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How is the use of plasma cleaners in the electronic screen industry?

How is the use of plasma cleaners in the electronic screen industry? Modern touch screens, LCD monitors and TV screens place high demands on the production process, because plastic parts must be treated with highly transparent scratch-resistant and anti-static coatings before bonding and assembly. Removing the impurities on the surface of the mobile phone screen and roughening the surface is conducive to improving the adhesion of the mobile phone screen coating and making it stick more firmly. Our conventional sandpaper polishing is obviously not suitable for use on the mobile phone screen, because it will Scratching the screen of the mobile phone will affect the use. Is there a way to remove the dirt on the surface of the screen and improve the roughness of the surface without affecting its aesthetics? The plasma treatment process of the plasma cleaning machine can be very solve this problem well. First of all, the plasma generated by the plasma surface cleaning machine contains electrons, ions and active free radicals. These particles are relatively easy to react with organic pollutants on the surface of the material to generate volatile and harmless gases, such as CO2 and water vapor. The whole reaction The process time is short, the efficiency is high, and the treatment effect is good. Secondly, when the plasma-treated mobile phone screen is being coated or sprayed, the active components in the plasma will quickly form chemical bonds with the material and the sprayed material. This bonding can greatly improve the strength of intermolecular bonding and make The film layer is difficult to loosen. The COG assembly process of the LCD is to mount the bare IC on the TO glass, and use the compression and deformation of the gold ball to make the pins on the ITO glass and the pins on the IC conduct. Due to the continuous development of fine line technology, it has developed to produce products with a pitch of 20um and a line of 10um. The production and assembly of these fine circuit electronic products have high requirements on the surface cleanliness of the TO glass, and the products are required to have good solderability, firm soldering, and no organic and inorganic substances remaining on the ITO glass to prevent the TO electrode terminals from contacting with each other. The continuity of the IC BUMP, therefore, the cleaning of the TO glass is very important. In the current ITO glass cleaning process, everyone is trying to use various cleaning agents (alcohol cleaning, cotton swab + lemonade cleaning) for cleaning, but due to the introduction of cleaning agents, it will lead to the introduction of cleaning agents. Therefore, exploring new cleaning methods has become the direction of efforts of various manufacturers. Through step-by-step tests, the principle of plasma cleaning is used to clean the surface of ITO glass, which is a more effective cleaning method. In the plasma cleaning of liquid crystal glass, the activated gas used is oxygen plasma, which can remove oily dirt and organic pollutant particles, because oxygen plasma can oxidize organic matter and form gas discharge. Its only problem is that it needs to add a static elimination device after removing the particles, and its cleaning process is as follows: Air blowing - oxygen plasma - static electricity removal The requirements of the electronics industry for a high degree of automation require the adoption of an online surface treatment process with high reliability, high production efficiency and treatment effect. The ultra-fine atmospheric plasma cleaning and plasma activation provided by the plasma process brings effective solutions to the electronics industry. Plasma treatment of the plastic viewing window section prior to antistatic and anti-scratch spraying on spray equipment. Due to the use of plasma cleaning technology, the surface energy of the material is increased, so the coating distribution is more uniform, the plasma cleaning machine not only creates an impeccable product appearance, but also greatly reduces the scrap rate in the production process.

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What are the causes of plasma catheter etching?

Plasma treatment technology is an emerging technology that developed rapidly in the 20th century, and has become a key technology in some important industries (such as microelectronics, semiconductors, materials, aerospace, metallurgy, etc.) , surface modification and other aspects of the application has created great economic benefits. The advantages of plasma treatment are many, the most important is that the treatment effect is limited to the surface without affecting the bulk properties. The surface of the catheter is cleaned, disinfected and sterilized by the plasma method. For the silicon treatment on the surface of the catheter, an organic solvent needs to be used, which will cause pollution to the environment. The material used in the oxygen plasma method is oxygen or air, which does not pollute the environment. It is an environmentally friendly new surface treatment. method. There was no significant difference in the infrared absorption of these major groups before and after sample treatment. The energy of the active particles in the plasma is generally several to a dozen eV, while the chemical bond energy in the rubber material molecules is mostly 3-6 eV. The energy of the particles in the plasma is greater than or equal to the bonding energy of the rubber material molecules, so the bonding bonds can be broken to form new bonds, but because its energy is much lower than that of the radiation, the plasma treatment only occurs on the surface of the substrate, while the Does not damage the substrate. Etching-deposition is a pair of opposite and simultaneous chemical reactions that the plasma acts on the surface of the material to be treated. The oxygen plasma treats the film wrapped on the surface of the catheter, and its chemical structure is similar to that of the rubber material. This is practically beneficial as it avoids harmful side effects due to surface treatments. The contact angle of the catheter surface was 84° without treatment, 67° after treatment with oxygen plasma, and decreased by 17° after treatment, indicating that the hydrophilicity of the catheter was better improved. After the surface of the urinary catheter is treated by oxygen plasma, etching occurs, the surface is clean, and a small amount of hydrophilic groups are generated, thereby improving its hydrophilic performance and reducing the contact angle. After the oxygen plasma treatment, the burrs on the surface of the catheter are passivated, the coarse particles become smaller, and the surface becomes smooth. This is consistent with the measurement results of the surface contact angle. Causes of catheter etching include physical sputtering as well as chemical etching. The very low content of charged active species in the plasma plays an extremely important role in the surface treatment of materials. Since the moving speed of electrons is much greater than that of ions, the surface potential of the material placed in the plasma is negative relative to the plasma potential (called the drift potential. The high-speed electrons excite, ionize or break the reactive molecules into free radical fragments, The positive ions continuously bombard the surface of the material to be treated, which significantly affects the chemical reaction that occurs on the surface. Chemical etching is due to the fact that the energy of the active particles in the plasma is close to or slightly greater than the bond energy of the chemical bonds of the molecules of the material being processed. The closeness of this energy level makes the chemical bonds of the catheter material molecules exposed to the plasma easily broken, or the formation of small molecules from the matrix, or the formation of new chemical bonds, resulting in cross-linking, or the formation of free radicals. The effect of chemical etching is not obvious; from the results of SEM analysis, the effect of physical sputtering is obvious; the measurement results of contact angle suggest that physical sputtering and chemical etching work at the same time. Therefore, it can be inferred that the role of physical sputtering in the initial stage of oxygen plasma treatment on the catheter surface is dominant. Oxygen plasma treatment of the surface of the catheter leads to its surface etching, which makes the surface smooth and hydrophilic. The chemical structure of the surface film formed by the oxygen plasma treatment does not change much, so as to avoid the side effects of the urinary catheter in practical application.

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Today, Chengfeng Zhizao will analyze the precautions for the power supply of low-temperature plasma cleaning equipment

         The following will tell you a few things that basically all types of low-temperature plasma cleaning equipment should pay attention to when using it. Now with the development of science and technology, there are more and more types of low-temperature plasma cleaning equipment. It is only necessary to understand the instructions for use. Some low-temperature plasma equipment also require operators to receive on-the-job training. With the development of science and technology, many low-temperature plasma equipment has begun to have a self-cleaning function, and the daily maintenance of the equipment has become more concise. In the experiment, when we want to clean, activate, corrode, deposit or polymerize the surfaces of various materials, low-temperature plasma processing equipment is a necessity, and as a high-precision equipment often used in laboratories, the price is naturally high. If Improper operation when using low-temperature plasma equipment is likely to cause damage to the equipment or affect the operation results, so today Chengfeng Zhizao will tell you about the precautions for the use of low-temperature plasma cleaning equipment. First, the low-temperature plasma cleaning equipment requires a power supply with a frequency of 220V AC and a frequency of 50HZ during operation. The connection and inspection of the power supply should be done before turning on the equipment. After the equipment is running, it should emit a smooth running sound. And usually, there will be a green indicator light on to show that the equipment is running normally. If the yellow fault light is on, stop the operation for scheduled inspection. Second, when using Chengfeng Zhizhi low temperature plasma cleaning equipment, special attention should be paid to the red warning light. Usually, the red light will be always on when there is a problem with the operation of the equipment or the jitter frequency is too fast. At this time, you should press the reset button immediately to observe If the equipment is still abnormal, the operation of the equipment should be stopped, and then the troubleshooting should be carried out to avoid damage to the equipment. Third, when using low-temperature plasma cleaning equipment, it should be cleaned regularly, and when cleaning, the power must be disconnected first, and then the vacuum chamber and electric control box must be opened, and attention should be paid to cleaning according to the specifications required in the manual. The vacuum chambers of many low-temperature plasma equipment are external toroidal electrodes, so it is not easy to cause contamination in the chamber. I hope the above explanation can help you, and you are welcome to inquire about this issue, and you can contact us if you need it.

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How is the use of plasma cleaners in the electronics industry?

Plasma cleaning machine, also known as plasma surface treatment instrument, is a new high-tech instrument. It uses the properties of active components to treat the surface of the sample to achieve the purpose of cleaning. In addition to cleaning, it can also activate and engrave. Corrosion, etc., are widely used in various fields. Let me give you an example: dry cleaning in the electronic industry cleaning requires a vacuum pump to create a certain vacuum condition to meet the cleaning needs. Let's take a look at the working process and precautions of the plasma cleaning machine. The plasma required for plasma cleaning is mainly generated by specific gas molecules in vacuum, discharge and other special occasions, such as low-pressure gas glow plasma. Simply put, plasma cleaning needs to be carried out in a vacuum state (generally need to be kept at about 100Pa), so a vacuum pump is required for vacuuming. The main process includes: first, the workpiece to be cleaned is sent to the vacuum chamber to be fixed, and the vacuum pump and other devices are started to evacuate to a vacuum degree of about 10Pa; then, the gas for plasma cleaning is introduced into the vacuum chamber (according to the different cleaning materials, The selected gas is also different, such as oxygen, hydrogen, argon, nitrogen, etc.), and the pressure is kept at about 100Pa; a high-frequency voltage is applied between the electrode in the vacuum chamber and the grounding device, so that the gas is broken down and passed through the glow. The light discharge makes it ionized and generates plasma; after the plasma generated in the vacuum chamber completely covers the workpiece to be cleaned, the cleaning operation starts, and the cleaning process lasts for tens of seconds to several minutes. The following is a detailed introduction to what should be paid attention to when using a plasma cleaner.  1. Before starting the plasma cleaning machine, all kinds of preparations must be done. First, the operating staff must be trained in technical aspects, so that they can master the operation procedures and use them in strict accordance with the operation requirements.  2. Before using the plasma cleaning machine formally, it is necessary to correctly set the parameters of its operation, and to carry out the operation carefully according to the instruction manual of the instrument, and it cannot be used arbitrarily.  3. It is necessary to protect the ignition device of the plasma, so as to ensure the normal opening of the plasma cleaning machine, otherwise it will cause difficulty in opening or abnormal opening.  4. If there is no ventilation for the primary air duct, it is necessary to ensure that the operating time of the plasma generator is within the specified time, not longer than the time required in the equipment manual, otherwise the burner will be destroyed, causing a lot of damage. unnecessary loss. 5. Regular maintenance and maintenance. Maintenance and care of plasma cleaners When the power is turned off, the power of the device must be turned off first, and the corresponding operation can be carried out after the power is cut off. It must not be operated with power on to prevent accidents.

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What aspects can be improved by using the functional characteristics of the plasma plasma cleaning machine?

What aspects can be improved by using the functional characteristics of the plasma plasma cleaner? Plasma plasma cleaning machine uses high-energy particles and active particles in the plasma to achieve the purpose of removing dirt on metal surfaces through bombardment or activation reaction. No chemical reagents are used in the plasma cleaning process, so it will not cause secondary pollution. The cleaning equipment is highly repeatable, so the operating cost of the equipment is relatively low, and the operation is flexible and simple, which can realize the whole or some parts of the metal surface. And the cleaning of complex structures; some surface properties can be improved after plasma cleaning, which is helpful for subsequent processing applications of metals. Plasma plasma cleaners are widely used in cleaning, etching, modification, coating and activation. Plasma surface treatment. Through surface treatment, the wettability of the surface of the material can be improved, thereby improving the properties of the material such as coating, enhancing the adhesion and cohesion of the material and removing organic pollutants. The ultrasonic cleaners that appear on the market now cannot achieve the effect of modification. They can only clean some visible objects on the surface. Due to various defects in the process, high-tech products such as plasma cleaners have been derived. More and more industries are using plasma cleaning machines. Through plasma cleaning machines, surface modification, cleaning, and product performance improvement can be achieved, which greatly reduces the defect rate caused by the product in the process, thereby improving product quality and reducing production costs, etc. In the process of metal surface cleaning, the collision between electrons and atoms or molecules can generate excited neutral atoms or radicals (also known as free radicals), which are activated with pollutant molecules. Reacts to remove contaminants from the metal surface. When the electrons are transported to the surface cleaning area, they collide with the pollutant molecules adsorbed on the cleaning surface, which will cause the pollutant molecules to decompose and generate active free radicals, which will help to trigger further activation reactions of the pollutant molecules; moreover, the mass Very small electrons move much faster than ions, so the electrons reach the surface earlier than the ions and give the surface a negative charge, helping to initiate further activation reactions. In general, the number of free radicals in the plasma is more than that of ions, which is electrically neutral, has a relatively long life, and has a relatively high energy. During the cleaning process, the pollutant molecules on the surface are easily combined with high-energy free radicals to generate new free radicals. These new free radicals also live in a high-energy state, which is extremely unstable and easily decomposes itself and transforms into smaller free radicals. At the same time, new free radicals are generated. This process will continue until it is decomposed into stable and volatile simple small molecules, and finally the pollutants are released from the metal surface. In this process, the main role of free radicals It is manifested in the energy transfer during the activation process. In the process of combining free radicals with surface dirt molecules, a large amount of binding energy will be released, and the released energy is used to promote new activation reactions of surface dirt molecules. Power, which is conducive to the more thorough removal of contaminants under the activation of plasma. Using the features of the plasma cleaner can improve the following areas: ①plasma plasma cleaner changes wettability (also known as wettability). The wettability of the surface of some organic compounds has a great influence on the adhesion of pigments, inks, binders, etc., as well as the electrical properties such as flashover voltage and surface leakage current on the surface of the material. The measure of wettability is called the contact angle. ②plasma plasma cleaner enhances adhesion. The bond strength of the material to the adhesive can be enhanced by treating some polymers and metals with plasma-activated gases. The reason may be that the crosslinking of the polymer surface strengthens the adhesion of the boundary layer; or the introduction of dipoles during the plasma treatment improves the adhesion strength of the polymer surface; it may also be that the plasma treatment eliminates the polymer The dirt layer on the surface improves the adhesion conditions. Corona treatment also has the same effect. ③Plasma plasma cleaner strengthens the adhesion of polymer to polymer. For example, glass fiber reinforced epoxy resins have 233% enhanced adhesion to vulcanizates after plasma treatment with helium. After the polyester tire cord is plasma treated (eg NH3), the adhesion strength to the rubber is greatly improve

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Today, I will tell you how the plasma etches the LDPE film.

Plasma modification mainly has the following advantages: ①It is a dry process, which meets the current needs of energy saving and environmental protection; ②There are no special requirements for the materials to be processed, and it has universal applicability; ③ The processing time is short, only a few seconds to a few minutes; ④ Only modify the surface layer of the material without causing damage to the substrate itself. Therefore, the plasma technology has better application effect than the traditional modification technology. Plasma is a non-condensed system produced by complete or partial ionization of the gaseous state. The so-called "ionization" means that at least one electron is detached from an atom or molecule, thereby converting the atom or molecule into a positively charged ion. The system includes atoms, molecules, ionic excited states and metastable states. The number of positive and negative charges in the system is equal, and the system is macroscopically neutral. The application of plasma technology in material science is particularly significant. The development of new materials is to modify their surfaces through plasma technology in order to achieve higher performance, which is an important means of research and development of new materials. In the process of modifying the material surface by plasma, the original chemical bond on the material surface is broken to form a new chemical bond usually by hitting the material surface. With the exception of ions, most of the ions in the plasma have energies higher than chemical bond energies. This suggests that plasma can break chemical bonds on the surface of materials and form new ones. The surface modification of plasma treatment is to expose the material to the plasma of non-polymeric gas, and bombard the surface of the material with the plasma to change the polymer structure, so as to achieve the purpose of modifying the surface of the polymer material.  Plasma treatment is mainly aimed at inert gases. Organic polymer materials are treated with non-polymeric inorganic gases such as oxygen, nitrogen, hydrogen, and argon, and then contact with air, which will introduce functional groups on the surface to form cross-linked structural layers or generate free radicals. In general, the hydrophilicity of the surface is greatly improved after plasma treatment of the surface. The crystallinity and timeliness of PET film after surface modification were studied. After treatment under dielectric barrier discharge conditions, the water contact angle of the film decreases with the increase of energy density, and the biaxially stretched film with the highest crystallinity has the smallest contact angle. The etching effect of air plasma on the LDPE film is the most obvious, so the surface morphology change is the most prominent. Under the best conditions, the peel strength after bonding is significantly increased compared with that before treatment. This is because the active groups generated by air plasma interact with the surface of LDPE to increase active particles and attract oxygen-containing groups. In addition, due to the timeliness of plasma treatment, the next process should be entered immediately after treatment. After the PTFE is treated by plasma jet, the hydrophilic property of the material surface is enhanced. It was found from the SEM pictures that the treated PTFE surface produced dense micron-sized particles, which increased the surface roughness, and the density and roughness of these particles increased with the prolongation of the treatment time. This is because the cleavage of C-F bonds on the surface of PTFE introduces oxygen-containing groups.     After the plasma modification treatment, the hydrophilicity and surface roughness of the material surface are greatly improved, and there is a linear increase trend with the working pressure. The increased nitrogen content after plasma treatment improves the biocompatibility of the polycarbonate.

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