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Atmospheric plasma surface treatment to change the surface energy of waterborne coatings for automotive industry

Atmospheric plasma surface treatment to change the surface energy of waterborne coatings for automotive industry

How does atmospheric plasma surface treatment ensure the adhesion of waterborne coatings in automobile industry?   When cleaning contaminated surfaces and activating non-polar plastics, it is not possible to obtain long-term stability and flawless adhesion of paint to the surface without a subtle degree of cleaning. There are a variety of cleaning and activation methods and the use of chemical solvents is widely used, but more than 50 per cent of volatile organic compound (VOC) emissions are due to the use of solvents and spraying operations account for the majority of these emissions.   Surface energy is the key factor to ensure wettability and adhesion. Whether the coating can have the adhesion force needed to combine with the substrate mainly depends on the surface energy of the coating. Good wettability means that the surface of the material is ultrafine and clean, and the surface of solid material can be higher than the surface tension of liquid. Chemical solvent-based pretreatment processes are harmful to the environment and are often health-damaging, energy-consuming and costly to dispose of. So it's no surprise that in an era of increasing environmental awareness, car manufacturers are looking for alternatives, and water-based paint systems are moving toward environmentally friendly surface treatment technologies. Atmospheric plasma surface treatment technology is an environmentally friendly, economical and efficient pretreatment process.   Plasma surface treatment technology is a dry pretreatment process without chemical solvent, which combines three effects of micro-cleaning, electrostatic dissipation and surface synchronous activation. Plasma is produced by a high-pressure discharge from a nozzle and is delivered to the surface in the form of an air stream. The surface is activated by chemical and physical interaction between plasma and matrix. When plasmas collide with the plastic surface, the groups containing oxygen and nitrogen combine with the non-polar polymer matrix, and the plasma activation increases the surface energy and makes it become polar. Plasma contains a lot of energy -- free radicals, ions, atoms and molecular fragments -- which release that energy onto the surface of the pretreated material, triggering a chemical reaction to produce an effect. The resulting functional hydroxyl, carbonyl, and carboxyl groups (as well as nitrous oxide) have a strong chemical bond with the coating and contribute to a significant increase in adhesion. During pretreatment, the surface temperature of the plastic generally does not exceed 30℃.   This plasma effect leads to uniform surface wettability, which not only produces good adhesion in a few seconds, but also ensures a high quality finish with waterborne coatings. This environmentally safe process requires only compressed air as the reaction gas and electricity.   The on-line spray gun system of atmospheric plasma surface processor controlled by computer can be monitored by screen and is fully compatible with the machine. At the same time, the process itself is powerful. Traditional pretreatment methods can be completely eliminated by plasma treatment in most cases. Unlike the chemical solvent pretreatment method, this method does not require drying and temporary storage, so it can be used to spray parts immediately after atmospheric plasma cleaning and activation, which not only eliminates some process steps, greatly reduces energy consumption and operating costs, and improves output and product quality.

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Influence of H2 on methane conversion reaction under plasma action

Influence of H2 on methane conversion reaction under plasma action

In the reaction of methane conversion by dc discharge plasma at atmospheric pressure, the amount of H2 added has an influence on the conversion rate of methane, the selectivity of C2 hydrocarbons and the yield of C2 hydrocarbons. With the increase of the amount of H2 added, XCH4, SC2 and YC2 all show an upward trend. When the addition of hydrogen is 80%, XCH4 is 55.1%, YC2 is 42.4%, and SC2 is 82.7%. Spectrum analysis results show that, with H2, with the increase of adding amount of spectral peak intensity H and C2 species increased, analysis the reason may be the H2 cracking generates a large amount of hydrogen plasma activity, active hydrogen atom inelastic collision with methane, prompting generate methane dissociation CHx (x = 1 ~ 3), therefore the conversion of methane is gradually increasing.   At the same time, the spectrum peak strength of CH also gradually increased, indicating that with the increase of the amount of H2 added, the amount of CH generated by methane dissociation increased, and the free radical coupling generated C2 hydrocarbon, so the yield of C2 hydrocarbon increased gradually. In addition, the spectral line strength of C remained basically unchanged, while the selectivity of C2 hydrocarbons in the reaction increased. The analysis was attributed to the fact that the presence of a large number of active hydrogen atoms in plasma inhibited the decomposition and dehydrogenation of C2 hydrocarbons, and the C generated in the reaction system was reduced to CH free radicals, which were coupled to generate C2 hydrocarbons, thereby reducing carbon deposition. The reduction of carbon deposition on the reactor wall and electrode was also observed during the experiment.

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Does plasma cleaning work on blind hole

Does plasma cleaning work on blind hole

Due to the small aperture of THE HDI plate, the traditional chemical cleaning process cannot meet the cleaning requirements for the blind hole structure, and the liquid surface tension makes it difficult for the liquid to penetrate into the hole, especially when the laser is drilled into the microblind hole, its reliability is poor. At present, the technology used for microburied blind hole cleaning is mainly ultrasonic cleaning and plasma cleaning of plasma cleaning machine. Ultrasonic cleaning is mainly to achieve the purpose of cleaning according to the bubble effect, belongs to wet treatment, cleaning time is longer, and depends on the cleaning fluid decontution performance, increasing the difficulty of disposing waste liquid.   At present widely used technology is the plasma cleaning machine plasma cleaning process, the plasma treatment process is simple, environmental protection, cleaning effect is obvious, for the blind hole structure is very effective. Plasma cleaning refers to the gas-solid chemical reaction of highly activated plasma with the borehole dirt on the borehole wall through directional motion under the action of electric field, and at the same time, some unreacted gas and particles are discharged through the air pump.   When cleaning the HDI plate blind hole, the plasma is generally divided into three stages. In the initial stage, the plasma is produced with high purity N2, while the printed plate is preheated, so that the polymer material is in a certain activated state. In the second stage, O2 and CF4 are used as the original gas. After mixing, O and F plasma is generated, which reacts with acrylic acid, PI, FR4 and glass fiber to achieve the purpose of cleaning drilling and fouling. In the third stage, O2 is used as the original gas, and the generated plasma and reaction residue make the hole wall clean.   In addition to plasma chemical reaction, the cleaning process of plasma cleaning machine also has physical reaction with material surface. Plasma particles can shoot down atoms on the surface of the material, or knock atoms off the surface of the material, which is conducive to cleaning the etching reaction. With the development of materials and technology, the structure of buried blind hole will become more and more miniaturized and refined. It will be more and more difficult to electroplate fill the blind hole with traditional chemical degumming method, but plasma-treated degumming method can overcome the shortcomings of wet degumming method, and achieve good cleaning of the blind hole and small hole, so as to ensure a good effect in the electroplating fill process of burying the blind hole.   Plasma cleaning machine cleaning is a dry cleaning, mainly depends on the active ion in the plasma "activation" to remove the object surface stains. This treatment can also be applied to the cell, can effectively remove the cell pole pole end face of dirt, dust, etc., for the battery welding in advance to prepare, to reduce welding defects.

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Plasma-flame machine Rubber surface treatment process

Plasma-flame machine Rubber surface treatment process

By means of physical and chemical reactions between high-energy particles of plasma flame machine and the surface of organic material, activation, etching and decontamination of the surface of the material can be realized, and various surface properties of the material, such as friction coefficient, adhesion and hydrophilicity, can be improved. Plasma-cleaning machine is used to modify the rubber surface, which can obviously improve the adhesion between components, and the quality is stable. Compared with the traditional polishing process, plasma flame machine surface treatment technology has the advantages of simple process flow, easy operation, high processing efficiency, energy saving, environmental protection, health and safety, etc., and has a wide range of application prospects in the field of rubber bonding.   The adhesion of half parts is an important index in the production of multi-part rubber products, such as tires, and the adhesion quality is especially important in the forming process. At present, the adhesion of half parts mainly depends on its own adhesion in the process of production, and the adhesion effect can be improved by grinding the surface and brushing the glue pulp. The bonding performance of the semi-finished product is influenced by the environment (such as temperature, humidity, light, ventilation, etc.) as well as the expiry date of the binder and dust. The operation process of glue or oil coating is complicated, which requires many process points and is greatly affected by temperature, humidity and other factors. In the season with large temperature difference, the adhesive quality fluctuates easily. At the same time, there are serious defects such as not environmental protection and hidden danger of affecting operator's health and safety.   Nowadays, low-temperature plasma technology of plasma flame machine is widely used in the surface treatment of materials in the automobile industry. It modifies the parts of automobile such as instrument, seat, engine, rim, paint and rubber seal. The practical application shows that this technology is very effective in improving the surface performance of parts and has been favored by many parts and automobile manufacturers.   Plasma flame machine at the time of activation product surface molecules on plasma surface treatment, won't destroy the structure of the product, whether all kinds of silicone products or special printing material such as rubber, after plasma surface treatment, can improve the product surface adhesion, reduce the traditional way of handling damage, reduce production costs, more can be applied to the original can't printing materials, for clients to develop new markets, create new value.

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Application of low-temperature plasma in the field of polymer materials

Application of low-temperature plasma in the field of polymer materials

Conductive plastics is a very active research and development field nowadays. It has developed from pure laboratory research to applied research and become a new generation of electronic materials. According to the conductive mechanism, conductive polymer materials can be divided into two types: structural type and composite type.   At present, the synthesis process of structural conductive polymers is complex and the cost is high. Due to its simple processing technology and low cost, composite conductive polymer has been widely used in electronics, automobile, civil and other fields. Structural conductive plastic is a functional polymer material made by mixing resin with conductive material. It is mainly used in electronics, integrated circuit packaging, electromagnetic shielding and other fields.   Conductive plastics can generally be classified into the following two categories:   1, according to the electrical performance classification, can be divided into: insulator, antistatic body, conductive body, high conductor. Resistance is generally greater than 1010 Ω · cm called insulators; Resistance to Ω · cm diameter range of 104 ~ 109 is called semiconductor or antistatic body; Resistance value is less than 104 Ω · cm called conductive body, resistance under 100 Ω · cm called high conductor is even lower.   2. Manufacturing methods of electric plastics can be classified into two types: structural conductive plastics and composite conductive plastics. Structural conductive plastics, also known as intrinsic conductive plastics, refer to the conductivity of their own or their chemical modification.   Structural conductive polymer materials: (1) conjugated polymers: such as polyethylene, (Sr) N, linear polybenzene, layered high polymer, etc. (2) Metal chelates, such as polyketone phthalocyanine; (3) Charge mobile polymer complex: such as polycation, CQ complex. The production cost of polymer structural materials is high, and the technology is difficult, so it has not been produced on a large scale. Currently, conductive polymer materials are widely used as composite polymer materials, and their fillings mainly include: (a) Metal dispersion system; (b) Black carbon; (c) Organic complex dispersion system; (d) Carbon fiber.   3. According to different USES, low-temperature plasma can be divided into: Anti-static materials, conductive materials, electromagnetic shielding materials, tunnel theory explains the impact of conductive packing on conductivity. Conductive plastics conduct electricity because electrons can pass through the gaps between conductive fillers. At a certain concentration, as long as the distance between conductive fillers is reduced by a small part, electrons can conduct electricity through the pores between conductive fillers. At this time, the resistivity will be suddenly changed and the conductive plastic will change from the original insulator to conductor, which will produce leakage effect. The percolation concentration of carbon black filled LDPE compound is closely related to the structure of carbon black. The percolation concentration of the specially conductive carbon black filler compound is lower than that of the acetylene carbon black filler compound. In the production process, it is still difficult to reach the critical concentration, but the adoption of low temperature plasma treatment technology can make it easier to reach the critical concentration.

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Plasma pulse etching technology of plasma cleaning machine

Plasma pulse etching technology of plasma cleaning machine

In the traditional sense, the plasma etching process of plasma cleaning machine needs to achieve high yield, high uniformity, high selection ratio, anisotropy and no damage, etc. Etching process yield is a measure of productivity. It refers to the number of wafers etched per unit of time. Another important quality-related indicator is the etching uniformity within and between wafers. The required etching uniformity is the guarantee of chip yield. For the etching anisotropy of plasma cleaning machine, it directly defines the profile of the side wall of the etched microstructure. The potential plasma-induced damage (PID) has a significant impact on the performance of the device. For conventional continuous plasma etching, it becomes more and more difficult to achieve the etching target when the device size is reduced to below 14nm node. In order to meet these challenges, plasma pulse etching technology of plasma cleaning machine has been developed and gradually applied in industry.   Plasma pulsed technology was reported in the late 1980s and used for basic research in plasma physics. It is found that the pulsed plasma etching technology can solve many problems of the traditional continuous plasma etching, especially for the etching process with negative plasma. Compared with traditional continuous plasma etching, plasma pulsing technology of plasma cleaning machine can achieve etching process with high selectivity, high anisotropy and light charge accumulation damage, and can improve etching rate, reduce polymer production, increase etching uniformity and reduce uv radiation damage.   In order to better understand the relationship between input parameters (control variables) and output results (etching results) of plasma pulse etching technique. Different input parameters, such as reactor structure, Source and Bias power, air pressure and Frequency, gas flow rate and composition, material and cavity wall temperature, Pulse method (Source only, Bias, only, Synchronous Pulsing), Pulse Frequency, Pulse Repetition Frequency, PRF), Pulse Duty ratio (Pulse Duty Cycle) and Pulse Phase ((Phase Difference), etc., will affect the plasma characteristics in the reactor, Such as plasma density, reactive group activity, electron temperature, ion flux and energy, neutral particle and ion flux ratio, and dissociation rate. By changing the plasma characteristics of the plasma cleaning machine to affect the output results, such as cavity side wall state, macroscopic etching non-uniformity, etching and polymer deposition, microscopic etching non-uniformity, vertical and horizontal etching, graphic side wall protection layer, key size, side distortion and plasma-induced damage.   Optimize etching results by regulating important plasma properties by regulating chemical and physical reactions occurring inside the plasma and on the wafer surface. To better control these plasma characteristics, this is typically achieved by controlling the electron energy distribution (EED) and the ion energy distribution (IED), because the distribution of electrons and ions greatly affects the rate at which the ions and wafers react. In a general sense, the plasma cleaning machine electrons affect the excitation, ionization, decomposition and thermal diffusion processes, thus affecting the flux, energy and surface reaction rate of many neutral reaction groups. Ions can transmit enough energy to promote the surface chemical reaction process and induce sputtering, thus affecting the flux and energy of reactive ions as well as the surface reaction rate involved by ions.

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