacuum Plasma Surface Treatment System (Encyclopedia)

Introduction to Plasma of Vacuum Plasma Surface Treatment System (Encyclopedia) Introduction to plasma of vacuum plasma surface treatment system (Daquan):         The plasma surface treatment system we produce has produced atmospheric plasma, vacuum plasma surface treatment system and wide-format equipment series of treatment systems. With decades of experience and research results, the equipment runs trouble-free up to 99.9% and gives a powerful surface Cleaning and activation function. Vacuum plasma surface treatment system         Vacuum plasma surface treatment system plasma treatment surface:         Plasma treatment is used in the previous treatment steps, such as printing, bonding, spraying, painting or cleaning the coating and activating the surface. They are used to solve problems related to adhesion and wetting in many industries.         1. Introduction to plasma         Plasma is a state of existence of matter, usually in three states: solid, liquid, and gas, but in some special cases, it may also exist in the fourth state, such as substances from the surface of the sun and the ionosphere of the earth’s atmosphere. . This state of matter is called the plasma state, which is the fourth state of matter. The following substances exist in the plasma, and electrons are in high-speed motion; neutral atoms, molecules, and atomic groups (radicals) are in an activated state; ionized atoms and molecules; ultraviolet rays generated in the decomposition reaction of molecules; unreacted molecules and atoms And so on, but the substance is still neutral as a whole.         2. How to generate plasma         Various forms such as arc discharge, glow discharge, laser, flame or shock wave can transform gaseous matter under low pressure state into plasma state. For example, gas molecules, such as oxygen, nitrogen, methane, and water vapor, in a high-frequency electric field at low pressure, when the glow discharges, they will decompose accelerating atoms and molecules, so that the generated particles will be decomposed. Dissociate into electrons and positively and negatively charged atoms and molecules. The charged particles and electrons produced in this process gain high energy when they are accelerated in the electric field, and collide with surrounding molecules or atoms, so that the molecules and atoms are re-excited by the electrons, and they themselves are in an excited state. And ionic state, when the matter is in a plasma state.         3. Types of plasma in vacuum plasma surface treatment system         According to the temperature, it can be divided into two types: high temperature plasma and low temperature plasma.         According to the different chemical properties of the gas used when generating the plasma, from the perspective of the activity degree of the gas, the plasma can be divided into reactive gas plasma and inert gas plasma.         4. The effect of plasma on the surface of an object         In addition to gas molecules, ions and electrons, there are also atoms or groups of atoms (also called free radicals) that are excited by energy in the plasma of the vacuum plasma surface treatment system, as well as the light emitted by the plasma. Among them, the wave of The length and energy level play an important role when the plasma interacts with the surface of the object.         1) Free radicals such as radicals react with the surface of the object.         2) The effect of electrons on the surface of an object.         3) The effect of ions on the surface of an object.

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