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What is the role of plasma equipment parameters Langmuir probe diagnosi

What is the role of plasma equipment parameters Langmuir probe diagnosi

What is the role of plasma plasma equipment parameters Langmuir probe diagnosis: There are many factors that affect the processing effect of plasma plasma equipment. Plasma parameters are an important factor in the influencing factors. Therefore, it can be understood that the detection and diagnosis of plasma parameters of plasma plasma equipment is very important. There are many methods for measuring and diagnosing plasma parameters. The Langmuir probe method is a common diagnostic method that has been used so far. So what is this Langmuir probe method? The Langmuir probe method essentially uses an electrostatic probe to insert a metal probe into the plasma and apply a positive or negative bias to it to collect electrons or ion currents. Like other electrodes, a sheath is formed around the probe, and the area is usually small, so under appropriate conditions, the probe can only locally interfere with the plasma of the plasma plasma equipment. For the actual parameter diagnosis, the bias voltage of the Langmuir probe relative to the ground is VB, and the plasma potential is φp. When the detection voltage Vb=φp, the detection is at the same potential as the plasma. At this time, the current it collects from the mobile electrons mainly comes from the mobile electrons. With the increase of Vb and greater than φp, the current will saturate and reach the electronic saturation current value, but due to the increase of voltage, the current will also increase with the increase of the effective collection area of ​​the probe, which is related to the geometry of the probe related. However, when the voltage of the probe changes, its effective collection area will also change, resulting in a change in the ion saturation current. Because the mass of ions is much greater than that of electrons, the saturation current of ions is much smaller than that of electrons. Chengfeng Zhizao has focused on the research and development of plasma plasma equipment for 20 years. If you want to know more product details or have questions about the use of the equipment, please click on the Chengfeng Zhizao online customer service, waiting for your call!

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How to improve the plasma plasma cleaner to make it better after the discharge problem in the treatment chamber occurs

How to improve the plasma plasma cleaner to make it better after the discharge problem in the treatment chamber occurs

How to improve the plasma plasma cleaner to make it better after the discharge problem in the treatment chamber occurs: The plasma plasma cleaner manufactured by Chengfeng Zhizhi introduces you to the ideal PEF plasma treatment process. The electric field in the treatment room is evenly distributed, which can greatly reduce the influence of the treatment process on the raw materials. In the actual PEF plasma processing equipment, when the electric field strength is high, the insulation of the liquid raw materials in the processing chamber is easily destroyed and discharges. In short, on the one hand, the gas dissolved in the liquid, due to the temperature rise or continuous flow during processing, is easy to overflow in the processing area and form bubbles. The dielectric constant of the bubbles is much smaller than that of the liquid. Therefore, the pulse voltage is basically applied to the bubbles. , Resulting in bubble breakdown. In addition, due to the improper design of the electrode in the treatment chamber of the plasma plasma cleaner, the surface of the electrode produced non-smooth tiny metal bumps, resulting in uneven electric field distribution in the treatment area, and local strong distortions turned into concentrated currents, which caused the local liquid to heat and vaporize. Air bubbles cause liquid insulation breakdown. In addition, the liquid raw material contains solid particles, which are prone to discharge at the interface between the liquid and the solid particles, or when its electrical conductivity is high, the leakage current will increase through the passage, the heat phenomenon in the solution will increase, and the breakdown probability of the processing chamber will increase. Dealing with emissions during the indoor use stage is currently an important issue that is widely faced. When the pressure in the treatment chamber is constant, the appearance of bubbles in the liquid in the treatment chamber will have a significant impact on the electric field distribution in the treatment chamber, which increases the possibility of discharge breakdown in the treatment chamber of the plasma plasma cleaner. If a bubble with a diameter greater than 1mm is located in a processing chamber with a spacing of less than 3mm, its dielectric breakdown threshold voltage is much greater than a bubble with a diameter of less than 0.5mm in a processing chamber with a spacing greater than 5mm. In order to reduce the dead zone of the flow velocity and the local high temperature zone, and reduce the possibility of generating bubbles on the flow path, the structure of the plasma plasma cleaning machine processing chamber should be adjusted, or the tubular electrode of the same field processing chamber should be replaced with a mesh electrode, and in the same field. An insulating layer is added between the electrodes of the field treatment chamber to reduce the possibility of breakdown in the treatment chamber. Chengfeng Zhizhi has focused on the research and development of plasma cleaning machines for 20 years. If you want to know more product details or have questions about the use of the equipment, please click on Chengfeng Zhizhi online customer service, waiting for your call!

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Research on plasma surface treatment of ultra-smooth substrate by plasma etching machine

Research on plasma surface treatment of ultra-smooth substrate by plasma etching machine

Research on plasma surface treatment of ultra-smooth substrate by plasma etching machine: Plasma treatment can remove the processed deterioration layer by sputtering, reduce the surface roughness, improve the surface cleanliness and surface energy of the substrate. The optimized parameters prove that the substrate treated by plasma etching is better than the substrate without plasma treatment. The loss after coating was reduced by an average of 34.2ppm and showed good consistency. In recent years, with the rapid development of semiconductor technology and optical technology, the application of ultra-smooth surfaces has become more and more extensive, and the requirements for the quality of ultra-smooth surfaces have become higher and higher. In the manufacture of laser gyro, the processing quality of the mirror substrate directly affects the optical performance of the coated mirror and the quality of the photoresist between the optical elements, which in turn affects the accuracy, stability and reliability of the gyro. At present, the super-smooth surface is mainly obtained by polishing. Due to the processing characteristics and environmental factors, the polished super-smooth surface adsorbs a large number of particulate organic matter and other pollutants, and the optical surface obtained by the asphalt polishing process is a "pseudo surface", namely There is a processing deterioration layer, which is composed of a rheological layer damage layer and a hydrolyzate layer. The "pseudo surface" has a large number of internal defects and is highly active. It is easy to become a nucleation center during the coating process, which seriously affects the physical structure of the film and thus has a great impact on the optical performance of the mirror. In order to describe the real surface, the surface is divided into: outer surface layer (pollutant, adsorption layer) and inner surface layer (processed deterioration layer). Traditional surface treatment mainly uses brushing and ultrasonic cleaning. Due to the technology itself, it can only remove the dirt adsorbed on the surface, that is, the outer surface layer, and has no effect on the inner surface layer (polished and deteriorated layer). Plasma etching Plasma surface treatment is a technology developed in the past ten years, and it is widely used due to its full dry method and good pollution-free treatment effect. The ion energy in the plasma reaches hundreds of electron volts, which can not only remove the fine impurities adsorbed on the surface, but also sputter and polish the surface of the substrate. Plasma treatment can reduce the surface roughness of the substrate and remove the processed deterioration layer. The radio frequency power of plasma etching directly affects the density of gas ionization and the energy of ions, which in turn affects the effect of plasma on the surface of the substrate. Plasma surface treatment uses high-energy ions to act on the surface of the substrate to sputter off the loose atomic layer (that is, the polished metamorphic layer) by collision. The treatment is carried out in a vacuum environment, and the surface of the substrate is not easily contaminated, thereby obtaining freshness. The dense real surface improves the quality of the ultra-smooth optical surface, which is conducive to the growth of epitaxial films. Before plasma etching plasma treatment, the droplets are not spread out on the surface of the substrate, and the shape is irregular; after plasma treatment, the droplets spread out on the surface, the average spread area is 4.6 times that before the treatment, and the shape is regular Round. This shows that the surface energy of the substrate is improved and becomes uniform after plasma treatment. The surface of the asphalt-polished substrate must have a processing deterioration layer. Plasma etching plasma treatment can remove the processing deterioration layer by sputtering, reduce surface defects, greatly improve the cleanliness and surface energy of the substrate surface, and obtain a fresh, dense, uniform, and flat Super smooth surface.

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Application of plasma etching technology in chip integrated circuit manufacturin

Application of plasma etching technology in chip integrated circuit manufacturin

Application of plasma etching technology in chip integrated circuit manufacturing: Plasma etching is one of the key processes in the manufacture of chip integrated circuits. Its purpose is to completely copy the mask pattern to the surface of the silicon wafer. Its scope covers the control of the size of the front-end CMOS gate, as well as the etching and etching of the back-end metal aluminum. Etching of Via and Trench. Today, no integrated circuit chip can be completed without plasma etching technology. The investment in etching equipment accounts for about 10% to 12% of the equipment investment in the entire chip factory, and its technological level will directly affect the quality of the product and the advancement of production technology. It was reported very early that the literature on plasma etching technology was published in Japan in 1973, and soon attracted the attention of the industry. The parallel electrode etching reaction chamber (Reactive Ion Etch-RIE), which is still widely used in chip integrated circuit manufacturing, was proposed in 1974. This kind of reaction chamber consists of the following items: a vacuum chamber and a vacuum system, a gas system for providing different gas types and flow rates, a radio frequency power supply and its regulating and matching circuit system. The principle of plasma etching can be summarized as the following steps: 1. Under low pressure, the reaction gas is excited by radio frequency power to produce ionization and form plasma. The plasma is composed of charged electrons and ions. The gas in the reaction chamber is converted into ions under the impact of electrons. , Can also absorb energy and form a large number of active groups; 2. The active reactive group and the surface of the etched substance form a chemical reaction and form a volatile reaction product; 3. The reaction product separates from the surface of the etched material and is drawn out of the cavity by the vacuum system. In a plasma reaction chamber with parallel electrodes, the etched object is placed on an electrode with a smaller area. In this case, a DC bias voltage will be formed between the plasma and the electrode and cause a positively charged reaction. The gas ions accelerate to hit the surface of the etched material. This ion bombardment can greatly accelerate the chemical reaction on the surface and the desorption of reaction products, resulting in a high etching rate. It is precisely because of the existence of ion bombardment that all directions The opposite sex is etched. There are many types of plasma etching technology, such as pure physical etching, pure chemical reactive etching, and so on. Etching can be divided into wet etching and dry etching. The etching method used in the early chip semiconductor manufacturing process is wet etching, that is, using a specific chemical solution to decompose the part of the film to be etched that is not covered by photoresist, and convert it into a compound that is soluble in the solution, and then eliminate it to achieve etching. the goal of. Plasma is a state of existence of matter. Generally, matter exists in three states: solid, liquid, and gas, but in some special cases, there is a fourth state, such as the ionosphere in the earth’s atmosphere. The following substances exist in the plasma state: electrons in a state of high-speed motion; neutral atoms, molecules, and groups of atoms (radicals) in an activated state; ionized atoms and molecules; unreacted molecules, atoms, etc., but the substance is in the whole The electrical neutral state is still maintained. In the vacuum chamber, a high-energy disordered plasma is generated by the radio frequency power supply under a certain pressure, and the surface of the product is cleaned by plasma bombardment. In order to achieve the purpose of cleaning.

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The technology of vacuum plasma machine is eye-opening, and contact lenses can also be processed with it

The technology of vacuum plasma machine is eye-opening, and contact lenses can also be processed with it

The technology of vacuum plasma machine is eye-opening, and contact lenses can also be processed with it: With the rapid development of low-temperature plasma surface treatment technology, vacuum plasma machines have been widely used in many industries such as automobile manufacturing, textiles, medical equipment, health and beauty, cosmetics, etc., and gradually penetrated into people’s lives, quietly changing people’s lives . Maybe you still have some doubts, contact lenses can also be processed in a vacuum plasma machine. Contact lenses, also called contact lenses, are lenses worn on the cornea of ​​the eyeball to correct vision or protect the eyes. Contact lenses can be divided into hard, semi-hard, and soft according to their softness and hardness. Because of its small size, light weight, easy-to-wear, beautiful appearance, it has been favored by consumers in recent years. Now if I ask you, what are the characteristics of contact lenses? How to choose? Is it impossible to answer for a while? In fact, wearing contact lenses is comfortable and not dry, and the surface is aseptic and hygienic. These characteristics actually contain many characteristics that contact lenses need to have, such as smooth surface, good water wettability, and good durability. , Wearing comfort, reducing bacterial adhesion, etc. These characteristics sometimes require the low-temperature plasma processing technology of the vacuum plasma machine to complete. At present, the main method of caring for hard lenses is washing and dipping with care solution, which is of great help to the safe use of lenses. However, the above methods still cannot fundamentally solve the problems of the deterioration of the physical properties of the lens and the decrease in comfort with the increase of use time, and some impurities on the surface of the lens cannot be completely removed by the care solution. In order to ensure the user's better wearing safety and comfort, it is very important to perform surface treatment on the contact lens through a vacuum plasma machine. After the surface of the contact lens is treated by the vacuum plasma machine, the surface can be further cleaned to make the surface of the lens smooth, water-wet, durable, comfortable to wear, and reduce bacterial adhesion. Chengfeng Zhizhuang has focused on the research and development of vacuum plasma machines for 20 years. If you want to know more product details or have questions about the use of the equipment, please click Chengfeng Zhizhao's online customer service, waiting for your call!

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Vacuum plasma equipment is the best choice to improve the reliability of copper lead frame bonding and packaging

Vacuum plasma equipment is the best choice to improve the reliability of copper lead frame bonding and packaging

Vacuum plasma equipment is the best choice to improve the reliability of copper lead frame bonding and packaging: Copper wire frame is a commonly used material in microelectronics packaging. Vacuum plasma equipment is often used in the industry to remove oxides and organics on the surface, improve the reliability of wire bonding, and increase product yield. Then the improvement effect of vacuum plasma equipment is really Is it obvious? Copper alloy materials, due to their good electrical conductivity, thermal conductivity, processing properties, and low cost of use, so in the field of microelectronic packaging, the lead frame with copper alloy materials as the main material, that is, the well-known copper lead frame, in practice In the production process, layered sealing molding often occurs, resulting in poor sealing performance and chronic air leakage of the copper lead frame after sealing molding, and it also affects the quality of chip bonding and lead connection. The main reason for this problem is the presence of copper oxide and other organic pollutants on the surface of the copper wire frame, which affects the quality and reliability of the product. Can vacuum plasma equipment effectively solve this problem? Let's take a look at the comparison below. A copper lead frame of 238mm×70mm was selected, and the angle of water droplets before and after the equipment was compared to judge the processing effect on the copper lead frame. In order to obtain more accurate data, we selected 9 points to measure separately and obtain the average value. A comparison of the average processing results of a single measurement point, multiple measurement points, and multiple measurement points shows that the copper wire skeleton processed by Chengfeng Zhizhi vacuum plasma equipment can effectively remove organic matter and oxide layer, and The surface is activated and roughened to ensure the reliability of wire bonding and packaging. This conclusion has also been verified in actual production, and the yield of the product has also been improved. Chengfeng Zhizhi has focused on the research and development of plasma cleaning machines for 20 years. If you want to know more product details or have questions about the use of the equipment, please click on Chengfeng Zhizhi online customer service, waiting for your call!

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