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Atmosphere plasma cleaning machine PE material surface before screen printing process treatment

Atmosphere plasma cleaning machine PE material surface before screen printing process treatment

Polyethylene PE screen printing pretreatment plasma cleaning machine can operate online treatment, without low pressure vacuum environment, reduce costs. In addition, in order to facilitate user operation, the power of the plasma cleaning machine can be adjusted to improve the use efficiency of the equipment. Atmospheric plasma cleaning machine using low temperature plasma technology, no need to worry about the product in the production process of damage, is a variety of accessories, material surface treatment process. Polyethylene PE screen printing pre-treatment plasma cleaning machine process characteristics: 1, atmospheric plasma cleaning machine ejected electricity is neutral, no charge can be used for surface treatment of various polymers, metals, rubber, PCB circuit boards and other materials; 2, improve the bonding strength of plastic products, such as PP products after treatment can be increased several times, most plastic products after treatment of the surface energy can reach 70 up to the factor; 3, the surface performance of atmospheric plasma treatment is durable and stable, and the maintenance time is long; 4, dry treatment, no pollution, no waste water, in line with environmental protection requirements. Polyethylene screen printing pre-treatment plasma cleaning machine is widely used in the following industries: petroleum, chemical, chemical fiber, pharmaceutical, rubber, food, leather, spray paint, color printing. Plasma cleaning also has the following characteristics: easy to use numerical control technology, high degree of automation; High precision control equipment, high precision time control; Correct plasma cleaning will not produce damage layer on the surface, to ensure the surface quality; Do not pollute the environment, ensure that the cleaning surface is free from secondary pollution. Application of atmospheric plasma cleaning machine method: 1, conventional cleaning methods can not completely remove the film on the surface of the material, leaving only a very thin impurity layer, and solvent cleaning is a typical type of this. 2, the use of atmospheric plasma cleaning machine, to use plasma bombardment material surface, in a gentle and thorough way to clean the surface. 3. Plasma cleaning will remove the invisible oil film, tiny rust and other such dirt formed on the surface due to the user's contact with the outside world. In addition, plasma cleaning will not leave any residue on the surface. 4, Plasma cleaning function to handle a variety of materials: including plastic, metal, ceramic and a variety of geometric shape of the surface. 5. The advantage of atmospheric plasma cleaning is that it can not only wash away the dirt on the surface, but also enhance the adhesion of the surface of the material.

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Vacuum plasma cleaning machine manufacturers on the relationship between free electrons and plasma

Vacuum plasma cleaning machine manufacturers on the relationship between free electrons and plasma

Normally, when we think of plasma or plasma, we think of ionized air or hot material from the sun. But if you assume that the free-electron model of metal is carefully thought through, the "gas" of free electrons moving in a positive ion scene is also a "plasma". In metals, the collective oscillation of the positive ion lattice can be quantized into phonon explosion, transmission and annihilation. Similarly, in metals, the collective oscillation of the free electron gas can be thought of as an agitation, or quantized as a burst, transfer, and annihilation of a quasi particle. A plasmon is this quasi particle, perhaps a "plasma unit." It's not an elementary element of a exciton. "Exciton" means "collective excitation" or "excitation "; "Plasmon" means "plasmon, "which is the basic unit of plasma, but it's completely absent. Free electrons and metal ions are the basic units of plasma in metals. There are two types of collective electron shaking in a metal: one in which the whole metal's electrons shake synchronously under the action of an external electric field, and the other in which they shake collectively on the surface of the metal. Because of the metal's effective shielding of the applied electric field, the collective sloshiness does not end up in the microscopic metal (and therefore is not easy to be as dense or cloudy as the high-temperature equivalent ionization proposed in the controlled fusion study), but only in the nanoparticles. Another kind of very common, we often call "metallic luster" also has to do with this. The second form of surface sloshing has been called "surface plasmon". In addition, the plasma cleaning is not fixed in one place, but pass, pass all things, because keeping electronic vibration and metal cations, inevitable part is no longer electrically neutral, but "polarization", focused on the local area and quasi particle properties of polarization, the formation of "surface etc from shock yuan" (SPP) so the name of a man. A little paraphrase, it can be called "surface iso-polariton", indicating that this exciton has the characteristic of "polarization". In this way, surface plasmas can also be classified as "plasmas". But this "plasma" is not the "solid, liquid, gas" side by side of the hot plasma that people think. The above is the CRF vacuum plasma cleaning machine manufacturers on the relationship between free electrons and plasma.

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Headlamp manufacturing plasma processing makes cold glue become the mainstream of the automotive industry

Headlamp manufacturing plasma processing makes cold glue become the mainstream of the automotive industry

When BGA packaging process is carried out by plasma cleaning machine, almost all automobile headlamps are made of adhesive to meet the requirements of glue leakage between the light distribution mirror piece and the housing, hot melt adhesive and cold adhesive. They have their own characteristics. The characteristics of hot melt adhesive: in a fluid state at a certain melting temperature, by the active glue machine active glue injection, cooling speed is fast, glue production force occupies a greater advantage, so suitable for mass production. Cold adhesive characteristics: in normal temperature conditions in the fluid state, under the condition of the condensation, naturally over time, the coalition force will be more and more strong, the manual glue, suitable for small batch production, the sealing effect is better than hot melt adhesive, but under the condition of the need to stand for 24 hours after the condensation, need tooling and process, production cycle is longer than hot melt adhesive moment. It is assumed that the cold adhesive can obtain both cheap and high quality adhesive effect with reasonable technology and its own price advantage. The pretreatment of the cemented surface by plasma treatment makes this result possible, while the processing equipment of plasma treatment of the cemented surface is at atmospheric pressure, which makes this process acceptable to the user in terms of production and capital investment. Gaseous plasmas with different chemical properties produce different functional properties, such as surface materials that are more hydrophobic or more hydrophilic. Atmospheric plasma equipment does not require a valuable vacuum system, which makes the cost of the equipment and operating costs easily acceptable to the user, and because it is operated at atmospheric pressure, it can be well integrated with existing production lines for continuous production. As a result of these characteristics, some domestic automotive lamp manufacturing enterprises with considerable research and development strength have begun to explore or apply this production mode.

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Application of Plasma Surface Treatment in Microassembly Technology Application of Plasma Surface Treatment in Microassembly Technology

Application of Plasma Surface Treatment in Microassembly Technology Application of Plasma Surface Treatment in Microassembly Technology

Overview of microgroup assembly technology: From the beginning of micro assembly concept put forward, especially surface-mount technology development to a high level of specific stages, namely the guide feet must be less than 3 mm between components in surface-mount technology, with the further development of technology, now also refers to various forms of element SMT technology, such as circuit lead spacing is small, such as modules, components, systems or SMT technology. There is another saying that micro-assembly technology is short for micro-circuit assembly technology, that is, the assembler uses assembly equipment, tools, and micro-welding, interconnection and packaging technology to assemble a variety of micro components, integrated circuit chips, micro structural parts, etc., on the multi-layer interconnect substrate. Processes, methods and techniques for making it a highly reliable, high-density, two-dimensional microelectronic product (module/component/component/subsystem/system). The main application objects of micro - assembly technology are: micro - components, micro - spacing, micro - structure and micro - connection. The application of micro-assembly technology mainly includes: device level packaging, circuit module level assembly, micro-assembly or micro-system level assembly. The main contents of micro-assembly technology are as follows: 1) chip welding (conductive adhesive connection, eutectic welding, reverse assembly welding, etc.); 2) Interconnection of chemical plates (lead connection, automatic connection of carrier belt, micro-convex connection, etc.); 3) Device 3D assembly (wafer level 2D assembly, chip level 2D assembly, package level H-dimensional assembly); 4) Stereo assembly (chip level stereo assembly, board level stereo assembly). The main characteristics of microassembly technology are: 1) on a single printed plate (or substrate) to assemble a plurality of components (including outer package and no outer package) and other small components to form circuit modules (or components, Microsystems, subsystems); 2) the circuit module or component has a specific function and performance; 3) Independent circuit modules or components are generally not externally packaged, but can also be externally packaged (when the substrate is equipped with unpackaged components or specially required components); 4) Through motherboard and vertical interconnection technology, multiple independent circuit modules or components can be assembled into three-dimensional components -- dimensional three-dimensional assembly; 5) Multiple independent circuit modules or components can form a higher level system through motherboard, connection and plug interconnection or cable interconnection technology -- complete machine interconnection technology; 6) Multi-disciplinary optimization and micro-assembly design should be carried out according to the requirements of micro-assembly design with the pin spacing less than 3mm of the components. Plasma surface treatment process: In the process of microassembly, plasma surface treatment technology is a very important link, which directly affects the quality of the functional modules of microassembly. In the process of microassembly, plasma cleaning process is mainly used in the following two aspects. (1) point conductive adhesive before: the contaminants on the substrate will make the substrate wettability worse, point conductive adhesive is adverse to the tile glue, glue is round. Plasma surface treatment technology can greatly improve the wetting property of the substrate surface, which is beneficial to the adhesion between the conductive adhesive layer and the chip, and improve the bonding strength of the chip. (2) before the lead connection: chip affixed on the substrate, after high temperature curing, the substrate contaminants may contain particles and oxides, so that the lead and chip or substrate connection is not strong, resulting in insufficient connection strength. Isoionization treatment can obviously improve the surface activity before lead connection and thus enhance the strength of lead connection. The objects of plasma surface treatment in microassembly mainly include chip bonding zone, substrate, guide frame, ceramic substrate, etc. In this experiment, the substrate was cleaned, and silver and oxidation were generated on the surface of the substrate. Plasma cleaning machine was used to clean the substrate, and hydrogen and nitrogen mixture was selected as the cleaning process gas. During the cleaning process of plasma surface treatment, hydrogen plasma was effective enough to remove oxides on the substrate. The experimental results show that the process parameters such as pressure, power, time and gas flow can be effectively controlled in the cleaning process, and a better cleaning effect can be achieved.

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Vacuum plasma cleaning machine manufacturers on oxygen hydrogen plasma etching graphene introduction

Vacuum plasma cleaning machine manufacturers on oxygen hydrogen plasma etching graphene introduction

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Plasma surface treatment equipment PCB and polymer material surface treatment effect

Plasma surface treatment equipment PCB and polymer material surface treatment effect

Plasma is formed by applying electric field to low-pressure gas for glow discharge, which can modify the surface energy of polymer materials such as PTFE. Plasma surface treatment equipment is widely used in PCB(printed circuit board) hole metallization pretreatment, polytetrafluoroethylene and other materials bonding pretreatment and PCB surface activation treatment. It can replace the traditional sodium naphthalene solution immersion, and provides a fast, convenient and clean treatment method for the surface activation of PTFE and other substrates. The system software of plasma processing equipment mainly consists of PLC control program and computer monitoring software. When the system runs automatically, the operator sets the control parameters, and then presses the automatic button to enter the automatic control monitoring interface. PLC can send all kinds of control commands, at the same time can collect all kinds of real-time data of PLC, to achieve the whole process of production monitoring. The plasma processing system also has the function of real-time alarm and historical data preservation. PLC software is used to realize all the control interface tasks of the equipment. Its design idea is based on saving the hardware investment as much as possible, replacing the hardware with software and improving the software efficiency for programming. PLC program powerful, flexible configuration, outstanding performance, including the bit logic counter timer, mathematical operation and other intelligent control module, can monitor the input state, change the output state, to achieve the purpose of control. In practical application, the plasma processor system runs normally, the performance is stable and reliable, the interface is friendly, the user can simply monitor the process flow and parameter setting, and the efficiency is improved. The plasma surface treatment equipment has obvious surface treatment effect on PCB and polymer materials, and can significantly improve the adhesion, hygroscopic and adsorptive properties of materials. Compared with the traditional control method, the plasma processor has the advantages of good real-time performance, simple operation, stable and reliable performance. The design of plasma treatment system not only improves the production efficiency of PCB manufacturers and brings good economic benefits to enterprises, but also improves the automation level of the system to a great extent, which can provide reference for the design of other systems.

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