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Metal plasma surface treatment of metal surface treatment applications

Metal plasma surface treatment of metal surface treatment applications

Plasma surface processor (PSMP) USES energetic particles and active particles in the plasma to bombish or activate the metal surface in order to remove dirt. No chemical reagent is used in the plasma cleaning process, so it will not cause secondary pollution. The cleaning equipment can be reused, so the operating cost of the equipment is low, and the operation is simple and flexible, which can realize the overall or partial cleaning of the metal surface and the complex structure. The surface properties of some plasmas after cleaning can also be improved, which is beneficial to the application of metal processing. Principle of plasma surface treatment: In addition to gas molecules, electrons and ions, plasma contains a large number of neutral atoms, atomic groups, free radicals and the light emitted by the plasma. Plasma cleaning is a process in which ions, electrons, excited atoms, free radicals and their activation reactions with pollutant molecules on the cleaned surface are respectively used to remove pollutants. The role of electrons in cleaning metal surfaces: Electrons in the plasma collide with atoms or molecules to form excited neutral atoms or groups of atoms (also known as free radicals) that can react with contaminant molecules in an activation reaction that removes the contaminant from the metal surface. In the process of electron transport to the surface cleaning area, it will collide with the adsorbed pollutant molecules on the surface to promote the decomposition of pollutant molecules and generate active free radicals, thus triggering the further activation reaction of pollutant molecules. In addition, electrons, which have very little mass, move faster than ions, so they reach the surface earlier than ions and make the surface negatively charged, triggering further activation reactions. The role of ions in cleaning metal surfaces: The cation is accelerated by the surface of the negatively charged object to obtain a large amount of kinetic energy. In this process, a pure physical collision occurs, which makes the dirt attached to the surface of the object be stripped off. At the same time, the impact of the cation also increases the chance of the activation reaction of pollutant molecules on the surface of the object. The role of free radicals in cleaning metal surfaces: In general, in plasma, the number of free radicals is more than that of ions, which is electrically neutral, has a long life, and has a large energy. Cleaning process, the pollutant molecules on the surface to be quite easy to combine with high-energy radicals, generate new free radical, these free radicals are also in high energy condition, and unstable, easily autolysis, and translated into smaller molecules that generate new free radicals at the same time, this process will continue, until it is broken into stable, volatile small molecules, and finally make the pollutants from the metal surface, in this process, the main role of free radicals is characterized by activation of energy transfer, in the process of free radicals and surface dirt molecules, there will be a lot of binding energy released, The released energy ACTS as a driving force for the activation reaction of surface dirt molecules, which is conducive to the thorough removal of pollutants under the action of plasma activation. The role of emitting light in the process of cleaning metal surfaces: When the plasma is generated, it emits light, which has high light energy and great penetration. Under the action of light, molecular bonds of dirt molecules on the metal surface break, which is beneficial to promote the further activation of pollutant molecules and make them remove the dirt on the metal surface. To sum up, the plasma surface treatment machine rely mainly on the plasma electrons, ions and excited atoms and free radicals and other reactive ion activation, gradually break down the large molecules of organic pollutants on the metal surface, and finally form stable volatile simple small molecules, will stick to the surface of the dirt from the surface completely separated. The adhesion and wettability of metal surface can be greatly improved by plasma cleaning, and the improvement of these properties is of great help to the further surface treatment of metal materials. With the rapid development of high and new technology industry, plasma cleaning technology has been more and more widely used in electronics, semiconductor, photoelectric and other high and new technology fields.

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Vacuum plasma cleaning machine maintenance and use requirements

Vacuum plasma cleaning machine maintenance and use requirements

As the saying goes, sharpening a knife never misses a woodcutter. Good use of a good tool can often make the work more effective. Of course, the machine is also good to maintain, so below to share some of the vacuum plasma cleaning machine maintenance matters. Vacuum plasma cleaning machine maintenance: Note: All relevant safety precautions should be taken prior to the commencement of cleaning machine maintenance or repair, not limited to the contents mentioned here. I. Premise Work: 1. Turn off the power switch of the equipment and disconnect the main power protector. 2. Shut off all gas. 3. Prepare the necessary toolbox. Ii. Maintenance of vacuum chamber and vacuum generating system: 1. The vacuum cavity and the electric plate are the working areas of the workpiece. After being used for a certain period of time, some dirt will remain in the cavity and adhere to the electric plate and the wall of the cavity. Treatment method: After continuous use for one month, clean all electric plates and cavity walls with dust-free cloth (paper) dipped in alcohol to keep the cavity clean. 2. The observation window is used by the staff to observe the discharge in the cavity during work. After using for a period of time, the surface of the observation window glass will be slightly corroded, making it blurred. Treatment method: clean the glass with dust-free cloth (paper) dipped in alcohol or acetone or replace the vacuum glass directly. 3. Vacuum pump used in oil for oil to prevent oxidation, change in time is beneficial to the normal work of the vacuum pump, prolong the service life of pump body, suggest changing once every three months, often should observe in the vacuum pump oil is enough, if the oil level of oil level gauge instructions below cut-off use (clearly marked) by the side of the oil level gauge, inject new oil to normal oil amount in time. Iii. Specific steps for replacing vacuum pump oil: 1. Open the oil plug of the refueling port of the vacuum pump (inner hexagon wrench); 2. Open the drain plug on the oil valve (pay attention to the direction of the knob switch); 3. Release the oil safely, and then the oil level in the oil level meter will drop; 4. Tighten the drain plug after cleaning the oil in the pump; 5. Pour the new oil into the filling port and add more than the minimum amount; 6. Tighten the oil filling plug with a hexagon wrench; Note: Please inject pure and special oil when replacing. Remove the original oil from the vacuum pump. Staff should wear rubber gloves and face masks when changing oil. Please dispose of the waste oil properly and safely. Vacuum pump exhaust outlet is connected with oil mist filter, oil mist filter can remove nearly 90% oil mist discharged from the vacuum pump, can prevent the pollution of the working environment, but also can play a silencing effect. The filtered oil must be expelled from the body through the oil return port, otherwise the oil will accumulate between the filter element and the body, which will lead to the formation of oil mist. 1. It is recommended to replace the filter elements every three months. 2. If there is no exhaust, check whether the filter element is blocked, and consider replacing the filter element if necessary. The plasma generator is a high-frequency device, which involves frequency drift and other problems. After use, it should be adjusted once every 2 years or so. The customer should determine the time to contact the manufacturer and return to the factory for correction and adjustment. The seal of the equipment should be replaced every 18 months or so, and then every 18 months to ensure the reliability of the vacuum seal. Iv. Specific maintenance items of vacuum plasma cleaning machine: 1. Check the vacuum pump oil regularly every month to check the oil level and purity of the vacuum pump oil, observe the oil level window, and add to the position between the upper and lower of the oil red line when the oil level is close to the lowest red line scale; Observe the color of the oil. The normal oil is clean and transparent. When the oil becomes turbid (the oil color becomes grayish brown or the oil level window is blurred) and the noise of the vacuum pump is abnormal, replace the vacuum oil in time. 2. Cleaning the reaction chamber: first, use defatted cotton cloth dipped in anhydrous ethanol (commonly known as alcohol) to wipe the vacuum chamber (do not wipe the reaction chamber with ethanol to observe the glass). Secondly, gas (argon + oxygen or nitrogen + oxygen) is introduced into the chamber to react with plasma to remove the residue in the chamber. The processing time should be around 10 minutes, at least once a month. Check the integrity of the gas pipeline and vacuum hermetically. Check the integrity of the vacuum system periodically. This should be done after a thorough cleaning of the reaction chamber to avoid contamination from missing i

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The cleaning characteristics of plasma cleaning machine under different action

The cleaning characteristics of plasma cleaning machine under different action

Plasma cleaning machine in different role, its cleaning characteristics are also different, the following introduced a few for everyone to discuss oh. 1. Cleaning function: it can remove the weak bonds on the surface of the matrix and typical CH-based organic pollutants and oxides. Main features: for the material surface function and no erosion of the interior, can get a super clean surface, ready for the next process. 2. Etching: The typical gas combination is used to form etchable gas equivalence ionites and organic materials on the surface of the object to produce other gases such as CO, CO2, H2O, etc., so as to achieve the purpose of plasma etching. Main features: uniform etching of material workpiece; No harm to the workpiece substrate; It can effectively remove the foreign matter on the surface and achieve the ideal etching degree. Activation: Three groups -- C=O Carbonyl, -COOH Carboxyl, and OH Hydroxyl -- are formed on the substrate surface. These groups have stable hydrophilic properties and have positive effects on adhesion. Main features: active atoms, free radicals and unsaturated bonds can appear on the surface of the polymer. These active groups react with the active particles in the plasma to generate new active groups, increase the surface energy, change the surface chemical characteristics, and effectively enhance the surface adhesion and adhesion. 4. Coating (grafting and deposition) : In plasma coating and plating, two kinds of gases enter the reaction chamber at the same time, and the gases polymerize under the action of plasma. This application requires more rigor than activation and cleaning. Typical applications are the formation of protective coatings, applied to fuel containers, scratch-proof surfaces, similar to PTFE coating, waterproof coating, etc. Main features: it can make the molecular chain on the surface of the material break to generate new radical, double bond and other active groups, and thus generate crosslinking, grafting and other reactions in the process; The active gases can aggregate on the surface of the material to produce a sedimentary layer. The presence of the sedimentary layer will effectively improve the adhesion, coating and printing of the material surface. Shenzhen Sing Fung Intelligent  Manufacturing Co., Ltd. LTD. Is a high-tech enterprise engaged in plasma equipment research and development, manufacturing, production and sales. As a professional plasma equipment manufacturer, has many years of experience in plasma technology services.

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Application of semiconductor plasma cleaning machine in wafer cleaning

Application of semiconductor plasma cleaning machine in wafer cleaning

With the continuous development of semiconductor technology, the requirement of process technology is higher and higher, especially the surface quality of semiconductor chip. The main reason is that the particles and metal impurities on the surface of the chip will seriously affect the quality and yield of the device. In the current IC production, there is still more than 50% material loss due to the pollution of the wafer surface. In semiconductor manufacturing, almost every process needs cleaning, and the quality of wafer cleaning has a serious impact on device performance. It is precisely because wafer cleaning is the most important and frequent step in semiconductor manufacturing process, and its process quality will directly affect the yield, performance and reliability of the device, so companies and research institutions at home and abroad have been constantly studying the cleaning process. Plasma cleaning, as an advanced dry cleaning technology, has the characteristics of environmental protection. With the rapid development of microelectronics industry, plasma cleaning machine has been used more and more in semiconductor industry. Plasma cleaning has the advantages of simple process, easy operation, no waste treatment and environmental pollution. Plasma cleaning is commonly used in photoresist removal. A small amount of oxygen is introduced into the plasma reaction system. Under the action of a strong electric field, oxygen produces plasma, which rapidly oxidizes the photoresist into volatile gas and is pumped away. This cleaning technology has the advantages of easy operation, high efficiency, clean surface, no scratch and so on, which is helpful to guarantee the product quality. And do not use acid, alkali, organic solvents, more and more attention by people. The following is a brief introduction to the impurities and classification of semiconductors: Semiconductor manufacturing requires the participation of some organic and inorganic materials. In addition, because the process is always carried out by people in the purification room, the semiconductor chip will inevitably be contaminated with various impurities. According to the sources and properties of pollutants, they can be roughly classified into four categories: particles, organic matter, metal ions and oxides. 1.1 particles: Particles are mainly polymers, photoresist and etching impurities. This contaminant is usually adsorbed on the wafer surface and affects the geometric pattern formation and electrical parameters of the photolithography process. The removal method of this kind of pollutant is mainly to clean the particles through physical or chemical methods, gradually reduce the contact area between particles and the surface of the wafer, and finally remove. 1.2 Organic matters: Organic impurities come from a wide range of sources, such as human skin oils, bacteria, oil, vacuum oils, photoresist, cleaning solvents, etc. These contaminants usually form an organic film on the surface of the wafer to prevent the cleaning solution from reaching the wafer surface, resulting in incomplete surface cleaning and leaving contaminants such as metal impurities on the surface intact. Removal of such contaminants is usually done in the first step of the cleaning process, using mainly sulfuric acid and hydrogen peroxide. 1.3 metals: Common metal impurities in semiconductor technology include iron, copper, aluminum, chromium, tungsten, titanium, sodium, potassium, lithium and so on. The sources of these impurities include various containers, pipes, chemical reagents, and metal contamination in semiconductor wafer processing. Chemical methods are often used to remove such impurities. Cleaning fluids prepared with various reagents and chemicals react with metal ions to form metal ion complexes, which are separated from the wafer surface. 1.4 Oxide: A natural oxide layer forms on the surface of a semiconductor chip exposed to oxygen and water. Not only does this oxide film block many of the steps in semiconductor manufacturing, but it also contains metal impurities that, under certain conditions, can transfer to the chip and form electrical defects. The removal of this oxide film is usually accomplished by immersion in dilute hydrofluoric acid.

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Application of plasma surface processor in textile processing

Application of plasma surface processor in textile processing

Textile industry is one of the industries with a long history of mankind, and also an important part of the industrial revolution. For a long time, in order to adapt to the changing consumer changes and cope with the increasingly severe environmental pressure, the textile industry has been developing and making progress. Textile plasma surface treatment technology is developing rapidly in China. The early plasma surface treatment technology has been replaced by new atmospheric plasma surface treatment technology. This new technology can improve the performance of a fabric by changing its surface properties. Development Trend of textile Industry: The textile industry provides a large number of jobs, creates a lot of wealth, and also has a huge impact on many industries, including mechanical engineering, polymer materials, chemistry and fuel. Since the 1990s, market drivers have included design and innovative fabrics, as well as increased investment in new technologies by industrialized countries to reverse the long-term decline of their textile and clothing industries. Earlier, the newly industrialised countries of East Asia that had succeeded in entering western markets were beginning to find their places being taken by a new generation of developing countries. In the whole textile industry chain, the competition between enterprises and western countries is increasingly intensified. Most countries with developed garment industry have established r&d centers, which are engaged in extensive improvement research and basic research work. Textile plasma surface treatment: The textile industry has long recognized that the surface performance of fabrics is a critical factor in many processing processes and applications, and the specific requirements for the surface performance of fabrics are often very different from that of base fabrics. The surface properties of the fabric not only determine the dyeing rate and color fastness of the fabric, but also determine the simplicity of the finishing process of the fabric, determine the binding strength between the coating and the base cloth, and play a crucial role in the biocompatibility between the coating and the base cloth. In addition, surface properties play a key role in the disinfection performance and biocompatibility of medical implants requiring liquid chemical treatment. Conventional textile processing technology consumes a large amount of energy and water resources in the processing process, causing serious water pollution, high cost and environmental damage. In the conventional fabric treatment process, the surface treatment of the fabric is carried out at the same time as the base fabric treatment, which will adversely affect the overall performance of the fabric. Therefore, the textile industry urgently needs to choose alternative surface treatment technology to reduce production costs, protect the environment, and produce new products with long life, high quality and good performance. Certain properties of fabrics can be adapted to meet specific needs by changing the function or shape of the fabric surface. By etching the fiber surface, cracks and cracks can be created on the fiber surface. This etching can help enhance the wettability of the fabric, thus achieving more effective dyeing or deep dyeing. Conversely, by reducing the wettability of the fabric can be achieved waterproof effect. The new chemical function of fabric surface can promote the reaction between fabric surface and dyes, thus greatly improving the adhesion between layers. It is a very complicated process to change the surface property of fabric by plasma surface treatment. The reactions initiated by the particles in the plasma usually occur at a depth of 10nm from the surface of the material. The radiation caused by short-wave ultraviolet radiation in the plasma is very deep, within 100nm of the surface. The working gas and other process parameters of plasma can change the interaction and range of action between the two reactions. The outermost layer of the fabric is only a few atoms thick, usually less than 1nm, but it determines how the fabric interacts with other media. The chemical composition of the outermost layer of the fiber surface determines the interlaminar bonding ability of the fabric and the suitability of the fabric for impregnation. The outermost layer of the fiber chemical structure and composition can be modified by plasma. The fabric surface treatment not only needs to choose the appropriate process parameters, but also the original surface performance of the fabric is also important. At present, plasma surface treatment technology has been applied to the surface modification of textiles and the modification of base fabrics, which has successfully improved many kinds of fabrics from traditional fabrics to advanced composite fabrics. The results show that the surface energy of fiber and fabric can

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Plasma cleaning machine to increase the surface viscosity of materials

Plasma cleaning machine to increase the surface viscosity of materials

Plasma cleaning machine is the key technology of ultra-fine environmental cleaning, surface activation and plasma coating. Plasma cleaning machine can not only clean and remove dirt, but also improve the surface performance of the material itself. For example, to improve the surface wettability, increase ink, coating, coating adhesion, enhance the material's surface energy, hydrophilic. Adhesiveness refers to the stability of the connection or combination between the substrate and the adhesive coating. The separation force is the standard for bonding performance and is directly applied to the separation force value during bonding (peel test, end force test). Plasma cleaning machine can improve the surface adhesion of materials, is a very environmentally friendly treatment method. If the binding force is higher than the adhesion strength of one of the two bonds, the adhesion performance is better. If the separation of attachment is not caused by the dissolution of the compound but by the fracture of the material in a pair of complexes, then the above situation is corresponding. If the coating material (paint, adhesive) completely wet the substrate, it can achieve good adhesion. Wettability can usually be determined by: Check ink; LABS testing; Contact Angle measurement. No matter what kind of substrate or coating, the basic use of plasma cleaning machine must be pretreated, the purpose is to get enough adhesion, because there are always some factors will affect the adhesion. Preprocessing includes at least one or more of the following sets of steps: Cleaning: especially for the removal of hydrocarbons (mold release agent, oil, grease, etc.), the plasma cleaning machine can be used for processing, can completely remove such substances, so as to improve the surface adhesion. Plasma activation: in order to completely bond the coating, the surface of the substrate must be greater than the surface tension of the coating. The surface energy can be increased by plasma activation, and almost every material combination can achieve complete binding. Increase surface area: A rough (clean, active) surface is much better than a smooth (smooth) surface. Through plasma treatment coarsening, surface roughness (increase surface area) can be realized, so as to realize frosting and sandblasting processing. Corrosion: chemical etching, plasma etching, micro-sandblasting. Oxidation removal: By plasma treatment, the oxide layer on the material surface is also removed.

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