图片名称

NEWS

Popular Articles

Contact Us

图片名称
图片名称

Service Hotline

13632675935

CRF

TEL：13632675935

E-mail：shaobo@sfi-crf.com

Address: 1303, Building 3, Manjinghua Science and Innovation Workshop, No.6 Songjiang Road, Songgang Street, Bao'an District, Shenzhen, China.

Liquid crystal automatic terminal plasma cleaning machine to enhance surface adhesion

Liquid crystal automatic terminal plasma cleaning machine to enhance surface adhesion

Liquid crystal terminal automatic plasma cleaning machine adopts low temperature plasma cold arc discharge technology. Cleaning efficiency is high and processing speed is fast. A variety of nozzles can be selected, available gases :N2, H2, CDA(air), etc. No preheating is required and can be started and stopped at any time. It can be operated online or offline, with low operating cost, no pollution, no static residual, no arc, small size, easy installation and maintenance. Liquid crystal automatic terminal plasma cleaning machine products can be applied to the industry In-cell, On-cell, OGS full fitting screen STN-LCD, TFT-LCD and so on. LCD automatic terminal plasma cleaning machine Plasma cleaning machine surface treatment process characteristics; 1. The plasma flow is neutral, no charge, can be used for surface treatment of various polymers, metals, rubber, liquid crystal terminals, printed circuit boards and other materials to improve the bonding ability; 2. Improve the bonding strength of plastic parts, such as PP material after treatment can be increased several times, most plastic parts after treatment can make the surface can reach more than 60 dynes; 3. After plasma treatment, the surface performance is durable and stable for a long time; 4. Dry treatment without pollution, no waste water, in line with environmental protection requirements; 5. The output temperature is moderate, which will not cause damage and deformation to the workpiece. 6. The processing width can be adjusted, whether it is processing narrow edges and small grooves or large areas can be processed. 7. Adopt special electrode material, which can reduce pollution and avoid secondary pollution of workpiece. 8. The power can be adjusted continuously, the nozzle structure can be adjusted according to the need, can adapt to different processing width. 9. Very low failure rate, avoid production stagnation, high stability. CRF team engaged in plasma equipment manufacturing for many years, has successfully developed a variety of plasma cleaning machine equipment. In order to meet the market demand, the equipment has good stability, self-inspection, fault alarm, small size, easy to carry and other advantages, has been widely used in cable, electronics, food, automotive, liquid crystal, chip semiconductor and other industries in the cleaning process.

MORE +
Plasma surface processor equipment to solve the difficulties of paint coating in the mobile phone industry

Plasma surface processor equipment to solve the difficulties of paint coating in the mobile phone industry

Mobile phone is an indispensable tool in modern people's life. However, a headache is that after a period of use, the phone's casing will lose paint, wear and tear, or the logo will become clearer and clearer, seriously affecting the appearance of the phone. The application of plasma surface processor equipment technology to help mobile phone manufacturers to completely solve the above problems, it can be said that plasma technology is a new environmental protection technology in the market, completely replaced the traditional method of surface treatment of mobile phone shell relying on chemical agents. The mobile phone shell with plasma surface treatment has better wear resistance after being treated by the equipment, which can ensure that the paint will not fall off or wear off again after long-term use. Because the plasma surface processor technology can clean the dust, impurities or grease left in the production process of mobile phone shell, the larger program can improve the activity of the plastic surface, so that the coating effect is very uniform, the coating bonding effect is better, and the connection with the coating is more firm.

MORE +
The application of plasma surface treatment technology in the automotive industry to solve the problem of bonding

The application of plasma surface treatment technology in the automotive industry to solve the problem of bonding

Because most of the plastic surface tension is very low, so in the past a lot of design is to use accommodation material, as long as the surface after a certain plasma surface processor processing, can achieve spraying or bonding and other technical requirements, priority to use this material. In recent years, the cost and performance of materials have become increasingly dominant factors in product design, which has led auto industry manufacturers to focus on more plastic varieties. Nowadays, PP, PC, ABS, SMC, various elastomers and various composite materials have been widely used in the field of automotive manufacturing. In this way, it not only solves the mutual bonding between the parts of the same material, but also solves the mutual bonding between the parts of different materials, but the traditional processing method is difficult to meet the requirements of this processing technology. From the surface treatment effect, the current various surface treatment methods, fluorination treatment effect is good, can make the material to enhance the adhesion. But this method produces a lot of harmful fumes, and the cost of treating them is unacceptable to most carmakers. Happily, the emergence of plasma surface treatment technology has brought a revolution to the plastics industry, which has the following advantages: 1, environmental protection technology: the action process of plasma surface treatment is gas-solid coherent reaction, does not consume water resources, no need to add chemical agents. 2, high efficiency: the whole process can be completed in a relatively short time. 3, low cost: simple equipment, convenient operation and maintenance, with a small amount of gas instead of expensive cleaning fluid, but also without treatment of waste liquid. 4, can go deep into small holes and depression area, to complete the cleaning task. 5, plasma surface treatment machine for a wide range of application: plasma surface treatment technology can achieve the treatment of most solid substances, so the application range is very wide.

MORE +
Influence of plasma etching on SM

Influence of plasma etching on SM

Integrated circuit chips are placed at a certain temperature for a certain period of time, but no current is applied. In some cases, we can also observe the presence of gaps or holes in metal wires, or even complete disconnection. This phenomenon usually occurs under the action of stress transfer (SM). When a metal is subjected to a mechanical stress greater than its yield stress, the metal will undergo a time-dependent plastic deformation. Under fixed mechanical stress, the continuous deformation over time is called creep, and the creep deformation will continue until the stress level falls below the yield stress or until failure occurs. In fact, stress transfer in IC is the metal atom transport process caused by mechanical stress, and its failure is usually driven by creep. In essence, it is the stress release in the chip metal interconnection layer, and one of the results of stress release is the formation of cavity in the metal layer. The mechanical stress is caused by many high-temperature processes in the metal interconnection of integrated circuits and the insulating layer protection process. Due to the different thermal expansion coefficients of metal materials and insulating materials, these high-temperature processes will introduce a large stress in the metal layer aluminum or copper, and the size of the mechanical stress is inversely proportional to the temperature. The nucleation or growth of the cavity in the metal layer caused by stress is a spreading process, which is proportional to temperature. Under the combined effect of mechanical stress and diffusion, the rate of cavity nucleation induced by stress transfer reaches the peak at a certain temperature. This temperature, depending on the properties of the conductor and the surrounding insulator, is generally about 150~200℃. Under the action of stress gradient, the void on the copper grain boundary moves and aggregates to form the void. The bottom of the copper interconnection through hole is a discontinuous structure composed of a variety of metal materials, and its stress is relatively small, so the vacancy tends to move and gather toward the bottom of the through hole. The surrounding copper grain boundary and the interface between copper and dielectric barrier layer provide the source of the vacancy. When a single through hole is placed on a wide copper wire, the effect is severe, because the wide copper wire can provide enough space for the cavity to grow and form a circuit break. The phenomenon of stress transfer can be described by the creep rate model proposed by McPherson and Dunn, whose failure time model is TF = B0 (T0) - nexp (Ea/kBT) (7 to 17) Where, T0 is the temperature of the metal without stress, and is approximately the temperature of deposition for Cu. N is the temperature difference exponential factor; Ea is the activation energy associated with metal diffusion. In engineering, the sample is usually baked at a specific temperature for a specific time, and the ratio of resistance change before and after baking is used to evaluate SM. TEM images of the samples with the contact resistance of the through hole increased by 85% and 200% after baking respectively show that when the cavity is just under the through hole, the resistance increases more greatly. According to the principle of Sm, the film deposition process has a great influence on Sm, such as the microstructure control of Cu deposition, the sputtering amount of the underlying metal during the deposition of metal barrier layer, the control of dielectric thermal expansion coefficient, the influence of alloys in copper, etc. The influence of etching on SM is mainly in two aspects. One is the morphology of the through-hole after etching. If a small palisade morphology appears at the junction of the groove and through-hole, the cavity will appear in the through-hole after copper filling, resulting in the early failure of SM. Second is a hole in the bottom of the polymer residues left much as well as to the bottom of the copper surface Treatment, such as Zhou discusses the different etching processing (Post Etch Treatment, PET) technology on the impact of SM, using N2 PET than CO2 / H2 gas can better remove polymer residues at the bottom of the hole, and to restore of copper at the bottom of the hole, significantly improve the performance of SM.

MORE +
Why cooling water should be used in vacuum plasma surface treatment process

Why cooling water should be used in vacuum plasma surface treatment process

Process cooling water is a commonly used temperature control medium in industrial production. Its application is very wide. According to the types of use, it is mainly divided into dust-free workshop cooling, process equipment cooling, production process cooling, etc., and the application of vacuum plasma cleaning machine surface treatment can be summarized as process equipment cooling. Many people may think, plasma cleaning machine is not the use of low temperature plasma equipment, why will be used in the process of cooling water, and how can it be used correctly? So let's look at it. 1, plasma cleaning machine process cooling water application: (1) the electrode plate of cooling vacuum plasma cleaning machine: Vacuum plasma cleaning machine produced by plasma temperature is very low, but in use process, if you use a larger power or processing time is too long, can appear electric plate temperature, and plasma cleaning machine is also commonly deal with some of the products is more sensitive to temperature, this is where, according to the requirement of the user by cooling electrode plates in order to achieve the temperature stability of cavity in the purpose of the requirements. (2) Plasma generator cooling: The plasma generator of the plasma cleaning machine is the core component of the equipment. Generally, the use of small plasma cleaning machine is smaller, and the heat generated by the plasma generator itself is smaller, and the method of air cooling is generally chosen. The large plasma cleaning machine is the use of large output power of the plasma generator, the work of its own heat is also very large, in order to ensure the stability of the use of equipment, prolong the service life, the use of process cooling water temperature removal method to cool. (3) Vacuum pump cooling: Vacuum pump in the process of use without lubricating oil cooling, between the mechanical structure and produced a very high friction temperature, such as vacuum pump in the case of no cooling work, there will be rotor or screw locked, resulting in scrap. Therefore, vacuum pump needs real time cooling in use, the method adopted is to use process cooling water cooling. In order to reduce the noise of the motor and better protect the motor, the local dry pump in the design will generally choose the water-cooled motor, and the process cooling water is also needed for real-time cooling. 2, plasma cleaning machine process cooling water application: (1) Process cooling water of plasma cleaning machine: The process cooling water used by the plasma cleaning machine mainly has two sources, the supply of cooling water and the circulating water supply at the client end. For large plasma cleaning machines, independent cooling water units are required to protect the equipment. (2) General requirements of process cooling water: The cooling water temperature of plasma cleaning machine is generally controlled at 20~50℃, the pressure is generally between 0.3~ 0.5Mpa, and the flow rate is generally between 2~7SLM according to the actual needs. According to the practical application, the value range of operation parameters should be determined. (3) Real-time monitoring and control of process cooling water: All the parts that need to be cooled are key parts. If the temperature is too high or the pressure is insufficient, the products will be scrapped and the equipment parts will be damaged. Therefore, real-time monitoring is very important. In general, the plasma cleaning machine cooling water pressure and flow monitoring is completed by the water flow switch, the water flow switch is divided into mechanical and quantitative, need to be applied in series to the intake pipe, when the pressure or flow is too small, the output signal, complete the alarm function of the equipment. Generally, independent water flow switch is installed at the entrance of each temperature control component to ensure its stability and reliability. By installing a temperature sensor on each part, the chiller signal output, each part comes with a temperature sensor signal output, select the specific implementation method, so as to realize the temperature alarm. In practical application, in order to ensure the stability of the operation of vacuum plasma surface treatment equipment, a variety of methods are usually used at the same time.

MORE +
6 surface treatment plasma cleaning machine solution application

6 surface treatment plasma cleaning machine solution application

In view of the wide application of plasma cleaning machine in all walks of life, CRF Chengfeng Intelligent manufacturing Xiaobian summed up the six application solutions of plasma cleaning machine. 1. Surface Activation Solution: After the plasma surface treatment of the object, can enhance the surface energy, hydrophilicity, increase the bond, adhesion and so on. 2, the material surface etching solution: The material surface is selectively etched by reactive gas plasma cleaning. The impurity residues on the etched material are converted into gaseous state, and then discharged by vacuum pump. After treatment, the micro surface volume of the material increases, and it has good hydrophilicity. 3. Nano coating solution: After plasma cleaning machine treatment, plasma guided polymerization reaction to form nano coating. Through the surface coating can make a variety of materials to achieve hydrophobic (hydrophobic), hydrophilic (hydrophilic), lipphobic (fat resistance), oleophobic (oil resistance). 4. TSP/OLED product solutions: TSP: the main process of touch screen cleaning, improve OCA/OCR, laminating, ACF, Ar /AF coating adhesion/coating force, through a variety of atmospheric pressure plasma form, can eliminate bubbles/foreign bodies, all kinds of glass, film uniform plasma discharge, so that the surface without damage processing. 5, vacuum plasma spraying equipment solutions: Because of the high energy density in the plasma of the vacuum plasma cleaner, virtually all powders with a stable molten phase can be converted into a dense, strongly adhered spray coating. The quality of the spray coating depends on the instantaneous melting degree of the spray powder particles when they hit the surface of the workpiece. Vacuum plasma spraying technology has improved the production efficiency of modern coating machines. 6, cleaning the surface solution: The high-energy disordered plasma is generated in the vacuum plasma cavity by the radio frequency power supply, and the surface of the product to be cleaned is bombarded by the plasma to make the pollutants fall off from the product to achieve the purpose of cleaning.

MORE +
< 1...495051...132 > proceed page
图片名称

CRF

National Service Hotline

136 3267 5935

Contact Email

shaobo@sfi-crf.com

Address:1303, Building 3, Manjinghua Science and Innovation Workshop, No.6 Songjiang Road, Songgang Street, Bao'an District, Shenzhen, China.

图片名称

Add WeChat
Get related information

Links

Apply to exchange friend links

Copyright © Shenzhen Chengfeng Smart Co.

京ICP备10002622号-38

粤公网安备 44030602005200号

图片名称

Cheng Feng Zhi Zuang a focus on plasma research and development for 20 years

We

The services of

Inquire for free sample testing

1-to-1 program customization

24-hour online after-sales service

Source manufacturer

Get the program
%{tishi_zhanwei}%
图片名称

Scan the code for information

诚峰智造