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What is a plasma polymerization facility

What is a plasma polymerization facility

Plasma polymerization is a method to improve the hydrophobicity of rubber, plastic products or films, hence the derivation of plasma polymerization equipment.   Plasma polymerization is commonly used to prevent debris from attaching to rubber during manufacturing, and by doing so we can improve surfaces such as silicon, rubber and plastic to prevent them from sticking together during further production. Plasma surface modification is considered as a "green" alternative that is more environmentally friendly than other surface modification methods. Plasma surface treatment does not require the use of irritating chemicals, let alone any chemical exposure. This will not only protect the environment, but also protect the lives of employees. Firstly, RF source is used to generate plasma, and then plasma treatment is carried out on the surface of the material, which can improve the hydrophobicity of plastic or rubber surface, so as to realize plasma polymerization.   Plasma treatment has many advantages over other surface treatment methods, which arouses people's interest in plasma treatment. The enhanced chemical and mechanical properties of various polymers formed by plasma technology have led to the application of plasma technology in many different industries and products. The plasma polymerization equipment USES the appropriate treatment gas, we can improve the surface hydrophobicity of the material, improve the wettability and practicality of the product, and prevent the product from bonding during further processing. This method is suitable for many rubber and silicon products.   History of plasma polymerization:   In 1982, functional plasma-polymer film deposition was identified, and these plasma-functional methods can be used not only to produce hydrophobic coatings, but also to improve the biocompatibility of biological implants. The value of functional plasma polymers has been applied in water treatment, care of burn patients and other traumatic injuries. Technologies such as microchannel coating, nano-patterning and microencapsulation all use plasma polymers to improve product quality.

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Etching of passivated layer dielectric aluminum pad by plasma Industrial Cleaning Machine

Etching of passivated layer dielectric aluminum pad by plasma Industrial Cleaning Machine

Etching of passivated layer dielectric material: Passivation layer is used to protect IC devices and metal connection structure, provide a certain stress buffer, not by subsequent cutting, cleaning and packaging process damage and corrosion of the protective layer. The dielectric materials used in the passivation layer are usually silicon oxide and silicon nitride materials, whose dimensions are micron scale and have no special requirements on the lateral wall contour curve. Passivation layer of dielectric material using single photoresist etching for film, etching to [F] for gas, usually is the combination of CF4 and CHF3 or CH2F2 accompanied by some dilute gas, plasma industrial cleaning machine by optimizing etching gas ratio, plasma source power and bias power and temperature adjustment side outline view, size and uniformity of plasma etching depth.   Metal etching of aluminum pad:   Aluminum metal etching usually USES photoresist as mask and is carried out in plasma metal etching reaction chamber. Because the product AlF3 is a non-volatile product with low vapor pressure, it can not be used to etch aluminum, usually it is etched with chlorine gas. Is isotropic etching aluminium, pure chlorine gas for the anisotropic etching process to get the contours of the curve and size, must be used in the process of etching polymer passivation wall for protection, in addition to zapped with plasma physics photoresist polymer, carbon capture to get some more prone to polymer gas as etching agent, such as CHF3, N, CH4, etc; At the same time, BCl3 gas is also widely used in aluminum etching by the plasma industrial cleaning machine. The main purpose is that BCl3 has excellent reactivity with [O] and [H] ions, and the [O] and [H] ions generated in the reaction chamber and the reaction process are taken away after the first reaction to reduce the possibility of aluminum etching termination and corrosion in the future. At the same time, BCl3 gas is decomposed into BClx in plasma, atomic group and positive ion. [BCl3]+ positive ion with a large molecular weight is an important ion source for the formation of plasma physical bombardment, which enhances the effect of physical bombardment. BClx atoms, on the other hand, can "recombine" with Cl atoms, as shown in Formula (3-8), which would normally occur without exposure to Cl atoms BClx + Cl - > BClx + 1 (3-8) This recombination reaction will consume chlorine atoms on the side wall surface under particle bombardment, reduce fluorine atoms adsorbed on the side wall, thus reducing side etching, improving the anisotropy of etching, and achieving a good control of the profile of the side wall contour.   To join in the process of etching can quickly generate polymer provides wall protection gases such as CHF3, N2, or CH4, make relatively preferential adsorption on metal aluminum wall fluorine, nitrogen or hydrocarbons, to further reduce the chlorine atoms react with aluminum wall contact, protect wall, make chlorine gas to metal base aluminum ability of anisotropic etching is better. By studying the influence of these three kinds of gases on the side wall morphology of metal aluminum after etching, the results show that N2 protective gas produces too much side wall protection during etching, which is easy to form trapezoidal side wall morphology. The protection of CHF3 to the side wall is not perfect. CF4 gas provides uniform sidewall protection and maintains a nearly vertical sidewall Angle, providing sidewall protection.   One difficulty in the etching of metal aluminum in the plasma industrial cleaning machine is the complexity of its multilayer metal composite film. TiN or other anti-reflection materials are often used in the composite film as a graphic exposure anti-reflection layer, and the adhesion barrier layer below, such as Ti or other materials, all increase the complexity of the etching process. To antireflective material layer on the surface of the etching, may use the chemical gas is Cl2 / SF6 / CF4 / CHF3 / BCl3 / Ar/O2 combination of these, and etching TiN antireflective film with Cl2 / BCl3 / N2 / CHF3 combination of them. In addition, since the oxidation of aluminum exposed to air occurs almost simultaneously, the production of aluminum oxide must be suppressed or controlled, otherwise the etching can be terminated. Typical steps for etching aluminum metal composite film are described in detail below:   1. Etch anti-reflective layer. 2. Remove the pre-etching of natural oxide layer on the surface (which may also be combined with step 1). 3. The main etching of metallic aluminum is usually detected by the reaction product detector to detect the etching termination of metallic aluminum. 4. Remove overetching of aluminum residues. This step may also be a continuation of the main etching step. 5. Etching of the bottom barrier layer (may also be combine

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Influence of plasma etching on yield of LOGIC Integrated circuit in plasma equipment

Influence of plasma etching on yield of LOGIC Integrated circuit in plasma equipment

Every step from design and manufacturing to packaging is critical for the chip to perform the desired function. As the size of integrated circuits continues to shrink, the timing window of transistors continues to shrink. In the manufacture of advanced process logic integrated circuit, the process fluctuation has more and more influence on the working timing window of transistors, so the manufacturability of chips must be considered in the design of chips. When the completed layout is put into the factory, it is necessary to check it first, look for the graphics that will bring difficulties or make it impossible to produce and make reasonable adjustments. When it comes to the manufacturing stage, the yield of the chip will rise quickly for the mature complete process, and even the yield of the chip can reach the standard in a single stream. But for processes in development, yield increases can be a long process, spanning several quarters or even longer. The following introduces the concept of yield in logic IC manufacturing and the process of yield improvement, and discusses the key role of plasma etching process on yield improvement in plasma equipment.   Every link in semiconductor manufacturing may cause product failure. The manufacturing plant typically goes through hundreds of processes from the time a wafer is rolled off the production line to the time it is completed. The manufacturing plant is concerned with how many grains on a wafer meet the shipping requirements. Yield is an indicator to quantify this ability. For example, a wafer that has 1,000 grains and 900 grains that pass the electrical property test has a yield of 90%. The yield of 25 wafers in the same lot may vary due to subtle differences in location, order, etc., but there is generally no significant difference. Yield can also fluctuate with the time drift of machine parameters on the production line, and sometimes a large deviation or excursion can lead to a sudden fall of yield. Long-term stability at a high level of yield is a sign of a mature production line.   The device failure caused by process can be divided into parametric and functional failure according to the failure characteristics. Parametric failure refers to the device electrical parameter optimization and can not meet the design requirements, such as chip working frequency measurement under the rated working voltage is too low, when static beyond the rated power consumption, etc., traditionally called soft failure (soft fail), functional failure refers to the device function is lost, can't detect some electrical parameters, such as memory read/write failure, the result of logic circuit error, etc., traditionally called hard failure (hard fail).   Parametric failure is mainly related to the physical parameters of the device, such as gate size, active region size, active region doping concentration, etc. Etching is to define the device size, thickness, appearance, the key technology to the influence of parametric failure is very big, such as inadequate because the machine maintenance and prompted a large grid size deviation, tends to yield loss, functional failure are often caused by the flaws of the wafer, defects including physical on the wafer foreign bodies, chemical pollution, graphics, defects and lattice defects, etc. As a key process in semiconductor manufacturing, plasma etching in plasma equipment also has a great impact on functional failure. For example, the particles dropped from the reaction chamber on the wafer surface caused the etching to be blocked, and the insufficient etching time caused the through-hole and the sublayer metal to break up, etc. It can be seen from this that the yield improvement of LOGICAL integrated circuit can be divided into two parts: one is that the device department selects reasonable device parameters through experiments; the other is that the process department optimizes and solves various defects in the whole process; and the process integration department integrates the work of the above two parts to achieve the goal.

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Silicon rubber plasma processor surface treatment

Silicon rubber plasma processor surface treatment

Polymethyl methacrylate has been used as a contact lens material since the 1940s. PMMA is still widely used because of its high refractive index, suitable hardness and good bioaffinity. However, PMMA has poor hydrophilicity, which can cause long-term pannus closure and discomfort to the wearer. At the same time, its oxygen permeability is poor, serious can lead to complications. If the above shortcomings of PMMA can be overcome, its efficiency can be greatly improved. Plasma polymer of acetylene, nitrogen and water was used to coat PMMA lens surface, which can improve the hydrophilicity of material and reduce adhesion of corneal epithelial cells. The addition of organosiloxane to the polymer sandwich can improve the permeability of the material, but due to its inherent hydrophobic nature, siloxane will reduce its moisture retention. The surface hydrophobic problem of silicon-containing polymer can be treated by glow discharge generated by vacuum plasma cleaner. PMMA through vacuum plasma cleaning machine and polysiloxane binding material surface treatment, can reduce the surface carbon content, increase the oxygen content of PMMA, improve its moisture.   Contact lenses made of silicone rubber are called "soft" lenses. Silicone rubber has good permeability, soft texture, good mechanical elasticity, durability and other characteristics. Its disadvantages are too large viscosity, hydrophobic, liquid easy to permeate. Coating the silicone rubber with a layer of methane film can improve its moisture retention, reduce viscosity, reduce the permeability of liquid, and maintain its air permeability.   PMMA is a material commonly used for intraocular lens transplantation, but its contact with corneal epithelial cells can lead to damage of corneal epithelial cells. Hydrophilic monomers, such as hydroxyethyl isobutenate or N-vinyl pyrrolidone, can be deposited on the PMMA surface by grafting or irradiation with a vacuum plasma cleaning machine. Static "contact tests" between the cornea and lens of rabbits showed that PMMA surfaces without plasma treatment could cause 10-30% cell damage, while PMMA/HEMA composite surfaces could cause about 10% cell damage, and PMMA/NVP composite surfaces could cause less than 10% cell damage. Plasma deposition on C3F8, HEMA and NVP all significantly reduced corneal cell damage. In addition, adhesion ability of NVP membrane on PMMA surface was significantly lower than that of PMMA.   Plasma treatment is usually a plasma reaction that causes changes in the molecular structure of the surface or substitutions of the surface atoms. Even in the inert environment of oxygen and nitrogen, plasma treatment can produce high active groups at low temperature. In the process, the plasma also emits high-energy ultraviolet light and produces fast-moving ions and electrons that break the polymer's bonds and generate the energy needed for chemical reactions on the surface. The bulk properties of the polymer remain unchanged only if a few atomic layers are involved in the chemical process on the surface of the material. In addition, the possibility of thermal damage and deformation is avoided due to the low temperature of plasma treatment. Selecting appropriate reaction gas and process parameters can promote some specific reactions and form special polymer attachments and structures.

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Application of plasma surface treatment in plastic and rubber industry

Application of plasma surface treatment in plastic and rubber industry

Due to the non-polarity of polypropylene, PTFE and other plastic materials, in industrial applications, it will be difficult to bond the surface of some plastic products. In the absence of plasma surface treatment, the printing, bonding, coating and other processes have very poor effect, or even cannot be carried out. Some processes use some chemicals to treat the surface of these rubbers and plastics in the production process, which can change the adhesive effect, but this method is difficult to master, the chemicals themselves are toxic, the operation is very complicated, the cost is high, and the chemicals have an impact on the original excellent properties of rubber and plastics materials. Plasma surface treatment technology is used to treat these materials, so that these materials can play the role of structural surface under the bombardment of high speed and high energy plasma. Meanwhile, an active layer is formed on the surface of the materials to enable rubber and plastic to carry out printing, bonding, coating and other operations.   Plasma surface treatment for plastic surface treatment:   The study found that most plastics have low surface tension, such as polyethylene (PE) and polypropylene (PP), which have a surface tension of 31 Dyne,The surface tension of polyester (PET) and PVC (PVC) is 39 Dyne,Nylon (PA) is 41 Dyne.   In order to meet the requirements of printing and bonding, the surface tension must reach the dyne value of 38, 38, 52, 48, 56 or even higher. Until the invention of off-surface processing machines, many plastic process designs preferred materials, which could meet the requirements of spraying or bonding processes, before the use of such materials, because of the high cost of materials, manufacturing costs have been high. Since the 1980s, with the extensive application of plasma surface treatment, manufacturers began to focus on more plastic varieties, PP, PC, ABS, SMC all kinds of elastomer and a variety of composite materials have also been fully developed. Plasma surface treatment not only solves the adhesion between the same material components, but also solves the adhesion between different material components. In the new process, the traditional surface treatment (such as polishing machine, polishing effect is limited) and environmentally friendly water-based coating treatment (some treatment only about 40mN/m, the material can not be completely wetted) have been impacted. Although fluoride treatment has a good effect, a lot of harmful gases will be produced in the process of use, which often greatly increases the cost of waste gas treatment for manufacturers. Plasma surface treatment is an economical and environmentally friendly surface treatment process, the treated material surface can easily reach 65 because of the surface tension, to meet many high standards of process requirements. It is the use of electromagnetic discharge to produce plasma, jet to the surface of the material, thus greatly improving the surface energy of plastic products.   Plasma surface treatment for rubber:   Rubber and plastics are non-polar, not under the state of surface treatment, its printing, bonding, coating, and other functions are very poor, or even can not be carried out. In the surface treatment process of some rubber, the use of some chemicals, although it can improve the bonding effect, but this method is complex to operate, chemicals themselves toxic, very careful use, and the purchase cost is high, and the chemicals will destroy the rubber material part of the good performance. Plasma-surface treatment is used for rubber surface treatment, so that these materials can play the role of structural surface to a great extent under the bombardment of high speed and high energy plasma, and at the same time, an activation layer is formed on the surface of the material, so that rubber can be used for printing, bonding, coating and other operations. Using plasma technology to treat rubber surface, simple operation, no harmful substances before and after treatment, good treatment effect, high production efficiency, low operating cost.

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Plasma film deposition technology

Plasma film deposition technology

Plasma polymerization medium film can protect electronic components, using plasma deposition conductive film technology to protect electronic circuits and equipment from damage caused by static charge accumulation, plasma deposition film technology can also be used to make capacitor components. It can be widely used in electronic industry, chemical industry, optics and other fields.   Plasma volume silicon compound, SiOxHy is produced using SiH4+N2O(or Si(OC2H4)+O2). The air pressure is 1~5 ttos (1 ttos ≈133 pa) and the power is 13.5MHz. SiH4+SiH3+N2 was used for Si3N4 deposition at 300℃ and the deposition rate was 180 angm/min. The amorphous silicon carbide film is obtained SixC1+x: H by adding a carbon containing co-reactant silane, and x is Si/Si+C ratio. Hardness over 2500 kg/mm.   The selective osmosis and reverse osmosis membranes are prepared by depositing a thin polymer film on a porous substrate by plasma, which can be used to separate gases in the mixture, ions and water. It can also be combined with ultra-thin film layer to adapt to different selectivity, such as molecular size, solubility, ionic affinity, diffusivity, etc. In the conventional method, 0.5 mm film was deposited on the carbonate - silicon copolymer substrate, the permeation ratio of hydrogen to methane was 0.85, and the permeability of methane was higher than that of hydrogen. When the plasma deposited benzoyl cyanide monomer on the substrate, the ratio increased to 33, and the separation efficiency was greatly improved. Reverse osmosis membrane can be used for desalting seawater. When the water flow rate is lower than a certain threshold, the desalting effect is better. The polymer film has good permeability resistance, such as olefins, heterologous aromatics and aromatic amines.   The film prepared by plasma deposition technology can be used for optical elements, such as anti-reflection film, moisture-proof film, anti-wear film, etc. Plasma can be used in integrated optics to deposit a stable film according to the required refractive index and connect it to each element in the optical path. Such films lose 0.04 decibels of light per centimetre.

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