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Atmospheric pressure plasma processor for processing metal material welding and surface oil pollution application

Atmospheric pressure plasma processor for processing metal material welding and surface oil pollution application

 Atmospheric pressure plasma processor for processing metal material welding and surface oil pollution application: Atmospheric pressure plasma treatment machine is a type of plasma treatment machine. Due to its own characteristics, it has a wide range of applications in the treatment of many materials, such as electronics, textiles, plastics, polymers, etc., to obtain ideal plasma surface treatment effect. But for the treatment of metal materials, such as aluminum, copper, steel and other materials, atmospheric pressure plasma treatment machines also have great industrial application value. Improving the welding effect and removing surface oil are two application directions. 1. Atmospheric pressure plasma processor is used to improve the welding effect of the weld joint: In general, if you need metal materials to achieve a certain welding quality, you can clean the weld before welding, such as wiping with artificial cotton cloth, cleaning with detergent, etc., but the above methods often fail to achieve the ideal welding effect or Environmental protection requirements, after the introduction of atmospheric pressure plasma cleaning machine, the surface treatment is more clean and thorough, and the welding effect is better. 2. Remove oil and other substances on the surface of metal wires: The surface treatment of metal materials by atmospheric pressure plasma treatment machine can remove nano-scale oil, oxide, scale and other substances on the surface of the material. Because atmospheric pressure plasma cleaning machine has the advantages of high efficiency and easy operation, it is more commonly used in this regard. For the processing of wires, DBD atmospheric dielectric barrier atmospheric plasma processing machine can be used for processing.

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Process optimization of plasma cleaning in IC packaging process of plasma industrial cleaning machine

Process optimization of plasma cleaning in IC packaging process of plasma industrial cleaning machine

Process optimization of plasma cleaning in IC packaging process of plasma industrial cleaning machine: IC packaging forms vary widely and are constantly evolving, but the production process can be roughly divided into more than a dozen stages, such as wafer cutting, wire bonding in the chip placement rack, and sealing and curing. Only the packaging that meets the requirements can be put into practical application. , Become a terminal product.  The quality of packaging will directly affect the cost and performance of electronic products. In IC packaging, about 1/4 device failures are related to contaminants on the surface of the material. How to solve the contaminants such as micro particles and oxide layers in the packaging process , Improving the quality of packaging has become particularly important. The problems in IC packaging mainly include solder delamination, virtual soldering or insufficient wire bonding strength. The culprit of these problems is the pollutants on the lead frame and chip surface, mainly microparticle pollution, oxide layer, organic residues, etc. These existing contaminants make the wire bonding between the chip and the frame substrate incomplete or there is a false solder. Plasma industrial cleaners mainly use active plasma to physically bombard the surface of the material or chemical reactions and other single or dual effects, so as to achieve the removal or modification of contaminants at the molecular level of the surface of the material. Plasma cleaners are effectively used in the IC packaging process to effectively remove organic residues, microparticle contamination, and thin oxide layers on the material surface, improve the surface activity of the workpiece, and avoid bonding delamination or virtual welding. The application of plasma industrial cleaning machines and processes in the field of IC packaging will become more and more extensive, and with their excellent performance, they will become a key production device in the field of IC packaging in the 21st century, and become a means of improving the yield and reliability of products in the mass production process. Important technological measures will be indispensable in the future. The cleaning technology of plasma industrial cleaning machines will also continue to develop and expand the scope of application. As far as the current situation is concerned, it is imperative to promote its process technology to the LED packaging and LCD industries.

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Application in surface treatment of plasma equipment for processing metal materials

Application in surface treatment of plasma equipment for processing metal materials

Application in surface treatment of plasma equipment for processing metal materials: When processing metal materials, plasma equipment can change the inherent surface mechanical properties of metal materials, improve various properties of metal materials, such as wear resistance, corrosion resistance, etc., and improve adhesion. What aspects of metal materials can plasma equipment specifically solve? Removal of oil stains and other dirt on the surface of metal materials by plasma equipment: Plasma cleaning technology is used to process metal materials, which can make the surface of metal materials easy to adhere to residues such as oil stains and oxides. Plasma treatment can remove contaminants and oil stains on the surface of various metal materials to form a clean surface. Plasma equipment improves the adhesion and welding strength between metal and other materials: It can react with the metal surface at nanometer level, and through the physical bombardment of particles and molecular chemical reaction, the metal surface becomes micro-rough and clean, thereby improving the adhesion and welding strength between the surface of the metal material and other materials. It helps to improve the effect of subsequent bonding, spraying, printing, and welding, and can remove static electricity on the surface of the material. Plasma equipment can improve the corrosion resistance and wear resistance of metal surfaces: Plasma surface treatment is used to cover the metal surface with a layer of anti-corrosion material to prevent the metal material from contacting external water molecules and acid-base substances, thereby improving the anti-corrosion ability of the metal material surface. In addition, in the printed circuit board industry, plasma is also required to remove the chemical flux used in soldering, otherwise this substance is prone to corrosion. Similar to the improvement of anti-corrosion ability, the improvement of metal surface hardness and wear resistance also form a layer of substance on the metal surface, which improves the hardness and wear resistance, making it harder and more wear-resistant. Processing of plasma equipment for metal special-shaped parts: Plasma equipment will inevitably encounter some special-shaped parts when surface treatment of metal materials. Its surface treatment has good diffusion and unevenness, high treatment efficiency and good uniformity, which is suitable for most metal specifications Batch processing of special-shaped parts.

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What is the difference in the dry treatment of the plastic material surface of the plasma cleaning instrument equipmen

What is the difference in the dry treatment of the plastic material surface of the plasma cleaning instrument equipmen

What is the difference in the dry treatment of the plastic material surface of the plasma cleaning instrument equipment: Compared with the earlier polishing and water-based paint treatments, the surface treatment of rubber and plastic materials usually adopts wet treatment and plasma cleaning equipment dry treatment. The wet treatment is mainly processed by chemical reagents and solvents. The surface of the material, and the plasma cleaner equipment is a typical dry treatment method, which does not require solvents and chemicals. What is the difference between these two methods? Wet processing generally uses chemical agents to treat materials to improve the effects of processes such as plastic-plastic material bonding. However, chemical agents are difficult to operate and difficult to control during use. They may damage the materials and affect the performance of the materials. The entire processing process still needs Consume a lot of water resources and produce wastewater pollution. The content of the surface treatment method of plasma cleaning equipment is not repeated here. You can refer to the previous related articles. With the application of low-temperature plasma surface treatment technology, the types of materials selected in the rubber and plastic industries are also increasing. , Not only PP, PC, ABS and other materials, but also various elastomers and composite materials are also widely used. The drying treatment of the plasma cleaner equipment can make the surface of the material rough, and introduce active groups on the surface of the material to increase the surface energy and improve the effects of printing, bonding, coating, etc. The dry treatment technology of plasma cleaner equipment has been promoted and developed under the current market and policy environment. The reason is not only that the technology can meet many high-standard process requirements, but also because the surface treatment is simple to operate on rubber and plastic materials. The treatment effect is good, the treatment efficiency is high, the operating cost is low, and no harmful substances are generated before and after treatment.

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Application of packaging plasma cleaning machine manufacturer's technology in microelectronic packaging

Application of packaging plasma cleaning machine manufacturer's technology in microelectronic packaging

Application of packaging plasma cleaning machine manufacturer's technology in microelectronic packaging: Chengfeng Zhizhi plasma cleaning machine manufacturer equipment is widely used in metal, microelectronics, polymers, biological functional materials, low-temperature sterilization and pollution control and other fields. It is an ideal equipment for plasma surface treatment of enterprises and scientific research institutes. In the production process of microelectronic packaging, due to various fingerprints, fluxes, cross-contamination, natural oxidation, devices and materials will form various surface pollution, including organic matter, epoxy resin, photoresist and solder, metal salt, etc. These stains will have a significant impact on the packaging production process and quality. The use of encapsulated plasma cleaning machine can be easily removed through the formation of contamination in the molecular-level production process, ensuring that atoms and atoms are in close contact with the surface of the workpiece, thereby effectively improving the bonding strength, improving the quality of wafer bonding, and reducing leakage Rate, improve packaging performance, output and component reliability. The choice of plasma cleaning process in microelectronic packaging depends on the requirements of subsequent processes on the surface of the material, the original characteristic chemical composition of the surface of the material and the nature of the primer. Commonly used in plasma cleaning gas argon, oxygen, hydrogen, carbon tetrafluoride and their mixed gases. The choice of plasma cleaning technology application. Small silver glue village bottom: Pollutants will cause the colloidal silver to be spherical, which is not conducive to chip sticking, and it is easy to stab the chip. The use of radio frequency plasma cleaning can greatly improve the surface roughness and hydrophilicity, which is beneficial to silver glue and tile sticking. Chips, while using the amount can save silver glue and reduce costs. Bow-wire bonding: Before the chip is bonded to the substrate and after high-temperature curing, the existing contaminants may contain microparticles and oxides. The physical and chemical reactions of these contaminants are lead and the bonding between the chip and the substrate is incomplete and the bonding strength is poor. , Adhesion is not enough. Before wire bonding, radio frequency plasma cleaning can significantly increase the surface activity and increase the bonding strength and tensile strength of the bonding wire. The pressure on the welding head can be low (when there are contaminants. The welding head penetrates the contaminants, more pressure is required), and in some cases, the bonding temperature can also be lowered, thereby increasing production and reducing costs. Gluing: In the epoxy resin process, pollutants will cause high foaming rate, resulting in low product quality and service life, so in order to avoid problems in the formation of the sealing foam. After cleaning the high daughter body such as radio frequency, the bonding of the chip and the substrate with the colloid will be closer. The foam formed will be greatly reduced, and the heat dissipation and light emissivity will be significantly improved.

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The influence of plasma treatment on the surface hydrophilicity of graphite film

The influence of plasma treatment on the surface hydrophilicity of graphite film

The influence of plasma treatment on the surface hydrophilicity of graphite film: Graphite film is a new type of heat dissipation material that has emerged in recent years, and its horizontal direction has an ultra-high thermal conductivity. However, because the graphite film has a layered crystal structure, there is van der Waals force between the layers, which makes the vertical thermal conductivity of the graphite film poor, and even has a certain heat insulation effect, which seriously affects the heat dissipation performance of the graphite film. Graphite film/metal matrix composite materials, by using the excellent thermal conductivity of metal materials, effectively make up for the shortcomings of the graphite film’s poor thermal conductivity in the vertical direction. At present, the main preparation method is to magnetron sputter copper and other metal films on the surface of the graphite film. Or use a rewinder to composite the graphite film, thermal conductive glue and metal materials into a composite shape. The use of magnetron sputtering to prepare graphite film/metal matrix composites is expensive and energy-consuming, making it difficult to achieve large-scale material preparation and continuous production. The graphite film/metal composite heat sink is prepared by a rewinder. Because the metal plate used in this method is thick and the thermal performance of the middle thermal conductive adhesive layer is poor, the heat dissipation performance is seriously affected. Due to the smooth surface and strong hydrophobicity of the graphite film, the interface performance between the graphite film and the metal film is poor, and the bonding force between the graphite film and the metal film is very weak. Therefore, how to improve the hydrophilicity of the graphite film is a key issue to enhance the bonding force between the graphite film and the metal coating. After the graphite film is plasma treated, the surface is etched and oxygen-containing polar groups are introduced. The plasma treatment significantly improves the hydrophilicity of the graphite film surface. Plasma modification only occurs on the surface of the material. It can fully improve the surface properties of the material without changing the inherent properties of the material. It is a simple, clean, efficient, energy-saving and environmentally-friendly surface modification method. The surface of the graphite film before and after plasma treatment contains C and O elements, but according to the molecular structure of the graphite film, it is impossible for the untreated graphite film to contain oxygen. However, the full scan reveals that the graphite film contains trace amounts of oxygen. The graphite film is in the atmosphere before XPS, and impurities or water vapor in the air are adsorbed on the surface of the graphite film, thereby introducing oxygen. After plasma treatment, oxygen-containing functional groups such as hydroxyl and carboxyl groups were introduced, resulting in a significant change in the chemical composition of the graphite film surface. The C atom number fraction decreased from 98.37% before the treatment to 83.13%, and the O atom number fraction was changed from that before the treatment. 1.63% increased to 16.87%, and the O/C content ratio increased from 1.66% before treatment to 20.29%. The introduction of these oxygen-containing groups is one of the reasons for the increased hydrophilicity of the graphite film surface. The peel strength of copper-plated samples decreases with the increase of the contact angle of water droplets on the surface of the graphite film, which can qualitatively indicate that the hydrophilicity of the graphite film surface is better after plasma treatment, and the copper plating layer electrodeposited on the graphite film is more The stronger the bonding force of the substrate. On the graphite film without plasma treatment, the bonding force of the electrodeposited copper coating is very weak. There are two mechanisms by which plasma treatment can improve the bonding force between copper and graphite film. First, plasma treatment of the graphite film will cause a large number of carboxyl and hydroxyl groups on the surface. These oxygen-containing functional groups significantly enhance the hydrophilicity of the graphite film surface. When copper is electrodeposited on the surface of the graphite film, the copper reacts with the oxygen in the carboxyl group or the hydroxyl group to form a Cu-O bond, which can enhance the bonding force between the copper and the substrate. Second, the plasma treatment makes the surface of the graphite film rough, and the surface roughness of the material has a good effect on improving the adhesion of the coating. The bonding force between the graphite film and the copper plating layer can be qualitatively characterized by the hydrophilicity of the graphite film surface. The better the hydrophilicity of the graphite film surface, the stronger the bonding

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