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Factors affecting the physical strength of bonding

Factors affecting the physical strength of bonding

Factors affecting the physical strength of bonding: With the development of economy, people’s living standards continue to improve, and the requirements for the quality of consumer goods are getting higher and higher. Plasma technology will gradually enter the consumer goods production industry. In addition, with the continuous development of science and technology, various technical issues continue to be raised. With the continuous emergence of materials, more and more scientific research institutions have realized the importance of plasma technology and invested a lot of money in technical research. Plasma technology has played a very important role in it. However, if the factors that affect plasma cleaning and bonding are not handled properly, it will affect the bonding problems on the surface of the plasma cleaned object. Chengfeng Zhizhi Shenzhen plasma cleaning machine equipment manufacturer lists what are the influencing factors. 1. Surface roughness of plasma cleaner equipment: When the adhesive well infiltrates the surface of the material to be adhered (contact angle θ<90°), the roughening of the surface is beneficial to increase the degree of infiltration of the adhesive liquid on the surface, increase the density of the contact point between the adhesive and the material to be adhered, and thus help improve the adhesion.接 Strength. Conversely, when the adhesive does not infiltrate the material to be adhered (θ>90°), the roughening of the surface is not conducive to the improvement of the bonding strength. To 2. Surface treatment of plasma cleaner equipment: The surface treatment before bonding is the key to successful bonding, and its purpose is to obtain a strong and durable joint. Due to the existence of the "weak boundary layer" formed by the oxide layer (such as rust), chrome plating, phosphating layer, release agent, etc. of the adherend, the surface treatment of the adherend will affect the bonding strength. For example, the surface of polyethylene can be treated with hot chromic acid oxidation to improve the bonding strength. When heated to 70-80°C for 1-5 minutes, a good bondable surface will be obtained. This method is suitable for polyethylene plates, thick Wall tube etc. When the polyethylene film is treated with chromic acid, it can only be carried out at room temperature. If it is carried out at the above temperature, the surface treatment of the film will adopt plasma or micro flame treatment. When the surface of natural rubber, styrene-butadiene rubber, nitrile rubber and neoprene is treated with concentrated sulfuric acid, it is hoped that the rubber surface will be slightly oxidized. Therefore, the sulfuric acid must be thoroughly washed off in a short time after acid application. Excessive oxidation instead leaves more fragile structures on the rubber surface, which is not conducive to bonding. To When locally bonding the vulcanized rubber surface, remove the release agent from the surface treatment, and it is not advisable to use a large amount of solvent to wash, so as not to prevent the release agent from spreading to the treated surface and hinder the bonding. In the surface treatment of aluminum and aluminum alloys, it is hoped that aluminum oxide crystals will be generated on the aluminum surface, while the naturally oxidized aluminum surface is a very irregular and relatively loose aluminum oxide layer, which is not conducive to bonding. Therefore, the natural aluminum oxide layer needs to be removed. However, excessive oxidation will leave a weak layer in the bonded joint. To 3. Penetration: The bonded joints are often infiltrated into some other low-molecular molecules under the influence of the environmental atmosphere. For example, when the joint is in a humid environment or underwater, water molecules penetrate into the glue layer; the polymer glue layer is in an organic solvent, and solvent molecules penetrate into the polymer. The penetration of low molecules first deforms the adhesive layer, and then enters the interface between the adhesive layer and the adherend. Decrease the strength of the adhesive layer, which leads to the destruction of the bond. Penetration not only starts from the edge of the adhesive layer. For porous adherends, low-molecular substances can also penetrate into the adherend from the voids, capillaries or cracks of the adherend, and then penetrate into the interface, causing defects or even damage to the joint. . Penetration will not only lead to a decrease in the physical properties of the joint, but also chemical changes in the interface due to the penetration of low-molecular substances, resulting in a corrosion zone that is not conducive to bonding, making the bonding completely invalid. To 4. Migration: Adhesive materials containing plasticizers, because these small molecules have poor compatibility with polymer macromolecules, they are easy to migrate from the polymer surface or interface. If the migrated small molecules accumulate on

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Plasma processor low temperature plasma technology and its application in plastic packaging

Plasma processor low temperature plasma technology and its application in plastic packaging

Plasma processor low temperature plasma technology and its application in plastic packaging: The technological advancement of the plastics industry has made the functional development trend of plastic packaging films increasingly obvious, and high-requirement and high-tech plastic packaging films are becoming the pillar industry and R&D targets in the industry. The plastic packaging industry is an important part of the packaging industry. The plastic packaging industry accounts for about 28% of my country's entire packaging industry. At the same time, the plastic packaging industry is also one of the rapidly developing fields in China's plastics industry. The poor adhesion of the ink on the surface of the plastic film is a relatively large problem in the printing process of the plastic film, which will lead to greater losses. The main reason for this phenomenon is that the surface tension of the plastic film is insufficient, and the wettability of the ink is not good enough. Therefore, it is particularly important to increase the surface tension of the plastic film, enhance the wetting performance of the ink, and improve the printing adaptability of the plastic film. The use of plasma processor low-temperature plasma technology to treat the surface of the plastic film can significantly improve its surface free energy and change the surface wettability of the material. The energy of particles in low-temperature plasma is generally higher than many bond energies of polymer. Therefore, when electrons or ions in the plasma reach the surface of the medium, some chemical bonds in the polymer can be easily opened to make them become free radicals. , Such as CH, OH, CN, CS, COOH, etc., even break and decompose the molecular bonds of macromolecules of organic materials, thereby accelerating the activation of the surface of the material and changing its surface activity. For the plasma processor low-temperature plasma of non-polymeric reactive gases like O2, N2, etc., a large number of free radicals can be directly generated through oxidation reaction, and a large number of oxygen-containing groups can be combined on the macromolecular chain by means of the chain reaction of free radicals. Some of the chemical bonds of carbon atoms in the surface molecules of materials such as PE and PET are broken by active ions and become free radicals of carbon. Carbon free radicals combine with oxygen free radicals to generate CO or CO2 gas, which is extracted, leaving a large number of vacancies in the film surface molecules, thereby generating a large number of "micropits" and "micro grooves", making the surface rough and increasing the film and Mechanical interlocking between inks. On the other hand, for non-reactive gases such as ArHe or non-reactive gases, plasma processor plasma treatment on the surface of the plastic film can increase the content of polar groups, increase the surface energy and roughness of the plastic film, thereby increasing The wettability and adhesion of the ink on the plastic surface improve the printability of the plastic film. Insufficient film adhesion often occurs in the composite process, which affects the composite processing. The surface wettability of the plastic film not only affects the printability, but also has a close relationship with the difficulty of bonding and coating. The use of low-temperature plasma technology to act on the surface of the plastic film increases the surface activity of the film. This activated surface is easily combined with other materials, which is beneficial to the coating of the adhesive and enhances the composite fastness of the film. The huge printing and packaging industry provides a broad platform for the development of plasma processor low-temperature plasma technology. The continuous maturation of low-temperature plasma plastic film modification technology and the promotion of industrialization will bring us higher quality food and beverage plastic packaging. From the standpoint of sustainable development and environmental protection, more and more attention will be paid to low-temperature plasma technology that can realize high-functionality and high-value-added processing.

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Plasma cleaner is used for wafer-level packaging surface treatment to improve product reliability

Plasma cleaner is used for wafer-level packaging surface treatment to improve product reliability

Plasma cleaner is used for wafer-level packaging surface treatment to improve product reliability: The purpose of the pre-treatment of wafer-level packaging is to remove surface inorganics, reduce oxidation, increase copper surface roughness, and improve product reliability. In industry, plasma cleaners are generally used for ultra-clean cleaning and surface roughening treatment. Wafer Level Package (WLP, WaferLevelPackage) is an advanced chip packaging method, which refers to packaging and testing directly on the wafer after the production of the entire wafer is completed, and then the entire wafer is cut into one Die; the electrical connection part uses a copper bump (CopperBump) instead of wire bonding (WireBond), so there is no need for wire bonding or glue filling process. What are the advantages of using a plasma cleaner for wafer-level packaging surface treatment? The editor will introduce to you. Due to production capacity requirements, vacuum reaction chamber, electrode structure, air flow distribution, water cooling device, uniformity and other factors, there are obvious differences in the design of plasma cleaning machines. Why do we have to choose a plasma cleaner for wafer-level package surface treatment? The reason is simple: the remaining photoresist after the chip is manufactured cannot be cleaned by wet cleaning, but can only be removed by plasma. In addition, since the thickness of the photoresist cannot be determined, it is necessary to adjust the corresponding process parameters through a number of experiments to achieve a very good processing effect. If you are interested in the plasma cleaning machine or want to know more details, please click Chengfeng Zhizao online customer service, Chengfeng Zhizao is waiting for your call!

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Ten tips for disassembling and assembling the vacuum oil pump of the vacuum plasma surface treatment machine cannot be ignored

Ten tips for disassembling and assembling the vacuum oil pump of the vacuum plasma surface treatment machine cannot be ignored

Ten tips for disassembling and assembling the vacuum oil pump of the vacuum plasma surface treatment machine cannot be ignored: The vacuum system of the vacuum plasma surface treatment machine is composed of connecting pipes such as a vacuum pump, a vacuum reaction chamber, a vacuum gauge, a baffle valve, an intake pipe, and a flange. As an important part of the vacuum system, how should the vacuum pump be disassembled and assembled? What else needs attention? Chengfeng Zhizao will give you a detailed explanation. If there is no special requirement for the vacuum pump in the vacuum plasma surface treatment machine, most of the rotary vane oil pumps can be used. The working principle of the rotary vane oil pump is to mechanically pump the vacuum reaction chamber. When the vacuum degree can satisfy the plasma discharge, the process gas is kept in and the plasma reaction by-products are removed to ensure the stability of the plasma discharge. After grasping the correct method, the maintenance of the vacuum plasma surface treatment oil-type vacuum pump is actually very simple. Chengfeng Zhizao organized the disassembly and assembly steps of the vacuum plasma surface treatment oil pump. Disassembly and assembly of the vacuum pump oil storage tank: 1. Before disassembling the oil tank of the vacuum pump, discharge the vacuum pump oil first, and tighten the oil drain screw with an Allen wrench to discharge the vacuum oil in the vacuum pump; 2. Use an Allen wrench to remove the fastening screws of the vacuum pump oil tank; 3. When disassembling the fuel tank, be careful not to damage the gasket of the fuel tank; Gloves, masks and bags containing waste oil are the three necessary small items for vacuum pump maintenance. Various industries and products, the waste gas produced by plasma cleaning and various dirt produced by the reaction of vacuum pump oil, pay special attention to whether there are corrosive and toxic gases and liquids that harm the human body. Disassemble the exhaust valve of the vacuum pump of the vacuum plasma surface treatment machine: 1. Remove the protective cover of the exhaust valve plate, fold off the sturdy protective cover screw, and remove the protective cover, taking care not to damage the sealing ring; 2. Disassemble the pressure plate of the exhaust valve plate. 3. Remove the exhaust valve piece. Disassemble the vacuum pump rotor of the vacuum plasma surface treatment machine: 1. Remove the fastening screws of the rotor; 2. Remove the small screw cap and check the wear of the small screw cap at the same time; 3. Disassemble the cylinder cavity of the second-stage rotor, check the wear of the second-stage rotor, and check whether the oil circuit is blocked. Remove the check valve of the vacuum pump of the vacuum plasma surface treatment machine: 1. Remove the fastening screw of the air inlet of the vacuum pump, take out the air inlet, and be careful not to damage the sealing ring; 2. Take out the limit circlip of the check valve, take out the check valve, check whether the air passage and oil passage are blocked, check whether the check valve has excessive resistance and whether there is any damage; if the check valve is stuck, when it is removed Be careful not to damage the pump body. The assembly of the vacuum pump: After the internal cleaning of the vacuum pump is completed, install the parts one by one in the reverse order of disassembly and assembly. Pay attention to inspection during assembly to avoid missing small parts and ensure that each part is installed in place. Have you learned how to disassemble and assemble the oil-type vacuum pump for vacuum plasma surface treatment? It should be noted that you must not miss during assembly, please check repeatedly to ensure that every working part is installed in place. If you are interested in plasma cleaners or want to know more details, please click on the online customer service consultation of Chengfeng Zhizao, Chengfeng Zhizao is waiting for your call!

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Can the low-temperature plasma surface treatment equipment surpass the ultrasonic cleaning machine to become a new generation of overlord

Can the low-temperature plasma surface treatment equipment surpass the ultrasonic cleaning machine to become a new generation of overlord

Can the low-temperature plasma surface treatment equipment surpass the ultrasonic cleaning machine to become a new generation of overlord: Many industrial product manufacturers are familiar with products such as low-temperature plasma surface treatment equipment and ultrasonic cleaning machines. Many industrial product manufacturers will have similar ideas when they are connected to the incomplete cleaning of the ultrasonic cleaning machine. There is no equipment that can replace the ultrasonic cleaning machine, so a lot of information on cleaning products may be searched on the Internet, and it may be so diverse that it still can't solve your own doubts. So let's talk about it today, what is the relationship between the low-temperature plasma surface treatment equipment and the ultrasonic cleaning machine? Many industrial product manufacturers may have used ultrasonic cleaning. This equipment can be used in many industries. Its cleaning purpose is to clean the surface of the workpiece, so that the dirt on the surface of the workpiece can be removed, so as to achieve a clean effect. In this way, many people understand that ultrasonic cleaning is actually cleaning some visible substances on the surface. So for us, what is the cleaning purpose of the low-temperature plasma surface treatment equipment? First analyze its origin, also known as plasma equipment. At present, there are not many manufacturers in China that can produce, develop, and research. Many manufacturers are mostly traders who contacted them, rather than real plasma equipment manufacturers. At present, there are few manufacturers with completely independent research and development, equipment customization, integrated sales and complete after-sales service. Our company has 20 years of plasma research and development experience, hundreds of plasma solutions, 30+ technical patent certifications, and strength qualifications. Obviously. Next, we talk about the cleaning purpose of low-temperature plasma surface treatment equipment, which is to use plasma to achieve an effect that cannot be achieved by conventional cleaning. For example, the active component of plasma is composed of ions, electrons and photons, then the cleaning effect it achieves It must be different from cleaning products such as general ultrasonic cleaners. Low-temperature plasma surface treatment equipment uses these active components such as ions and photons to treat the surface of the workpiece to achieve the purpose of cleaning. Obviously, this cleaning effect is better than ordinary cleaning. So for us, can it replace the ultrasonic cleaning machine? The answer is definitely no, because the ultrasonic cleaner is a device for cleaning the visible material on the surface, while the low-temperature plasma surface treatment device is not. Low-temperature plasma equipment is used to clean organic matter on the surface, modify the product, increase the defect rate, and activate the surface. Therefore, it cannot replace the ultrasonic cleaning machine. Then we say that they are a complementary thing. After the ultrasonic cleaning is done, the low-temperature plasma surface treatment equipment cleaning will make the performance of the product achieve better results. It is believed that many industrial product manufacturers will have the same feeling and recognition when using these two types of products in combination.

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Application research on plasma treatment technology of plasma cleaner in microwave printed circuit board

Application research on plasma treatment technology of plasma cleaner in microwave printed circuit board

Application research on plasma treatment technology of plasma cleaner in microwave printed circuit board: PTFE has excellent dielectric properties in a wide frequency range, as well as good temperature and wear resistance and chemical resistance, so it is widely used in high-frequency components and seals, such as microwave printed board substrates coated with fluorine Sealing ring, etc. However, due to the low surface energy of PTFE and its very stable chemical properties, it brings great difficulties to the production process of parts, such as metalized surface coating and bonding, and other processing operations must be surface treated first. , Otherwise it is difficult to process or poor reliability after processing. Plasma cleaner plasma is an ionized material, it is a state of matter containing ionic electrons and free radicals. Plasma includes high-temperature plasma and low-temperature plasma, and low-temperature plasma is generally used in plasma processing technology. When polymer materials undergo plasma treatment with plasma cleaners, the surface activation process can actually include two parts. On the one hand, gas particles accelerated by an electric field hit the surface of the material at a high speed, causing plasma etching to make the polymer material The crystal morphology of the surface has changed, which is a physical aspect. On the other hand, the impact of gas on the surface of the material causes a chemical reaction, which generates free radicals on the surface of the material, introduces unsaturated bonds of polar groups and a cross-linked layer, and changes the molecular structure of the surface layer of the material. This is a chemical effect. Both effects can activate the surface of polymer materials to increase wettability, thereby improving the adhesiveness, dyeability and printability of polymer materials. But according to analysis, the effect of chemical action on the surface condition of the material is higher than that of physical action. The characteristic of the plasma treatment technology of the plasma cleaner is that the treatment is concentrated on the superficial layer of the material, so it does not change the bulk properties of the material to be treated. The quality of the hole wall and the pull-out strength of the metallized holes of the PTFE microwave printed board after the plasma treatment technology of the plasma cleaner meets the requirements of the relevant standards. The PTFE microwave printed board is attached after the three-proof coating The focus test is less than level 2, and the film layer is uniform and continuous. These show that the plasma treatment technology has unique advantages in the hole metallization pretreatment and the three-proof coating pretreatment of the PTFE microwave printed board, and it has the advantages of flexible construction, pollution-free, low cost, short treatment cycle, and application. It has the advantages of wide range and low requirements for operators, and is suitable for mass production. Therefore, it has good application prospects in the manufacture of PTFE microwave printed boards.

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