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The bonding and other processes can only be implemented after the metal plastic activation treatment of the oxygen plasma cleaner

The bonding and other processes can only be implemented after the metal plastic activation treatment of the oxygen plasma cleaner: The application of oxygen plasma cleaner technology in organic matter processing has great advantages, and its advantages are as follows. (1) Dry process, energy saving, no pollution, meeting energy saving and environmental protection requirements; (2) Short time and high efficiency; (3) There are no strict requirements on the shape to be processed, and it is universal; (4) It can handle grooves of various shapes, and the product appearance has good uniformity; (5) The reaction environment temperature is low; (6) The effect of improving the appearance is only a few hundred nanometers, and the functions of all materials are not affected. 1. Metal activation treatment of oxygen plasma cleaner: It may be that the metal has been activated, but the activation of the metal is very unstable, so the effective time is short. If the metal is activated, the next processing (gluing, painting...) process must be completed within a few minutes, if it is a low-temperature plasma surface treatment, because the surface will quickly bond with the dirt in the surrounding air. After the metal is activated, processes such as soldering or bonding can be implemented. 2. Plastic activation treatment of oxygen plasma cleaner: Plastics such as polyethylene or polyethylene are all non-polar structures. This means that these plastics must be pre-treated before they can be painted and bonded. Generally used as process gas, dry, oil-free compressed air. Immerse the processed and unprocessed workpieces in water (polar solution), the temperature and activation effect of the oxygen plasma cleaner is better. For untreated parts, droplets of normal shape are formed. The processed parts of the processed parts are completely wetted by water. 3 Oxygen plasma cleaner activates glass and ceramics: The performance of glass bottles and ceramic bottles is similar to that of metal bottles. Plasma and active treatment have a short validity period. Generally, compressed air is used as the process gas. The skills of processing the surface of low-temperature plasma select low-temperature plasma for data surface modification. 1. Enhance the adhesion of the metal surface: After the metal special oxygen plasma cleaning machine is processed, the surface morphology changes microscopically. After the oxygen plasma cleaning machine treats the metal surface, the surface bonding force can reach 62 dynes or more, which can meet various bonding and spraying , Printing and other processes, and at the same time achieve the effect of eliminating static electricity. 2. Improve the corrosion resistance of the metal surface: The existing iron and steel alloys undergo plasma treatment to improve impact resistance and corrosion resistance. Since ions in the four directions are injected into the sample at the same time, there is no visual field limitation, so it can handle samples with more complicated shapes. Using an oxygen plasma cleaner to coat polyparaxylylene on the metal surface, and the aluminum surface to coat aluminum alloy, these technologies are often used to protect the metal surface of spacecraft. 3. Improve the hardness and wear resistance of metals: The early application research of plasma immersion technology mainly used nitrogen plasma to process the surface morphology of metal materials. Through the formation of TiN and CrN super hardened layers, the wear resistance of the sample surface has been significantly improved.

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The plasma generator power supply chooses different process gas classification and action mechanism

The plasma generator power supply chooses different process gas classification and action mechanism: The process gas used by the plasma generator power supply, such as hydrogen, argon, helium and other right and wrong reflective gases. This gas atom cannot directly enter the macromolecular chain on the surface of the macromolecule, but due to the bombardment of the surface by the high-energy particles in the non-reactive gas plasma, energy transfer is performed, and a large number of free radicals are generated. These free radicals pass on the surface. A large number of free radicals are formed on the surface due to the formation of double bonds and cross-linked structures. Therefore, the non-reactive gas plasma forms a thin and thin cross-linked layer through the surface, which not only changes the free energy of the material surface, but also reduces polymerization. Exudation of low-molecular-weight substances (plasticizers, antioxidants, etc.) inside the substance. When the plasma discharge of hydrogen ion plasma generator power supply selects lazy gas for plasma surface treatment, if the processed polymer material itself contains oxygen, the macromolecules will split to produce macromolecular fragments, which enter the plasma and provide oxygen for the plasma system , Will also produce oxygen plasma effect. If the material itself does not contain oxygen, after lazy plasma treatment, new free radicals (with a half-life of up to 2 to 3 days) and the oxygen effect in the air can also cause the combination of oxygen and macromolecular chains. Therefore, inert gas plasma treatment contains In the case of oxygen polymers, cross-linking and etching will occur, and polar groups will be introduced into a tripartite competitive reaction. For oxygen-free polymer materials, oxygen-containing groups will be introduced only after the treatment and the effect of oxygen in the air. Plasma generator power plasma surface treatment refers to the physical and chemical process of non-polymeric gas on the surface of polymer materials during plasma surface treatment. Non-polymerized gases include reactive gas and non-reactive gas. The mechanism of action of different gas classification methods selected by the plasma generator power supply on the surface effect of macromolecules is also different. Plasma generator power supply plasma-induced polymerization refers to polymerization induced by activated particles (molecules) under glow discharge conditions. Free radicals are apparently generated and then combined with monomers. For example, molecular chains are cross-linked or side-linked. Chain grafting, functional group replacement and block polymerization, etc. To use plasma-induced polymerization to form a polymer, the monomer must contain a structure with polymerization energy, such as a double bond, a triple bond, or a ring bond. Plasma state polymerization (PSP) is a process of re-polymerization of particles activated by plasma and deposited on the surface. This polymerization is the process of atoms that occur in the plasma.

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Plasma glass cleaning machines are widely used in manufacturing industries such as mobile phone coating and new materials

Plasma glass cleaning machines are widely used in manufacturing industries such as mobile phone coating and new materials:        Mobile phone screens are generally coated on their surface, and their effects are different. Some are to improve light transmittance, and some are to improve hydrophobicity and oleophobicity by brushing AF film (alias anti-fingerprint film, in fact, the actual effect is mostly It is anti-fingerprint). The surface of some raw materials is very smooth, and the surface of some raw materials has air pollutants. It is easy to make the surface difficult to be coated, or the surface is easy to fall off after coating, just like painting on rusty iron. At this time, it is necessary to improve the surface roughness of the product and remove the impurities on the surface in order to carry out high-quality coating treatment, just as we need to remove the rust with sanding paper, and then paint. ,         So the problem arises, we are unlikely to wipe the phone screen clean with sandpaper, so the phone screen will be scratched. So, is there a way to remove impurities from the surface of the mobile phone screen and improve its surface roughness without affecting the normal application of the appearance? At this time, a plasma glass cleaning machine appeared. Crokes clearly proposed the existence of the fourth state of matter in 1879, which is called plasma (Plasma). The plasma generated by the plasma glass cleaning machine through reaction includes electrons, ions, and highly active free radicals. These particles can easily react with pollutants on the surface of the product and form carbon dioxide and water vapor to increase surface roughness and surface cleaning. Purpose. ,         Plasma glass cleaning machine plasma (plasma) forms free radicals in the reaction, which can remove organic pollutants on the surface of the product and activate the surface of the product. The purpose is to improve the adhesion of the product surface and the reliability and durability of the surface adhesion. It can also clean the surface of the product, increase the surface affinity (reduce the angle of water drop), and increase the adhesion of the coated body. ,         But on the other hand, using compressed air as the gas source of the plasma glass cleaning machine, the plasma generated by its reaction can deposit a large amount of oxygen ions and free radicals. If the plasma treated product is quickly coated or sprayed, the oxygen ions will It will chemically bond with the product and the spraying material. This bonding reaction can further improve the bonding strength between the molecules and make the film difficult to detach and fall off In addition, the plasma glass cleaning machine processing process is also a kind of micro-processing. Generally, the processing depth can reach nanometer to micron level. It is difficult to see the changes before and after the product is processed with the naked eye. Therefore, the plasma glass cleaning machine is widely used in mobile phone coating and new materials. And other manufacturing industries.

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The low-temperature plasma has enough energy to break the chemical bonds in the biomass feedstock

The low-temperature plasma has enough energy to break the chemical bonds in the biomass feedstock: With the in-depth research on biomass refining all over the world, new bio-refining technologies continue to emerge. Low-temperature plasma technology has become one of the promising biomass refining technologies with its unique chemical activity and high energy. Plasma is usually juxtaposed with solid, liquid, and gaseous states, and is called the fourth state of matter. According to the energy, temperature and ion density of its system, plasma is usually divided into high-temperature plasma and low-temperature plasma. High-temperature plasma is mainly used in controllable nuclear fusion in the energy field, while low-temperature plasma is more closely related to modern industry. Low-temperature plasma refers to a plasma with high electron temperature but low system temperature. The temperature of electrons can reach more than 10,000K, while the temperature of heavy particles such as ions and atoms can be as low as 300-500K. The huge temperature difference between electrons and heavy particles has two effects. On the one hand, the electrons have enough energy to excite, ionize and dissociate the reactant molecules. On the other hand, the system can be kept at a low temperature or even close to room temperature. Under the action of the high-voltage electric field between the electrodes, a large number of high-energy particles such as electrons, ions, molecules, neutral atoms, excited atoms, photons and free radicals are produced, and the total positive and negative charges of the particles are equal, and they are macroscopically charged. sex. The highly active particles enriched in the low-temperature plasma space have the following characteristics: an active atmosphere, the highly active particles have high kinetic energy and internal energy under the action of an electric field, which provide activation energy for chemical reactions, and have the possibility of chemical reactions sex. The production process of bio-based products is the process of breaking and depolymerizing the chemical bonds in the biomass matrix and the formation-polymerization process of new chemical bonds under the action of physics and chemistry. Since the energy of most active particles in low-temperature plasma is higher than the bond energy of common chemical bonds in biomass raw materials, low-temperature plasma has enough energy to break the chemical bonds in biomass raw materials, and has the ability to polymerize with the biomass matrix. The possibility of depolymerization reaction has broad application prospects in the field of biomass refining. The low-temperature plasma biomass refining mechanism provides a new way for efficient and clean biomass refining. Biomass resources are rich in components and complex in structure. During the evolution process, a series of natural barriers against degradation have been formed. The use of biological, physical and chemical methods to change or remove the barriers of its structure and composition is the focus of research on efficient refining of biomass resources. High-energy particles generated by oxygen or air low-temperature plasma are used to impact textile cotton fibers, replacing conventional chemical wet processing procedures. Through the introduction of the waxy and unique groups on the surface of textile fibers or fabrics, the molecules attached to the fiber surface are oxidized and decomposed, and the molecular chains are cut to generate carbon dioxide and water to be removed, and some low molecules are oxidized. , It forms substances containing -OH, -COOH and other easily soluble groups in water to be removed, and relieves the natural barrier formed by the stratum corneum of textile fibers and pectin. Similarly, low-temperature plasma can be used to remove the keratin and pectin and other natural anti-degradation barriers on the surface of the straw to increase its permeability by 10-100 times, which will help the enzymatic conversion of biomass resources such as straw. In addition, the low-temperature plasma has a low temperature, will not cause thermal damage to the bacterial species, and the concentration of new particles is high, which can produce obvious mutagenic effects. Therefore, low-temperature plasma is also used in biomass pretreatment/refining process microorganisms Breeding and transformation. The low-temperature plasma technology does not use strong corrosive chemicals such as acids and alkalis. The reaction process is pollution-free, harmless to humans, and corrosive to equipment. The entire process and its products are environmentally friendly. The low-temperature plasma modification technology of biomass has many advantages such as less pollution, no damage to the performance of the matrix, high efficiency, and far lower energy requirements than thermochemical reactions. It is widely used in the field of biomass modification, such as wood modification and texti

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The historical development process of plasma low temperature plasma

The historical development process of plasma low temperature plasma: Plasma was discovered in 1879 and called "plasma" in 1928. It is a microscopic system consisting of a large number of charged particles that interact but are still in an unbound state. They are the fourth material in addition to gas, liquid, and solid. state. Electron temperature and ion temperature can be used to respectively indicate plasma temperature. The ionization rate of plasma low-temperature plasma is low, and the ion temperature can even be almost the same as room temperature. Therefore, there are many scenarios in daily life that can use low-temperature plasma technology. In the process of plasma low-temperature plasma generation, a large number of active particles can also be produced. These particles have more types of reactions than general chemical reactions, more active, and simpler reactions when they come in contact with the surface of the material. Compared with traditional physical and chemical methods, plasma surface treatment has low cost, no waste, and no pollution to the environment. Therefore, the surface modification treatment of low-temperature plasma materials is very suitable. In addition, low-temperature plasma can also be used to prepare organic and Inorganic nanoparticles are used in sterilization and other fields. Low-temperature plasma can be generated by ultraviolet radiation, electromagnetic field excitation, high-temperature heating, and the application of X-rays. In the meantime, electromagnetic field excitation method, which is a relatively simple technology to manipulate gas release method, is used in laboratory research and industrial production. Much. Arc discharge is one of the plasmas produced by various gas discharges; it is difficult to produce sufficient active particles in the low-temperature plasma produced by corona discharge; DC glow discharge requires a low-pressure environment, so expensive vacuum systems are required. Therefore, it is difficult to achieve continuous production; the electrodes of the low-frequency AC discharge plasma are exposed to the outside and only pollute the plasma generated by simple pollution. Therefore, these gas discharge methods are not suitable for large-scale assembly line industries. Dielectric Barrier Discharge (DBD for short) refers to placing an insulating medium between two metal electrodes to obstruct the discharge channel across the air gap between the plates, so that the discharge in the air gap channel does not generate arcs, but Existing in the form of filament discharge, the plasma low-temperature plasma is dispersed in it. This method is easy to implement in the laboratory and is widely used in industrial production; and in the atmospheric pressure discharge mode, the plasma that occurs in this way The body can be evenly distributed in the entire discharge space. Therefore, atmospheric pressure glow discharge is also called dielectric obstructive discharge in uniform mode, but it is more difficult to achieve in the laboratory. In filament discharge mode, if it is improperly operated, it will become The dielectric obstructs the discharge. Therefore, dielectric barrier discharge is currently a plasma generation method suitable for industrial production. The basis of dielectric obstruction of discharge is to increase the insulating medium. If there is no insulating medium to hinder the discharge, the charged particles located in the air gap of the electrode plate will tend to attach to the two electrode plates at a very high migration speed, which makes it difficult for the airflow to blow out and become charged. The particles will reach the surface of the insulating medium after the two plates are covered with an insulating layer, instead of the surface of the plate. After applying the reverse voltage of the high-frequency AC power supply on the two plates, the low-temperature plasma of the plasma again undergoes avalanche ionization due to the action of the strong electric field in the gap between the two plates, and the current is immediately cut off, and the current curve shows a sharp pulse. At this time, there are still charged particles in the air, and they will continue to move to the two plates and continue to move. This kind of charged particles are plasma low-temperature plasma ions that occur after being ionized. Because they exist in the air gap between the plates in a suspended state, they can easily blow out the ionization zone.

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Removal of pollutant molecules in the production process of microelectronics packaging of plasma processing equipment

Removal of pollutant molecules in the production process of microelectronics packaging of plasma processing equipment: In the microelectronics industry, cleaning is a broad concept that includes all processes related to the removal of pollutants. Generally, it refers to effectively removing residual dust, metal ions, and organic impurities on the surface of the data without destroying the surface and electrical characteristics of the data. At present, the widely used physical and chemical cleaning methods can be roughly divided into two types: wet cleaning and dry cleaning of plasma treatment equipment.  At present, wet cleaning still occupies the leading position in the cleaning process of microelectronics. However, from the perspective of environmental impact, consumption of original materials and future development, dry cleaning is significantly better than wet cleaning. Dry cleaning has developed rapidly and has obvious advantages. Plasma processing equipment cleaning has gradually begun to be widely used in semiconductor manufacturing, microelectronic packaging, precision machinery and other industries. The major feature of plasma processing equipment technology is that regardless of the type of substrate to be processed, it can process metals, semiconductors, oxides and most polymer materials, such as polypropylene, polyester, polyimide, and polychloride. Ethane, epoxy and even polytetrafluoroethylene, etc., can be used for comprehensive, partial and messy structure cleaning. Plasma treatment equipment cleaning also has the following characteristics: simple numerical control technology, high degree of automation; high precision of the operating device; no damage layer on the surface, material quality is guaranteed; vacuum from the inside out, does not pollute the environment, and ensures that the surface is cleaned Not subject to secondary pollution. In the production process of microelectronics packaging, due to fingerprints, flux, various cross-contamination, natural oxidation, etc., various dirts will be formed on the surface of equipment and materials, including organic matter, epoxy resin, photoresist, solder, metal salt, etc. This will have a significant impact on the quality of related processes in the packaging production process. Plasma cleaning with plasma processing equipment can easily eliminate the pollutant molecules generated during the production process, ensure the close contact between the surface atoms of the workpiece and the plasma atoms, and then effectively improve the wire connection strength, improve the quality of wafer bonding, and reduce package leakage. Gas rate, improve component performance, increase yield and reliability. Before the aluminum wire connection, a certain domestic unit used the plasma cleaning method to increase the connection yield by 30% and the consistency of the connection strength.

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