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Plasma surface treatment technology Plasma treatment materials increase wettability

Plasma surface treatment technology Plasma treatment materials increase wettability

        Plasma surface treatment technology can effectively change the wettability of the surface. It is recommended to paste the material as soon as possible after plasma treatment. But once the treated surface comes into contact with paint, ink, adhesive, or other materials, the bond becomes permanent. Plasma surface treatment technology         What is plasma surface treatment technology?         The surface energy of solid materials and the requirements for surface treatment of polymers. Plastic materials often need to be adhered to metal or other plastic materials, or simply printed on the surface of the plastic. To do this, the liquid adhesive or ink should be able to wet the surface of the material. Plasma treatment technology can achieve this effect.         The wettability depends on a special property of the surface: the surface energy commonly referred to as surface tension. The unit of surface energy, such as surface tension, is mN/m. The surface energy of the solid substrate directly affects the wetting of the surface by the liquid. The measurement of the contact angle can easily prove its wettability. The contact angle is the angle between the tangent and the horizontal plane of the solid surface at the point of contact. When the water droplets are placed on a smooth solid surface, the water droplets will be dispersed on the substrate. If it is completely wetted, the contact angle will be close to zero. Conversely, if the wetting is local, the contact angle can be balanced between 0 and 180 degrees.         The greater the surface energy of the solid matrix against the surface tension of the liquid, the better the wettability and the smaller the contact angle; to make the liquid and the surface of the material form a good bond, the surface energy of the material should be greater than about 2-10mN/m of the liquid tension. This type of polymer material has the characteristics of chemical inertness, low friction coefficient, high wear, puncture resistance, tear resistance and so on. However, these polymers have poor wettability, causing problems for designers to bond and decorate materials. Plasma surface treatment technology can improve the wettability of the material by increasing the energy on the surface of the material, and affect the performance of the adhesive by creating connection points. .         There are always free electrons accelerating and ionizing the gas during high-voltage discharge in the air gap. When high-speed electrons collide with gas molecules, when the discharge is strong, there is no momentum loss, and an electron avalanche phenomenon occurs. Put the plastic part into the discharge channel, and the electrons generated during the discharge process have about 2-3 times the energy of impacting the surface, thereby breaking most of the molecular bonds on the surface of the substrate. This creates active free radicals. Such free radicals exist in oxygen and can react quickly to form a variety of functional groups on the surface of the substrate. The functional groups generated by the oxidation reaction can effectively increase the surface energy and strengthen the chemical bond with the resin matrix. These include carbonyl (-C=O-), carboxy (HOOC-) which is hydrogen peroxide (HOO-) and hydroxyl (HO-) groups. Plasma surface treatment with high-voltage discharge only changes the surface characteristics and does not affect the volume characteristics of the material.

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Plasma treatment system equipment improves the adhesion of plastic glass mobile phones and other products

Plasma treatment system equipment improves the adhesion of plastic glass mobile phones and other products

Plasma treatment system equipment can improve the wetting performance of polymer materials, rubber, metal, glass, ceramics, etc. Change the molecules of the hard-to-stick material to make it have better adhesion performance without damaging the surface. Plasma treatment system equipment         Plasma treatment system equipment is very suitable for three-dimensional plastic products, films, rubber profiles, coated cardboard, foam, solid materials and other thick material sheets. It is suitable for medical, automotive, packaging, FPC, mobile phones and polymer films and other industrial fields .         In general, foam, glass, plastic sheets and corrugated materials have poor wettability, and plasma treatment is required:         1. Generally, plastic products can only be used after surface treatment.         2. The hydrophobicity of the glass surface makes it difficult to bond.         3. Many materials need to be micro-processed before coating, printing or coating.         Because of its material composition and uneven surface, anti-corrugation plastic board and wall board post-processing applications. Through mature technology, plasma processing system equipment can achieve high-performance and high-efficiency production, because our plasma system increases the combination of ink, paint, and adhesive with the substrate to improve adhesion. Plasma treatment is suitable for production lines or manual treatment stations. The operation is simple. The equipment can generate a large amount of plasma to increase the effect of surface active treatment, thereby forming a firm bond between the substrate, ink, laminate, paint and adhesive. The plasma processing system can be set before printing or lamination, or it can be used as a separate manual system. Process control interface, surface treatment is uniform, reliable and repeatable.         Chengfengzhi has developed several different types of plasma treatment special plasma treatment system equipment, namely atmospheric pressure plasma treatment system, vacuum plasma treatment system, wide-format plasma treatment, etc., used in flat plates, glass, extruded hollow plates, Surface treatment of foam, honeycomb materials and printed electronics. Linear plasma system processing can prevent damage to fine substrates and embedded circuits. Provide customers with real, economic and efficient plasma surface treatment and other plasma surface treatment system solutions.         Through research, professional knowledge, innovation and experience, we will promote high-quality plasma equipment products to the domestic market. Provide a complete set of standard products and customized products to meet the needs of customers regardless of the size and scope of the project. Cooperate earnestly and establish good and long-term customer relationships with high-quality products and excellent services.

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Application of plasma cleaning of pcb plasma cleaning machine in FPCB assembly

Application of plasma cleaning of pcb plasma cleaning machine in FPCB assembly

Application of plasma cleaning of pcb plasma cleaning machine in FPCB assembly:         The market demand for flexible printed boards and rigid-flex printed boards is increasing. It places high requirements on board requirements such as surface roughness and surface material modification. Plasma cleaners and PI surface modification can be used to achieve The purpose of roughening and surface modification. pcb plasma cleaner cleaning         With the development of electronic products toward miniaturization, lightness and thinness, portability, and multi-function, flexible printed circuit boards (FPCB) and rigid-flex printed circuit boards (R-FPCB) are increasingly used.         Because the material used in FPCB and R-FPCB is polyimide (PI), its hydrophilicity is poor, and its smooth surface results in poor bonding performance. It is necessary to modify the PI surface without changing the overall performance of PI. It can improve the roughness and improve the bonding performance to meet the long-term requirements of terminal electronic products.         Plasma cleaning machine can meet the requirements of PI surface roughening and surface modification. Plasma cleaning is a dry process. Plasma cleaning mechanism and characteristics: The high-frequency generator separates the processing gas under the electric field energy and vacuum conditions to establish plasma. In the plasma state, the electrons are free from the bond of the central atom, and the neutral atoms, neutral molecules and positive and negative ions make irregular movements. It has a very high energy, but overall it is apparently neutral. The gas molecules in the vacuum are excited by electric energy and the accelerated electrons collide with each other to excite the outer electrons of the atoms and molecules, from the ground state to the excited state, and transition to a more stable orbit. The electrons leaving the ground state orbit generate ions or reaction activity. Relatively high free radicals.         The resulting free radicals, positive and negative ions collide with the surface of the material under the continuous acceleration of the electric field and under the collision of high motion, destroying the van der Waals force between the molecules and the original bonding between the molecules at a depth of several microns. A certain depth of surface material on the PI surface is shaved off to form fine unevenness, and the gas generated at the same time becomes a functional group, which will continue to induce physical and chemical changes on the surface of the material. In general, the whole process is the process of continuous gas ionization and continuous recombination reaction, so as to ensure the continuous progress of the entire reaction, and then achieve the purpose of roughening the PI surface and modifying the PI surface.         In the FPCB assembly process, the reinforcement will be assembled on the PI cover film, and it is required to improve the bonding force between the reinforcement and PI. In the case that the reinforcement surface cannot be processed, the PI surface should be roughened and modified to meet the reliability requirements. Sexual requirements.         Treating PI surface with plasma cleaner has the following characteristics:         (1) The PI surface after plasma cleaning is already very dry, and there is no need to go through subsequent drying treatments         (2) The use of gas solvents will not produce harmful pollutants on the PI surface, which is an environmentally friendly green cleaning method;         (3) The plasma generated by the high-voltage electric field has no direction and can penetrate into the tiny holes and depressions on the PI surface;         (4) While cleaning the PI surface, it can also change the surface properties of the PI material itself, improve the wetting performance of the surface, and increase the bonding force.

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Automatic surface plasma treatment solution plasma cleaning machine solution

Automatic surface plasma treatment solution plasma cleaning machine solution

        Chengfeng Zhizhi provides atmospheric pressure plasma, wide-width linear vacuum plasma and automatic surface plasma treatment solutions. No matter what kind of plasma surface modification and activation is required for your production, we can find a suitable plasma cleaning machine for you. Program. Automatic surface plasma treatment solution         Chengfeng Zhizhi provides atmospheric plasma and vacuum plasma automatic surface plasma treatment solutions, which can increase the surface energy of rubber components and ensure that printing inks, paints, adhesives, coatings, wool, anti-stick paints, etc. have good adhesion. Plasma surface activation, cleaning, modification and other equipment have been widely used in various industries and are widely used in various substrates.         With years of experience and continuous product development, it has become the preferred supplier of plasma cleaning machine solutions. An increasing number of customers cover the following industries: electronics industry, sheet industry, automation, lithium battery industry, glass manufacturing, semiconductor chip cleaning, aerospace and ceramic automotive industries.         Utilizing our rich plasma treatment and surface measurement technology, automatic surface plasma treatment program engineers have prepared standard training courses for customers at any time, covering the theoretical and practical applications of surface and surface measurement. At the same time, the company has also established a complete after-sales service system, including pre-sales training and after-sales service. Providing training courses to customers and distributors strengthens our commitment not only as a supplier but also as a technical partner in the surface treatment industry. After professional training, improve the overall efficiency of the company, reduce production costs, and increase the enthusiasm of employees.

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Research on Improving Hydrophilicity of Polyimide Plasma Treatment

Research on Improving Hydrophilicity of Polyimide Plasma Treatment

Research on improving hydrophilicity of polyimide plasma treatment:         Polyimide (P84) fiber has good mechanical properties, radiation resistance, thermal stability and non-combustibility, and can be widely used in some special environments, such as fire protection, electronic aerospace and industrial production. Because polyimide (P84) fiber is limited by its surface structure chemical inertness and surface energy, its poor adhesion affects its reinforcing effect in composite materials. Low-temperature plasma surface modification methods can be used to overcome this shortcoming of fibers.         Plasma is a gas composed of high-energy charged particles and neutral particles. Plasma surface modification only occurs on the surface of the material and does not affect the body of the fiber, so that the fiber can fully improve its surface performance while maintaining its own excellent overall performance.         Through low-temperature plasma surface treatment, the surface of the material undergoes multiple physical and chemical changes, or is etched and rough, or forms a dense cross-linked layer, or introduces oxygen-containing polar groups to make the hydrophilic adhesiveness dyeable Performance, biocompatibility and electrical properties have been improved.         Comparing the surface of the P84 fiber before and after the treatment, it is found that the surface of the untreated fiber is smooth, while pits appear on the surface of the P84 fiber after low-temperature plasma treatment. This is because particles such as ions and electrons excited molecules or atoms in the plasma sputter and etch the fiber surface. The chemically active substances in the plasma cause oxidative degradation and other reactions on the surface of the material to cause chemical micro-etching.         Under the simultaneous action of the two etchings, pits are formed on the surface of the P84 fiber, and convex deposits are generated at the same time, thus increasing the micro-roughness of the fiber surface. After low-temperature plasma modification, the relative content of N and O elements on the surface of P84 fibers increased significantly. The relative content of C element decreased, and the O/C ratio rose from 25.79% to 27.32%, which indicated that oxygen-containing groups were added on the fiber surface.         Plasma treatment produces unsaturated bonds and free radicals on the surface of polyimide (P84) fibers. These unsaturated bonds and free radicals interact with oxygen in the air to generate new oxygen-containing polar groups, thereby making P84 fibers The chemical composition of the surface changes.         After plasma treatment, the surface of polyimide (P84) fiber undergoes oxidation reaction, and hydrophilic polar groups are introduced into the fiber surface. Enhance the moisture absorption and moisture conduction performance. This is because when low-temperature plasma particles bombard the surface of the polyimide (P84) fiber, the surface will undergo processes such as etching, cross-linking and oxidation, thereby introducing a large number of hydrophilic groups. The presence of hydrophilic groups greatly enhances the moisture absorption capacity of the fiber surface; at the same time, the surface area of ​​the polyimide (P84) fiber after low-temperature plasma treatment increases the surface area, which further improves the moisture absorption and moisture conduction performance.

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Powder plasma surface treatment equipment Plasma powder treatment improves surface tension

Powder plasma surface treatment equipment Plasma powder treatment improves surface tension

        Powder materials, especially nano-materials (nano-materials refer to particles or structures, crystals or nano-composites with a nanometer length ranging from 1 to 100 nm). A very important feature is the surface effect. The surface effect of powder materials is the powder The ratio of the surface atom number of the bulk particles increases greatly with the smaller the size of the powder particles. After the powder plasma surface treatment equipment is processed, the surface energy of the particles can be increased, that is, the surface tension also increases, thereby causing changes in the properties of the powder materials. . Powder plasma surface treatment equipment         As the particle size decreases, the specific surface area of ​​the particles increases rapidly and is very unstable. Therefore, these atoms are easily combined with other atoms and stabilized. They have high chemical reaction activity. For example, metal nanoparticles will burn in the air. Some oxide powder particles are exposed to the atmosphere to adsorb gases and so on.         The main problem in the application of powder materials for powder plasma surface treatment equipment is to improve the surface effect of the powder. Improve the dispersibility and surface indirectness of the powder. For example, it can be seen that the smaller the nano-particle size, the more obvious the nano-specific function. The smaller the particle size of the powder, the more serious the agglomeration of particles. The agglomerates may reach sub-micron or even micron levels, which seriously affects the application of nano additives in fibers, especially the spinnability of the powder particle/fiber composite system. The use of powder plasma surface treatment equipment can realize the conventional performance of particles, which fully reflects the special functions of the powder particle/fiber composite system.

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