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Plasma manufacturers introduce the potential application of germanium in integrated circuits and its etching method (II)

Plasma manufacturers introduce the potential application of germanium in integrated circuits and its etching method (II)

From the point of view of the author, the use of highly active etching gas seems to be more critical, both the increase of chlorine gas and the use of CHF3 will accelerate the etching of metal components. However, the impact of bombardment bias is not the key, except for the difference of key size, the difference of morphology under high and low bias pressure is not obvious. It can be seen that the further increase of chlorine gas flow will accelerate the formation of the bottom adducted morphology of the germanium alloy side etching, which also indicates that the highly active chemical etching gas is more effective for germanium etching without losing too much photoresists, so as to ensure the effect of side wall profile curve. The other is mainly fluorinated gas etching, the main etching agent is CF4, the product is more volatile GEF4. We can get very smooth shapes. Adding oxygen can adjust the selection ratio of germanium to its alloy, and the ratio is up to 434. This is important because the multilayer structure of germanium is generally epitaxial, and the induced layer and interlayer structure are generally germanium alloy materials. The selection of high ratio process can better control the etching of such multilayer structure. We know that CF4 is also a highly reactive chemical etching gas. From the effect, adding oxygen to CF4 has a higher etching selection ratio, because oxygen is more likely to react with the underlying material (SN) to form a protective surface film, preventing further etching and improving the selection ratio. It seems that the morphology of the CF4 etching is also better, but the advantage of chlorine etching is low damage, and it is good for the interface layer and channel layer. Both chlorine-based and fluorine-based germanium etching are common processes at present, which have achieved good results and have been applied in device manufacturing respectively. Another less common class of germanium is etched using XEF2 gas.

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Plasma surface treatment equipment manufacturers - mechanical properties of nanomaterials

Plasma surface treatment equipment manufacturers - mechanical properties of nanomaterials

Grain Boundaries and Defects in Nano (Micro/Nanomechanics) : Nano solid materials are three-dimensional block-like materials that consist of particles with particle sizes ranging from 1 to 100nm. The basic composition of nano solid materials (Micro/Nanomechanics) is the interface between nanoparticles and particles. Interfaces in physics do not refer to geometrical interfaces, but to a thin layer (micro-nano mechanics) whose surfaces have different properties from the substrates on either side. All interface phenomena exist because the atoms at the interface of an object are stressed differently from the atoms inside it, and therefore their energy states are different. In conventional coarse-grain materials, grain boundaries are only surface defects. For nanomaterials (micro-nano mechanics), grain boundaries are not only surface defects, but more importantly, a unit that constitutes nanomaterials (micro-nano mechanics), namely grain boundary unit. Nano - solid materials (micro - nano mechanics) have become one of the basic structures and have an impact on the special properties of nano - solid materials. Gleiter proposed in 1987 that the arrangement of atoms on the interface of nanometer micrograins is neither long-range ordered nor short-range ordered, but has a highly disordered gas-like structure. It is believed that the interface of nanomaterials (micro-nano mechanics) is arranged in an orderly manner, which is not different from that of coarse-grained structures. However, further studies show that the ordering of the atomic arrangement of interface elements is local and conditional, which mainly depends on the spacing of interface atoms and the size of particles. If the arrangement of atoms is locally ordered, the arrangement of interface tuples is reversed and disordered. The atomic structure of the grain boundaries of nanomaterials (micro-nano mechanics) is difficult to unify with a single model. Nevertheless, we still believe that the grain boundary structure of nanomaterials (micro-nano mechanics) is not fundamentally different from that of ordinary coarse grains. The shortcoming is that the actual crystal structure deviates from the ideal region. In the nanomaterial structure, the translation period is seriously damaged, the interfacial atomic arrangement is disordered, and the atomic coordination number is not complete, which leads to the increase of interfacial defects. In addition, the lattice constant increases or decreases after the nanometer powder is extruded into blocks, and the change of lattice constant increases the defect. The above is the plasma surface treatment equipment manufacturers on the mechanical properties of nanomaterials, I hope to help you.

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How many intermediate relays are needed for vacuum plasma cleaning machine

How many intermediate relays are needed for vacuum plasma cleaning machine

As long as you have a little basic knowledge of power circuit, you should know the role of the intermediate relay, it is a power circuit control element, how many vacuum plasma cleaning opportunities? Let Xiaobian explain for you. The relay is composed of stator transformer core, moving transformer core, spring, moving contactor, static contactor, electromagnetic coil, plug pins, terminal board and plastic shell. Basic is similar to the action principle of intermediate relay contactor, in vacuum plasma cleaning machine control circuit, and ac contactor is different: ac contactor main breaker can carry on the operation according to the large current, and the intermediate relay circuit breaker can only be operated according to the low current, therefore, the intermediate relay contactor has certain ability to work on load, when the load capacity is small, can change the small ac contactor to intermediate relay. The use of intermediate relay to control the control loop of vacuum plasma cleaning machine, not only can have the operation target, but also can save indoor space, so that the vacuum plasma cleaning machine power control part looks more concise and beautiful. In control circuit, the intermediate relay mainly ACTS as middle data signals, complete the self-locking interlock of intermediate data signals, the advantages of vacuum plasma mechanical pump and diaphragm valves in the middle of the relay would play a self-locking interlock function, when the mechanical pump stop working, diaphragm valve will automatically shut down completely, to avoid vacuum pump failure occurs, due to reasons such as error, introduce the oily be soiled, cause the pollution of mechanical pump and internal goods. Vacuum plasma cleaning machine uses general eight intermediate relays (specific needs to see the actual demand to decide), is a large number of electronic components in the control loop of vacuum plasma cleaning machine. In the control loop of the vacuum plasma cleaning machine, although the size of the intermediate relay is small, it plays a key role in the operation part of the whole plasma cleaning machine. The eight intermediate relays in the control loop are indispensable. In order to ensure the reliability and service life of the vacuum plasma cleaning machine to get customer satisfaction, some manufacturers with better brand image will adopt the intermediate relay with better quality.

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Mechanical structure and function of on-line plasma cleaning machine system equipment

Mechanical structure and function of on-line plasma cleaning machine system equipment

As a kind of precision dry cleaning equipment, plasma cleaning machine can effectively remove pollutants in the process of IC packaging, improve the surface performance of materials, and increase the surface energy of materials. Compared with the traditional independent plasma cleaning equipment, the online plasma cleaning equipment has high degree of automation, high cleaning efficiency, high equipment cleanliness, wide application range, and is suitable for large-scale fully automated production. Plasma cleaning technology has the advantages of low cost, easy to use, low maintenance cost and environmental protection. It can be used for surface treatment before chip bonding process, lead bonding and flip chip packaging process. With the deep research and wide application of plasma cleaning technology in the world, the demand for plasma cleaning equipment increases exponentially. However, plasma cleaning is still in its infancy in China. Many companies use plasma cleaning machines are basically imported from abroad. Under the monopoly of developed countries, the price of plasma equipment is relatively high. Therefore, the use of the existing mature plasma cleaning technology and equipment manufacturing base, increase equipment automation function, combining the development of conventional plasma cleaning equipment, reference of foreign equipment structure form, the fully automatic cleaning operation mode that adapted to the integrated circuit module, suitable for mass production of integrated circuit online cleaning equipment, is of great significance. The system on the basis of the mechanical structure of the plasma cleaning system, with reference to separate plasma cleaning, using automatic operation mode, can be linked to upstream and downstream production process, satisfy the requirement of the device packaging industry for mass production, thoroughly remove tiny residue and dirt particles size less than 1 um organic film, greatly improve the surface performance, improve the reliability of the welding, encapsulation, bonding and so on the follow-up process, to ensure that electronic products in the bad environment under the condition of high precision, high reliability. As a kind of precision dry cleaning equipment, on-line plasma cleaning equipment can effectively remove contaminants and improve the surface properties of materials. It has the advantages of high automation, high cleaning efficiency, high cleanliness of equipment and wide application range. On - line plasma cleaning equipment is on the basis of mature plasma cleaning technology and equipment manufacturing, increase the automatic loading and unloading function, material transfer function and other functions. The key is the lead frame in the IC package of pre-treatment cleaning, glue packaging, chip bonding, plastic sealing. While greatly improving the bonding performance and bonding strength, it can avoid the secondary contamination caused by human factors that contact the lead frame for a long time, and the chip damage that may be caused by batch cleaning in the cavity for a long time. The scheme basically meets the design requirements of automatic material handling in on-line plasma cleaning system. Compared with the traditional plasma cleaning system, it reduces the overcost of manual operation and improves the automation level of the equipment.

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Plasma cleaning machine for mechanical equipment manufacturing surface treatment application

Plasma cleaning machine for mechanical equipment manufacturing surface treatment application

Machinery and equipment often give the impression that they only appear in the workplace such as the production shop, the construction site and so on, and seem to have no direct connection with our daily life. Have you ever taken an elevator in a shopping center? Have you ever heard of the "hum" of residential weeding? Have you ever seen the grinding equipment used in decoration room to cut aluminum alloy and other metals? If you think about it, the members of this family of mechanical devices are all around us. However, the problem is that they do not seem to have anything to do with plasma cleaning machine surface treatment. In fact, they have a lot of connections. Next, I will explain what applications there are. 1. Bonding the parts of the weeder and surface treatment before potting Because the weeding machine vibration at work constantly, metal friction will produce a lot of heat, so the weeding machine structure, such as pieces of fasteners and function of reliability and safety of the demand is higher, usually in the glue or potting before these plastic, metal materials and other accessories for plasma surface treatment, is of great help to improve the quality of products. 2. Plasma surface treatment before assembly of lift components and bonding of environmental protection materials The operation of the lift involves the safety of people and property, so it is necessary to ensure the safety, reliability and stability of the relevant facilities. Plasma surface treatment technology can remove the release agent and organic pollutants of plastic, rubber, glass, metal and other materials. Plasma cleaning machine can improve the bonding performance between various environmental protection materials, and provide a strong guarantee for the surface bonding, sealing and other quality. 3. Plasma surface treatment before processing of grinding and cutting equipment accessories. In the research and development of advanced metal abrasive cutting products, plasma cleaning machine commonly used by plasma surface treatment process to improve the cleanliness of metal material surface, and can activate the metal surface, increase its bond strength with synthetic resin, synthetic diamond and the whole of the metal body tightly bonding, to ensure the durability and reliability of the product. 4. Plasma surface treatment before mechanical equipment communication cable printing, inkjet, potting and bonding Communication cables is indispensable to any machinery and equipment, materials, and communication cable insulation material is made up of different plastic polymer, some plastic polymer with low surface energy, almost no polarity, after plasma surface treatment, can remove dirt, form the active group, improve printing, inkjet, potting, bonding process, etc. From objectively, domestic or domestic sales of machinery and equipment, the parts used in the process of processing or assembling the plasma cleaning machine plasma surface treatment technology is relatively more, along with the continuous development of our country's economy, the quality of people's lives and safety consciousness gradually improve, believe that the application of plasma surface treatment on mechanical equipment technology will be more and more! Low-temperature plasma treatment equipment has been widely used in plasma cleaning, plasma etching, plasma spraying, plasma ash, plasma surface modification and other aspects. The use of plasma surface treatment, can improve the wettability of the material surface, so that a variety of materials can be coated, coating and other operations, enhance the viscosity, adhesion, while removing organic pollutants, oxide layer, oil or grease.

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Application of Plasma Cleaning in Packaging Technology for IC IC Manufacturing

Application of Plasma Cleaning in Packaging Technology for IC IC Manufacturing

In the domestic integrated circuit industry chain, the integrated circuit packaging industry is the pillar industry. With the reduction of the size of integrated circuit devices and the improvement of computing speed, packaging technology has become a key technology. The quality and cost of a product are affected by the packaging process. The characteristic size of future IC technology, chip area, the number of transistors contained in the chip and its development trajectory require IC package technology to develop in the direction of miniaturization, low cost, customization, green and environmental protection, and early coordination of package design. Lead frame is a chip carrier, through the bonding wire to achieve the internal circuit of the chip lead terminal and the external lead electrical connection. It is a key structural component that forms the circuit and acts as a bridge with the external leads. Lead frame is an important basic material in the electronic information industry. 1, the basic principle of IC packaging: On the one hand, integrated circuit packaging plays a role in mounting, fixing, sealing, protecting the chip and enhancing the electrothermal performance. On the other hand, it is connected to the pins of the package housing through the contacts on the chip, and these pins are connected to other devices through the wires on the printed circuit board, thus enabling the connection between the internal chip and the external circuit. At the same time, the chip must be isolated from the outside world to prevent the corrosion of the chip circuit by impurities in the air and the degradation of electrical performance. Oxides and particulate contaminants on the chip surface degrade the quality of the product during the packaging of integrated circuits. These contaminants can be effectively removed if plasma cleaning is performed during the packaging process prior to loading, lead bonding, and plastic curing. 2, IC packaging process flow: Only in the IC packaging process of packaging, can it become a terminal product and put into practical application. Integrated circuit packaging process is divided into pre - process, intermediate process and post - process. The packaging technology of integrated circuit has undergone great changes through continuous development. The front-end process can be divided into the following steps: Patch: the protective film and metal frame will be fixed silicon chip cut into silicon chip, and then a single chip; The cutting of a silicon wafer into a single chip for inspection; Chip mounting: place the silver glue or insulating glue at the corresponding position on the lead frame, remove the cut chip from the scribing film and paste it on the fixed position of the lead frame; Bonding: a gold wire is used to connect the lead hole on the chip and the pins on the frame pad, so that the chip is connected to an external circuit; Encapsulation: The circuit that encapsulates a component. Enhance the physical properties of the element to protect the element from external force damage; Post-curing: Curing the plastic packaging material so that it has sufficient hardness and strength to go through the entire packaging process. Pollutants in the process of integrated circuit packaging is an important factor affecting its development, how to solve these problems has been perplexing people, online plasma cleaning technology is a dry cleaning method without any environmental pollution can solve this problem. Plasma cleaning is a process in which the surface of the chip is treated by plasma, so that the contaminants on the sample surface are removed and the surface activity is improved.

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