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Plasma etching solutions for two-dimensional materials in integrated circuits

Plasma etching solutions for two-dimensional materials in integrated circuits

In recent years, there are many two-dimensional materials similar to graphene that have been discovered and studied. Due to its ultra-high mobility, people have paid wide attention to them, such as molybdenum sulfide, black phosphorus, silicon, tungsten selenide and so on. The common characteristics of this kind of two-dimensional materials are: ① is a layered structure, all atoms are located in one or two planes. These materials can form two-dimensional electron-gas transport in the two-dimensional direction, which enables them to have very high mobility in the undoped state, and the threshold voltage is very small. The device does not need to use the reverse region to operate, and does not need to use deep Wells to limit leakage and migration. These advantages will save a lot of plasma doping process for chip processing and greatly save the cost. The difficulty, of course, is finding the right dielectric layer and metal electrode; Predictably, once such materials are used in chip manufacturing, how to improve the contact resistance becomes a whole new problem. ② At present, such materials are not widely available. This kind of two-dimensional material has high activity, rigidity and easy fracture. At the beginning of the study are dispersed by ultrasonic material plasma in benign solvent in the monolayer or multilayer structure, the method of material area is not too big, but with the in-depth study and industrial demand, this kind of material is expected to the growth of large area, only need to explore the substrate material and the growth conditions. (3) Such materials often do not have band structure or very narrow band, which leads to their high activity, easy to capture or release charge. In industry this makes the process more difficult. The thermal conductivity and hardness are also good, and often have the characteristics of the dominant direction of heat conduction and the dominant direction of electrical transmission is different. ⑤ in the direction of the vertical two-dimensional surface conductivity is very low, even insulation. The above characteristics of these materials are both high performance and low practicability characteristics, but there is no doubt that every shortcomings to overcome will make it a step forward in the use of the road, will also bring great commercial value. The etching of these materials is generally difficult, because they are characterized by strong activity, small volume and extremely thin thickness of the target material. It is difficult to control the etching parameters when using strong chemical etching plasma etching. It's obviously not a good idea to use a high-energy plasma, because that would damage the film. At present, there is no mature etching technology to carry out patterning. According to the development of etching technology in recent years, the increasingly mature atomic layer etching or remote plasma etching technology is expected to solve the etching problem of this kind of material. Atomic layer etching has the characteristic of precise positioning etching quantity, and distal plasma etching is the representative of low damage etching technology. In principle, plasma etching of two-dimensional materials is expected to be solved by it, and of course, it is hoped that other new etching processes will emerge. At present, the semiconductor device processing of these two-dimensional materials is mostly in the laboratory stage. The main method of film formation is to peel the lamellar structure from the bulk material. Most of these 2D materials are highly active and have the characteristics of instability when they meet water and air. With time in the air, the morphology of black phosphorus peel changes constantly, and its thickness also increases. It is formed by the interaction with water and oxygen in the air, and this material property will greatly affect the stability of the device. Large area processing difficulties and harsh stability conditions are two major problems in the industrialization of two-dimensional materials. The above is the CRF plasma etching manufacturer of two-dimensional materials in the application of plasma etching solutions in integrated circuits.

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Small vacuum plasma cleaning machine vacuum plasma cleaning surface material modification

Small vacuum plasma cleaning machine vacuum plasma cleaning surface material modification

Small vacuum plasma cleaning machine vacuum plasma cleaning surface material modification Small vacuum plasma cleaning machine can improve the adhesion of the material surface, improve the adhesion performance of the material, solve the problem of adhesion. The effect of vacuum plasma cleaning is very obvious when the contact Angle is measured during the actual operation, and the uniform and thorough adhesion of material modification is improved. Small vacuum plasma cleaning machine is a method to improve the surface adhesion, improve the bonding properties of materials, and solve the problem of bonding. A lot of materials in the factory, originally rely on the corona treatment effect, but the effect of plasma treatment is far better than ordinary treatment. Small vacuum plasma cleaning machine Equipment parameters of vacuum plasma cleaning machine: Customized cavity plasma cleaners from 2 litres to 23 litres or more are available. Here we focus on small vacuum plasma cleaners. The equipment uses a temperature control system to ensure that heat/humidity sensitive materials are not damaged. Can be processed on any product, different products after the actual treatment of the effect is not the same, specific through the contact Angle tester hydrophilicity test, through a large number of tests we found that almost all materials after plasma treatment, hydrophilicity has changed to different degrees. Oxygen argon plasma and hydrogen plasma cleaning: Using different types of gases (oxygen, argon, nitrogen, hydrogen, helium, etc.), small vacuum plasma cleaners can change a variety of properties of the substrate surface. This includes but is not limited to: 1. Improvement of surface tension/surface energy/contact Angle characteristics. 2, improve the adhesion of the surface. 3. Hydrogen plasma is very effective in removing oxides from glass or metal products. 4. Change the wettability of the surface to produce hydrophilicity or hydrophobicity (increase or decrease the adhesion of the liquid)- for pretreatment, coating and coating. 5, coating process: adhesion, wettability, corrosion resistance and wear resistance, electrical conductivity and insulation, magnetic induction, reflective/reflective, anti-microbial, scratch resistance, waterproof, coloring, etc. Plasma activation refers to the treatment of a polymer to improve its ability to be coated or printed. This is done by oxidizing the outer layer of the polymer using an oxygen plasma. Argon is often used in easily oxidized metals. This can not only produce cleaning products, but also increase the polarity, directly improve the printing and coating performance of polymer products, oxygen plasma is also activated by plasma.

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Vacuum low temperature plasma processor technology provides activation effect in flexible materials

Vacuum low temperature plasma processor technology provides activation effect in flexible materials

        The vacuum low temperature plasma processor technology provides an excellent surface activation effect on flexible materials. It can be used for plasma cleaning before wire bonding to provide a cleaner bonding surface, provide surface activation function for flexible materials, and the removal process is uniform and stable. . Vacuum low temperature plasma processor technology         The plasma treatment of the vacuum low temperature plasma processor has always been regarded as an important process in the microelectronics and semiconductor packaging industry. Before introducing a suitable plasma process, plasma cleaning can make the bonding surface cleaner, thereby reducing product failures. The potential benefits are improved surface activity of flexible materials, improved equipment reliability, and elimination of deviations due to unsystematic effects, such as random surface contamination caused by uncontrollable factors.         The low-temperature plasma processor has an "alchemy" or "black box" halo. The plasma contributes to the performance of the lead connection process and the long-term reliability of the packaged device. Plasma has a double advantage: it improves the wire connection process itself and ensures the long-term reliability of the device. In order to greatly improve the quality and success rate of its manufacturing process and products through plasma cleaning before in-line bonding, the vacuum low temperature plasma processor plasma is a completely independent system. It not only saves energy, but also occupies a small space, so that the processing capacity is enlarged, and the production base area is reduced at the same time.         The double-layer rack cabinet of the vacuum low temperature plasma processor can install 20 30x35 inch panels in one cycle, and the multi-functional horizontal rack cabinet can handle a variety of different flexible PCB sizes and can be loaded easily. Efficient anti-fouling etching technology can remove epoxy resin, polyimide, compound and other resins, and has the ability to remove dust, which can effectively remove the resist residue on the inner layer and the panel and the residual solder paste exudation Objects, thereby improving adhesion and solderability.

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Glass plasma surface activation treatment plasma glass processing machine application

Glass plasma surface activation treatment plasma glass processing machine application

Glass plasma surface activation treatment plasma glass processing machine application:         Chengfeng Zhizao has accumulated a wealth of practical experience in the mobile phone glass industry, and has cooperated with many manufacturers to improve the bonding and coating performance of the glass. No matter what kind of glass is used, plasma glass processing machine plasma processing makes the bonding process easier. Plasma glass processing machine         It is difficult to stick glass products, what to do? Plasma glass processing machine will help! For many people, sticking materials to glass is a complicated and difficult process. However, the use of glass plasma surface activation treatment technology can effectively solve this problem.         Plasma glass cleaning includes:         1. Pre-treat glass jars and bottles before labeling.         2. Treat the glass bottle before inkjet printing.         3. Treatment of large area glass panels before coating.         4. Use UV curing adhesive to treat the glass bottle before plastic.         Although the surface of the glass is smooth from the human eye, there will be some impurities on the surface from a microscopic point of view, which will hinder the adhesion. The uneven surfaces of the glass sheets and glass pieces will attract contaminants and cause many problems. Contaminants on the surface of the glass sheets will significantly reduce the bonding quality, leading to defects in the glass sheets during use.         Plasma surface activation treatment of plasma glass processing machine increases the adhesion to glass due to its strong cleaning ability. The gas used to generate plasma (usually compressed air) is discharged by high-energy, after being purified by the plasma, it can be decomposed into ions, electrons, free radicals and other excited particles. This kind of excited particles can even remove organic contaminants on the glass surface at a microscopic level, and can even remove difficult-to-reach peaks and grooves.         The cleaning quality of plasma is stable and reliable, ensuring that all organic pollutants can be removed from the surface of the material, and plasma treatment will ensure a stable, high-quality combination. Surface treatment provides a cost-effective, environmentally friendly and more important process before bonding, printing and coating, which is easy to repeat to ensure high-performance bonding to glass. Adding a plasma glass processing machine can not only increase adhesion, but also produce a consistent and effective effect.         Plasma treatment of the glass plate before coating is an independent online surface activation method used by many large glass producers and manufacturers. This method is suitable for situations where the manufacturer wishes to increase the bonding strength of the glass plate before painting. Plasma surface treatment can be uniformly processed on glass panels of different sizes, and the processing speed does not change much, providing consistent, uniform and activated processing for the glass. Plasma glass processing machine plasma processing technology can significantly improve the production process, ensuring the increase in speed and efficiency.

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Influence of Low Temperature Plasma Technology Treatment Process Design on the Performance of Fabric Sputtered Copper Film

Influence of Low Temperature Plasma Technology Treatment Process Design on the Performance of Fabric Sputtered Copper Film

The influence of low-temperature plasma technology treatment process design on the performance of fabric sputtered copper film:         Nano-copper film is a new type of functional material with surface effect, quantum effect and other characteristics, and its good electrical conductivity is widely used in chemical, textile, medical and electronic industries. Low-temperature plasma treatment technology is an environmentally friendly surface treatment technology that can be applied to the surface treatment of different materials to achieve cleaning, etching, or grafting. Low temperature plasma technology treatment process design         The surface of the textile material is treated with low-temperature plasma technology and the nano-copper film is deposited on the surface of the textile material as a matrix, which can be used as an ideal functional material and increase the added value of textiles. The surface of polyester substrate without plasma pretreatment is smoother and the deposited nano-copper particles are unevenly distributed. However, the surface is uneven after argon plasma pretreatment, and the nano-copper particles can basically cover the surface of the substrate to form a complete film. This indicates that the argon plasma pretreatment has a certain etching effect on the polyester substrate, which increases the surface roughness of the fiber, and the increase in the specific surface area of ​​the nano-copper particles is easier to adsorb on the surface of the fiber.         When the surface of the substrate is not treated by low-temperature plasma technology, the sheet resistance value of the nano-copper film is 215.2 2/0. After argon and oxygen plasma treatment, the sheet resistance of the copper film is 192.7 and 137.6 0/0, respectively, which are reduced by 10 6% and 36.1% conductivity is significantly improved. This is due to the increased probability of nano copper particles reaching the surface of the polyester substrate after the polyester substrate is treated with oxygen plasma; on the other hand, it is also related to the free carrier concentration and mobility in the copper film.         After the substrate is treated by low-temperature plasma technology, the oxygen plasma treatment is designed to desorb the oxygen vacancies or interstitial copper atoms in the film due to the desorption of negatively charged oxygen groups. The increase in the concentration of free carriers causes the resistivity to decrease. After the substrate is plasma treated, the sputtered copper atoms or atomic groups reach the surface of the substrate, and the frequency increases and its energy is significantly enhanced. Deposited on the substrate has enough energy to crystallize and migrate, so the mobility of free carriers is also higher. The film is relatively dense and the particle size is relatively large. At the same time, the strong indirect scattering of the crystal grains also causes the resistivity of the film to decrease.         The contact angle of distilled water droplets on the copper-plated surface of polyester fabric without plasma treatment was 97.42° after about 20 s, and the state was similar to a spherical shape. It was difficult to spread on the surface of the fabric, indicating that the wettability of copper-plated polyester fabric was extremely poor. This is because the molecular structure of polyester fiber lacks hydrophilic functional groups such as hydroxyl and carboxyl groups. There is no direct force between water molecules and polyester fiber macromolecules, so the fabric cannot be wetted for a long time.         The wettability of distilled water droplets on the copper-plated surface of polyester fabric treated with low-temperature argon and oxygen plasma. The droplet shape gradually changed from a spherical non-wetting state to a spreading wet state. The contact angles decreased to 85. 09 ° and 36, respectively. . 79. It can be seen that the plasma treatment improves the penetration effect of droplets on the surface of the copper-plated polyester fabric.         This is because the etching effect of plasma treatment increases the roughness of the fiber surface and also introduces some oxygen-containing polar groups (such as hydroxyl, carboxyl, etc.) on the surface of the fabric, thereby increasing the gap between the copper nanoparticles and the polyester fiber. Interaction. The oxygen plasma pretreatment makes the surface change of the polyester substrate more obvious than that of the argon plasma treatment. The contact angle of droplets on the surface of the copper-plated polyester fabric is smaller and the hydrophilic performance is obviously improved.

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Application of plasma surface treatment device in the field of instrument manufacturing

Application of plasma surface treatment device in the field of instrument manufacturing

Application of plasma surface treatment device in the field of instrument manufacturing:         The plasma surface treatment device is used as a very effective surface activation method. The plasma method is particularly suitable for safe surface treatment, can realize an online process mode, and is widely used in the field of instrument manufacturing. Plasma surface treatment device         The dimensional accuracy and appearance quality of plasma surface treatment equipment used in the field of medical instrument injection processing are very important. In some special cases, the processing flow that originally required multiple components to be assembled separately has been simply double-component Instead, the two components here are a composite injection molded part made of PC material and a metal sleeve made of embroidered steel material. The device must have good leakage resistance, that is, the bonding between the two components must be very tight, and the application of plasma surface treatment device plays a key and decisive role in meeting the technical requirements. In order to achieve dense bonding, we are Before embedding and assembly, the metal bushing is pretreated under a fully automated controlled plasma.         This pretreatment process successfully overcomes many assembly process problems such as compression, tiny pores and gaps, and achieves an ideal leak-proof effect, especially when the cleaning fluid has a low viscosity, even very small pores. Liquid leakage will occur. This problem can also be solved by the plasma surface treatment device. At the same time, this technology can also enable the original injection molding process with a very narrow process window to be performed under wider process conditions, thereby improving the cleaning efficiency. Reduced cleaning costs.

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