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On-line plasma cleaning equipment NH3 plasma characteristics and surface modification PAN ultrafiltration membrane

On-line plasma cleaning equipment NH3 plasma characteristics and surface modification PAN ultrafiltration membrane

On-line plasma cleaning equipment NH3 plasma characteristics and surface modification PAN ultrafiltration membrane: Polyacrylonitrile (PAN) is widely used in the separation and concentration of substances due to its good bacteria resistance, weather resistance and thermal stability. However, because the membrane material itself is hydrophobic, the surface of the PAN ultrafiltration membrane is relatively poorly hydrophilic, and it is easy to adsorb proteins and other macromolecules, resulting in a decrease in membrane flux. Plasma modification of low-temperature online plasma cleaning equipment is an effective way to solve this problem. A variety of polar groups are introduced on the surface of the membrane to improve the hydrophilicity and anti-fouling ability of the membrane. Using plasma surface modification of polypropylene microporous membrane, the contact angle is reduced from 100° of the original membrane to 40°, and the hydrophilicity is significantly improved. Plasma surface modified thin film composite membrane (TFC), after modification, the hydrophilicity of the membrane surface is improved, and the anti-fouling ability is significantly increased. When low-temperature plasma acts on the surface of the material, a series of complex physical and chemical processes are generated. Therefore, understanding the characteristics and characteristic parameters of plasma discharge is of great significance to the application of plasma technology in material modification. Using online plasma cleaning equipment NH3 plasma surface modification of PAN ultrafiltration membrane, with the increase of discharge power, the contact angle decreases, with the increase of power, the free radical reaction initiated on the membrane surface is more fully generated, The increase in the amount of polar groups increases the hydrophilicity of the membrane surface. The treatment time is appropriately increased, and the free electrons in the plasma gain kinetic energy, which accelerates the collision with the macromolecular chains on the surface of the membrane, attracts more polar groups, and significantly improves the hydrophilicity. The flux test of the original membrane and plasma modified membrane samples on the PAN ultrafiltration membrane shows that the flux is significantly increased compared with the original membrane, the hydrophilicity of the ultrafiltration membrane surface is significantly improved, and protein molecules are not easy to adhere to the membrane surface. Anti-pollution performance and penetration performance are also further improved. Although plasma modification changes the surface structure of the membrane, the etching effect is not obvious. After modification, the pore size of the membrane is reduced, which has a good interception effect on protein molecules larger than the pore size of the membrane. After the plasma modification of the low-temperature online plasma cleaning equipment, the flux decay rate of the polyacrylonitrile ultrafiltration membrane is reduced from 68% of the original membrane to 43%, because the plasma can trigger the radical reaction on the surface of the ultrafiltration membrane. Hydrophilic groups such as carbonyl group (C=O) and carboxyl group (-COOH) are generated, which can combine with surrounding water molecules to form a hydrophilic interface and reduce the deposition of protein on the membrane surface. Therefore, the decrease in flux attenuation rate indicates Plasma modification improves the anti-fouling ability of ultrafiltration membranes.

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Examples of surface modification of plastic, rubber, and silica gel made by Chengfeng Zhizhi Plasma Cleaner Brand

Examples of surface modification of plastic, rubber, and silica gel made by Chengfeng Zhizhi Plasma Cleaner Brand

Examples of surface modification of plastic, rubber, and silica gel made by Chengfeng Zhizhi Plasma Cleaner Brand: The energy of the particles in the plasma of the plasma cleaner is generally around a few to tens of electron volts, which is greater than the binding bond energy of polymer materials (a few to tens of electron volts), which can completely break the chemical bonds of organic macromolecules to form new bonds. Energy; but much lower than high-energy radioactive rays, only involves the surface of the material, does not affect the performance of the matrix. The electrons in the low-temperature plasma have high energy in a non-thermodynamic equilibrium state, which can break the chemical bonds of the surface molecules of the material and improve the chemical reaction activity of the material (stronger than the thermal plasma), and the temperature of the neutral particles is close to room temperature This provides favorable conditions for the surface modification of heat-sensitive high molecular polymers. The following is the plasma cleaning machine brand made by Chengfeng Zhizhi to explain the action process of plasma on various materials. Plasma cleaning machine performs surface modification treatment on plastic, silica gel and other materials: After low-temperature plasma surface treatment, the surface of the material will undergo many physical and chemical changes, or corrode roughness, or form a dense cross-linked layer, or introduce oxygen-containing polar groups to improve the hydrophilicity and adhesion, respectively. Properties, absorbability, biocompatibility and electrical properties. The results show that after plasma treatment of silicone rubber, N2, Ar, O2, CH4-O2 and Ar-CH4-O2 plasma can all improve the hydrophilicity of silicone rubber, and the treatment effect of CH4-O2 and Ar-CH4-O2 is better. Well, it will not degrade over time. Under suitable process conditions, using a low-temperature plasma cleaning machine to treat materials such as PE, PP, PVF2, LDPE, etc., can significantly change the surface morphology of the material, introduce a variety of oxygen-containing groups, and make the surface change from infinite and difficult to stick. In order to have a certain polarity, easy adhesion and hydrophilicity, it is conducive to the bonding, coating and printing of materials. Surface grafting using plasma technology: Plasma graft polymerization is used to modify the surface of the material, and a covalent bond is formed between the graft layer and surface molecules, which has good durability. The polyester fiber treated with glow discharge plasma is grafted and polymerized with acrylic acid. The water absorption performance of the modified polyester fiber is greatly improved, and its antistatic performance is also improved. The advantages of industrial application characteristics are simple process, convenient operation, fast processing speed, good treatment effect, low environmental pollution, and energy saving; Use plasma cleaning machine technology to modify plastic components to improve the wetting rate of plastics; Adopt plasma technology to reflect light on plastic window glass, car blinds, lamps, halogen sky lights, etc.; Polyester fiber is strong and durable, but has a compact structure, poor water absorption, and is not easy to dye. Low-temperature nitrogen plasma is used to initiate acrylamide graft modification to polyester fabric, so that the dye uptake and dyeing depth of polyester fabric after grafting can be improved. The hydrophilicity is significantly improved; Plasma cleaner surface treatment for medical materials can introduce amino groups, carbonyl groups and other groups, and the grafting reaction of biologically active substances with these groups can be fixed on the surface of the material; Industrial: assembly bonding, camera module, headset bonding, mobile phone back cover baking, mobile phone cover processing. Display industry: TP patch. Bonding in the automotive industry: car lights, steering wheels, EPDM seals, windshields, automotive electronics, automotive decorative parts. Connection industry: character printing. Home appliances: glue dispensing, silk screen printing, and coding. New energy sources: lithium batteries, coding, assembly and bonding. Watch industry: bonding and inlaying. Plastic industry: surface activation, bonding, silk screen printing. Metal industry: gold plating, silver plating, soldering, removal of residual organic matter. Glass industry: coating, printing ink, coating, and pasting. The above is the 20 years of Chengfeng Zhizhi plasma cleaning machine brand to explain the application of different materials in different industries, if you have any questions, please feel free to consult, Chengfeng Zhizao is waiting for your call.

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Process treatment of vacuum plasma cleaning equipment for surface treatment of materials in 10 major fields

Process treatment of vacuum plasma cleaning equipment for surface treatment of materials in 10 major fields

Process treatment of vacuum plasma cleaning equipment for surface treatment of materials in 10 major fields: The main functions of the vacuum plasma cleaner are: 1. Clean the surface of the sample and treat it with surface activation to improve the hydrophilicity of the sample. 2. The surface activation treatment is performed on it, and the sample can achieve hydrophobic effect by adding special gas and processing technology. 3. The dual gas channels and multiple gas channels can be controlled separately. Performance characteristics of vacuum plasma cleaner: 1. Cleaning of organic pollutants on metal, glass, silicon wafer, ceramics, plastics, and polymer surfaces (such as paraffin, oil stains, release agents, proteins, etc.). 2. Changes to the surface properties of materials. 3. It can activate the surface of materials, such as glass, plastic, ceramics, and enhance the adhesion, compatibility and wettability of these materials. 4. Remove the oxide on the metal surface. The advantages of vacuum plasma cleaners: 1. This machine has stable performance, high cost performance, simple operation, extremely low use cost, and convenient maintenance. 2. Ultra-clean modification can be performed on the surface of various geometric shapes and different surface roughness objects such as metals, ceramics, glass, silicon wafers, plastics, etc. 3. Thorough removal of organic contaminants on the sample surface. 4. Regular processing, fast processing, and efficient cleaning. 5. Environmentally friendly, no chemical solvents are used, no secondary pollution to samples and the environment. 6. Non-destructive treatment of samples under ultra-clean conditions. Application areas of surface treatment of vacuum plasma cleaner products: 1. Ultra-clean optical components, electronic components, semiconductor components, laser devices, coated substrates, terminal installations, etc. 2. Clean various lenses, such as optical lenses, electron microscopes, etc. 3. Remove the photoresist material on the surface of optical components and semiconductor components, and remove the oxide on the surface of metal materials. 4. Clean semiconductor components, printed circuit boards, ATR components, artificial crystals, natural crystals, and gems. 5. Clean the biochip, microfluidic chip, and deposit gel on the substrate. 6. Cleaning and modifying in the packaging field to enhance its adhesion, suitable for direct packaging and adhesion. 7. Improve the adhesion of adhesives to optical components, optical fibers, biomedical materials, aerospace materials and other materials. 8. In the field of coating, the surface of glass, plastic, ceramics, polymers and other materials are modified to activate them to enhance the adhesion, wettability and compatibility of the surface, which can significantly improve the quality of the coating. 9. The surface pretreatment of titanium implants and silicone molding materials improves the wettability and compatibility of the materials. 10. In the medical field, the surface of prosthetic grafts and biological materials are pretreated to improve their infiltration, adhesion and compatibility.

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The five advantages of Chengfeng Zhizhi plasma cleaning equipment are reflected

The five advantages of Chengfeng Zhizhi plasma cleaning equipment are reflected

The five advantages of Chengfeng Zhizhi plasma cleaning equipment are reflected: Chengfeng Zhizhi plasma cleaning equipment can be used for nano-level surface cleaning and sample activation. It is a small, non-destructive ultra-cleaning equipment. The plasma cleaning equipment uses gas as the cleaning medium, which effectively avoids the secondary pollution caused by the liquid cleaning medium to the objects to be cleaned. In addition to the super-cleaning function, the plasma cleaning equipment can also change the surface properties of certain materials as needed under special conditions: plasma acts on the surface of the material to recombine the chemical bonds of surface molecules to form new surface characteristics. For some special-purpose materials, the glow discharge in the ultra-cleaning process not only enhances the adhesion, compatibility and infiltration of these materials, but also can be sterilized. Chengfeng Zhizhi plasma cleaning equipment has a wide range of applications in the fields of optics, optoelectronics, electronics, materials, life sciences, polymer sciences, biomedicine, and microfluidics. The main advantages of Chengfeng Zhizhi plasma cleaning equipment are: 1. If you use a plasma cleaning machine to clean the items, the items will remain in a dry state after the cleaning is completed, so you don’t need to send the items directly to the next process during the drying process, which is still very convenient and greatly improved Improve the efficiency of the entire assembly line. 2. In addition, the plasma cleaning equipment allows employees to operate remotely, so employees' safety issues can also be avoided. 3. Due to the use of high-frequency plasma, it can penetrate deep into the object to complete the corresponding cleaning task. Compared with the general cleaning machine, it still has great advantages. No matter what shape the object is, it can be cleaned. , And the cleanliness is also very good. 4. Use it to clean the surface of the material. Generally, there is no need to transport and discharge the cleaning liquid, so it also guarantees the environmental protection of the cleaning environment to a large extent. In addition, it also saves a certain amount of handling and post-processing to a certain extent. Human and material resources. This will further improve the cleaning efficiency of the overall items. 5. The plasma cleaning equipment made by Chengfeng Zhizhi is a brand new high-tech, which uses plasma to achieve effects that cannot be achieved by conventional cleaning methods. It uses the properties of these active components to perform surface treatment on the sample, so as to achieve the purpose of cleaning, coating, modification, and photoresist ashing.

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What are the steps involved in the wet etching system

What are the steps involved in the wet etching system

What are the steps involved in the wet etching system: The wet processing system provides a controllable chemical dripping capability, which further enhances the ability to remove particles from the surface of the substrate. At the same time, both SWC and LSC have a drip test system, which can greatly save the amount of chemical reagents. The dispensing system supports programmable chemical reagent mixing capabilities to control the distribution of chemical reagents on the entire substrate. Provides high repeatability, high uniformity and advanced megasonic cleaning, megasonic assisted photoresist stripping, and wet etching system. Wet etching is a commonly used chemical cleaning method. Its main purpose is to correctly copy the mask pattern on the surface of the silicon wafer to the glued silicon wafer, so as to protect the special area of ​​the silicon wafer. Since the start of semiconductor manufacturing, silicon wafer manufacturing has been closely related to wet etching systems. The current wet etching system is mainly used to remove residues, float to remove silicon, large-scale pattern etching, etc. It has the advantages of simple equipment, high material selection ratio, and less damage to devices. The wet etching process has the advantages of low temperature, high efficiency, and low cost. During the wet etching process, the phosphosilicate glass and metal ions on the silicon wafer can be effectively removed, and the passivation and cleaning can be completed at one time to remove impurities. Thereby improving the use efficiency of silicon wafers. The wet etching system is an etching method that peels off the etched object through a chemical reaction between a chemical etching solution. Most wet etching systems are isotropic etching that is difficult to control. Features: Strong adaptability, uniform surface, little damage to silicon wafers, suitable for almost all metals, glass, plastics and other materials. Disadvantages: The fidelity of the drawing is not ideal, and the drawing minimum line is difficult to grasp. Wet etching is a technique in which etching materials are immersed in an etching solution for etching. In short, it is the concept of chemical solution etching in middle school chemistry class. It is a pure chemical etching with excellent selectivity. It stops after etching the current film without destroying other materials below. film. Semiconductor wet etching systems are all isotropic etching, so for the etching of the oxide layer and the metal layer, the width of the horizontal etching is close to the vertical etching depth. In this way, the pattern on the upper photoresist and the pattern on the lower material will have a certain deviation, so that the work of pattern transfer and replication cannot be completed with high quality. Therefore, as the feature size decreases, in the process of pattern transfer Basically no longer used.

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The characteristics of the monomer selective solvent effect of plasma-initiated polymerization of plasma activation machine

The characteristics of the monomer selective solvent effect of plasma-initiated polymerization of plasma activation machine

The characteristics of the monomer selective solvent effect of plasma-initiated polymerization of plasma activation machine: The decaying chain transfer (DT) polymerization of iodine transfer is achieved by adding a chain transfer agent containing iodine to the polymerization system to establish a reversible chain transfer balance between free radicals and iodine, thereby achieving the purpose of controlled/living free radical polymerization. DT polymerization has obvious advantages, including easy access to chain transfer agents, wide adaptation of monomers, low requirements for polymerization conditions, and diversified polymerization methods. Iodoforms such as iodoform, ethyl iodoacetate, and iodoacetonitrile have been used in DT controlled/living polymerization as chain transfer agents. The active species of plasma-initiated polymerization by plasma activation machine can be terminated by conventional free radical polymerization inhibitors, and the sequence structure of random copolymers is also similar to ordinary free radical copolymers, so it is generally believed that they follow the free radical polymerization mechanism. However, plasma-induced polymerization has unique phenomena, such as long-lived active species, solvent effects, monomer selectivity, and monomer concentration dependence of the maximum polymerization rate. These characteristics cannot be explained by traditional free radical polymerization theory. . The structure of plasma-initiated polymerization active species has the viewpoints of ionic radicals, diradicals and cations. The PP film is treated with Ar plasma, the plasma active species generated on the surface can initiate the polymerization of vinyl monomers, and follow the free radical polymerization mechanism. Exposing the PP film treated by the plasma activator to the air, the free radicals on the surface of the film will immediately react with oxygen to generate peroxide, and the peroxide initiates polymerization into a classic free radical polymerization. Introducing alkyl iodide into plasma and peroxide initiation system can realize DT controllable/living polymerization. There are active species on the surface of the PP film of the plasma initiation system of the plasma activation machine and the plasma atmosphere. In the peroxide initiation system, due to the homolysis of the peroxide, the free radicals on the surface of the PP film will also be easily Into the solution, the polymerization system will simultaneously undergo PP surface graft polymerization and solution polymerization. In RAFT graft polymerization, the surface of the carrier has the same activity as free radicals in the solution. Therefore, it can be considered that the molecular weight of PAAc grafted on the surface of the PP film is equivalent to the molecular weight of PAAc in the solution. Because the graft polymerization is a heterogeneous reaction, the graft polymerization rate on the surface of the PP film is much lower than the polymerization rate in the solution. Therefore, it can be speculated that the molecular weight of the PAAc chain grafted on the surface of the PP film will also be much smaller than the PAAC obtained in the solution polymerization. Homopolymer molecular weight. The monomer selectivity and solvent effect of the plasma-initiated polymerization of the plasma activation machine cannot be explained by the classic free radical polymerization mechanism, which indicates that the active species in the plasma-initiated system is an "atypical" free radical. The difference in polymerization behavior indicates that ordinary free radicals are easier to combine with iodoform into the controllable state of DT polymerization than plasma active species. For peroxide and plasma-initiated DT polymerization, the grafting amount is directly proportional to the molecular weight, indicating that the chain length of the grafted chain or the size of the grafting amount can be easily adjusted by controlling the polymerization time. This behavior is for porous The graft modification of the membrane surface is of great significance. The contact angle of the grafted surface of DT polymerization initiated by plasma and peroxides continued to decrease with the increase of the grafting amount. This is due to the increase of hydrophilic carboxyl groups on the surface. The contact angle curve of the former is obviously lower than that of the latter, indicating that the longer PAAc graft chain under the same graft amount is more conducive to the reduction of contact angle. In plasma DT polymerization kinetics treatment, the surface grafting amount of PP film is proportional to the polymer molecular weight. At the same time, as the grafting amount increases, the surface contact angle also gradually decreases.

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