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Operating principle of vacuum plasma cleaning machine pump

Operating principle of vacuum plasma cleaning machine pump

Low pressure vacuum plasma cleaning machine is a kind of cleaning equipment that depends on the activation of the material in the plasma state to remove the surface stains of the object. It belongs to dry cleaning in industrial cleaning, which requires vacuum pump to produce vacuum conditions that meet cleaning requirements. The required plasma is mainly produced by specific gas molecules in special occasions such as vacuum and discharge, such as low-pressure gas glow plasma. Plasma cleaning needs to be in the vacuum state, so a vacuum pump is needed to complete the vacuum pumping work.   Its main principle steps are as follows: first, the workpiece to be cleaned is sent to the vacuum chamber for fixation, then the vacuum pump and other devices are started, vacuum is pumped, and the vacuum is discharged to about 10Pa vacuum degree. Then the gas used for plasma cleaning is introduced into the vacuum chamber (different gases, such as oxygen, hydrogen, argon, nitrogen, etc., are selected according to different cleaning materials), and the pressure is maintained at about 100Pa. A high frequency voltage is applied between the electrode and the grounding device in the vacuum chamber, which causes the gas to be broken down and ionized by glow discharge to produce plasma. After the plasma generated in the vacuum chamber has completely covered the cleaned workpiece, the cleaning work begins. The cleaning process lasts from tens of seconds to several minutes. The whole process depends on electromagnetic bombardment and surface treatment in the field of plasma. Most physical cleaning processes require high energy and low pressure. Before the bombardment, the atoms and ions on the surface of the object are bombarded to their maximum velocity. Because it takes a lot of energy to speed up the plasma, atoms and ions can travel faster in the plasma. The lower pressure is needed to increase the average distance between the atoms before they collide, and the longer the average free path, the greater the chance of bombarding the ions on the surface of the object being washed. This allows for surface treatment, cleaning and etching (there is a slight etching process during cleaning); When the cleaning is complete, the evaporating dirt and cleaning gas are expelled, while the air is returned to the indoor vacuum to return to normal atmospheric pressure.   During cleaning, in the vacuum environment of vacuum chamber controlled by vacuum pump, the gas flow determines the luminance chroma: if the color is heavy, it means that the vacuum degree is low and the gas flow is large; If it is white, it means high vacuum and low gas flow. The specific needs according to the need of the treatment effect to determine the vacuum pump to achieve the vacuum degree.   As a kind of precision dry cleaning equipment, vacuum plasma cleaning machine manufacturers mainly used for cleaning hybrid integrated circuit, monolithic integrated circuit shell and ceramic substrate; It is suitable for precise cleaning of semiconductor, thick film circuit, component before packaging, silicon wafer after etching, vacuum electronics, connector and relay, etc. It can remove organic matter and oxide layer such as grease and oil on metal surface. It can also be used for surface activation of plastics, rubber, metals, ceramics, and life science experiments.

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Application of improving biocompatibility of plasma-injected plasma

Application of improving biocompatibility of plasma-injected plasma

Improving the biocompatibility of materials is another successful application of plasma ion implantation, which can be applied independently or in combination with PVD or CVD processes. For example, standard low temperature isotropic pyrolytic carbon shows strong image shape thrombotic aggregation in vivo, but titanium-based biomaterials treated with PIII oxygen do not appear obvious thrombotic after being put into vivo. Through oxygen ion bombardment, oxide growth is controlled and rutile phase is formed. In addition, the biocompatibility of PIII treated LTI carbon materials was also greatly improved, and the platelet density was significantly reduced after implantation in vivo. It may be caused by the formation of the CN surface layer after nitrogen injection. Until now, these materials, which are very useful, have not been used in conventional surgery, because there are many obstacles. For example, the law stipulates that "a long process of testing and clinical trials is required before a new synthetic material can be implanted into the human body." This requires a legal procedure.   PII has been successfully applied to ion implantation of nonmetallic materials. When conventional ion implantation is used, non-metallic materials are easy to be charged. Since the ions on the material surface will be repelled by static electricity, when PII treatment is carried out in the plasma environment, the electrons in the plasma will automatically complete charge neutralization.

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What kinds of plasma cleaning

What kinds of plasma cleaning

There are two main cleaning methods that have been widely used: wet method and dry method. Considering environmental impact, raw material consumption and future development, wet cleaning has great limitations, and dry cleaning is obviously superior to wet cleaning. Among them, plasma cleaning develops rapidly and has obvious advantages. A plasma is an ionized gas. It is a collection of electrons, ions, atoms, molecules, or free radicals. In the process of cleaning, high-energy electrons will collide with gas molecules to dissociate or ionize them. A variety of particles generated will be used to bombate the cleaned surface or chemically react with the cleaned surface to effectively remove various pollutants. At the same time, it can also improve the surface performance of the material itself, such as improving the wettability of the surface, improving the adhesion of the film, etc., which is of great significance in many applications.   After plasma cleaning, the surface of the device is dried and no further treatment is required, which can improve the processing efficiency of the whole process line. It can prevent the operator from being hurt by harmful solvent. The plasma can be cleaned deep into the small holes and depressions inside the object, so the shape of the object to be cleaned does not need to be considered too much. It can also handle all kinds of materials, especially for high temperature and solvent resistant materials. All these advantages make plasma cleaning widely concerned.   There are several kinds of plasma cleaning, mainly divided into chemical, physical and physical chemistry. For different cleaning objects, process gases such as O2, H2 and Ar can be selected for surface treatment.   1. Chemical reaction cleaning: Chemical reactions are carried out with highly active free radicals in plasma and organic substances on the surface of the material, also known as PE. Clean with oxygen to convert non-volatile organic compounds into volatile substances to produce carbon dioxide, carbon monoxide and water. It has the advantages of fast cleaning speed and better cleaning effect on organic pollutants. Its main disadvantage is that oxides can be reformed on the material surface. Oxide production is undesirable when lead bonding is used, but these disadvantages can be avoided by selecting proper process parameters.   2. Physical reaction cleaning: The atoms attached to the surface of the material are broken down by pure physical collisions with ions in the plasma, also known as sputtering corrosion (SPE). When cleaned with argon, the argon ions have enough energy to bombard the surface with enough force to remove any dirt. The macromolecules in the polymer were separated into small molecules by chemical bonds and evaporated by vacuum pump. During argon plasma cleaning, the microstructure of the material surface can be changed to make the material more "rough" at the molecular level, thus greatly improving its surface activity and binding performance. The advantage of argon plasma is that no oxide is left on the surface of the material. The disadvantages are excessive corrosion or reconcentration of pollutant particles in other undesirable areas, but these disadvantages can be controlled by adjusting process parameters.   3. Simultaneous cleaning of physical and chemical reactions: Both physical and chemical reactions play an important role in the reaction. For example, using Ar and O2 mixed gas online plasma cleaning process, the reaction rate is faster than using Ar and O2 alone. After argon ion acceleration, the kinetic energy generated can enhance the reaction capacity of oxygen ion, so physical and chemical methods can be used to clean the surface of heavily polluted material.

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Plasma cleaner effect verification evaluation test

Plasma cleaner effect verification evaluation test

It is well known that the surface of the material treated by the plasma cleaning machine will have some subtle changes, which we can not distinguish with the naked eye. So how do we tell if the plasma-treated sample has changed? In general, there are several commonly used methods for validating effectiveness evaluation tests. The first and most direct method is to use the plasma-treated sample directly for the next process. If it meets your requirements, the plasma cleaning machine is effective. Of course, if you can not meet the requirements of the next process, we can not conclude that the plasma cleaning machine processing material is invalid. However, the treatment effect is different. Plasma surface treatment is applicable to all materials in a sense, and the treatment effect is also affected by many factors. Here are three commonly used methods to judge the effect of plasma treatment:   Contact Angle/edge Angle verification: Contact Angle refers to the contact Angle between the droplet profile and the solid surface when observing the projection of a static droplet on a solid. By physical definition, surfaces with a contact Angle less than 90° are hydrophilic (wettable) and hydrophobic (non-wettable) when the contact Angle is greater than 90°. With plasma surface treatment, the contact Angle changes (becomes larger or smaller). Through the appropriate plasma process or in the plasma process process, the appropriate coating treatment. Hydrophilic surfaces convert to hydrophobic surfaces (hydrophilic coatings have the opposite effect).   Test ink verification: Measuring method for estimating surface energy: If the test ink is concentrated in one place after being painted on the surface, the solid surface energy is lower than the ink, and if kept wet, the solid surface energy is equal to or greater than the liquid surface energy. By using a series of test inks with a gradient surface energy, the total surface tension of the solid can be determined. However, this method cannot determine the polar and non-polar parts of the surface energy.   Grid cutting test verification: In order to check the adhesion of the coating, a mesh cutting test is performed. After painting, the paint layer of the plastic parts is cut into a mesh, then the standard tape is attached to the cutting mesh, the tape is secured, and then suddenly torn off. If there is paint on the tape, there is not enough adhesion. Cut the mesh to show the bonding strength of the paint coating on the plastic parts.

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Plasma automatic cleaning machine ion and ionization degree

Plasma automatic cleaning machine ion and ionization degree

In general, the basic particles of plasma consist of electrons, ions and neutral particles. Let the electron density be Ne, the ionic density be Nj, and the density of neutral particles be Ng. Obviously, for a plasma with a single atmosphere and only first-order ionization, Ne=Ni exists, and n can be used to represent the density of any charged ion in the two, abbreviated as plasma density. Of course, mixed gas plasma or plasma with multiorder ionization may contain different valence ions or different kinds of neutral particles, so the electron density and ion density in the equiionization body are not the same.   When α<0.01, it is called weak ionization plasma. When 1> α> is 0.01, it is called strongly ionized plasma. When α=1, it is called a fully ionized plasma. In thermodynamic equilibrium systems, where there is an equilibrium between ionization and ion recombination, ionization degree α depends only on the type, density, and temperature of the particles. The following table shows the variation of ionization degree α of nitrogen plasma with temperature under the condition of thermal equilibrium at atmospheric pressure. As can be seen from the table, with the increase of temperature, the ionization degree increases rapidly, but if you want to get the plasma automatic cleaning machine plasma ionization, it must reach tens of thousands of degrees of high temperature. Variation of nitrogen plasma ionization α with temperature at atmospheric thermal equilibrium. T/K α 300 10^-122 5000 3.2×10^-7 10000 0.0065 15000 0.22 20000 0.82   There is a equilibrium between ionization and recombination in plasma. If the equilibrium is reached at temperature T, the relationship between ionization degree α and ionization conditions can be described by the Equation of Saha (Mcghnad Saha, 1893~1956, Indian astrophysicist).   P stands for pressure (Torr, 1 Torr=1.333 22×10^2Pa); T is for temperature (K); W stands for ionization potential (eV) of gas molecules (atoms); K represents Boltzmann constant (1.380 6505×10^ -23j/k); Alpha stands for ionization. Lowering the gas pressure, using a gas with a low ionization potential, or using a high electron temperature all contribute to increased ionization.

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PCB plasma surface cleaning machine Printed circuit board processing technology

PCB plasma surface cleaning machine Printed circuit board processing technology

Plasma processing technology is a new semiconductor manufacturing technology. This technology has been applied in semiconductor manufacturing field earlier and is an essential semiconductor manufacturing process. Therefore, IC processing is a long - term and mature technology. Plasma is a kind of high-energy and highly active material, which has a good etching effect on any organic material, etc. The production of plasma is processed by dry method and will not cause pollution, so it has been widely used in the production of PCB printed circuit board in recent years.   With the application of plasma processing technology becoming more and more popular today, PCB manufacturing process mainly has the following functions:   (1) Activation treatment of ptFE materials: Anyone who has ever been engaged in the hole metallization of PTFE material has the experience that using the hole metallization method on the common FR-4 multi-layer printed wire circuit board is not successful in the hole metallization of PTFE. Among them, PTFE activation pretreatment before chemical copper sink is the biggest difficulty and also the key step.   In the activation treatment of PTFE material before chemical deposition of copper, there are many methods that can be adopted, but in general, the product quality can be guaranteed and there are two purposes suitable for mass production as follows:   A) Chemical processing method: Metal sodium and naphthalene, in the solution of non-aqueous solvents such as tetrahydrofuran or glycol dimethyl ether reaction, the formation of naphthalene - sodium complex, the sodium naphthalene treatment solution, can make the surface of the polytetrafluoroethylene atoms etch, thereby achieving the purpose of wetting the hole wall. This is a typical method with good effect and stable quality, which is most widely used at present.   B) Plasma treatment: This process is easy to operate, stable and reliable, suitable for batch production, using dry process production. The sodium - naphthalene treatment solution prepared by chemical treatment is difficult to synthesize, toxic, short shelf life, and needs to be prepared according to the production situation, with high safety requirements.Therefore, at present, the activation treatment of PTFE surface mostly adopts plasma treatment method, which is easy to operate and greatly reduces the treatment of wastewater.   (2) Erosion of hole wall/removal of resin drilling dirt on hole wall: For fr-4 multilayer printed circuit board processing, the removal of material such as resin drilling dirt, etc. after nc drilling is usually performed by concentrated sulfuric acid treatment, chromic acid treatment, alkaline potassium permanganate treatment and plasma treatment.   But, at the beginning of flexible printed circuit boards and flexible printed circuit board to remove the dirt on the processing of drilling, due to the difference of material properties, if the chemical treatment method is used, the effect is not ideal, and using plasma to remove dirt and pitting drilling, you can get a better hole wall roughness, is advantageous to the hole metallization plating, and also has a "three-dimensional" pitting connection properties.   (3) Removal of carbide: Plasma treatment not only has obvious effect on drilling pollution of various plates, but also shows its superiority in drilling pollution treatment of composite resin materials and microholes. In addition, due to the increasing demand for the production of multilayer printed circuit boards with high interconnect density, many drilling blind holes are manufactured using laser technology. This is a by-product of laser drilling blind hole applications -- carbon, which needs to be removed before the hole metallization production process. At this point, plasma processing technology does not hesitate to take on the task of removing carbon.   (4) Internal pretreatment: Due to the increasing production demand of printed circuit boards, the corresponding processing technology requirements are also higher and higher. The inner layer pretreatment of flexible PCB and rigid flexible PCB can increase the surface roughness and activation degree, increase the bonding strength between the inner layers, and also have important significance to improve the yield of production.   Plasma treatment process is a dry process, compared with the wet process has many advantages, these advantages are determined by the characteristics of plasma itself. The whole reactive neutral plasma from high voltage ionization has a high degree of activity, and can continuously react with the atoms on the surface of the material, so that the surface material is constantly excited into gas, volatilization, in order to achieve the purpose of cleaning. It has good practicability in the process of PCB printed circuit board production, and is a clean, environme

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