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Small vacuum plasma cleaning machine vacuum plasma cleaning surface material modification

Small vacuum plasma cleaning machine vacuum plasma cleaning surface material modification

Small vacuum plasma cleaning machine vacuum plasma cleaning surface material modification Small vacuum plasma cleaning machine can improve the adhesion of the material surface, improve the adhesion performance of the material, solve the problem of adhesion. The effect of vacuum plasma cleaning is very obvious when the contact Angle is measured during the actual operation, and the uniform and thorough adhesion of material modification is improved. Small vacuum plasma cleaning machine is a method to improve the surface adhesion, improve the bonding properties of materials, and solve the problem of bonding. A lot of materials in the factory, originally rely on the corona treatment effect, but the effect of plasma treatment is far better than ordinary treatment. Small vacuum plasma cleaning machine Equipment parameters of vacuum plasma cleaning machine: Customized cavity plasma cleaners from 2 litres to 23 litres or more are available. Here we focus on small vacuum plasma cleaners. The equipment uses a temperature control system to ensure that heat/humidity sensitive materials are not damaged. Can be processed on any product, different products after the actual treatment of the effect is not the same, specific through the contact Angle tester hydrophilicity test, through a large number of tests we found that almost all materials after plasma treatment, hydrophilicity has changed to different degrees. Oxygen argon plasma and hydrogen plasma cleaning: Using different types of gases (oxygen, argon, nitrogen, hydrogen, helium, etc.), small vacuum plasma cleaners can change a variety of properties of the substrate surface. This includes but is not limited to: 1. Improvement of surface tension/surface energy/contact Angle characteristics. 2, improve the adhesion of the surface. 3. Hydrogen plasma is very effective in removing oxides from glass or metal products. 4. Change the wettability of the surface to produce hydrophilicity or hydrophobicity (increase or decrease the adhesion of the liquid)- for pretreatment, coating and coating. 5, coating process: adhesion, wettability, corrosion resistance and wear resistance, electrical conductivity and insulation, magnetic induction, reflective/reflective, anti-microbial, scratch resistance, waterproof, coloring, etc. Plasma activation refers to the treatment of a polymer to improve its ability to be coated or printed. This is done by oxidizing the outer layer of the polymer using an oxygen plasma. Argon is often used in easily oxidized metals. This can not only produce cleaning products, but also increase the polarity, directly improve the printing and coating performance of polymer products, oxygen plasma is also activated by plasma.

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Domestic plasma etching machine manufacturers: directed self-assembly material plasma etching

Domestic plasma etching machine manufacturers: directed self-assembly material plasma etching

Domestic plasma etching machine manufacturers: directed self-assembly material plasma etching Domestic Plasma Etching Machine Manufactory Directional Self-assembly Plasma Etching Application: In the process below 22nm, it is necessary to reduce the periodic spacing. The general practice is to achieve the pattern definition of small size and small diameter through the way of secondary exposure, namely repeated lithography etching. This method has been successfully mass-produced in the fin type field effect transistor, but it will undoubtedly increase exponentially. Many experts in the field of micrographic definition have long been exploring alternative methods of micrographic definition that go beyond the current lithography physics. Among them, directional self-assembly using polystyrene (PS), polymethyl methacrylate (PMMA) and its block copolymer is a method that has been discussed more. The method is to use the phase transition conditions between different components in the block copolymer to remove part of the components to realize the pattern definition. Some successful cases are the use of block copolymers of polystyrene and polymethyl methacrylate to reduce periodic spacing and the realization of minimal diameter contact holes through graphic definition. The minimum contact hole is defined by first defining the graph and then filling the block copolymer, so that the block copolymer will fill the previously defined graph, and the phase transition occurs at the boundary of the graph first and then gradually spreads to the body, which is just for our use. If the diameter of the contact hole is defined as 68nm first, then the contact hole can be reduced to 20nm after the second definition in this way. At the same time, different shapes, sizes and even different intensities of contact holes can be realized by using the different morphologies of the patterns in the previous step and adjusting the morphology of block copolymer. Domestic plasma etching machine manufacturer If the graphical definition of directional self-assembly can be used in mass production, how to remove these unwanted block copolymers becomes a problem that must be further studied. At present, the general method is to remove by wet etching or dry plasma etching. Generally speaking, the selection ratio of wet removal is very high, but the definition of the figure is not good enough, which will bring poor line width roughness and may cause the collapse of dense and narrow lines, due to the wetting effect of the solution. And domestic plasma etching machine manufacturers dry plasma etching removal generally lower selection ratio but will not have these problems. Common dry etching methods and actual performance are listed in Table 8.3. It can be seen that the mixed etching effect of AR and oxygen is good. Although the selection ratio of block copolymer is not high, the selection ratio of the lower material, the line width roughness and the key size definition are all good. Table 8.3 Etching results of block copolymers with different gas ratios: Ar O2 Ar/O2 CF4 O2/CHF3 PMMA/PS etch selectivity 3.63 1.50 2.04 1.85 1.82 Etch sel. To underlying material(Si or SiOx) Good Good Better Poor Poor Edge roughness Poor Poor Good Good Good CD(original CD:~25nm) Deformed 21.58 nm 24.24 nm 26.50 nm 25.92 nm Xe and H2 have a higher etching rate for PMMA and PS, the thicker PMMA/PS films growing on the control plate will be completed by plasma etching faster, and the etching termination phenomenon will occur when the two materials are etched with CO, and the gas saturation phenomenon occurs at the beginning of the etching stage. Compared with H2, the etching rate of PS will be faster and the selection ratio will be lower. And CO will be deposited on the PS surface can be used to adjust the etching selection ratio. Using the mixture of these three gases, we can see that the selection ratio is all above 5, which can be applied to industrial production. However, XE-Co mixture will cause more carbides to deposit on the surface of PMMA, which will destroy the original pattern. In contrast, the combination of Co-H2 has little influence on the patterning and is conducive to the actual control. Co-H2 has been used to successfully form lithographic plasma etching contact holes with key size difference less than 1nm and diameter of 15nm in a 10nm process. More and more close to the bottleneck of silicon semiconductor, new materials continue to emerge, and the realization of the device is more and more, and closer to mass production. These new materials, which will soon appear in semiconductor integrated circuits, are very challenging for etching. This kind of material generally has better electrical conductivity and chemical activity, preferring a little more chemical etching. The general requirement is that the graphic definition should be accurate and the damage to the key layer and the contact layer should be small. On this basi

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Using atmospheric pressure plasma jet to clean the glass panel of mobile phone to remove grease

Using atmospheric pressure plasma jet to clean the glass panel of mobile phone to remove grease

Using atmospheric pressure plasma jet to clean the glass panel of mobile phone to remove grease In recent years, mobile phones are glass panels, in order to improve the strength and hardness of glass panels, usually using chemical toughening. And need to be cleaned before chemical tempering, if the cleaning is poor, it will affect the quality of the product. The traditional cleaning method is to scrub with detergent first, and then use acid and alkaline solution and organic solvent ultrasonic cleaning. The process is complicated, time-consuming and costly, and causes pollution. And now there are low-temperature plasma treatments. The ions, electrons, excited atoms, molecules and free radicals enriched in low temperature plasma are all active particles, which are easy to react with the surface of the material. Therefore, it is widely used in surface modification, thin film deposition, etching processing, device cleaning and other fields. Atmospheric pressure plasma jet cleaning mobile phone glass panel Atmospheric cryogenic plasma jet is a newly developed plasma treatment technology in recent years. It has the advantages of low breakdown voltage, high ion and metastable molecular concentration, high electron temperature, low neutral molecular temperature, uniform plasma, good controllability, no need to vacuum, and continuous surface cleaning. When cleaning, the higher the concentration of chemical active components in the plasma, the better the cleaning effect. In addition to the mechanical action, the cleaning of the glass surface by plasma jet is mainly the chemical action of reactive oxygen species. The Ar* in the excited state in the plasma, Excite oxygen molecules into excited oxygen atoms Ar * + O2 - > O + O * + Ar (1) Ar * + O - > O + Ar (2) High-energy electrons collide with oxygen molecules and break them apart, forming excited oxygen atoms E + O2 - > * O + O + e (3) E + O2 - > O + O + e (4) The main components of stained lubricating oil and stearic acid are hydrocarbons, which are oxidized by reactive oxygen species to produce carbon dioxide and water CnHm + PO *→ XCO2 + YH2O (5) This removes grease from the surface of the glass. Lubricating oil and stearic acid are common contaminants on the glass surface plate of mobile phones. After contamination, the contact Angle of the glass surface to water increases, affecting ion exchange. The traditional cleaning method has complicated process and pollution. Atmospheric plasma generator, simple structure, do not need to vacuum, can be cleaned at room temperature, the generated excited state of oxygen atoms than the general oxygen atoms are more active, can be polluted lubricating oil and stearic acid in the oxidation of hydrocarbons, carbon dioxide and water. At the same time, the plasma jet also has mechanical impact, which plays a scrubbing role and makes the contaminants on the glass surface quickly escape from the glass surface, so as to achieve the purpose of efficient cleaning.

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Vacuum plasma surface cleaner for special purpose applications

Vacuum plasma surface cleaner for special purpose applications

Vacuum plasma surface cleaner for special purpose applications Vacuum plasma surface cleaning machine is specially used for IC chips and other materials surface treatment to increase adhesion, with a layer of vacuum plasma corrosion with a few atom thickness of the material, some IC chips only produce 10nm between electronic components, and there are manufacturers plan to reduce it to 5nm. Vacuum plasma surface cleaner What is the special application way of vacuum plasma surface cleaner? Vacuum Plasma Surface Cleaner deals with whether a clean surface will allow a binder to bond to a different surface. For example, when rubber parts are bonded to plastic tools. Plastic and rubber usually use different binders. Therefore, the approach of using the same binder for both materials is to ensure the cleaning and activation of each surface. Plasma activates the free radicals left on the surface of plastic or rubber material, making the bond between the material surface and the adhesive more tightly. This free radical occurs on the surface of the material and is chemically unstable; They are extremely strong in binding to adhesives. The production of these free radicals is also useful when printing surfaces, which usually do not accept ink. If printing is done on a bright or smooth surface, the plasma must be activated so that the printing surface can accept ink and produce a stain resistant effect. A vacuum plasma surface cleaner can be used to coat surfaces to enhance their luster, a process called plasma polymerization. Vacuum plasma is used to etch a layer of material several atoms thick to make small integrated circuit chips. Is the vacuum plasma surface cleaner used for cleaning other than activating the surface? Examples of plasma bonding: The shift registers can be glued together during assembly, and printing on smooth surfaces such as plastic or PTFE can result in poor finished product quality and a large amount of ink that does not adhere to the surface. It is difficult to bond other materials on smooth plastic products because different polymers require different adhesives, so the vacuum plasma surface cleaner can be used to improve the adhesion effect after cleaning.

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Vacuum plasma surface cleaner for special purpose applications

Vacuum plasma surface cleaner for special purpose applications

Vacuum plasma surface cleaner for special purpose applications Vacuum plasma surface cleaning machine is specially used for IC chips and other materials surface treatment to increase adhesion, with a layer of vacuum plasma corrosion with a few atom thickness of the material, some IC chips only produce 10nm between electronic components, and there are manufacturers plan to reduce it to 5nm. Vacuum plasma surface cleaner What is the special application way of vacuum plasma surface cleaner? Vacuum Plasma Surface Cleaner deals with whether a clean surface will allow a binder to bond to a different surface. For example, when rubber parts are bonded to plastic tools. Plastic and rubber usually use different binders. Therefore, the approach of using the same binder for both materials is to ensure the cleaning and activation of each surface. Plasma activates the free radicals left on the surface of plastic or rubber material, making the bond between the material surface and the adhesive more tightly. This free radical occurs on the surface of the material and is chemically unstable; They are extremely strong in binding to adhesives. The production of these free radicals is also useful when printing surfaces, which usually do not accept ink. If printing is done on a bright or smooth surface, the plasma must be activated so that the printing surface can accept ink and produce a stain resistant effect. A vacuum plasma surface cleaner can be used to coat surfaces to enhance their luster, a process called plasma polymerization. Vacuum plasma is used to etch a layer of material several atoms thick to make small integrated circuit chips. Is the vacuum plasma surface cleaner used for cleaning other than activating the surface? Examples of plasma bonding: The shift registers can be glued together during assembly, and printing on smooth surfaces such as plastic or PTFE can result in poor finished product quality and a large amount of ink that does not adhere to the surface. It is difficult to bond other materials on smooth plastic products because different polymers require different adhesives, so the vacuum plasma surface cleaner can be used to improve the adhesion effect after cleaning.

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Introduction of plasma surface treatment technology for three dimensional objects

Introduction of plasma surface treatment technology for three dimensional objects

Introduction of plasma surface treatment technology for three dimensional objects In plasma surface treatment technology, the energy of the particles is usually around a few to a dozen electron volts, which is much larger than the bonding energy of polymer materials (a few to a dozen electron volts), which can break the chemical bonds of organic macromolecules, thus generating new bond energy; However, it is far lower than high-energy radiation, which only involves the surface of the material and does not affect the performance of the matrix. Electrons in the plasma surface treatment technology in the thermodynamic equilibrium state, has the very high energy, can damage the material surface molecular bonds, and improve the particle chemical reactivity heat plasma (strong), and the temperature close to room temperature neutral particles, this for heat-sensitive provides favorable conditions of surface modification of polymers. After low temperature plasma surface treatment, the surface of the material will undergo many physical and chemical changes, or corrosion roughness phenomenon, or the formation of dense crosslinking layer, or the introduction of polar oxygen-containing groups, respectively improve the hydrophilicity, bonding, absorbability, biocompatibility and electrical properties. The surface morphology of the material can be obviously changed by using the appropriate process conditions, and the introduction of a variety of oxygen-containing groups makes the surface from non-extremely difficult to stick to a certain polarity, easy to stick and hydrophilic, which is conducive to bonding, coating and printing. Introduction to plasma surface treatment technology Plasma surface treatment of the material has the following effects: 1, activity: significantly improve the wetting, the formation of active surface; 2, cleaning: remove dirt and oil, fine cleaning and static electricity; 3, coating: through the surface coating treatment, provide functional surface, improve the surface adhesion ability, improve the reliability and durability of surface adhesion. The surface energy of all kinds of polymer plastics, ceramics, glass, PVC, paper and metal can be obtained by constant pressure plasma treatment. Adopts this kind of treatment technology, can improve the product surface tension performance, accords with the industry respect to the coating, the adhesive and so on treatment request. Such as: 1, liquid crystal display coating processing, casing and buttons and other junction surface of the oil injection screen printing, PCB surface in addition to the glue cleaning, cleaning before film paste, wire, cable before the processing of code injection and so on. 2. The processing of lampshade, brake pad and door seal tape before pasting in the auto industry; 3, in the mechanical industry, the metal parts for the small, harmless cleaning treatment, lens coating treatment, a variety of industrial materials between the connection and sealing before the treatment. 4, in the printing packaging pasting box machinery, the edge of the sealing position of the pre-gluing treatment. 5, in the medical device industry, before the needle and plastic catheter bonding treatment and so on. Plasma surface treatment technology is used to modify the surface of a three-dimensional object. High-frequency AC high voltage is applied to both ends of the electrode to make the air between the two electrodes produce plasma area to produce gas arc discharge. The plasma reaches the surface of the treated object under the airflow, thus realizing the modification of the three-dimensional object surface. Ion surface treatment technology is an economical, safe and thorough cleaning method. Contaminants are removed from the treated substrate surface without affecting the properties of the host material. Plasmas are widely used in the circuit board industry, including for conformal coating before PCB cleaning and for cleaning lead frames during packaging. Compared with other surface cleaning technologies, plasma treatment has significant advantages. Widely used in metal, plastic, glass, ceramics and other materials. And this approach is environmentally friendly, plasma cleaning does not need to use dangerous chemical solvents, do not need to worry about environmental pollution problems greatly save costs.

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