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After the plasma surface treatment effect test how to identify

After the plasma surface treatment effect test how to identify

Although we know that the surface properties of materials will change after plasma surface treatment, but the naked eye can not tell whether the material has been treated or not. So, is there a simple way to quickly tell whether the material has been treated or not? The following are some commonly used rapid identification methods. The user of the plasma surface treatment device can tell at a glance whether the plasma treatment has been performed by displaying the label and observing the plasma indicator compound. It takes almost no time to complete the tests. Can be used in a variety of plasma equipment for a variety of processing purposes, including cleaning, activation, etching or coating. Over the course of weeks or months, these indicators will determine whether your product or semi-finished product has been identified before plasma treatment. 1. Identification label The pasted label film is a film treated with special coating. It can be placed directly in the box as a reference or pasted on the components. When the dark indicator point disappears, the plasma treatment is completed successfully. Device testing may also use an indication label, in which case the label may be placed in a vacuum chamber. 2, ADP- plasma indicator The plasma indicator is a label made of a special fabric. After successful plasma treatment, the fabric will dissolve. Attach this sticker to the component or model as needed. It can be used as a reference exposure for plasma jets, and the indicator has no effect on the actual plasma processing process or the device itself. Fabric can be damaged during processing. 3. Plasma indicator -- metal compound A plasma indicator is a liquid metallic compound that decomposes in a plasma to give a shiny surface to objects treated by the plasma. Droplets applied to the component or reference sample, when treated by isoionization, turn to a shiny metallic coating, in sharp contrast to the original colorless droplets. The metal film produced in the plasma is visually outstanding because of its reflectivity compared with the various colors of the object. 4. Dain pen test Dain pen can directly draw a line on the product, can show the difference between the treatment and the treatment, different Dain pen to measure the results are different, need to be used according to the actual situation.

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Plasma cleaning machine for mechanical equipment manufacturing surface treatment application

Plasma cleaning machine for mechanical equipment manufacturing surface treatment application

Machinery and equipment often give the impression that they only appear in the workplace such as the production shop, the construction site and so on, and seem to have no direct connection with our daily life. Have you ever taken an elevator in a shopping center? Have you ever heard of the "hum" of residential weeding? Have you ever seen the grinding equipment used in decoration room to cut aluminum alloy and other metals? If you think about it, the members of this family of mechanical devices are all around us. However, the problem is that they do not seem to have anything to do with plasma cleaning machine surface treatment. In fact, they have a lot of connections. Next, I will explain what applications there are. 1. Bonding the parts of the weeder and surface treatment before potting Because the weeding machine vibration at work constantly, metal friction will produce a lot of heat, so the weeding machine structure, such as pieces of fasteners and function of reliability and safety of the demand is higher, usually in the glue or potting before these plastic, metal materials and other accessories for plasma surface treatment, is of great help to improve the quality of products. 2. Plasma surface treatment before assembly of lift components and bonding of environmental protection materials The operation of the lift involves the safety of people and property, so it is necessary to ensure the safety, reliability and stability of the relevant facilities. Plasma surface treatment technology can remove the release agent and organic pollutants of plastic, rubber, glass, metal and other materials. Plasma cleaning machine can improve the bonding performance between various environmental protection materials, and provide a strong guarantee for the surface bonding, sealing and other quality. 3. Plasma surface treatment before processing of grinding and cutting equipment accessories. In the research and development of advanced metal abrasive cutting products, plasma cleaning machine commonly used by plasma surface treatment process to improve the cleanliness of metal material surface, and can activate the metal surface, increase its bond strength with synthetic resin, synthetic diamond and the whole of the metal body tightly bonding, to ensure the durability and reliability of the product. 4. Plasma surface treatment before mechanical equipment communication cable printing, inkjet, potting and bonding Communication cables is indispensable to any machinery and equipment, materials, and communication cable insulation material is made up of different plastic polymer, some plastic polymer with low surface energy, almost no polarity, after plasma surface treatment, can remove dirt, form the active group, improve printing, inkjet, potting, bonding process, etc. From objectively, domestic or domestic sales of machinery and equipment, the parts used in the process of processing or assembling the plasma cleaning machine plasma surface treatment technology is relatively more, along with the continuous development of our country's economy, the quality of people's lives and safety consciousness gradually improve, believe that the application of plasma surface treatment on mechanical equipment technology will be more and more! Low-temperature plasma treatment equipment has been widely used in plasma cleaning, plasma etching, plasma spraying, plasma ash, plasma surface modification and other aspects. The use of plasma surface treatment, can improve the wettability of the material surface, so that a variety of materials can be coated, coating and other operations, enhance the viscosity, adhesion, while removing organic pollutants, oxide layer, oil or grease.

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The application of graphene in integrated circuit is introduced in Plasma cleaning machine

The application of graphene in integrated circuit is introduced in Plasma cleaning machine

It is no exaggeration to say that graphene is the star material of the 21st century. In 2004, the discovery of graphene overthrew the two-dimensional structure "thermodynamic fluctuation at a finite temperature are not allowed to two-dimensional crystal under free existence" of cognition, shocked the whole physics, its discoverer, department of physics and astronomy at the university of Manchester, England Geim and Novoselov have therefore won the nomination of the Nobel Prize for physics in 2008, and won the 2010 Nobel Prize for physics. Compared with silicon, graphene has unique advantages in integrated circuits. Silicon-based microcomputer processors can only perform a certain number of operations per second at room temperature, but electrons pass through graphene with almost no resistance and generate very little heat. In addition, graphene itself is a good heat conductor and can dissipate heat very quickly. Because of its excellent properties, graphene can be used to make electronic products at much faster speeds. Speed is just one advantage of graphene. Silicon cannot be cut into pieces smaller than 10nm, or it will lose its attractive electronic properties. Compared to silicon, graphene's basic physical properties do not change when it is partitioned, and its electronic properties may even behave differently. As a result, graphene, which is smaller than silicon, can continue to maintain Moore's law when silicon is no longer separable, and thus has the potential to be a silicon replacement to drive microelectronics forward. Therefore, the unique physical and chemical properties of graphene also arouse the great interest of scientists in the fields of physics, chemistry and materials. The above is the introduction of graphene in the integrated circuit of CRF plasma cleaning machine manufacturers.

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Study on graphene plasma etching of plasma cleaning machine manufacturers

Study on graphene plasma etching of plasma cleaning machine manufacturers

Since 2004, there have been numerous research reports on graphene, including hundreds of related reports in Science and Nature. Research on graphene dates back to the 1970s. Clar et al. used chemical methods to synthesize a series of compounds with large conjugated systems, namely graphene sheets. Since then, Schmidt and other scientists have improved their method and synthesized many graphene derivatives with different edge modification groups, but this method cannot produce large planar graphene structures. In 2004, Geim et al. took graphite as raw material and obtained a series of new materials "graphene" called two-dimensional atomic crystals through micromechanical stripping method. Graphene, also known as a "single-layer graphite sheet," refers to a dense layer of carbon atoms wrapped around a lattice of honeycomb crystals, arranged in a two-dimensional structure similar to the single-atom layer of graphite. Geim et al. made use of nanoscale gold "scaffolding" to create a monolayer graphene film suspended on it. They found that the suspended graphene film was not a "two-dimensional flat structure", but a "microwave-like monolayer structure", and attributed the stability of graphene monolayer structure to its "nanoscale micro-distortion". Graphene is a zero-band gap material where electrons and holes can exist continuously, even at room temperature. Carrier concentration can be as high as 10-13cm3, and mobility can exceed 2000cm2 /V·s. The theoretical specific surface area of graphene is as high as 2600m2/g, and it has outstanding thermal conductivity (3000W/m·K) and mechanical properties (1060GPa). In addition, its special structure, so that it has half integer quantum Hall effect, never disappear conductivity and so on. Graphene can be used as both a channel material and a backend interconnection due to its excellent two-dimensional transmission properties and high electrical conductivity. Of course, different use of etching process requirements are also different. However, graphene faces two problems in chip manufacturing applications: one is how to continuously grow high quality films in large areas; The second is how to pattern. The second aspect is closely related to the etching process. In contrast, there has been a lot of research on large areas of growth, but not a lot of work on patterning. This is because it is difficult to grow large areas of graphene on its own, and even fewer have the ability to develop both. In general, there are several plasma etching methods for graphene, such as oxygen, hydrogen and argon. This in addition to oxygen and hydrogen plasma etching more. They take advantage of graphene's high activity to react with it, typically splitting large areas of layered graphene along 60° or 120°.The above is the CRF plasma cleaning machine manufacturers on graphene plasma etching research some introduction.

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Application of Plasma Cleaning in Packaging Technology for IC IC Manufacturing

Application of Plasma Cleaning in Packaging Technology for IC IC Manufacturing

In the domestic integrated circuit industry chain, the integrated circuit packaging industry is the pillar industry. With the reduction of the size of integrated circuit devices and the improvement of computing speed, packaging technology has become a key technology. The quality and cost of a product are affected by the packaging process. The characteristic size of future IC technology, chip area, the number of transistors contained in the chip and its development trajectory require IC package technology to develop in the direction of miniaturization, low cost, customization, green and environmental protection, and early coordination of package design. Lead frame is a chip carrier, through the bonding wire to achieve the internal circuit of the chip lead terminal and the external lead electrical connection. It is a key structural component that forms the circuit and acts as a bridge with the external leads. Lead frame is an important basic material in the electronic information industry. 1, the basic principle of IC packaging: On the one hand, integrated circuit packaging plays a role in mounting, fixing, sealing, protecting the chip and enhancing the electrothermal performance. On the other hand, it is connected to the pins of the package housing through the contacts on the chip, and these pins are connected to other devices through the wires on the printed circuit board, thus enabling the connection between the internal chip and the external circuit. At the same time, the chip must be isolated from the outside world to prevent the corrosion of the chip circuit by impurities in the air and the degradation of electrical performance. Oxides and particulate contaminants on the chip surface degrade the quality of the product during the packaging of integrated circuits. These contaminants can be effectively removed if plasma cleaning is performed during the packaging process prior to loading, lead bonding, and plastic curing. 2, IC packaging process flow: Only in the IC packaging process of packaging, can it become a terminal product and put into practical application. Integrated circuit packaging process is divided into pre - process, intermediate process and post - process. The packaging technology of integrated circuit has undergone great changes through continuous development. The front-end process can be divided into the following steps: Patch: the protective film and metal frame will be fixed silicon chip cut into silicon chip, and then a single chip; The cutting of a silicon wafer into a single chip for inspection; Chip mounting: place the silver glue or insulating glue at the corresponding position on the lead frame, remove the cut chip from the scribing film and paste it on the fixed position of the lead frame; Bonding: a gold wire is used to connect the lead hole on the chip and the pins on the frame pad, so that the chip is connected to an external circuit; Encapsulation: The circuit that encapsulates a component. Enhance the physical properties of the element to protect the element from external force damage; Post-curing: Curing the plastic packaging material so that it has sufficient hardness and strength to go through the entire packaging process. Pollutants in the process of integrated circuit packaging is an important factor affecting its development, how to solve these problems has been perplexing people, online plasma cleaning technology is a dry cleaning method without any environmental pollution can solve this problem. Plasma cleaning is a process in which the surface of the chip is treated by plasma, so that the contaminants on the sample surface are removed and the surface activity is improved.

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Comparison of contact Angle before and after plasma cleaning before plastic IC sealant

Comparison of contact Angle before and after plasma cleaning before plastic IC sealant

Plasma cleaning is a pollution-free stripping cleaning. When plasma cleaning is used, different chip cleaning techniques vary greatly. For example, the surface of metal fragments cannot be cleaned with oxygen to prevent oxidation. The application of plasma cleaning technology in LED packaging can be roughly divided into the following categories. (1) dispensing and packaging before: if there are pollutants in the substrate dispensing silver glue, silver glue is easy to form a ball, reduce chip adhesion. Plasma cleaning can increase the surface roughness of the workpiece, which is conducive to the success of dispensing silver. At the same time, it can save the amount of silver glue and reduce the cost. (2) Before lead bonding, the chip is pasted on the lead frame substrate, and should be cured at high temperature. If there are contaminants on the surface of the chip, it will affect the bonding effect between the lead and the chip and the substrate, resulting in incomplete bonding or poor adhesion and low strength. Plasma cleaning before bonding can significantly improve the surface activity, bonding strength and tensile uniformity of the wires. (3) before curing: the existence of pollutants will also lead to the formation of bubbles in the process of epoxy resin injection, so that the chip is easy to damage in the temperature change, reduce the service life of the chip. Plasma cleaning enables the chip and substrate to bond more tightly to the gel, reducing the formation of bubbles, and significantly improves the characteristics of the components. The contact Angle test of the chip shows that the contact Angle of the sample without plasma cleaning is about 39°~65°. After chemical plasma cleaning, the chip contact Angle is about 150°~20°. After the chip is cleaned by the physical reaction plasma, the contact Angle is 20°~27°. This shows that the plasma surface treatment of the encapsulated chip is effective. The contact angles of copper lead frames before and after plasma cleaning were compared by means of contact Angle tester. The contact Angle before cleaning is 46°~50°, and the contact Angle after cleaning is 14°~24°, which meets the requirements of chip surface treatment. Today, with the rapid development of integrated circuit technology in accordance with Moore's law, microelectronics manufacturing technology has become the frontier technology representing advanced manufacturing technology, and is also an important standard to measure the manufacturing level of a country. With the improvement of IC chip integration, the number of pins increases and the pin spacing decreases. Particulate pollutants, oxides and epoxy resins on chips and substrates will restrict the rapid development of integrated circuit packaging industry to a large extent. The on-line plasma cleaning technology, which is beneficial to environmental protection, good cleaning uniformity, good repeatability, strong controllability, strong 3D processing ability and directional selective processing, is applied to the integrated circuit packaging technology, and will promote the faster development of the integrated circuit packaging industry.

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