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Describes the plasma surface treatment process equipment

Describes the plasma surface treatment process equipment

Describes the plasma surface treatment process equipment Plasma, the fourth state of matter, is a unique treatment medium used to treat and roughen surfaces. Plasma surface treatment equipment has unique advantages, the characteristics of its interaction with the surface and the scope of application are as follows. Plasma surface treatment equipment has the advantages of surface treatment, flexibility and consistency of process, low cost, easy to use, user and environment safety. Depending on the type of processing gas and material used, the plasmon surfaces interact differently. A variety of plasma treatment gases can be used for the removal, oxidation, activation, crosslinking and deposition of chemical and mechanical pollutants. Plasma surface treatment equipment technology What plasma is, how it is produced and maintained, and how it interacts with surfaces. A large number of ions, excited molecules, free radicals and other active particles in the plasma act on the surface of the solid sample, which can not only remove the original pollutants and impurities on the surface, but also play a corrosive role, making the sample surface rough, forming many small depressions, and increasing the specific surface area of the sample. Improve the wettability of solid surfaces. Plasma forming uses capacitive plates or magnetic induction to generate an RF oscillating electric field in a gas region. The combination of electric field acceleration of the electron and elastic scattering of neutral atoms or field lines at low enough pressure heats the electron. When electrons in a neutral gas gain kinetic energy beyond the ionization threshold, the neutral collision of electrons leads to further ionization, resulting in the creation of additional free electrons, which are heated in turn. Plasma surface interactions: The energy of the electrons and ions in the plasma surface treatment equipment process is sufficient to ionize neutral atoms, separate the molecules, form reactive free radicals, cause the atoms or molecules to produce excited states, and locally heat the surface. Depending on the process gas and process parameters, the plasma can make free radicals react with the surface through mechanical action, the dynamic migration of electrons and ions and the corrosive effect of the surface, as well as the chemical reaction work. In general, plasmas can act on and clean surfaces through several mechanisms: etching, activation, deposition, crosslinking, and grafting plasma surfaces. Plasma surface treatment equipment advantages: Effect on the surface of the material: plasma treatment only affects the near surface of the material and has no effect on the blocky properties of the material. Unlike many wet cleaning processes, plasma cleaning does not leave organic residues; Under the right conditions, plasma cleaning can completely remove contaminants, resulting in an "atomically clean" surface. Unlike aqueous solutions, plasmas are not limited by surface tension and can clean rough, porous, or uneven surfaces. Plasma treatment at near ambient temperature can reduce the damage to thermosensitive materials. Plasma surface treatment equipment process has a certain flexibility and consistency, depending on the process gas and use, plasma treatment can be used for surface characteristics of cleaning, activation, cleaning and modification changes. Plasmas react with a variety of materials, so they can also handle components made of different materials. 1. Low price/easy to use 2, high processing efficiency, short processing time, no drying stage, low energy consumption. 3. Plasma treatment can help avoid process losses due to heat loss and solvent damage. 4, Plasma processing is easier to use and maintain than chemical or mechanical processing, and does not require complex chemical analysis or maintenance. Plasma treatment usually does not require solvents, nor does it require continuous purchase and processing of solvents. 6. Plasma plasma technology is adopted to improve the safety of users and the environment. 7. Plasma technology can eliminate the safety risk of workers' contact with dangerous chemicals. 8. Plasma plasma treatment is carried out under conditions close to the ambient temperature, which will not cause safety problems. 9, can handle complex geometry of three-dimensional parts.

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Domestic plasma etching machine manufacturers: directed self-assembly material plasma etching

Domestic plasma etching machine manufacturers: directed self-assembly material plasma etching

Domestic plasma etching machine manufacturers: directed self-assembly material plasma etching Domestic Plasma Etching Machine Manufactory Directional Self-assembly Plasma Etching Application: In the process below 22nm, it is necessary to reduce the periodic spacing. The general practice is to achieve the pattern definition of small size and small diameter through the way of secondary exposure, namely repeated lithography etching. This method has been successfully mass-produced in the fin type field effect transistor, but it will undoubtedly increase exponentially. Many experts in the field of micrographic definition have long been exploring alternative methods of micrographic definition that go beyond the current lithography physics. Among them, directional self-assembly using polystyrene (PS), polymethyl methacrylate (PMMA) and its block copolymer is a method that has been discussed more. The method is to use the phase transition conditions between different components in the block copolymer to remove part of the components to realize the pattern definition. Some successful cases are the use of block copolymers of polystyrene and polymethyl methacrylate to reduce periodic spacing and the realization of minimal diameter contact holes through graphic definition. The minimum contact hole is defined by first defining the graph and then filling the block copolymer, so that the block copolymer will fill the previously defined graph, and the phase transition occurs at the boundary of the graph first and then gradually spreads to the body, which is just for our use. If the diameter of the contact hole is defined as 68nm first, then the contact hole can be reduced to 20nm after the second definition in this way. At the same time, different shapes, sizes and even different intensities of contact holes can be realized by using the different morphologies of the patterns in the previous step and adjusting the morphology of block copolymer. Domestic plasma etching machine manufacturer If the graphical definition of directional self-assembly can be used in mass production, how to remove these unwanted block copolymers becomes a problem that must be further studied. At present, the general method is to remove by wet etching or dry plasma etching. Generally speaking, the selection ratio of wet removal is very high, but the definition of the figure is not good enough, which will bring poor line width roughness and may cause the collapse of dense and narrow lines, due to the wetting effect of the solution. And domestic plasma etching machine manufacturers dry plasma etching removal generally lower selection ratio but will not have these problems. Common dry etching methods and actual performance are listed in Table 8.3. It can be seen that the mixed etching effect of AR and oxygen is good. Although the selection ratio of block copolymer is not high, the selection ratio of the lower material, the line width roughness and the key size definition are all good. Table 8.3 Etching results of block copolymers with different gas ratios: Ar O2 Ar/O2 CF4 O2/CHF3 PMMA/PS etch selectivity 3.63 1.50 2.04 1.85 1.82 Etch sel. To underlying material(Si or SiOx) Good Good Better Poor Poor Edge roughness Poor Poor Good Good Good CD(original CD:~25nm) Deformed 21.58 nm 24.24 nm 26.50 nm 25.92 nm Xe and H2 have a higher etching rate for PMMA and PS, the thicker PMMA/PS films growing on the control plate will be completed by plasma etching faster, and the etching termination phenomenon will occur when the two materials are etched with CO, and the gas saturation phenomenon occurs at the beginning of the etching stage. Compared with H2, the etching rate of PS will be faster and the selection ratio will be lower. And CO will be deposited on the PS surface can be used to adjust the etching selection ratio. Using the mixture of these three gases, we can see that the selection ratio is all above 5, which can be applied to industrial production. However, XE-Co mixture will cause more carbides to deposit on the surface of PMMA, which will destroy the original pattern. In contrast, the combination of Co-H2 has little influence on the patterning and is conducive to the actual control. Co-H2 has been used to successfully form lithographic plasma etching contact holes with key size difference less than 1nm and diameter of 15nm in a 10nm process. More and more close to the bottleneck of silicon semiconductor, new materials continue to emerge, and the realization of the device is more and more, and closer to mass production. These new materials, which will soon appear in semiconductor integrated circuits, are very challenging for etching. This kind of material generally has better electrical conductivity and chemical activity, preferring a little more chemical etching. The general requirement is that the graphic definition should be accurate and the damage to the key layer and the contact layer should be small. On this basi

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Effect of Oxygen Plasma Surface Treatment on ITO Films Improving the Electrical Properties of ITO Films

Effect of Oxygen Plasma Surface Treatment on ITO Films Improving the Electrical Properties of ITO Films

Effect of Oxygen Plasma Surface Treatment on ITO Films Improving the Electrical Properties of ITO Films Effect of Oxygen Plasma Surface Treatment on ITO Thin Films As an important transparent semiconductor material, indium tin oxide (ITO) has not only stable chemical properties, but also excellent light transmittance and electrical conductivity, so it has been widely used in the optoelectronics industry. The conduction band of ITO is mainly composed of In and 5S orbital of Sn, while the valence band is dominated by 2p orbital of oxygen. The oxygen vacancy and Sn-substituted doped atoms constitute the donor level and affect the carrier concentration In the conduction band. The highly degenerate N-type semiconductor of ITO is formed due to the generation of oxygen vacancy and Sn-doped substitution In the film during deposition. Its Fermi level, Er, is above EC at the bottom of the conduction band, thus having a high carrier concentration and a low resistivity. Effect of oxygen plasma surface treatment on ITO films In addition, ITO has a wide optical band gap, so it has a high transmittance to both visible and near-infrared light. Due to the above unique properties, ITO thin films are widely used in photovoltaic batteries, electroluminescence, liquid crystal display, sensors, lasers and other optoelectronic devices. As is known to all, ITO belongs to non-stoichiometry, compounds, deposition conditions, post-treatment technology and cleaning methods and other factors will significantly affect its surface properties, especially the surface morphology and chemical composition of its surface, thus affecting the interface characteristics between ITO film and organic layer, and further affecting the optoelectronic performance of devices. Therefore, before commercial ITO conductive glass is used to fabricate devices, it is usually necessary to adopt appropriate methods to treat the surface of ITO film, and improve the performance of devices by improving its surface electrical properties and surface morphology. Up to now, the methods used for surface modification of ITO can be divided into two types: dry treatment and wet treatment. Among them, the dry treatment of oxygen plasma surface treatment usually uses various ionized gas plasma to clean the surface of ITO to remove its surface pollution and improve its surface morphology. Wet treatment uses different organic solvents to bond new groups on the surface of ITO, so as to achieve the purpose of modifying its surface. The surface of ITO anode was modified by oxygen plasma treatment. The changes of chemical composition, crystal structure, light transmittance and block resistance of ITO film before and after treatment showed that the surface of untreated ITO contained residual pollutants related to carbon element. After plasma treatment, the acromion strength of ITO was significantly reduced. This indicates that oxygen plasma surface treatment can effectively remove organic pollutants on ITO surface. Plasma treatment can not only reduce the carbon concentration on ITO surface, but also increase the oxygen concentration on ITO surface, and improve the chemical composition on ITO surface, which is very important for improving the work function of ITO and the performance of devices. In addition, a four-probe method was used to measure the block resistance of ITO samples before and after treatment. It is found that plasma treatment can reduce the block resistance of ITO electrode, which is beneficial to the improvement of device performance. In conclusion, under the condition that the crystal structure and optical transmittance of ITO films are almost unchanged, oxygen plasma surface treatment not only reduces the block resistance of ITO, but also improves the chemical composition of ITO surface and the work function of ITO, thus optimizing the physical properties of ITO anode. Plasma surface modification is beneficial to improve the energy conversion efficiency of organic solar cells, improve the photovoltaic performance of the devices, and play an important role in improving the short circuit current, filling factor and energy conversion efficiency of organic solar cells.

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Using atmospheric pressure plasma jet to clean the glass panel of mobile phone to remove grease

Using atmospheric pressure plasma jet to clean the glass panel of mobile phone to remove grease

Using atmospheric pressure plasma jet to clean the glass panel of mobile phone to remove grease In recent years, mobile phones are glass panels, in order to improve the strength and hardness of glass panels, usually using chemical toughening. And need to be cleaned before chemical tempering, if the cleaning is poor, it will affect the quality of the product. The traditional cleaning method is to scrub with detergent first, and then use acid and alkaline solution and organic solvent ultrasonic cleaning. The process is complicated, time-consuming and costly, and causes pollution. And now there are low-temperature plasma treatments. The ions, electrons, excited atoms, molecules and free radicals enriched in low temperature plasma are all active particles, which are easy to react with the surface of the material. Therefore, it is widely used in surface modification, thin film deposition, etching processing, device cleaning and other fields. Atmospheric pressure plasma jet cleaning mobile phone glass panel Atmospheric cryogenic plasma jet is a newly developed plasma treatment technology in recent years. It has the advantages of low breakdown voltage, high ion and metastable molecular concentration, high electron temperature, low neutral molecular temperature, uniform plasma, good controllability, no need to vacuum, and continuous surface cleaning. When cleaning, the higher the concentration of chemical active components in the plasma, the better the cleaning effect. In addition to the mechanical action, the cleaning of the glass surface by plasma jet is mainly the chemical action of reactive oxygen species. The Ar* in the excited state in the plasma, Excite oxygen molecules into excited oxygen atoms Ar * + O2 - > O + O * + Ar (1) Ar * + O - > O + Ar (2) High-energy electrons collide with oxygen molecules and break them apart, forming excited oxygen atoms E + O2 - > * O + O + e (3) E + O2 - > O + O + e (4) The main components of stained lubricating oil and stearic acid are hydrocarbons, which are oxidized by reactive oxygen species to produce carbon dioxide and water CnHm + PO *→ XCO2 + YH2O (5) This removes grease from the surface of the glass. Lubricating oil and stearic acid are common contaminants on the glass surface plate of mobile phones. After contamination, the contact Angle of the glass surface to water increases, affecting ion exchange. The traditional cleaning method has complicated process and pollution. Atmospheric plasma generator, simple structure, do not need to vacuum, can be cleaned at room temperature, the generated excited state of oxygen atoms than the general oxygen atoms are more active, can be polluted lubricating oil and stearic acid in the oxidation of hydrocarbons, carbon dioxide and water. At the same time, the plasma jet also has mechanical impact, which plays a scrubbing role and makes the contaminants on the glass surface quickly escape from the glass surface, so as to achieve the purpose of efficient cleaning.

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Plasma surface modification equipment to treat different materials before pretreatment to improve adhesion

Plasma surface modification equipment to treat different materials before pretreatment to improve adhesion

Plasma surface modification equipment to treat different materials before pretreatment to improve adhesion In different materials before the plasma surface modification equipment processing to improve adhesion, its cleaning principle is through the surface adhesion or adsorption of functional groups, to adapt to the specific application of the surface characteristics of the polymer surface cleaning activation, improve the ability of bonding. Plasma surface modification equipment for plasma activation circuit board, epoxy resin, PTFE printed circuit board etching and decontamination, gold contact deoxidization, O-ring plasma cleaning, PWIS cleaning, etc. There are strict requirements for the use of many O-rings and sealing elements, and the assemblies are free of any paint wetting damaging substances (such as silicone). This method can be used for coating, coating process and coating application, and also for some printed circuit boards which perform important wire welding tasks. Plasma surface modification equipment Elastic materials contain a large number of coating wetting damage substances, the traditional wetting process can not remove these substances. Softeners and release agents can be transferred from the body of the elastomer to the surface, causing quality problems. Plasma surface modification equipment Plasma cleaning processes are used to ensure compliance with standards in these components. Plasma cleaning eliminates the barrier between paint and coating. It can remove silicone contaminants and increase the bonding force of various plastics. Improve the wettability of all polymer materials surface, plasma treatment printing adhesion processing of three-dimensional shape surface activation, for different materials such as metal, ceramic, glass printing textile plasma treatment can improve the performance of many industries, including semiconductors, medical, IC integrated circuits and so on. Plasma surface modification equipment improves ink adhesion on difficult surfaces such as polypropylene (PP), polyethylene (PE), polycarbonate (PC) and polyamide (PA). These surfaces can be wetting in seconds through machining and in-line plasma treatment, giving uniform, solvent-free inks with good printing adhesion. Plasma processing is an inherent cold processing technology, which is also suitable for thermal sensitive materials. Plasma treatment is especially suitable for different materials complex three-dimensional shape of metal, glass, ceramic surface activation, such as ionization treatment can achieve ink adhesion performance is good, improve the surface adhesion. Plasma surface modification equipment principle: 1. The surface is treated by attachment or adsorption of functional groups to suit specific applications. 2, improve the polymer surface microstructure, improve adhesion. 3, plasma polymerization deposition of polymer layer, surface corrosion. 4. Plasma activates the grafted functional polymers or end groups on the surface. 5. Surface prepared for subsequent processing, such as thin film deposition or molecular adsorption. 6, improve the surface cover and spread of the coating, improve the adhesion and wettability between the two surfaces. 7. Wetting makes the surface hydrophilic. 8. Change the surface characteristics without affecting the material.

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Vacuum plasma surface cleaner for special purpose applications

Vacuum plasma surface cleaner for special purpose applications

Vacuum plasma surface cleaner for special purpose applications Vacuum plasma surface cleaning machine is specially used for IC chips and other materials surface treatment to increase adhesion, with a layer of vacuum plasma corrosion with a few atom thickness of the material, some IC chips only produce 10nm between electronic components, and there are manufacturers plan to reduce it to 5nm. Vacuum plasma surface cleaner What is the special application way of vacuum plasma surface cleaner? Vacuum Plasma Surface Cleaner deals with whether a clean surface will allow a binder to bond to a different surface. For example, when rubber parts are bonded to plastic tools. Plastic and rubber usually use different binders. Therefore, the approach of using the same binder for both materials is to ensure the cleaning and activation of each surface. Plasma activates the free radicals left on the surface of plastic or rubber material, making the bond between the material surface and the adhesive more tightly. This free radical occurs on the surface of the material and is chemically unstable; They are extremely strong in binding to adhesives. The production of these free radicals is also useful when printing surfaces, which usually do not accept ink. If printing is done on a bright or smooth surface, the plasma must be activated so that the printing surface can accept ink and produce a stain resistant effect. A vacuum plasma surface cleaner can be used to coat surfaces to enhance their luster, a process called plasma polymerization. Vacuum plasma is used to etch a layer of material several atoms thick to make small integrated circuit chips. Is the vacuum plasma surface cleaner used for cleaning other than activating the surface? Examples of plasma bonding: The shift registers can be glued together during assembly, and printing on smooth surfaces such as plastic or PTFE can result in poor finished product quality and a large amount of ink that does not adhere to the surface. It is difficult to bond other materials on smooth plastic products because different polymers require different adhesives, so the vacuum plasma surface cleaner can be used to improve the adhesion effect after cleaning.

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