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The potential application of germanium in integrated circuits by plasma etching manufacturers and its etching methods (middle)

The potential application of germanium in integrated circuits by plasma etching manufacturers and its etching methods (middle)

As a new generation of semiconductor material, germanium has a great possibility to be used in IC manufacturing industry. And in the semiconductor industry planning also germanium as the future integrated circuit PMOS tube material. The use of germanium in the fabrication of integrated circuits, where large areas of germanium or germanium alloy films are defect-free, is a major obstacle in the way of industry. For germanium etching, there are two common etching methods. One is chlor-based etching, which is easier to achieve and does not introduce changes in electrical properties. The disadvantage is that it is difficult to control the overall shape. In general, germanium etching has a high aspect ratio, or multi-layer structure, in the etching to maintain good graphics transfer needs to use a lot of means. Chlorine (400 w, 200 SCCM, ER ~ 200 a/s) of the boundary of the etching will not damage the interface (lateral boundary lattice intact), it is of vital importance in high-performance device, may leave out the subsequent repair injury of lattice technology, reduce costs, to etch itself also reduces the difficulty, but we can also see, the wall graphic control is not good enough to get the graphics around 75 ° Angle, it is difficult to meet the actual needs. For the control of the profile shape of the side wall, the general practice is to add polymer etching gas and control the overall shape by multi-step etching. Argon gas and chlorine gas are mainly used to control the shape of the graph by adding polymer etching gas or changing bias pressure, and the graph of different side wall morphology is obtained respectively. CH3F and chlorine are very effective at controlling the form. The regulation of bias voltage and flow rate plays an important role in controlling the bottom shape. By these means, the form control of germanium and the adjustment of key dimensions can be accomplished.

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Plasma manufacturers introduce the potential application of germanium in integrated circuits and its etching method (II)

Plasma manufacturers introduce the potential application of germanium in integrated circuits and its etching method (II)

From the point of view of the author, the use of highly active etching gas seems to be more critical, both the increase of chlorine gas and the use of CHF3 will accelerate the etching of metal components. However, the impact of bombardment bias is not the key, except for the difference of key size, the difference of morphology under high and low bias pressure is not obvious. It can be seen that the further increase of chlorine gas flow will accelerate the formation of the bottom adducted morphology of the germanium alloy side etching, which also indicates that the highly active chemical etching gas is more effective for germanium etching without losing too much photoresists, so as to ensure the effect of side wall profile curve. The other is mainly fluorinated gas etching, the main etching agent is CF4, the product is more volatile GEF4. We can get very smooth shapes. Adding oxygen can adjust the selection ratio of germanium to its alloy, and the ratio is up to 434. This is important because the multilayer structure of germanium is generally epitaxial, and the induced layer and interlayer structure are generally germanium alloy materials. The selection of high ratio process can better control the etching of such multilayer structure. We know that CF4 is also a highly reactive chemical etching gas. From the effect, adding oxygen to CF4 has a higher etching selection ratio, because oxygen is more likely to react with the underlying material (SN) to form a protective surface film, preventing further etching and improving the selection ratio. It seems that the morphology of the CF4 etching is also better, but the advantage of chlorine etching is low damage, and it is good for the interface layer and channel layer. Both chlorine-based and fluorine-based germanium etching are common processes at present, which have achieved good results and have been applied in device manufacturing respectively. Another less common class of germanium is etched using XEF2 gas.

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Plasma cleaning machine enterprise technical equipment characteristics

Plasma cleaning machine enterprise technical equipment characteristics

Plasma cleaning machine technology is often used in the field of material surface treatment products, through ion exchange to change the surface characteristics of the material. With the continuous improvement and upgrading of plasma cleaning technology, there are more and more cleaning equipment coming to the market, so today, we will take you to understand the specific characteristics of the equipment produced by advanced plasma cleaning machine enterprises. Advanced cleaning equipment can effectively improve cleaning efficiency. In the process of plasma cleaning, it often takes a certain amount of time, and the treatment effect is also different. The more advanced the equipment we use, the more mature the technology, the more satisfactory the effect can be achieved, thus effectively saving the production and operation costs for the major enterprises. Secondly, plasma cleaning equipment in the technology of continuous development and upgrading. At present, most of the common equipment in the market is the advanced research results in the field of technology at home and abroad, and has been widely praised by many enterprises in the overall application market. The normal operation and use of our daily equipment can achieve the purpose of cleaning by changing the state of the substance and modifying the surface. The energy saving and environmental protection of plasma cleaning machine equipment is also our concern. Cleaning usually adopts plasma technology, which will not cause additional environmental pollution and has good environmental applicability. And the more advanced equipment we choose, the better the overall performance will be. At present, the advanced plasma cleaning machine equipment on the market is advanced in many aspects, and the product design and functional design of plasma enterprises are becoming more and more perfect. Some customers may not understand this aspect. If you need to understand this industry information, please through our website to understand more in-depth, or consult our customer service staff for further answers.

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Atmospheric low temperature plasma cleaning machine manufacturers

Atmospheric low temperature plasma cleaning machine manufacturers

Atmospheric low temperature plasma cleaning machine is a set of physics, chemistry, biology, environmental science as one of the comprehensive interdisciplinary. Therefore, the emergence of low temperature plasma has been favored and recognized by many friends. Therefore, what are the characteristics of low temperature plasma cleaning machine equipment manufacturers? The following is a small series with you in detail. When the low-temperature atmospheric plasma cleaning machine is used, it can run by itself after it is started up. It is very limited by the working conditions and does not need special operation. It can be said that the low-temperature plasma technology is very high end, and the process is also very simple. Secondly, the use of low-temperature plasma cleaning machine friends should know, because there is no mechanical equipment, in the cleaning operation, not only the air resistance is very small, and compared with other cleaning equipment, power consumption is less. Third, no matter the switch or off, the working speed of the atmospheric low temperature plasma cleaning machine is very fast, and can be used anytime and anywhere, not affected by the temperature. It can work well even under 250 degrees, or in foggy working conditions. Four is because the low temperature plasma cleaning machine is made of stainless steel and copper and other materials, its oxidation resistance and corrosion resistance are very good, so as long as we can maintain it regularly, its service life is very guaranteed. Five is the use of low temperature plasma cleaning machine work, only need to consume power, basically will not take up labor costs, and equipment failure rate is very low, even if long-term use will not increase maintenance costs. Because the characteristics of plasma cleaning equipment are so significant, so it has been favored by many enterprises as soon as it is listed, and in recent years, with the development of society, the demand for cleaning machine is more and more large, as long as we buy from the regular atmospheric low temperature plasma cleaning machine manufacturers, the quality is more guaranteed.

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Plasma surface treatment equipment manufacturers - mechanical properties of nanomaterials

Plasma surface treatment equipment manufacturers - mechanical properties of nanomaterials

Grain Boundaries and Defects in Nano (Micro/Nanomechanics) : Nano solid materials are three-dimensional block-like materials that consist of particles with particle sizes ranging from 1 to 100nm. The basic composition of nano solid materials (Micro/Nanomechanics) is the interface between nanoparticles and particles. Interfaces in physics do not refer to geometrical interfaces, but to a thin layer (micro-nano mechanics) whose surfaces have different properties from the substrates on either side. All interface phenomena exist because the atoms at the interface of an object are stressed differently from the atoms inside it, and therefore their energy states are different. In conventional coarse-grain materials, grain boundaries are only surface defects. For nanomaterials (micro-nano mechanics), grain boundaries are not only surface defects, but more importantly, a unit that constitutes nanomaterials (micro-nano mechanics), namely grain boundary unit. Nano - solid materials (micro - nano mechanics) have become one of the basic structures and have an impact on the special properties of nano - solid materials. Gleiter proposed in 1987 that the arrangement of atoms on the interface of nanometer micrograins is neither long-range ordered nor short-range ordered, but has a highly disordered gas-like structure. It is believed that the interface of nanomaterials (micro-nano mechanics) is arranged in an orderly manner, which is not different from that of coarse-grained structures. However, further studies show that the ordering of the atomic arrangement of interface elements is local and conditional, which mainly depends on the spacing of interface atoms and the size of particles. If the arrangement of atoms is locally ordered, the arrangement of interface tuples is reversed and disordered. The atomic structure of the grain boundaries of nanomaterials (micro-nano mechanics) is difficult to unify with a single model. Nevertheless, we still believe that the grain boundary structure of nanomaterials (micro-nano mechanics) is not fundamentally different from that of ordinary coarse grains. The shortcoming is that the actual crystal structure deviates from the ideal region. In the nanomaterial structure, the translation period is seriously damaged, the interfacial atomic arrangement is disordered, and the atomic coordination number is not complete, which leads to the increase of interfacial defects. In addition, the lattice constant increases or decreases after the nanometer powder is extruded into blocks, and the change of lattice constant increases the defect. The above is the plasma surface treatment equipment manufacturers on the mechanical properties of nanomaterials, I hope to help you.

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Plasma surface treatment technology has improved non-woven fabric treatment

Plasma surface treatment technology has improved non-woven fabric treatment

In recent years, a great deal of research has been done on the application of plasma surface treatment to nonwovens. Surface modification of blood filtration material PBT melt-blown nonwovens by air and AR atmospheric plasma surface treatment can significantly improve the wettability of the material surface. Ar vacuum plasma surface treatment technology was used to modify the surface of polypropylene nonwovens used for battery diaphragm. The plasma surface treatment can improve the alkali absorption speed and rate of the material, thus improving the performance of battery diaphragm. Plasma surface treatment and modification treatment have some influence on the mechanical properties of polypropylene nonwovens for battery diaphragm, but it will not affect their normal use. Using the O2, N2 plasma PET nonwovens for plasma surface modification treatment, can improve the wettability of the material surface, using the O2 plasma treatment, after 60 s PET nonwovens instantaneous water absorption and large bibulous rate is increased, use of air plasma surface treatment can effectively improve hydrophilicity on the surface of the viscose spinning polyester nonwovens, plasma control of processing conditions on the degree of modification. After He/O2 plasma surface treatment, the wettability and moisture regain of PET spunbonded nonwovens are increased to more than 10 times and 3 times as much as before modification. Surface treatment of polypropylene nonwovens was conducted by HE glow discharge plasma at atmospheric pressure. The results show that the surface morphology changes are related to the tensile strength, stress properties, air permeability, wettability and other factors of the fabric.

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