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Plasma generator classification

Plasma generator classification

1. High-frequency induction plasma generator is also called high-frequency plasma torch, or rf plasma torch. It USES the induction coupling without electrodes to input the energy of the high-frequency power supply into the continuous air flow for high-frequency discharge. 2. Arc plasma generator is also known as arc plasma torch, or plasma spray gun, sometimes also known as arc heater. It is a kind of discharge device that can produce directional "low temperature" (about 2000 ~ 20000 open) plasma jet. 3. Low-pressure plasma generator A low-pressure gas discharge device, generally composed of three parts: a power source to generate plasma, a discharge chamber, a vacuum pumping system and a supply system for working gas (or reaction gas). There are usually four types: static discharge device, high voltage corona discharge device, high frequency (radio frequency) discharge device and microwave discharge device.

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What is plasma cleaning and what is its function

What is plasma cleaning and what is its function

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Application of low temperature plasma cleaning machine in the field of conductive polymer material preparation

Application of low temperature plasma cleaning machine in the field of conductive polymer material preparation

Conductive plastic, as a kind of polymer material, is a very active research and development field in the world at present. It has developed from pure laboratory research to applied research stage and become a new generation of electronic materials. Conductive polymer materials can be divided into two categories according to their conductive mechanism: structural type and composite type. At present, the synthesis of structural conductive polymer materials is more complex and costly. But the composite conductive polymer material processing is simple, low cost, so it is widely used in electronics, automobile, civil and other fields. Structural conductive plastic is a functional polymer material that mixes resin and conductive material and processes it in a plastic way. Mainly used in electronics, integrated circuit packaging, electromagnetic shielding fields. Conductive plastics are generally classified in the following two ways: (1) Photoelectricity performance classification, can be divided into: insulator, antistatic body, conductive body, high conductor. Resistance in 1010 Ω cm more often called insulators; Resistance in 104 ~ 109 Ω cm range called semiconductor or anti-static body; Resistance under 104 Ω cm are called conductive body; Even lower resistance under 100 Ω cm are called high conductor. (2) Manufacturing methods of electric plastics can be classified into structural conductive plastics and composite conductive plastics. Structural conductive plastic, also known as intrinsic conductive plastic, refers to the conductive plastic itself or the conductive plastic after chemical modification. Structural conductive polymer materials mainly include: (1) conjugated polymers: such as polyethylene, (Sr) N, linear polybenzene, layered polymers, etc.   (2) Metal chelates, such as polyketone phthalocyanine;   (3) Charge mobile polymer complex: such as polycation, CQ complex. The production cost of structural polymer materials is high, the process is difficult, so far there is no mass production, now widely used conductive polymer materials are generally composite polymer materials, the main filling materials are: a. Metal dispersion system; B. Carbon black system; C. Organic complex dispersion system; D. Carbon fiber. Low temperature plasma cleaning machine can be divided into: Antistatic materials, conductive materials and electromagnetic shielding materials. The effect of conductive packing on conductivity can be described by tunneling theory. Conductive plastics also conduct electricity because electrons can pass through the gaps between conductive fillers. At a certain critical concentration, the electrons can conduct electricity through the pores between the conductive fillers as long as the spacing between the conductive fillers is reduced by a very small part, and then the resistivity will change suddenly and the conductive plastic will change from the original insulator to conductor, which will produce the percolation effect. The percolation concentration of carbon black filled LDPE compound is related to the structure of carbon black. The percolation concentration of the specially conductive carbon black filling compound is lower than that of the acetylene carbon black filling compound. It is difficult to achieve the critical concentration in the production process, but it is easy to achieve the critical concentration by low temperature plasma treatment. Characteristics of atmospheric plasma cleaning machine in spraying process: (1) There are many optional coating materials, including metals, alloys, ceramics, cermets, carbides and others. (2) Coating equipment can use layers of different materials. (3) Produce surfaces suitable for a variety of applications, including a variety of different wear and corrosion resistance mechanisms, required thermal or electrical properties, surface repair and dimensional control. (4) Precise control of coating thickness and surface characteristics, such as voidage and hardness. (5) There is no distortion of heat-affected area or parts. (6) High deposition rate (7) Strong adhesion between coating and substrate (8) Coating with complex geometric shapes (9) Easy to cover areas that should not be sprayed (10) The process can be fully automated

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Can plasma cleaning machine replace ultrasonic cleaning machine and what's the difference

Can plasma cleaning machine replace ultrasonic cleaning machine and what's the difference

Believe that a lot of industrial product manufacturer of plasma cleaning machine and ultrasonic cleaning machine products are very familiar with, in many industrial products manufacturers understand the ultrasonic cleaning machine cleaning not thoroughly is similar to the idea, is there a device can replace the ultrasonic cleaning machine, so the search on the Internet to a large number of cleaning products information, may be varied, that still can't solve their doubts. Today we are going to talk about, in the end the plasma cleaning machine and ultrasonic cleaning machine have what kind of relationship? Many manufacturers of industrial products may have used ultrasonic cleaning. This equipment can be used in many industries. Its cleaning purpose is to clean the surface of the workpiece and remove the dirt from the surface of the workpiece, thus achieving a clean effect. So in that sense, a lot of people understand that ultrasonic cleaning is actually cleaning something visible on the surface. What is the purpose of the plasma cleaning machine? First to analyze the origin of the plasma cleaning machine, plasma cleaning machine, also known as plasma device, the advantages of plasma cleaning purposes, plasma cleaning machine is using the plasma for routine cleaning cannot reach the effect, such as plasma active component is ion, electrons and photons, etc, so it achieve the cleaning effect of affirmation and general cleaning products, such as ultrasonic cleaning machine is not the same. Plasma cleaning machine USES these ions and photons and other active components to treat the surface of the workpiece, and to achieve the purpose of cleaning, it is obvious that this cleaning effect is better than the ordinary cleaning. Can plasma cleaning machine replace ultrasonic cleaning machine? The answer is no, because an ultrasonic cleaner is a device for cleaning visible material on a surface, whereas a plasma cleaner is not. Plasma cleaning machine is to clean the surface of organic matter, so that the product modification, improve the rate of defects, do surface activation and other effects. So it can not replace the ultrasonic cleaning machine. Then we say that they are a complementary thing, after the ultrasonic cleaning to do the plasma cleaning machine cleaning will make the product performance to achieve better results. It is believed that many manufacturers of industrial products will have the same feeling and recognition when they combine the two types of products. Plasma cleaning machine is a dry cleaning, mainly cleaning very small oxides and pollutants. It is to use the working gas under the action of electromagnetic field to excite the plasma and the surface of the object to produce physical and chemical reactions, so as to achieve the purpose of cleaning; The ultrasonic cleaning machine is a wet cleaning, mainly cleaning obvious dust and pollutants, belongs to a rough cleaning. It is to use liquid (water or solvent) under the action of ultrasonic vibration to clean the object, so as to achieve the purpose of cleaning. The purpose of use is different, plasma cleaning machine is mainly to improve the surface of cleaning items fit effect, the surface of the workpiece is not necessarily washed clean, but the fit effect than no use to improve a lot. Ultrasonic cleaning machine is mainly used to clean the workpiece surface, improve the surface cleanliness. Plasma cleaning should use chemical method, ultrasonic cleaning is using physical method.

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Plasma cleaning machine specific applications of specific properties

Plasma cleaning machine specific applications of specific properties

Plasma cleaning machine/etching machine produce plasma device is set in an airtight container, two electrode form electric field with a vacuum pump to achieve a certain degree of vacuum, with gas more and more thin, the distance between molecules and the free movement of distance between molecules or ions is also becoming more and more long, the electric field, they collide and form plasma, the activity of these ions is very high, the energy enough to destroy almost all of the chemical bonds in any exposed surface caused by chemical reaction, the plasma of different gases with different chemical properties, such as oxygen plasma has the very high oxidation resistance, can resist oxidation reactions generated gas, So as to achieve the cleaning effect; Corrosive gas plasma has good anisotropy, which can meet the needs of etching. Glow is emitted by plasma treatment, so it is called glow discharge treatment. The mechanism of plasma cleaning machine mainly relies on the "activation action" of the active particles in plasma to remove the object surface stains. From the point of view of the reaction mechanism, the plasma cleaning machine usually includes the following processes: inorganic gas is excited to plasma state; The gaseous substance is adsorbed on the solid surface; The adsorbed group reacts with the solid surface molecule to form the product molecule. The molecules of the products were analyzed to form the gas phase. The residue of the reaction escapes from the surface. Plasma cleaning technology is characterized by both process base material type of object, can be processing, metal, semiconductor, oxides and most of the polymer materials, such as polypropylene, polyester, polyimide, poly (ethyl chloride, epoxy, and even can well with teflon etc, and can realize the overall and partial cleaning and complex structure.

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Plasma cleaning machine several frequency differences and applications

Plasma cleaning machine several frequency differences and applications

There are three commonly used plasma excitation frequencies. The plasma with excitation frequency of 40kHz is ultrasonic plasma, the plasma with 13.56MHz is rf plasma, and the plasma with 2.45GHz is microwave plasma. The self-bias voltage of the ultrasonic plasma is about 1000V, and that of the rf plasma is about 250V. The self-bias voltage of the microwave plasma is very low, only a few tens of volts. Moreover, the mechanisms of the three plasmas are different. The reaction in ultrasonic plasma is physical reaction, the reaction in rf plasma is both physical reaction and chemical reaction, while the reaction in microwave plasma is chemical reaction. Ultrasonic plasma cleaning has a great influence on the surface to be cleaned, so rf plasma cleaning and microwave plasma cleaning are mostly used in semiconductor manufacturing applications. Ultrasonic plasma is used in surface degluing, burring and polishing, etc. The typical plasma physical cleaning process is plasma cleaning with argon added in the reaction chamber as the auxiliary treatment. Argon itself is an inert gas. The plasma does not react with the surface, but it is cleaned by ion bombardment. The typical plasma chemical cleaning process is oxygen plasma cleaning. Oxygen radicals produced by plasma are very reactive and easily react with hydrocarbons, producing volatile substances such as carbon dioxide, carbon monoxide and water, thus removing pollutants from the surface. Plasma cleaning is given priority to with physical reaction, also known as sputtering etching (SPE) or ion milling (IM), its advantage lies in itself does not produce chemical reaction, will not leave any clean surface oxide, can keep the cleaning chemical pure sex, there is a kind of surface reaction mechanism of plasma cleaning is plays a significant role in physical and chemical reaction, the reactive ion etching or reactive ion beam etching, two kinds of cleaning can promote each other, by ion bombardment cleaning surface damage weaken its chemical bonds or atomic state formation, easy absorption of reactant, ion collision that is cleaning heat, making them more likely to respond; Selecting 40KHZ ultrasonic plasma and adding appropriate reaction gas can effectively remove gum residue, metal burrs and so on. Microwave plasma of 2.45ghz is often used in scientific research and laboratory.

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