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The potential application of germanium in integrated circuits by plasma etching manufacturers and its etching methods (middle)

The potential application of germanium in integrated circuits by plasma etching manufacturers and its etching methods (middle)

As a new generation of semiconductor material, germanium has a great possibility to be used in IC manufacturing industry. And in the semiconductor industry planning also germanium as the future integrated circuit PMOS tube material. The use of germanium in the fabrication of integrated circuits, where large areas of germanium or germanium alloy films are defect-free, is a major obstacle in the way of industry. For germanium etching, there are two common etching methods. One is chlor-based etching, which is easier to achieve and does not introduce changes in electrical properties. The disadvantage is that it is difficult to control the overall shape. In general, germanium etching has a high aspect ratio, or multi-layer structure, in the etching to maintain good graphics transfer needs to use a lot of means. Chlorine (400 w, 200 SCCM, ER ~ 200 a/s) of the boundary of the etching will not damage the interface (lateral boundary lattice intact), it is of vital importance in high-performance device, may leave out the subsequent repair injury of lattice technology, reduce costs, to etch itself also reduces the difficulty, but we can also see, the wall graphic control is not good enough to get the graphics around 75 ° Angle, it is difficult to meet the actual needs. For the control of the profile shape of the side wall, the general practice is to add polymer etching gas and control the overall shape by multi-step etching. Argon gas and chlorine gas are mainly used to control the shape of the graph by adding polymer etching gas or changing bias pressure, and the graph of different side wall morphology is obtained respectively. CH3F and chlorine are very effective at controlling the form. The regulation of bias voltage and flow rate plays an important role in controlling the bottom shape. By these means, the form control of germanium and the adjustment of key dimensions can be accomplished.

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Atmospheric low temperature plasma cleaning machine manufacturers

Atmospheric low temperature plasma cleaning machine manufacturers

Atmospheric low temperature plasma cleaning machine is a set of physics, chemistry, biology, environmental science as one of the comprehensive interdisciplinary. Therefore, the emergence of low temperature plasma has been favored and recognized by many friends. Therefore, what are the characteristics of low temperature plasma cleaning machine equipment manufacturers? The following is a small series with you in detail. When the low-temperature atmospheric plasma cleaning machine is used, it can run by itself after it is started up. It is very limited by the working conditions and does not need special operation. It can be said that the low-temperature plasma technology is very high end, and the process is also very simple. Secondly, the use of low-temperature plasma cleaning machine friends should know, because there is no mechanical equipment, in the cleaning operation, not only the air resistance is very small, and compared with other cleaning equipment, power consumption is less. Third, no matter the switch or off, the working speed of the atmospheric low temperature plasma cleaning machine is very fast, and can be used anytime and anywhere, not affected by the temperature. It can work well even under 250 degrees, or in foggy working conditions. Four is because the low temperature plasma cleaning machine is made of stainless steel and copper and other materials, its oxidation resistance and corrosion resistance are very good, so as long as we can maintain it regularly, its service life is very guaranteed. Five is the use of low temperature plasma cleaning machine work, only need to consume power, basically will not take up labor costs, and equipment failure rate is very low, even if long-term use will not increase maintenance costs. Because the characteristics of plasma cleaning equipment are so significant, so it has been favored by many enterprises as soon as it is listed, and in recent years, with the development of society, the demand for cleaning machine is more and more large, as long as we buy from the regular atmospheric low temperature plasma cleaning machine manufacturers, the quality is more guaranteed.

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Plasma surface treatment technology has improved non-woven fabric treatment

Plasma surface treatment technology has improved non-woven fabric treatment

In recent years, a great deal of research has been done on the application of plasma surface treatment to nonwovens. Surface modification of blood filtration material PBT melt-blown nonwovens by air and AR atmospheric plasma surface treatment can significantly improve the wettability of the material surface. Ar vacuum plasma surface treatment technology was used to modify the surface of polypropylene nonwovens used for battery diaphragm. The plasma surface treatment can improve the alkali absorption speed and rate of the material, thus improving the performance of battery diaphragm. Plasma surface treatment and modification treatment have some influence on the mechanical properties of polypropylene nonwovens for battery diaphragm, but it will not affect their normal use. Using the O2, N2 plasma PET nonwovens for plasma surface modification treatment, can improve the wettability of the material surface, using the O2 plasma treatment, after 60 s PET nonwovens instantaneous water absorption and large bibulous rate is increased, use of air plasma surface treatment can effectively improve hydrophilicity on the surface of the viscose spinning polyester nonwovens, plasma control of processing conditions on the degree of modification. After He/O2 plasma surface treatment, the wettability and moisture regain of PET spunbonded nonwovens are increased to more than 10 times and 3 times as much as before modification. Surface treatment of polypropylene nonwovens was conducted by HE glow discharge plasma at atmospheric pressure. The results show that the surface morphology changes are related to the tensile strength, stress properties, air permeability, wettability and other factors of the fabric.

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What is the function of plasma surface processor in helmet production

What is the function of plasma surface processor in helmet production

Since 2020, the "One helmet and one belt" safety campaign has been carried out nationwide. So far, wearing helmets on electric vehicles appropriately and standard has become an important aspect of raising public transport safety awareness in cities. Although the technology content of helmet production and processing is not high in recent years, it also shows the development trend of intelligent system, high tear resistance, high toughness, lightweight, extraordinary and so on. What is the role of surface treatment technology of plasma surface processor in helmet manufacturing? The following Xiaobian and everyone to discuss with each other. The manufacturing process of the helmet includes injection molding, molding, painting, packaging and printing, assembly and other steps. The plasma cleaning mechanism key is applied before the printing process of the helmet shell. Of low temperature plasma metal surface treatment technology, may to the helmet shell selection of fiber materials and polymer materials surface cleaning, make the raw material of the helmet shell surface activation, coarsening, improved the interfacial tension of raw materials and water, to improve the printing ink adhesion strength, improve the quality of helmet packaging and printing, to make it more beautiful, more strong and durable. The role of plasma surface treatment machine through the conductive gas generated plasma technology, often contains special particles in plasma technology, these particles can react with helmet shell surface of raw materials, polymer materials such as ABS, PC, carbon fiber, so as to cut off the long molecular chain structure, raw material surface on the surface of high-energy group, in addition, the helmet shell can also by bombarding particle physics, produce micro not smooth surface of the human eye is difficult to see, to improve surface activation energy of the raw materials, improving packaging and printing performance. The plasma cleaning machine is used to treat the metal surface of the raw material of helmet shell, which has the characteristics of simple process flow, simple operation, clean and zero pollution, and can take into account the requirements of environmental protection. In addition to these, Xiaobian would like to tell you that plasma surface treatment will not destroy or change the quality of the helmet shell raw material, processing safety and high efficiency, suitable for a large number of quantified helmet shell.

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Plasma processing machine for plastic film to provide you with pretreatment solutions

Plasma processing machine for plastic film to provide you with pretreatment solutions

Believe that you are no stranger to thin film materials, optical film, composite film, plastic film, metal film, superconductor film and so on, are more common membrane materials, and the thin film material is typically preprocessing, surface treatment of low temperature plasma processor, is a new kind of pretreatment method, through the processing of plasma processor, can be carried out on the thin film material surface cleaning, activation and coarsening, thus improve the film surface tension and adhesion, some friends to pretreatment the link still don't know, let's through plastic film packaging and printing industry is a typical example, To understand the necessity of film material pretreatment. The plastic film is light and transparent, oxygen-resistant and moisture-proof, smooth and folding resistant. It has advantages in performance and price, so it can often achieve good results in modern packaging and printing. But the plastic film is a non-polar polymer material with poor wetting, ink adhesion and color fastness. If the ink is directly bonded without pretreatment, it is easy to fall off and the printing effect is poor, which affects the printing and packaging effect. In addition, the pre-treatment can also improve the subsequent plastic film coating, composite, bronzing and other processing quality. Therefore, before printing, the thin film material must be treated by plasma processor or other pretreatment methods. Now that we have a certain understanding of the pretreatment of film materials, then the more common pretreatment of plastic film is chemical oxidation treatment, corona treatment and plasma cleaning treatment. The following to introduce the pretreatment of plastic film plasma processing machine processing. Plasma processor device surface treatment method is in the process of ionization, forming active particles in plasma, react with plastic film material surface, thus destroy the long chain molecules on the surface of the membrane material, form the high-energy group, in addition, the thin film material after being bombarded with particle physics, will form the rough surface, make the surface of the plastic film material freedom can be improved, as to enhance the surface dyne value performance. Plasma processing machine low temperature plasma surface treatment process is simple, easy to operate, clean and pollution-free, in line with environmental protection requirements, and safe and efficient treatment, no damage to the film material, suitable for mass production, production environment requirements are not high.

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Study on graphene plasma etching of plasma cleaning machine manufacturers

Study on graphene plasma etching of plasma cleaning machine manufacturers

Since 2004, there have been numerous research reports on graphene, including hundreds of related reports in Science and Nature. Research on graphene dates back to the 1970s. Clar et al. used chemical methods to synthesize a series of compounds with large conjugated systems, namely graphene sheets. Since then, Schmidt and other scientists have improved their method and synthesized many graphene derivatives with different edge modification groups, but this method cannot produce large planar graphene structures. In 2004, Geim et al. took graphite as raw material and obtained a series of new materials "graphene" called two-dimensional atomic crystals through micromechanical stripping method. Graphene, also known as a "single-layer graphite sheet," refers to a dense layer of carbon atoms wrapped around a lattice of honeycomb crystals, arranged in a two-dimensional structure similar to the single-atom layer of graphite. Geim et al. made use of nanoscale gold "scaffolding" to create a monolayer graphene film suspended on it. They found that the suspended graphene film was not a "two-dimensional flat structure", but a "microwave-like monolayer structure", and attributed the stability of graphene monolayer structure to its "nanoscale micro-distortion". Graphene is a zero-band gap material where electrons and holes can exist continuously, even at room temperature. Carrier concentration can be as high as 10-13cm3, and mobility can exceed 2000cm2 /V·s. The theoretical specific surface area of graphene is as high as 2600m2/g, and it has outstanding thermal conductivity (3000W/m·K) and mechanical properties (1060GPa). In addition, its special structure, so that it has half integer quantum Hall effect, never disappear conductivity and so on. Graphene can be used as both a channel material and a backend interconnection due to its excellent two-dimensional transmission properties and high electrical conductivity. Of course, different use of etching process requirements are also different. However, graphene faces two problems in chip manufacturing applications: one is how to continuously grow high quality films in large areas; The second is how to pattern. The second aspect is closely related to the etching process. In contrast, there has been a lot of research on large areas of growth, but not a lot of work on patterning. This is because it is difficult to grow large areas of graphene on its own, and even fewer have the ability to develop both. In general, there are several plasma etching methods for graphene, such as oxygen, hydrogen and argon. This in addition to oxygen and hydrogen plasma etching more. They take advantage of graphene's high activity to react with it, typically splitting large areas of layered graphene along 60° or 120°.The above is the CRF plasma cleaning machine manufacturers on graphene plasma etching research some introduction.

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